SL3S1013FTB0,115 - NXP Semiconductors

1. General description

NXP’s UCODE G2iM series transponder ICs offer s in addition to the leading-edge read

range features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, advanced

privacy-protection modes and a 640 bit configurable User Memor y.

Very high chip sensitivity (17.5 dBm) enables longer read ra nges with simple, single-port

antenna designs. In fashion and retail the UCODE G2iM series improve read rates and

provide for theft deterrence. In the electronic device market, they are ideally suited for

device configuration, activation, production control and PCB tagging. In authentication

applications, they protect bran ds and guard ag ainst counterfeiting. They can also be used

to tag containers, electronic vehicles, airline baggage, and more.

In addition to the EPC specifications the UCODE G2iM of fers an integrated Product S t atus

Flag (PSF) feature and read protection of the memory content.

The UCODE G2iM+ offers on top of the UCODE G2iM features an integrated tag tamper

alarm, digital switch, external supply mode, data transfer mode and real read range

reduction. A special feature is the co nditiona l, automatic real read rang e reduction, wher e

the activation condition can be defined by the user, is newly introduced in the UCODE

G2iM+. When connected to a power supply, the READ as well as the WRITE range can

be boosted to a sensitivity of 27 dBm.

The UCODE G2iM+ also allows the segmentation of the 640 bit User Memory in up to

three segments (open, protected, private) with different access levels (Access- and User

Password). For applications which require a longer EPC number the UCODE G2iM+

offers the possibility of up to 448 bit.

2. Features and benefits

2.1 Key features

UHF RFID Gen2 tag chip according EPCglobal v1.2.0

256 bit EPC for UCODE G2iM and up to 448 bit EPC for UCODE G2iM+

Up to 640 bit User Memory which can be segmented in the UCODE G2iM+

Private User Memory area protected by special User Password

Memory read protection

Integrated Product Status Flag (PSF)

Tag tamper al ar m

Digital switch

Data transfer mode

SL3S1003_1013

UCODE G2iM and G2iM+

Rev. 3.7 — 21 May 2015

201237 Product data sheet

COMPANY PUBLIC

Product data sheet

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201237 2 of 43

NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

Real Read Range Reduction (Pr ivacy Mode)

Conditional Real Read Range Reduction

External supply mode

Long read/write ranges due to extremely low power design

Reliable operation of multiple tags due to advanced anti-collision

Broad international operating frequency: from 840 MHz to 960 MHz

Data retention: 20 years

Wide specified temp er at ur e ra ng e : 40 C up to +85 C

2.1.1 Memory

256 bit of EPC memory / up to 448 bit in G2iM+

96 bit Tag IDentifier (TID) including 48-bit factory locked unique serial number

112 bit User TID memory

32 bit Kill Password to permanently disable the tag

32 bit Access Password to allow a transition into the se cured state

32 bit User Password to allow access to the private user memory segment

Read protection

BlockWrite (32 bit)

Write Lock

BlockPermalock

2.2 Key benefits

2.2.1 End user benefit

Outstanding User Memory size of 640 bit

Prevention of unauthorized memory access through di fferent levels of read protection

Indication of tag tampering attempt by use of the tag tamper alarm feature

Electronic device configuration an d / or activation by the u se of the digita l switch / dat a

transfer mode

Theft deterrence supported by the PSF feature (PSF alarm or EPC code)

Small label sizes, long read ranges due to high chip sensitivity

Product identification through unalterable TI D range, including a 48 bit serial number

Reliable operation in dense reader and noisy environments through high interference

suppression

2.2.2 Antenna design benefits

High sensitivity enables small and cost efficient antenna designs

Low Q-Value eases broad band antenna design for global usage

2.2.3 Label manufacturer benefit

Consistent performance on different materials due to low Q-factor

Ease of assembly and high assembly yields through large chip input capacitance and

Polyimide spacer

Fast first WRITE or BLOCKWRITE of the EPC memory for fast label initialization

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

2.3 Custom commands

PSF Alarm

Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag

(Electronic Article Surveillance) tag without the need for a back-end data base.

Read Protect

Protects all memory content from unauthorized reading.

ChangeConfig

Configures the addition al features of the chip li ke external supply mode, t amper alarm,

digital switch, read range reduction, privacy mode activation condition or data transfer.

The UCODE G2iM+ is equipped with a number of additional features. Nevertheless, the

chip is designed in a way standard EPCglobal READ/WRITE/ACCESS commands can be

used to operate the features. No custom commands are needed to take advantage of all

the features in case of unlocked EPC memory.

3. Applications

3.1 Markets

Fashion (apparel and foot we ar )

Retail

Electronics

Fast moving consumer goods

Asset management

Electronic vehicle identification

3.2 Applications

Supply chain managem ent

Item level tagging

Pallet and case tracking

Container identification

Product authentication

PCB tagging

Cost efficient, low level seals

Wireless firmware download

Wireless product act iva tio n

Product data sheet

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201237 4 of 43

NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

4. Ordering information

5. Marking

Table 1. Ordering information

Type number Package

Name IC type Description Version

SL3S1003FUD/BG Wafer G2iM bumped G2iM die on sawn 8” 120 mm wafer,

7 mm Polyimide spacer not applicable

SL3S1013FUD/BG W afer G2iM+ bumped G2iM+ die on sawn 8” 120 mm wafer ,

7 mm Polyimide spacer not applicable

SL3S1013FTB0 XSON6 G2iM+ plastic extremely thin small outline package;

no leads; 6 terminals; body 1  1.45  0.5 mm SOT886F1

Table 2. Marking codes

Type number Marking code Comment Version

SL3S1013FTB0 US UCODE G2iM+ SOT886

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

6. Block diagram

The SL3S10x3 IC consists of three major blocks:

- Analog Interface

- Digital Control

- EEPROM

The analog part provides stable supply voltage and demodulates data received from the

reader for being processed by the digital part. Further, the modulation transistor of the

analog pa rt transmits data back to the reader.

The digit al section includes the state machines, processes the protocol and handles

communication with the EEPROM, which contains the EPC and the user data.

Fig 1. Block diagram of SL3S10x3 IC

001aam226

MOD

DEMOD

VREG

VDD

data

out

R/W

ANALOG

RF INTERFACE

PAD

RECT

DIGITAL CONTROL

ANTENNA

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

I/O CONTROL

I/O

CONTROL

EEPROM

MEMORY

SEQUENCER

CHARGE PUMP

PAD

OUT

PAD

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

7. Pinning information

7.1 Pin description

Fig 2. Pinning bare di e Fig 3. Pin configuration for SOT886

001aan572

VDD

OUT RFN

RFP

NXP trademark

SL3S10x3FTB0

n.c.

aaa-001689

RFP

RFN

n.c.

VDD

OUT

Transparent top view

Table 3. Pin description bare die

Symbol Description

OUT output pin

RFN grounded antenna connector

VDD external supply

RFP ungrounded antenna connector

Table 4. Pin description SOT886

Pin Symbol Description

1 RFP ungrounded antenna connector

2 n.c. not connected

3 RFN grounded antenna conn ector

4 OUT output pin

5 n.c. not connected

6 VDD ex ternal supply

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

8. Wafer layout

8.1 Wafer layout

(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)

(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)

(3) Chip step, x-length: 615 m

(4) Chip step, y-length: 475 m

(5) Bump to bump distance X (OUT - RFN): 513 m

(6) Bump to bump distance Y (RFN - RFP): 333 m

(7) Distance bump to metal sealring X: 43,5 m (outer edge - top metal)

(8) Distance bump to metal sealring (RFP, VDD) Y: 40,3 m

(9) Distance bump to metal sealring (RFN, OUT) Y: 80,3 m

Bump size X  Y: 60 m ´ 60 m

Remark: OUT and VDD are used with G2iM+ only

Fig 4. SL3S10x3 wafer layout

001aan642

not to scale!

