TC1410EOA713 - Microchip Technology

 2003 Microchip Technology Inc. DS21389C-page 1

MTC1410/TC1410N

Features

• Latch-Up Protected: Will Withstand 500 mA

Reverse Current

• Input Will Withstand Negative Inputs Up to 5V

• ESD Protected: 4 kV

• High Peak Output Current: 0.5A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 16V

• High Capacitive Load Drive Capability:

- 500 pF in 25 nsec

• Short Delay Time: 30 nsec Typ.

• Consistent Delay Times With Changes in Supply

Voltage

• Matched Delay Times

• Low Supply Current

- With Logic ‘1’ Input: 500 µA

- With Logic ‘0’ Input: 100 µA

• Low Output Impedance: 16Ω

• Available in Space-Saving 8-pin MSOP Package

• Pinout Same as TC1411/TC1412/TC1413

Applications

• Switch Mode Power Supplies

• Line Drivers

• Pulse Transformer Drive

• Relay Driver

General Description

The TC1410/TC1410N are 0.5A CMOS buffers/drivers.

They will not latch-up under any conditions within their

power and voltage ratings. They are not subject to

damage when up to 5V of noise spiking of either

polarity occurs on the ground pin. They can accept,

without damage or logic upset, up to 500 mA of current

of either polarity being forced back into their output. All

terminals are fully protected against up to 4 kV of

electrostatic discharge.

As MOSFET drivers, the TC1410/TC1410N can easily

charge a 500 pF gate capacitance in 25 nsec with

matched rise and fall times, and provide low enough

impedance in both the ‘ON’ and ‘OFF’ states to ensure

the MOSFET’s intended state will not be affected, even

by large transients. The leading and trailing edge

propagation delay times are also matched to allow

driving short-duration inputs with greater accuracy.

Package Type

8-Pin MSOP/PDIP/SOIC

VDD

OUT

GND

VDD

GND

OUT

TC1410

NC = No Connection

26,7

Inverting

26,7

Non-Inverting

TC1410N

VDD

GND

VDD

OUT

GND

OUT

NOTE: Duplicate pins must be connected together

for proper operation.

0.5A High-Speed MOSFET Drivers

TC1410/TC1410N

DS21389C-page 2  2003 Microchip Technology Inc.

Functional Block Diagram

Effective

Input C = 10 pF

TC1410N

Output

Input

GND

VDD

300 mV

4.7V

Inverting

Non-Inverting

Output

TC1410

 2003 Microchip Technology Inc. DS21389C-page 3

TC1410/TC1410N

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage .....................................................+20V

Input Voltage ...................... VDD + 0.3V to GND – 5.0V

Power Dissipation (TA ≤ 70°C)

MSOP .......................................................... 340 mW

PDIP ............................................................ 730 mW

SOIC............................................................ 470 mW

Storage Temperature Range.............. -65°C to +150°C

Maximum Junction Temperature ...................... +150°C

† Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. These

are stress ratings only and functional operation of the device

at these or any other conditions above those indicated in the

operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

PIN FUNCTION TABLE

Symbol Description

VDD Supply input, 4.5V to 16V

INPUT Control input

NC No connection

GND Ground

OUTPUT CMOS push-pull output,

common to pin 7

OUTPUT CMOS push-pull output,

common to pin 6

VDD Supply input, 4.5V to 16V

DC ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

Typical values are measured at TA = +25°C, VDD = 16V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage VIH 2.0 — — V

Logic ‘0’, Low Input Voltage VIL ——0.8V

Input Current IIN -1 — 1 µA 0V ≤ VIN ≤ VDD, TA = +25°C

-10 — 10 -40°C ≤ TA ≤ +85°C

Output

High Output Voltage VOH VDD – 0.025 — — V DC Test

Low Output Voltage VOL — — 0.025 V DC Test

Output Resistance RO—1622ΩVDD = 16V, IO = 10 mA, TA = +25°C

—2028 0°C ≤ TA ≤ +70°C

— 20 28 -40°C ≤ TA ≤ +85°C

Peak Output Current IPK —0.5—AV

DD = 16V

Latch-Up Protection

Withstand Reverse Current

IREV — 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec,

VDD = 16V

Switching Time (Note 1)

Rise Time tR—2535nsecT

A = +25°C

—2740 0°C ≤ TA ≤ +70°C

— 29 40 -40°C ≤ TA ≤ +85°C, Figure 4-1

Fall Time tF—2535nsecT

A = +25°C

—2740 0°C ≤ TA ≤ +70°C

— 29 40 -40°C ≤ TA ≤ +85°C, Figure 4-1

Delay Time tD1 —3040nsecT

A = +25°C

—3345 0°C ≤ TA ≤ +70°C

— 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1

Note 1: Switching times ensured by design.

TC1410/TC1410N

DS21389C-page 4  2003 Microchip Technology Inc.

