User's GuideSBOU080 – July 2009
THS4521/2/4EVM
THS4521EVM
Features:
•Configured for split-supply operation; easily modified for single-supply operation.•Default single-ended input configuration can easily be reconfigured for differential input.•Default single-ended output configuration can easily be reconfigured for differential output.•Designed for easy connection to standard 50- Ωinput/output impedance test equipment.•Inputs and outputs include SMA connectors.
Contents1 Description .................................................................................................................... 22 Power Connections .......................................................................................................... 33 Input and Output Connections ............................................................................................. 34 THS4521EVM Schematic, Layout, and Bill of Materials (BOM) ....................................................... 45 THS4522EVM Schematic, Layout, and Bill of Materials (BOM) ....................................................... 76 THS4524EVM Schematic, Layout, and Bill of Materials (BOM) ..................................................... 10
List of Figures
1 THS4521EVM Schematic ................................................................................................... 52 THS4521EVM: Top Layer (Layer 1) ....................................................................................... 63 THS4521EVM: Ground Layer (Layer 2) .................................................................................. 64 THS4521EVM: Ground Layer (Layer 3) .................................................................................. 65 THS4521EVM: Bottom Layer (Layer 4) ................................................................................... 6All trademarks are the property of their respective owners.
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1 Description
Description
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6 THS4522EVM: Schematic 1 ................................................................................................ 87 THS4522EVM: Schematic 2 ................................................................................................ 88 THS4522EVM: Top Layer (Layer 1) ....................................................................................... 99 THS4522EVM: Ground Layer (Layer 2) .................................................................................. 910 THS4522EVM: Ground Layer (Layer 3) .................................................................................. 911 THS4522EVM: Bottom Layer (Layer 4) ................................................................................... 912 THS4524EVM: Schematic 1 .............................................................................................. 1113 THS4524EVM: Schematic 2 .............................................................................................. 1114 THS4524EVM: Schematic 3 .............................................................................................. 1215 THS4524EVM: Schematic 4 .............................................................................................. 1216 THS4524EVM: Top Layer (Layer 1) ..................................................................................... 1317 THS4524EVM: Ground Layer (Layer 2) ................................................................................. 1318 THS4524EVM: Ground Layer (Layer 3) ................................................................................. 1319 THS4524EVM: Bottom Layer (Layer 4) ................................................................................. 13
List of Tables
1 EVM Specifications .......................................................................................................... 22 Jumper Configuration ....................................................................................................... 33 THS4521 Parts List .......................................................................................................... 44 THS4522EVM Parts List .................................................................................................... 75 THS4524EVM Parts List .................................................................................................. 10
The THS4521 ,THS4522 , and THS4524 family of devices are very low-power, fully differential operationalamplifiers with rail-to-rail output and an input common-mode range that includes the negative rail. Theseamplifiers are designed for low-power data-acquisition systems and high-density applications where powerdissipation is a critical parameter.
The THS4521EVM is an evaluation module (EVM) for the single version, THS4521, in an SO-8 (D)package. The THS4522EVM is an evaluation module for the dual version, THS4522, in a TSSOP-16 (PW)package. The THS4524EVM is an evaluation module for the quad version, THS4524, in a TSSOP-32(DBT) package.
The THS4521/2/4EVMs are designed to quickly and easily demonstrate the functionality and versatility ofthese amplifiers. Each EVM is ready to connect to power, a signal source, and a variety of testinstruments through the use of onboard connectors. The default amplifier configuration for each module isa single-ended input, single-ended output (via transformer), and split-supply operation. The EVMs can beeasily configured for differential input, differential output, and single-supply operation. Throughout thisdocument, the acronym EVM and the phrases evaluation module and evaluation board are synonymouswith the THS4521/2/4EVMs. For clarity of reading, the abbreviation THS4521/2/4EVMs refers to theTHS4521EVM, THS4522EVM, and THS4524EVM, unless otherwise noted.
The electrical specifications for the THS4521/2/4EVMs are summarized in Table 1 .