(1)

(7)

(2)

(8)

(5)

(6) (4)

(3)

VDD

(9)

OUT RFN

RFP

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

9. Mechanical specification

The SL3S10x3 wafers are offered with 120 mm thickness and 7mm Polyimide spacer.

This robust structure with the enh anced Polyimide sp a cer su pport s e asy asse mbly due to

low assembly variations.

9.1 Wafer specification

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”.

9.1.1 Wafer

Table 5. Specifications

Wafer

Designation each wafer is scribed with batch number and

wafer number

Diameter 200 mm (8”)

Thickness 120 m 15 m

Number of pads 4

Pad location non diagonal/ placed in chip corners

Distance pad to pad RFN-RFP 333.0 m

Distance pad to pad OUT -RFN 513.0 m

Process CMOS 0.14 mm

Batch size 25 wafers

Potential good dies per wafer 100544

Wafer backside

Material Si

Treatment ground and stress release

Roughness Ra max. 0.5 m, Rt max. 5 m

Chip dimensions

Die size including scribe 0.615 mm  0.475 mm = 0.292 mm2

Scribe line width: x-dimension = 15 m

y-dimension = 15 m

Passivation on front

Type Sandwich structure

Material PE-Nitride (on top)

Thickness 1.75 m total thickness of passivation

Polyimide spacer 7 m

Au bump

Bump material > 99.9% pure Au

Bump hardness 35 – 80 HV 0.005

Bump shear strength > 70 MPa

Bump height 25 m[1]

Bump height uniformity

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

[1] Because of the 7 m spacer, the bump will measur e 18 m relative height protruding the spacer.

9.1.2 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results an d

additionally the results of mechanical/visual inspection.

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

9.1.3 Map file distribution

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

– within a die  2 m

– within a wafer  3 m

– wafer to wafer  4 m

Bump flatness 1.5 m

Bump size

– RFP, RFN 60  60 m

– OUT, VDD 60  60 m

Bump size variation  5 m

Table 5. Specifications …continued

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

10. Functional description

10.1 Air interface standards

The UCODE G2iM fully supports all parts of the "Specif ica tion for RFID Air Interface

EPCglobal, EPCTM Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF

RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".

10.2 Power transfer

The interrogator p rovides an RF field that po wers the t ag, equ ipped with a UCODE G2iM.

The antenna tra nsforms the impe dance of free space to the chip input imped ance in orde r

to get the maximum possib le power for the UCODE G2iM on the t a g. The UCODE G2iM+

can also be supplied ex te rn ally.

The RF field, which is oscillating on the operating frequency provided by the interrogator,

is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.

The antenna attached to the chip may use a DC connection between the two antenna

pads which also enab les loop antenna design.

10.3 Data tran sfer

10.3.1 Reader to tag Link

An interrogator transmits information to the UCODE G2iM by modulating an UHF RF

signal. The UCODE G2iM receives both information and operating en ergy from this RF

signal. Tags are passive, meaning that they receive all of their o perating energy from the

interrogator's RF waveform. In order to further improve the read range the UCODE G2iM

can be externally supplied as well so the energy to operate the chip does not need to be

transmitted by the reader.

An interrogato r is using a fixed modulation and data rate for the duration of at least one

inventory round. It com mun ica tes to the UCODE G2iM by modulating an RF carrier using

DSB-ASK with PIE encoding.

For further details refer to Section 17, Ref. 1. Interrogator-to-tag (R=>T) communications.

10.3.2 Tag to reader Link

An interrogator receives information from a UCODE G2iM by transmitting an unmodulated

RF carrier and listening for a backscattered reply. The UCODE G2iM backscatters by

switching the reflection coefficient of its antenna between two states in accordance with

the data being sent. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3.

The UCODE G2iM communicates information by backscatter-modulating the amplitude

and/or phase of the RF carrier. Interrogators shall be capable of demodulating either

demodulation type.

The encoding format, selected in response to interrogator commands, is either FM0

baseband or Miller-modulated subcarrier.

Product data sheet

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

10.4 UCODE G2iM and UCODE G2iM+ differences

The UCODE G2iM is tailored for application where EPC or TID number space, and User

Memory is needed. The UCODE G2iM+ provides beside the segmented memory

additional functionality such as tag tamper alarm, external supply operation to further

boost read/write range (external supply mode), a privacy mode reducing the read range

where the activation criteria (open or short) can be defined or I/O functionality (data

transfer to externally connected devices) where required.

The following table provides an overview of UCODE G2iM, UCODE G2iM+ special

features.

10.5 Supported commands

The UCODE G2iM supports all mandatory EPCglobal V1.2.0 commands.

In addition the UCODE G2iM supports the following optional commands:

•ACCESS

•BlockWrite (32 bit)

•BlockPermalock

The UCODE G2iM features the following custom commands described more in detail

later:

•ResetReadProtect (backward compatible to UCODE G2X; UCODE G2iL)

•ReadProtect(backward compatible to UCODE G2X; UCODE G2iL)

•ChangeEAS (backward compatible to UCODE G2X; UCODE G2iL)

•EAS_Alarm(backward compatible to UCODE G2X; UCODE G2iL)

•ChangeConfig(backward compatible to UCODE G2iL)

Table 6. Overview of UCODE G2iM and UCODE G2iM+ features

Features UCODE G2iM UCODE G2iM+

Read protection (bankwise) yes yes

PSF (Built-in Product Status Flag) yes yes

Backscatter strength reduction yes yes

BlockWrite (32 bit) yes yes

BlockPermalock yes yes

User TID (112 bit) yes yes

Segmented user memory (open, protected, private) - yes

Additional User Password for private memory - yes

EPC size selectable (448bit max.) - yes

Tag t amper alarm - yes

Digital switch / Digital input - yes

External supply mode - yes

Data transfer - yes

Real read range reduction - yes

Conditional Real Read Range Reduction - yes

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

10.6 UCODE G2iM and UCODE G2iM+ memory

The UCODE G2iM and UCODE G2iM+ memory is implemented according EPCglobal

Class1Gen2 and organized in four banks:

The logical address of all memory banks begin at zero (00h).

In addition to the four memory banks two configuration words are available. The first to

handle the UCODE G2iM memory configuration (Mem-Config-Word) is available at EPC

bank 01 address 1F 0h and the second to handle UCODE G2iM specific features

Config-Word) is available at EPC bank 01 address 200h. The configuration wor ds are

described in detail in Section 10.7.1 “ChangeConfig” and Section 10.7.3 “UCODE G2iM+

memory configuration control mechanism”.

Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle

before writing data to it. This approach accelerates initialization of the chip and enables

faster programming of the memo ry.

