SFH 4232
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
2010-05-18 1
Wesentliche Merkmale
• IR-Lichtquelle mit hohem Wirkungsgrad
• Chipgröße (emittierende Fläche) 1 x 1 mm2
• max. Gleichstrom 1 A
• niedriger Wärmewiderstand (9 K/W)
• Schwerpunktswellenlänge 850 nm
•ESD-sicher bis 2 kV nach JESD22-A114-E
•Erweiterte Korrosionsfestigkeit
(s.a. Abschnitt Maßzeichnung)
Anwendungen
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• Fahrer-Assistenz Systeme
• Beleuchtung für Bilderkennungssysteme
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Gesamtstrahlungsfluss1) (IF = 1A, tp = 10 ms)
Total Radiant Flux1)
Φe (mW)
SFH 4232 Q65110A8754 ≥ 320 (typ. 530)
1) gemessen mit Ulbrichtkugel / measured with integrating sphere
Features
• IR lightsource with high efficiency
• die-size (emitting area) 1 x 1 mm2
• max. DC-current 1 A
• Low thermal resistance (9 K/W)
• Center of spectral emission at 850 nm
• ESD safe up to 2 kV acc. to JESD22-A114-E
•Superior Corrosion Robustness
(see chapter package outlines)
Applications
• Infrared Illumination for cameras
• Surveillance systems
• Driver assistance systems
• Machine vision systems
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2010-05-18 2
SFH 4232
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg – 40 … + 125 °C
Sperrschichttemperatur
Junction temperature
TJ+ 145 °C
Sperrspannung
Reverse voltage
VR1 V
Vorwärtsgleichstrom
Forward current
IF1 A
Stoßstrom, tp < 200 µs, D = 0
Surge current
IFSM 5 A
Leistungsaufnahme
Power consumption
Ptot 1.8 W
Wärmewiderstand Sperrschicht - Lötstelle
Thermal resistance junction - soldering point
RthJS 9K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 1 A, tp = 10 ms
λpeak 860 nm
Schwerpunktswellenlänge der Strahlung
Centroid wavelength
IF = 1 A, tp = 10 ms
λcentroid 850 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 1 A, tp = 10 ms
Δλ 30 nm
Abstrahlwinkel
Half angle
ϕ± 60 Grad
deg.
Aktive Chipfläche
Active chip area
A1mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
1 × 1 mm²
SFH 4232
2010-05-18 3
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, IF = 5 A, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 5 A, RL = 50 Ω
tr / tf7 / 14 ns
Durchlassspannung
Forward voltage
IF = 1 A, tp = 100 µs
IF = 5 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
2.0 (< 2.9)
V
V
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie180 mW/sr
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 1 A, tp = 10 ms
TCI– 0.3 %/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 1 A, tp = 10 ms
TCV– 1 mV/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 1 A, tp = 10 ms
TCλ,centroid + 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2010-05-18 4
SFH 4232
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
Gesamtstrahlungsfluss1) Φe
Total Radiant Flux1) Φe
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
-CB -DA -DB
Gesamtstrahlungsfluss
Total Radiant Flux
IF = 1 A, tp = 10 ms
Φe min
Φe max
320
500
400
630
500
800
mW
mW
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) /
Only one group in one packing unit (variation lower 1.6:1)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
SFH 4232
2010-05-18 5
Relative spektrale Emission
Relative Spectral Emission
Irel = f (λ)
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (TA), RthJS = 9 K/W
700
0nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
0
0˚C
T
I
F
A
OHF04369
S
20 40 60 80 100 130
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
Durchlassstrom
Forward Current
IF = f (VF)
Single pulse, tp = 100 μs
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability IF = f (tp), TS = 85 °C,
Duty cycle D = parameter
OHF03847
V
F
0
10
101
10-1
10-2
F
I
A
0V0.5 1 1.5 2 2.5
0
-5
F
I
A
t
p
s
OHF04177
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
1010
P
t
=
DTT
t
P
I
F
0.01
0.33
0.5
0.2
0.1
0.02
D
0.005
=
0.05
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
1
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1000mA) = f (IF)
Single pulse, tp = 100 μs
OHF03848
10-3
A
101
0
10
5
5
10-1
-2
5
10
I
F
10 10 0
10 1
1055
-2 -1
Φ(1 A)
Φe
e
2010-05-18 6
SFH 4232
Maßzeichnung1)
Package Outlines
Korrosionsfestigkeit besser als EN 60068-2-60 (method 4):
mit erweitertem Korrosionstest: 40°C / 90%rh / 15ppm H2S / 336h
Corrosion robustness better than EN 60068-2-60 (method 4):
with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h
Kathodenkennung: Markierung
Cathode mark: mark
Gewicht / Approx. weight: 0.2 g
Gurtung / Polarität und Lage Verpackungseinheit 800/Rolle, ø180 mm
Method of Taping / Polarity and Orientation Packing unit 800/reel, ø180 mm
1) Maße in mm (inch) / Dimensions in mm (inch)
GPLY7072
6.2 (0.244)
5.8 (0.228)
1.9 (0.075)
1.7 (0.067)
Cathode
(R0.85 (0.033))
11.2 (0.441)
10.8 (0.425)
1.2 (0.047)
0.8 (0.031)
0...0.1 (0.004)
0.29 (0.011)
0.24 (0.009)
6.8 (0.268)
7.2 (0.283)
1.1 (0.043)
0.9 (0.035)
1.6 (0.063)
2.0 (0.079)
(ø4.2 (0.165))
ø0.81 (0.031)
4.25 (0.167)
5.35 (0.210)
5.25 (0.206)
ø0.73 (0.028)
4.15 (0.163)
0.65 (0.026)
0.45 (0.018)
SFH 4232
2010-05-18 7
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Solder resist
Freies Kupfer
Bare Copper
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHAY0681
0.3 (0.012)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
10 (0.394)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)
Achtung:
Anode und Heatsink sind elektrisch verbunden
Attention:
Anode and Heatsink are electrically connected
Footprint
2010-05-18 8
SFH 4232
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min