TEMPERATURE CHARACTERISTICS

Delay Time tD2 —3040nsecT

A = +25°C

—3345 0°C ≤ TA ≤ +70°C

— 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1

Power Supply

Power Supply Current IS—0.51.0mAV

IN = 3V, VDD = 16V

— 0.1 0.15 VIN = 0V

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) TA0—+70ºC

Specified Temperature Range (E) TA-40 — +85 ºC

Maximum Junction Temperature TJ——+150ºC

Storage Temperature Range TA-65 — +150 ºC

Package Thermal Resistances

Thermal Resistance, 8L-MSOP θJA — 206 — ºC/W

Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W

Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W

DC ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

Typical values are measured at TA = +25°C, VDD = 16V.

Parameters Sym Min Typ Max Units Conditions

Note 1: Switching times ensured by design.

 2003 Microchip Technology Inc. DS21389C-page 5

TC1410/TC1410N

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

FIGURE 2-1: Quiescent Supply Current

vs. Supply Voltage.

FIGURE 2-2: Input Threshold vs. Supply

Voltage.

FIGURE 2-3: High-State Output

Resistance vs. Supply Voltage.

FIGURE 2-4: Quiescent Supply Current

vs. Temperature.

FIGURE 2-5: Input Threshold vs.

Temperature.

FIGURE 2-6: Low-State Output

Resistance vs. Supply Voltage.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

100

200

300

400

500

16141210864

VIN = 3V

VIN = 0V

TA = +25°C

ISUPPLY (µA)

VDD (V)

1.1

1.2

1.3

1.4

1.5

1.6

16141210864

TA = +25°C

VDD (V)

VTHRESHOLD (V)

VIH

VIL

16141210864

(V)

DS-ON

(Ohms)

= -40°C

= +25°C

= +85°C

-40-200 20406080

100

200

300

400

500

ISUPPLY (µA)

VIN = 3V

VIN = 0V

VSUPPLY = 16V

TEMPERATURE (°C)

-40 -20 0 20 40 60 80

1.1

1.2

1.3

1.4

1.5

1.6

VSUPPLY = 16V

TEMPERATURE (°C)

VTHRESHOLD (V)

VIH

VIL

16141210864

VDD (V)

RDS-ON (Ohms)

TA = -40°C

TA = +25°C

TA = +85°C

TC1410/TC1410N

DS21389C-page 6  2003 Microchip Technology Inc.

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

FIGURE 2-7: Rise Time vs. Supply

Voltage.

FIGURE 2-8: Propagation Delay vs.

Supply Voltage.

FIGURE 2-9: Rise and Fall Times vs.

Capacitive Load.

FIGURE 2-10: Fall Time vs. Supply

Voltage.

FIGURE 2-11: Propagation Delay vs.

Supply Voltage.

FIGURE 2-12: Propagation Delays vs.

Capacitive Load.

100

16141210864

= -40°C

= +25°C

= +85°C

VDD (V)

LOAD

= 500 pF

tRISE (nsec)

100

16141210864

= -40°C

= +25°C

= +85°C

VDD (V)

LOAD

= 500 pF

tD1 (nsec)

0 500 1000 1500 2000 2500 3000 3500

100

tFALL

tRISE

TA = +25°C

VDD = 16V

tRISE, tFALL (nsec)

CLOAD (pF)

100

16141210864

VDD (V)

tFALL (nsec)

= -40°C

LOAD

= 500 pF

= +25°C

= +85°C

100

16141210864

VDD (V)

LOAD

= 500 pF

tD2 (nsec)

= -40°C

= +25°C

= +85°C

0 500 1000 1500 2000 2500 3000 3500

tD2

tD1

= +25°C

= 16V

CLOAD (pF)

Propagation Delays (nsec)

 2003 Microchip Technology Inc. DS21389C-page 7

TC1410/TC1410N

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Supply Input (VDD)

The VDD input is the bias supply for the MOSFET driver

and is rated for 4.5V to 16V with respect to the ground

pin. The VDD input should be bypassed to ground with

a local ceramic capacitor. The value of the capacitor

should be chosen based on the capacitive load that is

being driven. A value of 1.0 µF is suggested.

3.2 Control Input (INPUT)

The MOSFET driver input is a high-impedance,

TTL/CMOS-compatible input. The input also has

300 mV of hysteresis between the high and low

thresholds that prevents output glitching even when the

rise and fall time of the input signal is very slow.

3.3 CMOS Push-Pull Output

(OUTPUT)

The MOSFET driver output is a low-impedance,

CMOS, push-pull style output, capable of driving a

capacitive load with 0.5 A peak currents.

3.4 Ground

The ground pins are the return path for the bias current

and for the high peak currents that discharge the load

capacitor. The ground pins should be tied into a ground

plane or have very short traces to the bias supply

source return.

Pin No. Symbol Description

DD Supply input, 4.5V to 16V

2 INPUT Control input

3NC

No connection

4GND

Ground

5GND

Ground

6OUTPUT

CMOS push-pull output, common

to pin 7

7OUTPUT

CMOS push-pull output, common

to pin 6

DD Supply input, 4.5V to 16V

TC1410/TC1410N

DS21389C-page 8  2003 Microchip Technology Inc.

4.0 APPLICATIONS INFORMATION

FIGURE 4-1: Switching Time Test Circuit.