Table 1. EVM Specifications
Parameter Units
Single-supply voltage range (V
S–
= ground) 2.5 V to 5.5 VSplit Supply voltage range (V
S±
)±1.25 V to 2.75 VSupply current (I
S±
) 1.1 mA/A, typInput voltage (V
I
) V
S
±, maxOutput drive (I
O
)±55 mA, typ
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2 Power Connections
2.1 Split-Supply Operation
2.2 Single-Supply Operation
3 Input and Output Connections
3.1 Power-Down Operation
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Power Connections
The THS4521/2/4EVMs are equipped with banana jacks for easy power connections. The positive supplyinput is labeled V
S+
. The negative supply input is labeled V
S–
. Ground is labeled GND.
For split-supply operation, apply the positive supply voltage to V
S+
, the negative supply voltage to V
S–
, andthe ground reference from supply to GND.
For single-supply operation, connect V
S–
to GND with a jumper, and apply the positive supply voltage toV
S+
.
The THS4521/2/4EVMs are equipped with SMA connectors for easy connection of signal generators andanalysis equipment. As shipped from the factory, the EVMs are configured for single-ended input andoutput with termination for connection to 50- Ωtest equipment. For best results, the signal should berouted to and from the EVM with cables that have 50- Ωcharacteristic impedance. Refer to the THS4521,THS4522, THS4524 product data sheet , and the schematics and layouts provided in this user guide fordetails on how to reconfigure the EVM board for differential input or output operation.
The THS4521/2/4EVMs enable normal operation of the respective devices, or they can each be placedinto a power-down mode through the placement of jumpers, as shown in Table 2 .
Table 2. Jumper Configuration
EVM Jumper Operating Mode
Open NormalTHS4521EVM JP1
Shorted Power downOpen CH1-NormalJP1
Shorted CH1-Power downTHS4522EVM
Open CH2-NormalJP2
Shorted CH2-Power downOpen CH1-NormalJP1
Shorted CH1-Power downOpen CH2-NormalJP2
Shorted CH2-Power downTHS4524EVM
Open CH3-NormalJP3
Shorted CH3-Power downOpen CH4-NormalJP4
Shorted CH4-Power down
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4 THS4521EVM Schematic, Layout, and Bill of Materials (BOM)
THS4521EVM Schematic, Layout, and Bill of Materials (BOM)
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Table 3 lists the bill of materials for the THS4521EVM.
Figure 1 through Figure 5 show the schematic and printed circuit board (PCB) layouts, respectively, for theTHS4521EVM.
Table 3. THS4521 Parts List
SMD Reference ManufacturerItem Description Size Designator Qty Part Number
