FEATURES
◇ Plastic package has underwriters laboratories
flammability classification 94V-0
◇ Glass passivated chip junction
◇ For surface mount applications
◇ High temperature metallurgically bonded construction
of 265℃ for 10 seconds in solder bath
MECHANICAL DATA
◇ Case: JEDEC DO-213AB,molded plastic
◇ Terminals: Axial lead ,solderable per
MIL- STD-750,Method 2026
◇ Polarity: Color band denotes cathode
◇ Weight: 0.0046 ounces, 0.116 grams
◇ Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.
EGL
1B EGL
1D EGL
1F EGL
1G EGL
1H EGL
1J UNITS
Maximum recurrent peak reverse voltage
100 200 300 400 500 600
V
Maximum RMS voltage
70 140 210 280 350 420 V
Maximum DC blocking voltage
100 200 300 400 500 600
V
Maximum average forward rectified current
TT=75℃
Peak forward surge current
8.3ms single half-sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage @1.0A V
Maximum reverse current @TA=25℃
at rated DC blocking voltage @TA=125℃
Maximum reverse recovery time (Note 1) ns
Typical junction capacitance (Note 2) pF
Typical thermal resistance (Note 3)
K/W
Operating junction temperature range
℃
Storage temperature range ℃
NOTE: 1. Measured with IF=0.5A,IR=1.0A,Irr=0.25A
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Thermal resistance from junction to ambient, 0.24×0.24"(6.0×6.0mm) copper pads to each terminal.
1.25 1.35 1.70
trr
50
VDC
A
µA
I(AV)
1.0
IFSM
30
A
VF
IR5.0
50
www.galaxycn.com
VRRM
VRMS
EGL
1A
50
50
35
Cj
Tj
TSTG
RθJA - 55 ---- +175
- 55 ---- +175
15
150
B
L GALAXY ELECTRICALEGL1A - - - EGL1J
◇ High temperature soldering guaranteed:450℃/5 seconds
DO - 213AB
VOLTAGE RANGE: 50 --- 600 V
CURRENT: 1.0 A
at terminals.Complete device sub-mersible temperature
◇ Cavity-free glass passivated junction
SURFACE MOUNT
RECTIFIER
BLGALAXY ELECTRICAL
Document Number 0280092 1.
.6 .8 1.0 1.2 1.4 1.6 1.8 2.0
0.01
0.1
1
10
100
Tj=25 C
Pulse Width=300 s
1% Duty Cycle
o
EGL1A-EGL1D
EGL1F-EGL1G
EGL1H-EGL1J
.2
2
1.1
4
.4 1.0 2
40
10
20
60
100
4102040100
f=1MHz
TJ=25
025 50 75 100 125 150 175
0.6
1.0
1.5
0.8
0.4
0.2
RESISTIVE OR INDUCTIVE
LOAD
0.2X0.2"(5.0X5.0mm )
COPPER PAD
AREAS
0110 100
15
10
30
25
5
20
TL=110℃
8.3ms SINGLE HALF SINE-WAVE
(JEDEC METHOD)
BLGALAXY ELECTRICAL
Document Number 0280092 2.
www.galaxycn.com
0
0.1
10
20 40 60 80 100
0.01
TA=125℃
TA=100℃
TA=25℃
1
100
0.1 1 10
0.01
0.1
1
10
100
100
AVERAGE FORWARD RECTIFIED
CURRENT,AMPERES
PEAK FORWARD SURGE
CURRENT,AMPERES
INSTANTANEOUS FORWARD
CURRENT,AMPERES
INSTANTANEOUS REVERSE
LEAKAGE CURRENT(mA)
REVERSE VOLTAGE(V)
FIG.2 -- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
TERMINAL TEMPERATURE ℃ NUMB ER OF CYCLES AT 60HZ
INSTANTANEOUS FORWARD VOLTAGE(V)
FIG .6 -- TY PIC AL TR AN SIENT THERM AL IMPEDANCE
PERCENT OF RATED PEAK REVERSE VOLTAGE. ( ％)
JUNCTION CAPACITANCE(pF)
T,PULSE DURATION,
RATINGS AND CHARACTERISTIC CURVES EGL1A - - - EGL1J
FIG.3 -- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS FIG.4 -- TYPICAL REVERSE CHARACTERISTICS
FIG.5 -- TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANC
E
(oC/W)
FIG.1 - - FORWARD CURRENT DERATING CURVE