Table 7. UCODE G2iM and UCODE G2iM+ memory sections

Name Size Bank

Reserved memory (32 bit ACCESS and 32 bit KILL password) 64 bit 00b

EPC (excluding 16 bit CRC-16 and 16 bit PC) (UCODE G2iM)

EPC (excluding 16 bit CRC-16 and 16 bit PC) (UCODE G2iM+)

256 bit

128 bit

up to

448 bit

01b

G2iM Configuration Word (Config-Word) 16 bit 01b

G2iM Memory Configuration Word (Mem-Config-Word) 16 bit 01b

TID (including permalocked unique 48 bit serial number; 16bit unalterable

XTID-header) 96 bit 10b

User TID 112 bit 10b

User memory (UCODE G2iM)

User memory can be segmented and configured (UCODE G2iM+)

512 bit

320 bit

up to

640 bit

11b

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

10.6.1 UCODE G2iM and UCODE G2iM+ overall memory map

Table 8. UCODE G2iM and UCODE G2iM+ overall memory map

Bank

address Memory

address Type Content Initia l Remark

Bank 00 00h to 1Fh reserved Kill Password all 00h unlocked memory

20h to 3Fh reserved Access Password all 00h unlocked memory

Bank 01

EPC 00h to 0Fh EPC CRC-16: refer to Ref. 16 memory mapped

calculated CRC

10h to 14h EPC backscatter length 00110b unlocked memory

15h EPC UMI 0b calculated ac cord i n g EPC

16h EPC reserved for future use 0b hardwired to 0

17h to 1Fh EPC numbering system indicator 00h unlocked memory

20h to 9Fh EPC EPC [1] unlocked memory

Bank 01

Memory

Config Word

1F0h to 1F3h EPC RFU 0000b hardwired to 0000b

1F4h to 1F7h EPC Number of EPC blocks 0h unlocked memory

1F8h to 1FBh EPC Number protected memory

blocks 0h unlocke d me mory

1FCh to 1FFh EPC N umber of private memory

blocks 0h unlocke d me mory

Bank 01

Config Word 200h EPC tamper alarm flag 0b[4] indicator bit

201h EPC external supply flag or input

signal 0b[4] indicator bit

202h EPC RFU 0b[4] locked memory

203h EPC RFU 0b[4] locked memory

204h EPC invert digital output: 0b[4] temporary bit

205h EPC transparent mode on/off 0b[4] temporary bit

206h EPC transparent mode data/raw 0b[4] temporary bit

207h EPC conditional read range

reduction 0b[4] unlocked memory

208h EPC conditional read range

reduction

open/short

0b[4] unlocked memor y

209h EPC max. backscatter strength 1b[4] unlocked memory

20Ah EPC digital output 0b[4] unlocked memor y

20Bh EPC re ad range reduction on/off 0b[4] unlocked memory

20Ch EPC read protect User Memory 0b[4] locked memory

20Dh EPC read protect EPC Bank 0b[4] unlocked memory

20Eh EPC read protect TID 0b[4] unlocked memor y

20Fh EPC PSF alarm flag 0b[4] unlocked memor y

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

[1] UCODE G2iM: HEX E200 680A 0000 0000 0000 0000 (0000 0000)

UCODE G2iM+: HEX E200 680B 0000 0000 0000 0000 (0000 0000)

[2] Indicates the existence of a Configuration Word at the end of the EPC number

[3] See Figure 5

[4] See also Table 13 for further details.

Bank 10

TID 00h to 07h TID allocation class identifier 1110 0010b locked memory

08h to 13h TID tag mask designer identifier 0000 0000 0110b locked memory

14h TIG config word indicator 1b[2] locked memory

14h to 1Fh TID tag model number TMNR[3] locked memory

20h to 2Fh TID XTID Header 00h locked memory

30h to 5Fh TID serial number SNR locked memory

60h to CFh TID User TID memory all ’0’ unlocked memory

Bank 11

USER 000h to 27Fh USER User Memory undefine d unlocked memory

Table 8. UCODE G2iM and UCODE G2iM+ overall memory map

Bank

address Memory

address Type Content Initia l Remark

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

10.6.2 UCODE G2iM and UCODE G2iM+ TID memory details

Table 9. G2iM TID description

Model number

Type First 32 bit of

TID memory Class ID Mask designer

ID Config W o rd

indicator Sub version

number Version (Silicon)

number

UCODE G2iM E200680A E2h 006h 1 0000b 0001010

UCODE G2iM+ E200680B E2h 006h 1 0000b 0001011

Fig 5. G2iM TID memory structure

001aan573

Class Identifier

MS Byte

MS Bit LS Bit

TID

Mask-Designer Identifier Model Number XTID Header Serial Number

0007Bits 11 11 15 0 047

07h 13h 1Fh 5Fh00hAddresses

CFh00hAddresses

08h 14h 20h 2Fh 30h

E2h

(EAN.UCC)

TID Example

(UCODE G2iM) 006h

(NXP) 80Ah

(UCODE G2iM) 0000h

Sub Version Number Version Number

000b 0001010b

(UCODE G2iM)

6003Bits 0

1Fh14h 18hAddresses 19h

LS Byte

User TID

0112

CFh60h

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UCODE G2iM and G2iM+

10.7 Custom commands

The UCODE G2iM and UCODE G2iM+ supports a number of additional features and

custom commands. Nevertheless, the chip is designed in a way standard EPCglobal

READ/WRITE/ACCESS commands can be used to operate the features.

The memory map stated in the previous section describes the Config-Word used to

control the additional features located at address 200h as well as the Mem-Config-Word

located at 1F0h of the EPC memory. For this reason the standard READ/WRITE

commands of an UHF EPCglobal compliant rea der can be used to select the flags,

activate/deactivate features or define memory segments.

The features can only be activated/deactivated (written) using standard EPC WRITE

command as long the EPC is not locked. In case the EPC is locked either the bank needs

to be unlocked to apply changes or the ChangeConfig custom command is used to

change the settings.

The UCODE G2iM products supports the complete UCODE G2iL command set for

backward compatibility reasons.

Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable

selecting Config-Word enhanced transponders in mixed tag populations.

10.7.1 ChangeConfig

Although UCODE G2iM is tailored for supply chain management, item level tagging and

product authentication the UCODE G2iM+ version enables active interaction with

products. Among the p assword protected features are the capability of download firmware

to electronics, activate /dea ctivate electronics which can also be used as theft d eterren ce ,

a dedicated privacy mode by reducing the read range, integrated PSF (Product Status

Flag) or Tag Tamper Alarm. In addition to the UCODE G2iL/G2iL+ the activa tion condition

(open/short) for the Read Range Reduction can be defined by the user.

The UCODE G2iM ChangeConfig custom command allows handling the special NXP

Semiconductors features described in the following paragraph. Please also see the

memory map in Section 10.6 “UCODE G2iM and UCODE G2iM+ memory” and “Section

10.7.2 “UCODE G2iM and UCODE G2iM+ special features control mechanism”. If the

EPC memory is not write locked the standard EPC READ/WRITE command can be used

to change the settings.

UCODE G2iM and UCODE G2iM+ special features1

UCODE G2iM and UCODE G2iM+ common special features are:

•Bank wise read protection (separate for EPC, TID and User Memory)

EPC bank (except of configu ration words), the serial numbe r part of the TID as well as

the User TID and the User Memory (open segment) can be read protected

independently. When protected reading of the particular memory will return '0'. The

flags of the Config-W ord can be selected using the standard SELECT command. Only

read protected parts will then participate an inventory round.

1. The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be

used.

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

•Integrated PSF (Product Status Flag)

The PSF is a general purpose flag that can be used as an EAS (Electronic Article

Surveillance) flag, quality checked flag or similar.

The UCODE G2iM offers two ways of detecting an activated PSF. In cases extremely

fast detection is need e d th e EAS_Alarm command can be us ed . Th e UCO DE G2 iM

will reply a 64 bit alarm code like described in section EAS_Alarm upon sending the

command. As a second option the EPC SELECT command selecting the PSF flag of

the Config-Word can be used. In the following inventory round only PSF enab led

chips will reply their EPC number.

•Backscatter strength reduction

The UCODE G2iM features two levels of ba ckscatter strengths. Per default maximum

backscatter is enabled in order to enable m aximum read rates. Whe n clearing the flag

the strength can be reduced if needed.

