MC12083
MOTOROLA HIPERCOMM
BR1334 — Rev 4
4
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE R
SEATING
PLANE
14
58
A0.25 MCBSS
0.25 MBM
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A1.35 1.75
A1 0.10 0.25
B0.35 0.49
C0.18 0.25
D4.80 5.00
E1.27 BSCe3.80 4.00
H5.80 6.20
h
0 7
L0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
EH
A
Be
B
A1
CA
0.10
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 –A–
–B–
–T–
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M––– 10 ––– 10
N0.76 1.01 0.030 0.040
__
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MC12083/D
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