Capacitor, 10.0 µF, ceramic,1 0805 C7-C10 4 (AVX) 08056D106KAT2AX5R, 6.3 V2 Capacitor, 0.1 µF, ceramic, X7R, 16 V 0603 C3, C5, C11, C12 4 (AVX) 0603YC104KAT2ACapacitor, 0.22 µF, ceramic,3 0603 C1, C4, C6 3 (AVX) 0603ZC224KAT2AX7R, 10 V4 Open 0603 C2, C13-C16 5R1-R3, R7-R9, R18,5 Open 0603 12R19, R21-R23, R266 Resistor, 0 Ω0603 R24, R25 2 (ROHM) MCR03EZPJ0007 Resistor, 49.9 Ω, 1/10W, 1% 0603 R6 1 (ROHM) MCR03EZPFX49R98 Resistor, 52.3 Ω, 1/10W, 1% 0603 R10, R11, R20 3 (ROHM) MCR03EZPFX52R39 Resistor, 487 Ω, 1/10W, 1% 0603 R16, R17 2 (ROHM) MCR03EZPFX487010 Resistor, 1k Ω, 1/10W, 1% 0603 R12-R15 4 (ROHM) MCR03EZPFX100111 Resistor, 0 Ω0805 R4, R5 2 (ROHM) MCR10EZPJ00012 Open T1 113 Transformer, RF T2 1 (MINI-CIRCUITS) ADT1-1WTJack, banana receptance,14 J4, J5, J8 3 (SPC) 8130.25-in diameter hole15 Open J1, J3, J6, J7, J10, J11 616 Connector, edge, SMA PCB jack J2, J9 2 (JOHNSON) 142-0701-80117 Header, 0.1 in CTRS, 0.025-in sq. pins 2 POS. JP1 1 (SULLINS) PBC36SAAN18 Shunts JP1 1 (SULLINS) SSC02SYAN19 Test point, red TP1 1 (KEYSTONE) 500020 Test point, black TP2, TP3 2 (KEYSTONE) 500121 IC, THS4521 U1 1 (TI) THS4521D22 Standoff, 4-40 hex, 0.625 in 4 (KEYSTONE) 180823 Screw, Phillips, 4-40, 0.250 in 4 SHR-0440-016-SN24 Board, printed circuit 1 (TI) EDGE# 6494532
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TP2 TP3
C3
0.1 Fm
C603 C0805
C5
0.1 Fm
C8
10 Fm
C7
10 Fm
VS-
J4
VS-
C12
0.1 Fm
C603C0805
C11
0.1 Fm
C9
10 Fm
C10
10 Fm
VS+ VS+
J8
VS+
C15
Open
C16
Open
C13
Open
C14
Open
VS-
J5
GND
R1
R2
R12
1kW
R13
1kW
R14
1kW
R15
1kW
R25
0WJ9
J10
R26
R16
487 W
R20
52.3 W
R17
487 W
R22
2
1
3
5
6
4
R21
R7
5
4
6
2
3
1
R3
R4
0W
R6
49.9 W
C1
0.22 Fm
R8
C2
C4
0.22 Fm
VS-
VS-
VS+
R23
R18
R24
0W
R9
R5
0W
R10
52.3 W
R11
52.3 W
J6
R19
J7
J1
J2
T2T1
TP1
VOUT+
VOUT-
4
5
6
3
1
8
7
2
PD
CM
J11
JP1
J3
C6
0.22 Fm
U1:
THS4521
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THS4521EVM Schematic, Layout, and Bill of Materials (BOM)
Figure 1. THS4521EVM Schematic
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THS4521EVM Schematic, Layout, and Bill of Materials (BOM)
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Figure 2. THS4521EVM: Top Layer (Layer 1)
Figure 3. THS4521EVM: Ground Layer (Layer 2)
Figure 5. THS4521EVM: Bottom Layer (Layer 4)Figure 4. THS4521EVM: Ground Layer (Layer 3)
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5 THS4522EVM Schematic, Layout, and Bill of Materials (BOM)
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THS4522EVM Schematic, Layout, and Bill of Materials (BOM)
Table 4 lists the bill of materials for the THS4522EVM.
Figure 6 through Figure 11 show the schematic and PCB layouts, respectively, for the THS4522EVM.
Table 4. THS4522EVM Parts List
SMD Reference ManufacturerItem Description Size Designator Qty Part Number
Capacitor, 10.0 µF, ceramic,1 0805 C7-C10 4 (AVX) 08056D106KAT2AX5R, 6.3 V2 Capacitor, 0.1 µF, ceramic, X7R, 16 V 0603 C3, C5, C11, C12 4 (AVX) 0603YC104KAT2ACapacitor, 0.22 µF, ceramic,3 0603 C2, C4, C6, C18-C20 6 (AVX) 0603ZC224KAT2AX7R, 10 V