UCODE G2iM+ specific special features are:1

•Real Read Range Reduction 4R (UCODE G2iM+ only)

Some applications require the reduction of the read range to close proxim ity for

privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to

+12 dBm. The +12 dBm have to be available at chip start up (slow increase of field

strength is not applicable ). For additional pr ivacy, the read protection can be activated

in the same config ur at ion step . Th e rela te d flag of the con fig u ra tio n wor d ca n be

selected using the standard SELECT command so only chips with reduced read

range will be part of an inventory.

Remark: The attenuation will result in only a few centimeter of read range at 36 dBm

EIRP!

•Tag Tamper Alarm (UCODE G2iM+ only)

The UCODE G2iM+ Tamper Alarm will flag the status of the VDD to OUT pad

connection which can be designed as an predetermined breaking point (see

Figure 6).

The status of the pad connection (open/closed) can be read in the configuration register

and/or selected using the EPC SELECT. This feature enables the design of a wireless

RFID safety seal. When breaking the connection by peeling off the label or manipu lating a

lock an alarm can be triggered.

Fig 6. Schematic of connecting VDD and OUT pad with a predetermined breaking point

to turn a standard RFID label into a wireless safety seal

001aan668

OUT VDD

RFN RFP

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NXP Semiconductors SL3S1003_1013

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•Conditional Real Read Range Reduction (UCODE G2iM+ only)

In addition to the 4R and the Tag Tamper Alarm feature the UCODE G2iM+ offers a

feature which combines both in one functionality. This feature allow the automatic

activation of the 4R depending on the st atus of the VDD to OUT pad connection. To

offer high flexibility for the applications the 4R activation can be done on short (bit 8 =

’1’) or open (bit 8 =’0’) of the VDD to OUT pad connection . For activation of this

feature bit 7 and bit 11 of the Config-Word have to be set to ’1’.

•Digital Switch (UCOD E G2iM+ only)

By connecting a supply voltage between RFN and VDD the OUT pin of the UCODE

G2iM+ can be used as digital switch. Depending on the ‘Digital Output’ bit of the

Config-Word register the state of the OUT pin can be switched to VDD or GND.

The state of the OUT pin is persistent in the memory even af ter KILL or switching off

the supply. In absence of external Vsupply, one cannot detect the dif fer ence in Ohmic

resistance between OUT and VDD, regardless of whether ‘Digital Output’ bit is 0 or 1.

The sta te of the OUT pin can also be changed temporar y by toggling the 'Invert Digital

Output' bit.

This feature will allow activating/deactivating externally connected peripherals or can

be used as theft dete rrence of electronics.

•Data transfer Mode (UCODE G2iM+ only)

In applications where not switching the output like described in "Digital Switch" but

external device communication is needed the UCODE G2iM+ Data Transfer Mode

can be used by setting the according bit of the Config-Word register. When activated

the air interface communication will be directly transferred to the OUT pad of the chip.

Two modes of data transfer are available and can be switched using the Transparent

Mode DATA/RAW bit.

The default Transparent Mode DATA will remove the Frame Sync of the

communication and toggle the output with every raising edge in the RF field. This will

allow implementing a Manchester type of data transmission.

The T ransp arent Mo de RA W will switch the demodulated air interface communication

to the OUT pad.

•External Supply Indicator - Digi tal Input (UCODE G2iM+ only)

The VDD pad of the UCODE G2iM+ can be used as a digital input pin. The state of

the pad is directly associa ted with the External Supply Indicator bit of the config uration

Configuration Word register flag. RF reset is necessary for proper polling.

•External Supply Mode (G2iM+ only)

The UCODE G2iM+ can be supplied externally by connecting 1.85 V (Iout = 0 A)

supply. When externally supplied less energy from the RF field is needed to operate

the chip. This will not just enable further improved sensitivity and read ranges (up to

-27 dBm) but also enable a write range that is equal to the read range.

The figure schematically shows the supply connected to the UCODE G2iM+.

Remark: When permanently externally supplied there will not be a power-on-reset. This

will result in the following limitations:

•When externally supplied session flag S0 will keep it’s state during RF-OFF phase.

•When externally supplied session flag S2, S3, SL will have infinite persistence time

and will behave similar to S0.

•Session flag S1 will behave regular like in pure passive operation.

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The bits to be toggled in the configuration register need to be set to '1'.

E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the

very same command a second time will disable the features again.

The reply of the ChangeConfig will return the current register setting.

Fig 7. Schematic of external po wer supply

Table 10. ChangeConfig custom command

Command RFU Data RN CRC-16

No. of bits 16 8 16 16 16

Description 11100000

00000111 00000000 Toggle bits

XOR RN 16 handle -

Table 11. ChangeConfig custom comm and reply

Header Status bits RN CRC-16

No. of bits 1 16 16 16

Description 0 Config-Word Handle -

Table 12. ChangeConfig comma nd-response table

Starting state Condition Response Next state

ready all - ready

arbitrate, reply,

acknowledged all - arbitrate

open valid handle Status word

needs to change Backscatter unchanged

Config-Word immediately open

valid handle S tatus word does

not need to change Backscatter Config-Word

immediately open

secured valid handle Status word

needs to change Backscatter mo dified

Config-Word, when done secured

valid handle S tatus word does

not need to change Backscatter Config-Word

immediately secured

killed all - killed

001aan669

OUT VDD

Vsupply

RFN RFP

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The features can only be activated/deactivated using standard EPC WRITE if the EPC

bank is unlocked. The permanent and temporary bits of the Configuration Word can be

toggled without the need for an Access Password in case the Access Password is set to

zero. In case the EPC bank is locked the lock needs to be removed before applying

changes or the ChangeConfig command has to be used.

10.7.2 UCODE G2iM and UCODE G2iM+ special features control mechanism

Special features of the UCODE G2iM are managed using a configuration word

(Config-Word) located at address 200h in the EPC memory bank.

The entire Config-Word is selectable (using the st andard EPC SELECT command), as

well as single bits, an d can be read using standard EPC READ command and modified

using the standard EPC WRITE or ChangeConfig custom command in case the EPC

memory is locked for writing.

ChangeConfig can be executed from the OPEN and SECURED state.

The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS

password is zero; therefore it will not alter any status bits, but report the current status

only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip

will then remain in the current state. The CRC-16 is calculated from the first

command-code bit to the last hand le bit.

A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored.

The command will also be ignored if any of the RFU bits are toggled.

In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written

to the correspondin g r egister flag to togg le the status. E.g. sending 0x0002 to the register

will activate the read protection of the TID. Sending the same command a second time will

again clear the read protection of th e TID. In valid toggling on indicator or RFU bits are

ignored.

Executing the command with zero as payload or in the OPEN state will return the current

preamble rega rd less of the TRext value of th e Qu er y com m a nd .

After sending a ChangeConfig an interrogator shall transmit CW for less than TReply or

20ms, where TReply is the time between the interrogator's ChangeConfig command and

the chip’s backscattered reply. An interrogator may observe three possible responses

after sending a ChangeConfig, depending on the success or failure of the operation

•ChangeConfig succeeded: The chip will backscatter the reply shown above

comprising a header (a 0-bit), the current Config-Word setting, the handle, and a

CRC-16 calculated over the 0-bit, the Config-Word and the handle. If the interrogator

observes this reply within 20 ms then the ChangeConfig completed successfully.

•The chip encounters an error: The chip will backscatter an error code during the CW

period rather than the reply shown below (see EPCglobal Spec for error-code

definitions and for the reply format).

•ChangeConfig does not succeed: If the interrogator does not observe a reply within

20 ms then the ChangeConfig did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the chip is still in the

interrogator's field, and may reissue the ChangeConfig command.

