UPC1251GR-9LG-A - Renesas Electronics

The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics

sales representative for availability and additional information.

BIPOLAR ANALOG INTEGRATED CIRCUIT

PC1251GR-9LG, 358GR-9LG

LOW POWER DUAL OPERATIONAL AMPLIFIERS

PRELIMINARY DATA SHEET

Document No. G17929EJ2V0DS00 (2nd edition)

Date Published November 2006 NS CP(N)

Printed in Japan

2006

DESCRIPTION

The

PC1251GR-9LG, 358GR-9LG are dual operational amplifiers which are designed to operate from a single

power supply over a wide range of voltages. Operation from split power supplies is also possible and the power

supply current drain is very low. Further advantage, the input commonmode voltage range includes ground in the

linear mode.

FEATURES

• Internally frequency compensation

• Wide output voltage swing V− to V+ − 1.5 V

• Common mode input voltage range includes V−

• Wide supply voltage range

3 V to 30 V (Single)

±1.5 V to ±15 V (Split)

• Output short circuit protection

ORDERING INFORMATION

Part Number Package

PC1251GR-9LG-A 8-pin plastic TSSOP (5.72 mm (225))

PC1251GR(5)-9LG-A 8-pin plastic TSSOP (5.72 mm (225))

PC358GR-9LG-A 8-pin plastic TSSOP (5.72 mm (225))

PC358GR(5)-9LG-A 8-pin plastic TSSOP (5.72 mm (225))

PIN CONFIGURATION (Marking Side)

OUT1

II1

IN1

V–

V+

OUT2

II2

IN2

+–1

–+ 2

EQUIVALENT CIRCUIT (1/2 Circuit)

V+

V–

OUT

6 A

100 A

50 A

Preliminary Data Sheet G17929EJ2V0DS

PC1251GR-9LG, 358GR-9LG

ABSOLUTE MAXIMUM RATINGS (TA = 25°C)

Parameter Symbol

PC1251GR-9LG

PC358GR-9LG Unit

Voltage between V+ and V− Note 1 V

+ − V− −0.3 to +32 V

Differential Input Voltage VID ±32 V

Input Voltage Note 2 VI V

− − 0.3 to V− + 32 V

Output Voltage Note 3 VO V

− − 0.3 to V+ + 0.3 V

Power Dissipation Note 4 PT 440 mW

Output Short Circuit Duration Note 5 Indefinite s

Operating Ambient Temperature TA −40 to +125 −40 to +85 °C

Storage Temperature Tstg −55 to +150 −55 to +125 °C

Notes 1. Reverse connection of supply voltage can cause destruction.

2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of

V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will

establish when the both inputs are within the Common Mode Input Voltage Range of electrical

characteristics.

3. This specification is the voltage which should be allowed to supply to the output terminal from external

without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this

specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of

electrical characteristics.

4. The thermal deleting factor of these IC are same value as −5.5mW/°C, but the delete beginning temperature

in different as follows.

PC1251GR-9LG : 69°C

PC358GR-9LG : 44°C

The calculated junction to ambient thermal resistance at above conditions is 183°C/W.

5. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4.

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit

Supply Voltage (Split) V± ±1.5 ±15 V

Supply Voltage (V− = GND) V+ +3 +30 V

Preliminary Data Sheet G17929EJ2V0DS 3

PC1251GR-9LG, 358GR-9LG

PC1251GR-9LG,

PC358GR-9LG

ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input Offset Voltage VIO RS = 0 Ω ±2 ±7 mV

Input Offset Current IIO ±5 ±50 nA

Input Bias Current Note 6 IB 45 250 nA

Large Signal Voltage Gain AV RL ≥ 2 kΩ 25 100 V/mA

Supply Current Note 7 ICC RL = ∞, IO = 0 A 0.7 1.2 mA

Common Mode Rejection Ratio CMR 65 70 dB

Supply Voltage Rejection Ratio SVR 65 100 dB

Output Voltage Swing VO RL = 2 kΩ (Connect to GND) 0 V+ − 1.5 V

Common Mode Input Voltage Range VICM 0 V+ − 1.5 V

Output Current (SOURCE) IO SOURCE VIN+ = +1 V, VIN− = 0 V 20 40 mA

VIN− = +1 V, VIN+ = 0 V 10 20 mA Output Current (SINK) IO SINK

VIN− = +1 V, VIN+ = 0 V,

VO = 200 mV

12 50

Channel Separation f = 1 kHz to 20 kHz 120 dB

Notes 6. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input

stage.

7. This current flows irrespective of the existence of use.

PC1251GR(5)-9LG,

PC358GR(5)-9LG

ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input Offset Voltage VIO RS = 0 Ω ±2 ±3 mV

Input Offset Current IIO ±5 ±50 nA

Input Bias Current Note 6 IB 45 60 nA

Large Signal Voltage Gain AV RL ≥ 2 kΩ 50 100 V/mA

Supply Current Note 7 ICC RL = ∞, IO = 0 A 0.7 0.9 mA

Common Mode Rejection Ratio CMR 65 70 dB

Supply Voltage Rejection Ratio SVR 65 100 dB

Output Voltage Swing VO RL = 2 kΩ (Connect to GND) 0 V+ − 1.5 V

Common Mode Input Voltage Range VICM 0 V+ − 1.4 V

Output Current (SOURCE) IO SOURCE VIN+ = +1 V, VIN− = 0 V 30 40 mA

VIN− = +1 V, VIN+ = 0 V 15 20 mA Output Current (SINK) IO SINK

VIN− = +1 V, VIN+ = 0 V,

VO = 200 mV

30 50

Channel Separation f = 1 kHz to 20 kHz 120 dB

Notes 6. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input

stage.

7. This current flows irrespective of the existence of use.

Preliminary Data Sheet G17929EJ2V0DS

PC1251GR-9LG, 358GR-9LG

PACKAGE DRAWING

Sxb M

0.145±0.055

(UNIT:mm)

ITEM DIMENSIONS

3.15±0.15

3.00±0.10

4.40±0.10

6.40±0.20

1.20 MAX.

0.10±0.05

1.00±0.05

0.25

0.65

0.10

0.60

0.50

0.60±0.15

1.00±0.20

P8GR-65-9LG

3°+5°

−3°

NOTE

Each lead centerline is located within 0.10mm of

its true position at maximum material condition.

detail of lead end

8-PIN PLASTIC TSSOP (5.72mm (225))

0.24

+0.06

−0.05

Preliminary Data Sheet G17929EJ2V0DS 5

PC1251GR-9LG, 358GR-9LG

RECOMMENDED SOLDERING CONDITIONS

The

PC1251GR-9LG, 358GR-9LG should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

Process Conditions Symbol

Infrared ray reflow Peak temperature: 260 °C or below (Package surface temperature),

Reflow time: 60 seconds or less (at 220 °C or higher),

Maximum number of reflow processes: 3 time.

IR60-00-3

Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

WS60-00-1

Partial heating method Pin temperature: 350 °C or below,

Heat time: 3 seconds or less (Per each side of the device).

P350

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

REFERENCE DOCUMENTS

Document Name Document No.

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E

SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html

NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM

- STANDARD LINEAR IC

IEI-1212

PC1251GR-9LG, 358GR-9LG

The information in this document is current as of November, 2006. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

•

M8E 02. 11-1

(1)

(2)

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

"Standard":

"Special":

"Specific":