C1, C13-C17,4 Open 0603 10C21-C245 Resistor, 52.3 Ω, 1/16W, 1% 0402 R10, R11, R36, R37 4 (KOA) RK73H1ETTP52R3F6 Resistor, 487 Ω, 1/16W, 1% 0402 R16, R17, R42, R43 4 (KOA) RK73H1ETTP4870F7 Resistor, 1 k Ω, 1/16W, 1% 0402 R12-R15, R38-R41 8 (KOA) RK73H1ETTP1001FR1-R3, R6-R8, R19,R22, R23, R26-R29,8 Open 0603 20R32-R34, R45, R48,R49, R529 Resistor, 0 Ω0603 R24, R25, R50, R51 4 (ROHM) MCR03EZPJ000
(ROHM)10 Resistor, 49.9 Ω, 1/10W, 1% 0603 R9, R35 2
MCR03EZPFX49R9
(ROHM)11 Resistor, 52.3 Ω, 1/10W, 1% 0603 R18, R44 2
MCR03EZPFX52R312 Open 0805 R20, R21, R46, R47 413 Resistor, 0 Ω0805 R4, R5, R30, R31 4 (ROHM) MCR10EZPJ00014 Open T1, T3 2
(MINI-CIRCUITS)15 Transformer, RF T2, T4 2
ADT1-1WTJack, banana receptance,16 J3-J5 3 (SPC) 8130.25-in diameter hole17 Open J1, J7, J8, J11-J15 818 Connector, edge, SMA PCB jack J2, J6, J9, J10 4 (JOHNSON) 142-0701-80119 Header, 0.1 in CTRS, 0.025-in sq. pins 2 POS. JP1, JP2 2 (SULLINS) PBC36SAAN20 Shunts JP1, JP2 2 (SULLINS) SSC02SYAN21 Test point, red TP1, TP4 2 (KEYSTONE) 500022 Test point, black TP2, TP3 2 (KEYSTONE) 500123 IC, THS4522 U1 1 (TI) THS4522PW24 Standoff, 4-40 hex, 0.625 in 4 (KEYSTONE) 180825 Screw, Phillips, 4-40, 0.250 in 4 (BF) PMS4400031PH
(TI) EDGE# 6494533,26 Board, printed circuit 1
REV.A
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TP2 TP3
C3
0.1 Fm
C603 C0805
C5
0.1 Fm
C8
10 Fm
C7
10 Fm
VS-
J3
VS-
C12
0.1 Fm
C603C0805
C11
0.1 Fm
C9
10 Fm
C10
10 Fm
VS+
J5
VS+ VS+
C15
Open
C16
Open
C13
Open
C14
Open
VS-
VS+
C22
Open
C21
Open
C24
Open
C23
Open
VS-
J4
GND
R1
R2
R21
R12
1kW
R13
1kW
R14
1kW
R15
1kW
R25
0WJ6
J7
R26
R16
487 W
R18
52.3 W
R17
487 W
R22
2
1
3
5
6
4
R19
R6
5
4
6
2
3
1
R3
R4
0W
R9
49.9 W
C2
0.22 Fm
R8
R20
C4
0.1 Fm
VS-
VS-
VS+
R23
R24
0W
R7
R5
0W
R10
52.3 W
R11
52.3 W
J1
J2
T2T1
TP1
VOUT+
VOUT-
14
15
16
13
3
2
1
4
PD
CM
J14
JP1
J12
C6
0.1 Fm
C1
U1:A
THS4522
R27
R28
R47
R38
1kW
R39
1kW
R40
1kW
R41
1kW
R51
0WJ10
J11
R52
R42
487 W
R44
52.3 W
R43
487 W
R48
2
1
3
5
6
4
R45
R32
5
4
6
2
3
1
R3
R30
0W
R35
49.9 W
C18
0.22 Fm
R34
R46
C19
0.22 Fm
VS-
VS-
VS+
R49
R50
0W
R33
R31
0W
R36
52.3 W
R37
52.3 W
J8
J9
T4T3
TP4
VOUT+
VOUT-
10
11
12
9
7
6
5
8
PD
CM
J15
JP2
J13
C20
0.22 Fm
C17
U1:B
THS4522
THS4522EVM Schematic, Layout, and Bill of Materials (BOM)
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Figure 6. THS4522EVM: Schematic 1
Figure 7. THS4522EVM: Schematic 2
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THS4522EVM Schematic, Layout, and Bill of Materials (BOM)
Figure 8. THS4522EVM: Top Layer (Layer 1)
Figure 9. THS4522EVM: Ground Layer (Layer 2)
Figure 11. THS4522EVM: Bottom Layer (Layer 4)
Figure 10. THS4522EVM: Ground Layer (Layer 3)
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6 THS4524EVM Schematic, Layout, and Bill of Materials (BOM)
THS4524EVM Schematic, Layout, and Bill of Materials (BOM)
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Table 5 lists the bill of materials for the THS4524EVM.