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The UCODE G2iM configuratio n word (Config-Word) is located at address 200h of the

EPC memory and is structured as following:

The configuration word contains three different type of bits:

•Indicator bits cannot be changed by command:

Tag Tamper Alarm Indicator

External Supply Indicator (digital input)

•Temporary bits are reset at power up:

Invert Output

Tra nsparen t Mo d e on/o ff

Data Mode data/raw

•Permanent bits: permanently stored bits in the memory

Conditional Read Range Reduction on/off

Conditional Read Range Reduction short/open

Max. Backscatter Strength

Digital Output

Read Range Reduction

Read Protect User Memory

Read Protect EPC

Read Protect TID

PSF Alarm

Table 13. Address 200h to 207h

Indicator bi ts Temporary bits Permanent bits

Tamper

indicator External supply

indicator RFU RFU Invert Output Transparent

mode

on/off

Data mode

data/raw Conditional Read

Range Reduction

on/off

0 1 234 567

Table 14. Address 208h to 20Fh

Permanent bits

Conditional

Read Range

Reduction

open/short

max. backscatter

strength Digital

output Read

Range

Reduction

Protect UM Protect EPC Protect TID PSF Alarm

bit

8 9 10 11 12 13 14 15

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10.7.3 UCODE G2iM+ memory configuration control mechanism

The segmented user memor y available in the UCODE G2iM+ enables a flexible

configuration of the device with respect to EPC size and access rights to the User

Memory.

The standard configuration offers 256 bit EPC memory and 512 bit open User Memory for

UCODE G2iM and 128 bit EPC memory and 640 bit open User Memory for UCODE

G2iM+. For applications where more EPC memory is required the UCODE G2iM+ offers

the flexibility to extend the 128 bit EPC up to 448 bit (in steps of 64 bit) by reducing the

User Memory size accordingly. See Table 15 and Table 17.

Beside the possibility to extend the EPC memory the UCDOE G2iM+ offers the possibility

to segment the User Memory in up to three areas with different access rights.

•Open: no read/write protection

•Protected: read/write protected by the Access Password

•Private: read/wri te protected by the User Password (see Section 10.7.4)

Table 15. EPC / User Memory Standard Configuration (UCODE G2iM)

EPC Memory User Memory

Open

256 bit 512 bit

Table 16. EPC / User Memory Standard Configuration (UCODE G2iM+)

EPC Memory User Memory

Open

128 bit 640 bit

Table 17. EPC / User Memory Max. EPC Configuration (UCODE G2iM+)

EPC Memory User Memory

Open

448 bit 320 bit

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The memory configuration can be defined one time, by programming the memory

configuration word, at the initialization of the UCODE G2iM+. The UCODE G2iM+

Memory Configuration Word (Mem-Config-Word) is located at address 1F0h of the EPC

memory and is structured as following:

•RFU-Bits:

The four RFU bits are fixed to 0000b. These four bits are ignored for access

commands (e.g. WRITE).

•Number of EPC blocks:

The 4 bit of this region specify the number of blocks (max. 5) which should be added

on top of the standard EPC Memory of 128bit.

•Number of Protected memory blocks:

The 4 bit of this region specify the number of blocks which should be used for the

Protected memory region.

•Number of Private memory blocks:

The 4 bit of this region specify the number of blocks which should be used for the

Private memory region.

The total amount of User Memory is defined by the number of blocks for EPC-, Open-,

Protected- and Private- memory area. Based on the total User Memory size (640 bit) and

the defined block size of 64 bit, the overall number of blocks results in ten blocks. As

described in the exam ples (Table 19 to Table 21) below the blocks used for the EPC-,

Open-, Protected- or Private segment can be exchanged according to the application

requirements as long as the overall block number is below ten.

The number of blocks allocated to the Open Memory Area are defined by the number of

blocks specified in the Mem-Config-Word, therefore the size of the Open Memory area is

derived by subtracting the number of defined blocks (Mem-Config-Word) from the total

available number of blocks of the User Memory (10 blocks). Undefined blocks are always

added to the Open Memory area.

In case an invalid tot al amount of blocks (exceeds ten) is written to the Mem-Config-W ord,

the configuration fails and the error code (Locked Memory) will be returned.

The entire Mem-Config-Word is selectable (using the standard EPC SELECT command),

as well as single bit s, and can be read u sing standa rd EPC READ command and modified

using the standard EPC WRITE command.

NOTE:

THE MEM-CONFIG-WORD IS ONE TIME PROGRAMMABLE.

Programming has be pe rformed in the secure d state.

In case no programming of the memory configuration word is done at the initialization of

the UCODE G2iM+ it will be automatically locked upon a lock of any part of the memory.

Table 18. Memory Configuration Word, Address 1F0h to 1FFh

RFU Number

of EPC blocks Number of

Protected memory blocks Number of

Private memory blocks

0123456789101112131415

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The following tables will provide a few examples for different memory configurations.

•Standard EPC size, 4 blocks Protected and 3 blocks Private memory which results in

3 blocks Open memory.

(Mem-Config-Word value: 0043h)

See Table 19

•Standard EPC size, 3 blocks Protected memory which results in 7 blocks Open

memory. (Mem-Config-Word value: 0030h).

See Table 20

•192 bit EPC (1 block EPC added), 6 blocks Private memory which results in 4 blocks

Open memory. (Mem-Config-Word value: 0106h)

See Table 21

10.7.4 Private Memory Segment

The Private memory is a part of the User Memory which can be accessed out of the

secured state only. Private regions will appear as non existent to not authorized users.

The address of the location of the User Password is not fixed and has therefore to be

calculated based on the applied memory configuration.

The 32 bit User Password is loca te d at th e end of the User Memory. Sinc e the UC O DE

G2iM+ memory is configurable and can be segmented the address location of the User

Password depends on the Memory configuration done at the initialization.

User Password address calculation:

HEX[(Total number of memory blocks - blocks appointed to EPC)*Blocksize)]

Example:

EPC length: 192

This means that 1 block from the User Memory is r equired (128 bit + 64 bit)

HEX[(101)*64]=HEX[9*64]=HEX[384]=240h

Therefore the User Password for this configuration is located at address 240h to 25Fh

Table 19. User Memory Configuration with 3 segments

EPC Memory User Memory

Open Protected Private

128 bit 192 bit 256 bit 192 bit

Table 20. User Memory Configuration with 2 segments (no Private segment)

EPC Memory User Memory

Open Protected

128 bit 448 bit 192 bit

Table 21. User Memory Configuration with 2 areas (no Access password protected area)

EPC Memory User Memory

Open Private

192 bit 192 bit 384 bit

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10.7.5 ReadProtect2

The UCODE G2iM ReadProtect custom command enables reliable r ead protection of th e

entire UCODE G2iM memory. Executing ReadProtect from the Secured state will set the

ProtectEPC and ProtectTID bit s of the Confi guration Word to '1'. With the ReadProtect-Bit

set the UCODE G2iM will continue to work unaffected but veil its protected content.

The read protection can be removed by executing Reset ReadProtect. The

ReadProtect-Bits will than be cleared.

Devices whose access password is zero will ignore the command. A frame-sync must be

pre-pended the command.

After sending the ReadProtect command an interrogator shall transmit CW for the lesser

of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect

command and the backscattered reply. An interrogator may observe three possible

responses after sendin g a Rea d Pro te ct, dep ending on the success or failure of the

operation:

•ReadProtect succeeds: After completing the ReadProtect the UCODE G2iM shall

backscatter the reply shown in Table 23 comprising a header (a 0-bit), the tag's

handle, and a CRC-16 calculated over the 0-bit and handle. Immediately after this

reply the UCODE G2iM will render itself to this ReadProtect mode. If the interrogator

observes this reply within 20 ms then the ReadProtect completed successfully.