CL = 500 pF

0.1 µF

1.0 µF

Inverting Driver

Non-Inverting Driver

Input

VDD = 16V

Input

Output

tD1 tF

tD2

Input: 100 kHz,

square wave,

tRISE = tFALL ≤ 10 nsec

Output

Input

Output

tD1

tD2

+5V

10%

90%

10%

90%

10%

90%

VDD

90%

10%

10% 10%

90%

+5V

VDD

90%

4, 5

26, 7

1, 8

TC1410

TC1410N

TC1410

 2003 Microchip Technology Inc. DS21389C-page 9

TC1410/TC1410N

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil) Example:

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*Standard marking consists of Microchip part number, year code, week code, traceability code (facility

code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please

check with your Microchip Sales Office.

TC1410

CPA057

0346

8-Lead SOIC (150 mil) Example:

XXXXXXXX

XXXXYYWW

NNN

TC1410

COA0346

057

8-Lead MSOP Example:

XXXXXXX

YWWNNN

1410NE

346057

TC1410/TC1410N

DS21389C-page 10  2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

Units INCHES*MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n88

Pitch p.100 2.54

Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32

Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68

Base to Seating Plane A1 .015 0.38

Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26

Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60

Overall Length D .360 .373 .385 9.14 9.46 9.78

Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43

Lead Thickness c.008 .012 .015 0.20 0.29 0.38

Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78

Lower Lead Width B .014 .018 .022 0.36 0.46 0.56

Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92

Mold Draft Angle Top α51015 51015

Mold Draft Angle Bottom β51015 51015

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001

Drawing No. C04-018

.010” (0.254mm) per side.

§ Significant Characteristic

 2003 Microchip Technology Inc. DS21389C-page 11

TC1410/TC1410N

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

Foot Angle φ048048

1512015120

Mold Draft Angle Bottom

1512015120

Mold Draft Angle Top

0.510.420.33.020.017.013BLead Width

0.250.230.20.010.009.008

Lead Thickness

0.760.620.48.030.025.019LFoot Length

0.510.380.25.020.015.010hChamfer Distance

5.004.904.80.197.193.189DOverall Length

3.993.913.71.157.154.146E1Molded Package Width

6.206.025.79.244.237.228EOverall Width

0.250.180.10.010.007.004A1Standoff §

1.551.421.32.061.056.052A2Molded Package Thickness

1.751.551.35.069.061.053AOverall Height

1.27.050

Pitch

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

§ Significant Characteristic

TC1410/TC1410N

DS21389C-page 12  2003 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

(F)

n 1

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REFFFootprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016 .024

.118 BSC

.000

.030

.193 TYP.

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX NOM

1.10

0.80

0.15

0.95

MAX

15°5° -

JEDEC Equivalent: MO-187

0° - 8°

5°

5° -

15°

 2003 Microchip Technology Inc. DS21389C-page 13

TC1410/TC1410N

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Device: TC1410: 0.5A Single MOSFET Driver, Inverting

TC1410N: 0.5A Single MOSFET Driver, Non-Inverting

Temperature Range: C = 0°C to +70°C

E = -40°C to +85°C

Package: OA = Plastic SOIC, (150 mil Body), 8-lead

OA713 = Plastic SOIC, (150 mil Body), 8-lead

(Tape and Reel)

UA = Plastic Micro Small Outline (MSOP), 8-lead *

UA713 = Plastic Micro Small Outline (MSOP), 8-lead *

(Tape and Reel)

PA = Plastic DIP (300 mil Body), 8-lead

* MSOP package is only available in E-Temp.

PAR T NO. X/XX

PackageTemperature

Range

Device

Examples:

a) TC1410COA: 0.5A Single MOSFET

driver, SOIC package,

0°C to +70°C.

b) TC1410CPA: 0.5A Single MOSFET

driver, PDIP package,

0°C to +70°C.

c) TC1410EUA713: Tape and Reel,

0.5A Single MOSFET

driver, MSOP package,

-40°C to +85°C.

a) TC1410NCPA: 0.5A Single MOSFET

driver, PDIP package,

0°C to +70°C.

b) TC1410NEPA: 0.5A Single MOSFET

driver, PDIP package,

-40°C to +85°C.

c) TC1410NEUA: 0.5A Single MOSFET

driver, MSOP package,

-40°C to +85°C.

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

TC1410/TC1410N

DS21389C-page 14  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. DS21389C-page 15

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, microPort,

Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,

PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

DS21389C-page 16  2003 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180

Itasca, IL 60143

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

2767 S. Albright Road

Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Phoenix

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966

Fax: 480-792-4338

San Jose

2107 North First Street, Suite 590

San Jose, CA 95131

Tel: 408-436-7950

Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Unit 915

Bei Hai Wan Tai Bldg.

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100

Fax: 86-10-85282104

China - Chengdu

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Room 401, Hongjian Building

No. 2 Fengxiangnan Road, Ronggui Town

Shunde City, Guangdong 528303, China

Tel: 86-765-8395507 Fax: 86-765-8395571

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

India

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

Lautrup hoj 1-3

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

France

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Italy

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

07/28/03

WORLDWIDE SALES AND SERVICE