Figure 12 through Figure 19 show the schematics and PCB layouts, respectively, for the THS4524EVM.
Table 5. THS4524EVM Parts List
SMD Reference ManufacturerItem Description Size Designator Qty Part Number
1 Capacitor, 10.0 µF, ceramic, X5R, 6.3 V 805 C7-C10, C33 5 (AVX) 08056D106KAT2A2 Open 402 C29-C32 4C3, C5, C11-C16, (MURATA)3 Capacitor, 0.1 µF, ceramic, X7R, 16 V 402 12C34-C37 GRM155R71C104KA88DC2, C4, C6, C18-C21,4 Capacitor, 0.22 µF, ceramic, X7R, 10 V 603 12 (AVX) 0603ZC224KAT2AC23-C25, C27, C285 Open 603 C1, C17, C22, C26 4R10, R11, R36, R37,6 Resistor, 52.3 Ω, 1/16W, 1% 402 8 (KOA) RK73H1ETTP52R3FR53, R54, R79, R90R16, R17, R42, R43,7 Resistor, 487 Ω, 1/16W, 1% 402 8 (KOA) RK73H1ETTP4870FR77, R78, R103, R104R12-R15, R38-R41,8 Resistor, 1 k Ω, 1/16W, 1% 402 R70, R71, R74, R76, 16 (KOA) RK73H1ETTP1001FR96, R97, R100, R102R1-R3, R6-R8, R19,R22, R23, R26-R29,R32-R34, R45, R48,R49, R52, R57, R59,9 Open 603 R60, R62, R63, R65, 40R66, R69, R72, R75,R83, R85, R86, R88,R89, R91, R92, R95,R98, R101R24, R25, R50, R51,10 Resistor, 0 Ω603 8 (ROHM) MCR03EZPJ000R55, R73, R81, R9911 Resistor, 49.9 Ω, 1/10W, 1% 603 R9, R35, R61, R87 4 (ROHM) MCR03EZPFX49R912 Resistor, 52.3 Ω, 1/10W, 1% 603 R18, R44, R64, R90 4 (ROHM) MCR03EZPFX52R3R20, R21, R46, R47,13 Open 805 8R56, R58, R82, R84R4, R5, R30, R31, R67,14 Resistor, 0 Ω805 8 (ROHM) MCR10EZPJ000R68, R93, R9415 Open T1, T3, T5, T7 416 Transformer, RF T2, T4, T6, T8 4 (MINI-CIRCUITS) ADT1-1WTJack, banana receptance,17 2 POS. J3, J4, J5 3 (SPC) 8130.25-in diameter hole
J1, J7, J8, J11, J13,18 Open 16J14, J17, J18, J20-J27J2, J6, J9, J10, J12,19 Connector, edge, SMA PCB jack 8 (JOHNSON) 142-0701-801J15, J16, J1920 Header, 0.1 in CTRS, 0.025-in sq. pins JP1-JP4 4 (SULLINS) PBC36SAAN21 Shunts JP1-JP4 4 (SULLINS) SSC02SYAN22 Test point, red TP1, TP4-TP6 4 (KEYSTONE) 500023 Test point, black TP2, TP3 2 (KEYSTONE) 500124 IC, THS4524 U1 1 (TI) THS4524DBT25 Standoff, 4-40 hex, 0.625 in 4 (KEYSTONE) 180826 Screw, Phillips, 4-40, 0.250 in 4 (BF) PMS4400031PH27 Board, printed circuit 1 (TI) EDGE# 6494534, REV.A
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TP2 TP3
R1
R2
R12
1kW
R13
1kW
R14
1kW
R15
1kW
R25
0WJ6
J7
R26
R16
487 W
R18
52.3 W
R17
487 W
R22
2
1
3
5
6
4
R19
R6
5
4
6
2
3
1
R3
R4
0W
R9
49.9 W
C2
0.22 Fm
R8
C1
C4
0.22 Fm
VS-
VS-
VS+
R23
R24
0W
R7
R5
0W
R10
52.3 W
R11
52.3 W
J1
J2
T2T1
TP1
VOUT+
VOUT-
36
37
38
35
3
2
1
4
PD
CM
J24
JP1
J20
C6
0.22 Fm
R21