•The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error

code during the CW period rather than the reply shown in the EPCglobal Spec (see

Annex I for error-code definitions and for the reply format).

•ReadProtect does not succeed: If the interrogator does not observe a reply within

20 ms then the ReadProtect did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the UCODE G2iM is

still in the interrogation zone, and may re-initiate the ReadProtect command.

The UCODE G2iM reply to the ReadProtect command will use the extended preamble

shown in EPCglob al Spec (Figure 6.11 or Figure 6.1 5 ), as appro p ria te (i.e. a Tag shall

reply as if TRext=1) regardless of the TRext value in the Query that initiated the round.

2. Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”.

Table 22. ReadProtect command

Command RN CRC-16

# of bits 16 16 16

description 11100000 00000001 handle -

Table 23. UCODE G2iM reply to a successful ReadProtect procedure

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

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10.7.6 Reset ReadProtect2

Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of

the Configura tio n Word. This will re -e n ab le re ad in g of the re lat ed UC OD E G2iM me mo r y

content.

For details on the command response please refer to Table 25 “Reset ReadProtect

command”.

After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of

TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect

command and the UCODE G2iM backscattered reply. A Req_RN command prior to the

Reset ReadProtect is necessary to successfully execute the command. A frame-sync

must be pre-pended the command.

An interrogator may observe three possible responses after sending a Reset

ReadProtect, depending on the success or failure of the operation:

•Reset ReadProtect succeeds: After completing the Reset ReadProtect a UCODE

G2iM will backscatter the reply shown in Table 26 comprising a header ( a 0-bit), the

handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator

observes this reply within 20 ms then the Reset ReadProtect completed successfully.

•The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error

code during the CW period rather tha n the reply shown in Table 26 (see EPCglobal

Spec for error-code definitions and for the reply format).

•Reset ReadProtect does not succeed: If the interrogator does not observe a reply

within 20 ms then the Reset ReadProtect did not complete successfully. The

interrogator may issue a Req_RN command (containing the handle) to verify that the

G2iM is still in the interrogation zone, and may reissue the Reset ReadProtect

command.

The UCODE G2iM reply to the Reset ReadProtect command will use the extended

preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.1 5) , as ap pr o pr i at e (i.e . a

UCODE G2iM will reply as if TRext=1 regardless of the TRext value in the Query that

initiated the round.

Table 24. ReadProtect command-respon se table

Starting State Condition Response Next State

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open all - open

secured valid handle & invalid

access password – arbitrate

valid handle & valid

non zero access

password

Backscatter handle,

when done secured

invalid handle – secured

killed all – killed

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The Reset ReadProtect command is structured as following:

•16 bit command

•Password: 32 bit Access-Password XOR with 2 times current RN16

Remark: To generate the 32 bit p assword the 16 bit RN16 is duplicated and used two

times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234).

•16 bit handle

•CRC-16 calculate over the first command-code bit to the last handle bit

Table 25. Reset ReadProtect command

Command Password RN CRC-16

# of bits 16 32 16 16

description 11100000

00000010 (access

password) 

2*RN16

handle -

Table 26. UCODE G2iM reply to a successful Reset ReadProtect command

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

Table 27. Reset ReadProtect command-response table

Starting State Condition Response Next State

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open valid handle & valid access password Backscatter handle,

when done open

valid handle & invalid access password – arbitrate

invalid handle – open

secured valid handle & valid access password Backscatter handle,

when done secured

valid handle & invalid access password – arbitrate

invalid handle – secured

killed all – killed

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10.7.7 ChangeEAS2

UCODE G2iM equipped RFID tags w ill also feature a stand-alone operating EAS alarm

mechanism for fast and offline electronic article surveillance. The PSF bit of the

Config-Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the tag

will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without the

need of a Select or Query. The EAS is a built-in solution so no connection to a backend

database is required. In case the EAS_Alarm command is not implemented in the reader

a standard EPC SELCET to the Config-Word and Query can be used. When using

standard SELECT/QUERY the EPC will be returned during inventory.

ChangeEAS can be executed from the Secured state only. The command will be ignored

if the Access Password is zero, the command will also be ignored with an invalid CRC-16

or an invalid handle, the UCODE G2iM will than remain in the current state. The CRC-16

is calculated from the first command- code bit to the last hand le bit. A frame-syn c must be

pre-pended the command.

The UCODE G2iM reply to a successful ChangeEAS will use the extended preamble, as

appropriat e (i.e . a Tag shall reply as if TRext=1) regardless of the TRext value in the

Query that initiated the round.

After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or

20 ms, where TReply is the time between the interrogator's ChangeEAS command and

the UCODE G2iM backscattered reply. An interrogator may observe three possible

responses after sending a ChangeEAS, depending on the success or failure of the

operation

•ChangeEAS succeeds: After completing the ChangeEAS a UCODE G2iM will

backscatter the reply shown in Table 29 comprising a header (a 0-bit) , the handle, and

a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply

within

20 ms then the ChangeEAS completed successfully.

•The UCODE G2iM encounters an error: The UCODE G2iM will backscatter an error

code during the CW period rather tha n the reply shown in Table 29 (see EPCglobal

Spec for error-code definitions and for the reply format).

•ChangeEAS does not succeed: If the interrogator does not observe a reply within

20 ms then the ChangeEAS did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the G2iM is still in the

interrogator's field, and may reissue the ChangeEAS command.

Upon receiving a valid ChangeEAS command a G2iM will perform the commanded

set/reset operation of the PSF bit of the Configuration Word.

If PSF bit is set, the EAS_Alarm command will be available after the next power up and

reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be

ignored.

Table 28. ChangeEAS command

Command ChangeEas RN CRC-16

# of bits 16 1 16 1 6

description 11100000

00000011 1 ... set PSF bit

0 ... reset PSF bit handle

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10.7.8 EAS_Alarm

Upon receiving an EAS_Alarm custom command the UCODE G2iM will immediately

backscatter an EAS-Alarmcode in case the PSF bit of the Config-Word is set. The alarm

code is returned without any delay caused by Select, Query an d without the need for a

backend database.

The EAS feature of the UCODE G2iM is available after enabling it by sending a

ChangeEAS command described in Section 10.7.7 “ChangeEAS2” or after setting the

PSF bit of the Config-Word to ’1’. With the EAS-Alarm enabled the UCODE G2iM will

reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A UCODE

G2iM will reply to an EAS_Alarm command from the ready st ate only. As an alternative to

the fast EAS_Alarm command a standard SELECT (upon the Config-Word) and QUERY

can be used.

If the PSF bit is reset to '0' by sending a ChangeEAS command in the pa ssword protected

Secure state or clearing the PSF bit the UCODE G2iM will not reply to an EAS_Alarm

command.

The EAS_Alarm command is structured as following:

•16 bit command

•16 bit inverted command

•DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal S pec.

6.3.1.2. 8 an d Table 6.9.

•M (cycles per symbol) sets th e T=>R data rate and modulation format as shown in

EPCglobal Spec. Table 6.10.

•TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as

described in EPCglobal Spec. 6.3.1.3.

A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec,

6.3.1.2.8.

Table 29. UCODE G2iM reply to a successful ChangeEAS command

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

Table 30. ChangeEAS command-response table

Starting State Condition Response Next state

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open all – open

secured valid handle ba ckscatter handle,

when done secured

invalid handle – secured

killed all – killed

Product data sheet

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Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b

and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate

the CRC5 over the backscattered 64 bits received to verify the received code.