R20
VS-
VS+
C
Open
29
C0402
J4
GND
C0402
C
0.1 Fm
15 C
0.1 Fm
37 C
0.1 Fm
36 C
0.1 Fm
35 C
0.1 Fm
34 C
0.1 Fm
33 C
10 Fm
10
C
0.1 Fm
5C
0.1 Fm
16
J3
VS-
C
10 Fm
9
VS-
C
0.1 Fm
3C
0.1 Fm
13 C
0.1 Fm
14 C
0.1 Fm
11 C
0.1 Fm
12
C
10 Fm
8
J5
VS+
C
10 Fm
7
VS+
U1:A
THS4524DBT
R27
R28
R38
1kW
R39
1kW
R40
1kW
R41
1kW
R51
0WJ10
J11
R52
R42
487 W
R44
52.3 W
R43
487 W
R48
2
1
3
5
6
4
R45
R32
5
4
6
2
3
1
R29
R30
0W
R35
49.9 W
C18
0.22 Fm
R34
C17
C19
0.22 Fm
VS-
VS-
VS+
R49
R50
0W
R33
R31
0W
R36
52.3 W
R37
52.3 W
J8
J9
T2T1
TP4
VOUT+
VOUT-
31
32
33
30
8
7
6
9
PD
CM
J25
JP2
J21
C20
0.22 Fm
R47
R46
VS-
VS+
C
Open
30
U1:B
THS4524DBT
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THS4524EVM Schematic, Layout, and Bill of Materials (BOM)
Figure 12. THS4524EVM: Schematic 1
Figure 13. THS4524EVM: Schematic 2
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R69
R66
R71
1kW
R70
1kW
R75
1kW
R74
1kW
R73
0WJ15
J14
R72
R77
487 W
R63
52.3 W
R78
487 W
R63
2
1
3
5
6
4
R64
R32
5
4
6
2
3
1
R59
R68
0W
R61
49.9 W
C23
0.22 Fm
R60
C22
C24
0.22 Fm
VS-
VS-
VS+
R57
R55
0W
R62
R67
0W
R54
52.3 W
R53
52.3 W
J13
J12
T2T1
TP5
VOUT+
VOUT-
26
27
28
25
13
12
11
14
PD
CM
J26
JP3
J22
C21
0.22 Fm
R56
R58
VS-
VS+
C
Open
31
U1:C
THS4524DBT
R95
R92
R97
1kW
R96
1kW
R102
1kW
R100
1kW
R99
0WJ19
J18
R98
R103
487 W
R90
52.3 W
R104
487 W
R91
2
1
3
5
6
4
R89
R101
5
4
6
2
3
1
R85
R94
0W
R87
49.9 W
C27
0.22 Fm
R86
C26
C28
0.22 Fm
VS-
VS-
VS+
R83
R81
0W
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THS4524DBT
THS4524EVM Schematic, Layout, and Bill of Materials (BOM)
www.ti.com
Figure 14. THS4524EVM: Schematic 3
Figure 15. THS4524EVM: Schematic 4
THS4521/2/4EVM 12 SBOU080 – July 2009Submit Documentation Feedback
www.ti.com
THS4524EVM Schematic, Layout, and Bill of Materials (BOM)
Figure 16. THS4524EVM: Top Layer (Layer 1)
Figure 17. THS4524EVM: Ground Layer (Layer 2)
Figure 19. THS4524EVM: Bottom Layer (Layer 4)Figure 18. THS4524EVM: Ground Layer (Layer 3)
SBOU080 – July 2009 THS4521/2/4EVM 13Submit Documentation Feedback
EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh .No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 0 V to 5.5 V and the output voltage range of 3 V to 5.5 V.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than +85 °C. The EVM is designed to operateproperly with certain components above +85 °C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated
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