Table 31. EAS_Alarm command

Command Inv_Command DR MTRext CRC-16

# of bits 16 16 1 2 1 16

description 11100000

00000100 00011111

11111011 0: DR=8

1: DR=64/3 00: M=1

01: M=2

10: M=4

11: M=8

0: no pilot

tone

1: use pilot

tone

Table 32. UCODE G2iM reply to a successful EAS_Alarm co mmand

Header EAS Code

# of bits 1 64

description 0 CRC5 (MSB)

Table 33. EAS_Alarm command-response table

Starting State Condition Response Next state

ready PSF bit is set

PSF bit is cleard

backscatter alarm code

-- ready

arbitrate, reply,

acknowledged all – arbitrate

open all – open

secured all – secured

killed all – killed

Product data sheet

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11. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.

Table 34. Limiting values[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages are referenced to RFN

Symbol Parameter Conditions Min Max Unit

Bare die limitations

Tstg storage temperature 55 +125 C

Tamb ambient temperature 40 +85 C

VESD electrostatic discharge

voltage Human body

model [3] -±2kV

Pad limitations

Viinput voltage absolute limits,

VDD-OUT pad 0.5 +2.5 V

Iooutput current absolute limits

input/output

current, VDD-OUT

pad

0.5 +0.5 mA

Piinput power maximu m po wer

dissipation, RFP

pad

-100mW

Product data sheet

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12. Characteristics

12.1 UCODE G2iM and UCODE G2iM+ bare die characteristics

[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

[4] It has to be assured the reader (system) is capable of providing enough field strength to give +10 dBm at the chip otherwise

communication with the chip will not be possible.

[5] Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4.

[6] Will result in up to 10 dB higher tag backscatter power at high field strength.

[7] Results in approx. 18 dBm tag sensitivity on a 2 dBi gain antenna.

Table 35. UCODE G2iM and UCODE G2iM+ RF interface characteristics (RFN, RFP)

Symbol Parameter Conditions Min Typ Max Unit

fiinput frequency 840 - 960 MHz

Normal mode - no external supply, read range reduction OFF

Pi(min) minimum input power READ sensitivity [1][2][7] -17.5 - dBm

Pi(min) minimum input power WRITE,

BLOCKWRITE

sensitivity, (write

range/read range -

ratio)

-30

20 -%

Ciinput capacitance parallel [3] -0.77-pF

Q quality factor 915 MHz [3] -9.2--

Z impedance 866 MHz [3] -27 j234 - 

915 MHz [3] -24 j222 - 

953MHz [3] -23 j213 - 

External supply mode - VDD pad supplied, read range reduction OFF

Pi(min) minimum input power Ext. supplied READ [1][2] -27 - dBm

Ext. supplied WRITE [2] -27 - dBm

Z impedance externally supplied,

915 MHz [3] -8 -j228-

Read range reduct ion ON - no external supply

Pi(min) minimum input power 4R on READ [1][2][4] -+10-dBm

4R on WRITE [2][4] -+10-dBm

Z impedance 4R on, 915 MHz [3] -16 j1 - 

Modulation resistance

R resistance modulation

resistance, max.

backscatter = off

[5] -170-

modulation

resistance, max.

backscatter = on

[6] -55-

Product data sheet

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[1] Activates Digital Output (OUT pin), increases read range (external supplied).

[2] Activates Digital Output (OUT pin), increases read and write range (external supplied).

[3] Operating the chip outside the specified voltage range may lead to undefined behavior.

[4] Either the voltage or the current needs to be above given values to guarantee specified functionality.

[5] No proper operation is guaranteed if both, voltage and current, limits are exceeded.

[1] Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN.

[2] Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality.

[3] Resistance between VDD and OUT pin in checked during power up only.

[4] Resistance range to achieve tamper alarm flag = 1.

[5] Resistance range to achieve tamper alarm flag = 0:

Table 36. VDD pin characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Minimum supply voltage/current - without assisted EEPROM WRITE [1][3][4]

VDD supply voltage minimum voltage - - 1.8 V

IDD supply curren t minimum current,

Iout = 0 A-- 14A

Iout = 100 A--120A

Minimum supply voltage/current - assisted EEPROM READ and WRITE [2][3][4]

VDD supply voltage minimum voltage,

Iout = 0 A- 1.8 1.85 V

Iout = 100 A--1.95V

IDD supply curren t minimum current,

Iout = 0 A-- 135A

Iout = 100 A--265A

Maximum supply voltage/current [3][5]

VDD supply voltage absolute maximum

voltage 2.2 - - V

Ii(max) maximum input current absolute maximum

current 280 - - A

Table 37. G2iM, G2iM+ VDD and OUT pin characteristics

Symbol Parameter Conditions Min Typ Max Unit

OUT pin characteristics

VOL Low-level output voltage Isink = 1mA - - 100 mV

VOH HIGH-level output voltage VDD = 1.8 V; Isource

= 100A1.5 - - V

VDD/OUT pin characteris ti cs

CLload capacitance VDD - OUT pin max. [1] -- 5pF

Vooutput voltage maximum RF peak

voltage on VDD-OUT

pins

[2] -- 500mV

VDD/OUT pin tamper alarm characteristics [3]

RL(max) maximum load resistance resistance range high [4] -- <2 M

RL(min) minimum lo ad resistance resistance range low [5] >20 - - M

Product data sheet

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[1] Tamb 25 C

12.2 UCODE G2iM+ SOT886 characteristics

[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

Remark: For DC and memory characteristics refer to Table 36, Table 37 and Table 38.

Table 38. UCODE G2iM and UCODE G2iM+ memory characteristics

Symbol Parameter Conditions Min Typ Max Unit

EEPROM characteristics

tret retention time Tamb 55 C20--year

Nendu(W) write endurance 1000 10000[1] - cycle

Table 39. G2iM+ RF interface characteristics (RFN, RFP)

Symbol Parameter Conditions Min Typ Max Unit

Normal mode - no external supply, read range reduction OFF

Pi(min) minimum input power READ

sensitivity [1][2] -17.6 - dBm

Z impedance 915 MHz [3] - 21.2 -j199.7 - 

Normal mode - externally supply VDD = 1.8V, read range reduction OFF

Z impedance 915 MHz [3] - 6.9 -j205.5 - 

Product data sheet

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13. Package outline

Fig 8. Package outline SOT886

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT886 MO-252

sot886_po

04-07-22

12-01-05

Unit

mm max

nom

min

0.5 0.04 1.50

1.45

1.40

1.05

1.00

0.95

0.35

0.30

0.27

0.40

0.35

0.32

0.6

A(1)

Dimensions (mm are the original dimensions)

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886

A1b

0.25

0.20

0.17

DEee

0.5

terminal 1

index area

0 1 2 mm

scale

(2)

Product data sheet

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14. Handling information

14.1 Assembly conditions

14.1.1 General assembly recommendations

While pads OUT and VDD are not used for UCODE G2iM (SL3S1003), they are still

electrically active and therefore must not be connected to the antenna and the RFN and

RFP pads.

In case of any doubts, the customer is constrained to contact NXP Semiconductors for

further clarific atio n .

14.1.2 Label converting

Generally, an optimization of the entire lamination process by label manufacturer is

recommended in order to mini mize the stress onto the module and guarantee high

assembly yield. Roller diameter must not be smaller than 45 mm.

15. Packing information

15.1 Wafer

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

Product data sheet

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16. Abbreviations

Table 40. Abbreviations

Acronym Description

CRC Cyclic Redundancy Check

CW Continuous Wave

DC Direct Current

EAS Electronic Article Surveillance

EEPROM Electrically Erasable Programmable Read Only Memory

EPC Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

ESD ElectroStatic Discharge

FCS Flip Chip Strap

FM0 Bi phase space modulation

G2 Generation 2

HBM Human Body Model

IC Integrated Circuit

PSF Product Status Flag

PCB Printed Circuit Boa rd

RF Radio Frequency

UHF Ultra High Frequency

TID Tag IDentifier

Product data sheet

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17. References

[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF

RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0

(December 17, 2005)

[2] EPCglobal: EPC Tag Data Standards

[3] EPCglobal (2004 ): FMC G RFID P hy sical Requirements Document (draft)

[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference

(draft)

[5] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment oper ating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 1 – Technical characteristics and test methods

[6] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment oper ating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive

[7] [CEPT1]: CEPT REC 70-03 Annex 1

[8] [ETSI1]: ETSI EN 330 220-1, 2

[9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility

And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment

operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:

Technical characteristics and test methods.

[10] [FCC1]: FCC 47 Part 15 Section 247

[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International

Standards

[12] ISO/IEC 3309: Information technology – Telecommunications and information

exchange between systems – High-level dat a link control (HDLC) procedures –

Frame structure

[13] ISO/IEC 15961: Information techn ology, Automatic identificatio n and data capture –

Radio frequency identification (RFID) for item management – Data protocol:

application interface

[14] ISO/IEC 15962: Information technology, Automatic identification and data capture

techniques – Radio frequency identification (RFID) for item management – Data

protocol: data encoding rules and logical memory functions

[15] ISO/IEC 15963: Information technology — Radio frequency identification for item

management — Unique identification for RF tags

[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item

management — Part 1: Reference architectur e and definition of parameters to be

standardized

[17] ISO/IEC 18000-6: Information technology automatic identification and data capture

techniques — Radio frequency identification for item management air interface —

Part 6: Parameters for air interface communications at 860–960 MHz

[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary

– Part 3: radio-fr equency identification (RFID)

Product data sheet

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[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:

Radio-frequency devices, U.S. Federal Communications Commission.

[20] Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**3

3. ** ... document version number

Product data sheet

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18. Revision history

Table 41. Revision history

Document ID Relea se date Data sheet status Change notice Supersedes

SL3S1003_1013 v. 3.7 201 50521 Product data sheet - SL3S1003_ 1013 v. 3.6

Modifications: •Table 36 “VDD pin characteristics”: current units corrected

•Section 10.7.1 “ChangeConfig”: “Digital Switch” updated

SL3S1003_1013 v. 3.6 201 41017 Product data sheet - SL3S1003_ 1013 v. 3.5

Modifications: •Table 21 “User Memory Configuration with 2 areas (no Access password protected area)”:

corrected

•Table 39 “G2iM+ RF interface characteristics (RFN, RFP)”: corrected

SL3S1003_1013 v. 3.5 201 31107 Product data sheet - SL3S1003_1013 v. 3.4

Modifications: •Table 1 “Ordering information”: updated

•Table 2 “Marking codes”: updated

•Section 2.2 “Key benefits”: title updated

•Table 39 “G2iM+ RF interface characteristics (RFN, RFP)”: title updated

SL3S1003_1013 v. 3.4 201 20227 Product data sheet - SL3S1003_ 1013 v. 3.3

Modifications: •Figure 4 “SL3S10x3 wafer layout”: Figure notes (1) and (2) update d

SL3S1003_1013 v. 3.3 201 20130 Product data sheet SL3S1003_1013 v. 3.2

Modifications: •Section 14 “Handling information”: added

SL3S1003_1013 v. 3.2 201 20111 Product data sheet - SL3S1003_1013 v. 3.1

Modifications: •Section 8.1 “Wafer layout”: figure notes (1), (2), (8) and (9) updated

SL3S1003_1013 v. 3.1 20111117 Product data sheet - SL3S1003_1013 v. 3.0

Modifications: •Security status changed into COMPANY PUBLIC

•Package delivery form SOT886 added

•Section 5 “Marking”, Section 13 “Package outline”: added

SL3S1003_1013 v. 3.0 20110503 Product data sheet - SL3S10 03_1013 v. 2.0

Modifications: •Specification status changed into product

•Some EPC bit values changed

•Table 16 added

SL3S1003_1013 v. 2.0 20110415 Preliminary data sheet - -

Product data sheet

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19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsisten cy or conf lict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

19.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for an y of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for t he customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associa ted with their

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document cont ains data fro m the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet

COMPANY PUBLIC Rev. 3.7 — 21 May 2015

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NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

19.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

UCODE — is a trademark of NXP Semiconductors N.V.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors SL3S1003_1013

UCODE G2iM and G2iM+

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 21 May 2015

201237

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1.1 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2.1 End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2.2 Antenna design benefits. . . . . . . . . . . . . . . . . . 2

2.2.3 Label manufacturer benefit. . . . . . . . . . . . . . . . 2

2.3 Custom commands. . . . . . . . . . . . . . . . . . . . . . 3

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1 Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 4

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

7.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

8.1 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Mechanical specification . . . . . . . . . . . . . . . . . 8

9.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8

9.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

9.1.2 Fail die identification . . . . . . . . . . . . . . . . . . . . 9

9.1.3 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9

10 Functional description . . . . . . . . . . . . . . . . . . 10

10.1 Air interface standards . . . . . . . . . . . . . . . . . . 10

10.2 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 10

10.3 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 10

10.3.1 Reader to tag Link . . . . . . . . . . . . . . . . . . . . . 10

10.3.2 Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . 10

10.4 UCODE G2iM and UCODE G2iM+ differences 11

10.5 Supported commands . . . . . . . . . . . . . . . . . . 11

10.6 UCODE G2iM and UCODE G2iM+ memory . 12

10.6.1 UCODE G2iM and UCODE G2iM+ overall

memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 13

10.6.2 UCODE G2iM and UCODE G2iM+ TID

memory details . . . . . . . . . . . . . . . . . . . . . . . . 15

10.7 Custom commands. . . . . . . . . . . . . . . . . . . . . 16

10.7.1 ChangeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 16

UCODE G2iM and UCODE G2iM+ special

features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

10.7.2 UCODE G2iM and UCODE G2iM+ special

features control mechanism . . . . . . . . . . . . . . 20

10.7.3 UCODE G2iM+ memory configuration control

mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.7.4 Private Memory Segment. . . . . . . . . . . . . . . . 24

10.7.5 ReadProtect. . . . . . . . . . . . . . . . . . . . . . . . . . 25

10.7.6 Reset ReadProtect2. . . . . . . . . . . . . . . . . . . . 26

10.7.7 ChangeEAS2 . . . . . . . . . . . . . . . . . . . . . . . . . 28

10.7.8 EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 29

11 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31

12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

12.1 UCODE G2iM and UCODE G2iM+ bare die

characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

12.2 UCODE G2iM+ SOT886 characteristics . . . . 34

13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 35

14 Handling information . . . . . . . . . . . . . . . . . . . 36

14.1 Assembly conditions . . . . . . . . . . . . . . . . . . . 36

14.1.1 General assembly recommendations . . . . . . 36

14.1.2 Label converting. . . . . . . . . . . . . . . . . . . . . . . 36

15 Packing information . . . . . . . . . . . . . . . . . . . . 36

15.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 37

17 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

18 Revision history . . . . . . . . . . . . . . . . . . . . . . . 40

19 Legal information . . . . . . . . . . . . . . . . . . . . . . 41

19.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 41

19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41

19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42

20 Contact information . . . . . . . . . . . . . . . . . . . . 42

21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

SL3S1013FUD/BG,003 SL3S1003FUD/BG,003