www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE.Sellers’ and manufacturer s’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,
INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_QP_II_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenber g 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15,8/F W ah Wai Industrial Centre
No.38-40,Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Q-Pad
®
II
Foil-For mat Grease Replacement for Maximum Heat Tr ansfer
Features and Benefits
• Thermal impedance:
0.22°C-in2/W (@50 psi)
• Maximum heat transfer
• Aluminum foil coated both sides
• Designed to replace thermal grease
Q-Pad II is a composite of aluminum foil coated
on both sides with thermally / electr ically
conductive Sil-Pad r ubber.The mater ial is
designed for those applications in which maxi-
mum heat transfer is needed and electrical
isolation is not required. Q-Pad II is the ideal
ther mal interface mater ial to replace messy
ther mal grease compounds.
Q-Pad II eliminates problems associated with
grease such as contamination of reflow solder
or cleaning oper ations. Unlike grease , Q-Pad I I
can be used prior to these operations.Q-Pad II
also eliminates dust collection which can cause
possible surface shorting or heat buildup.
Typical Applications Include:
• Between a transistor and a heat sink
• Between two large surfaces such as an L-br acket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
tr ansformers and solid state relays
Configurations Available:
• Sheet form, die-cut parts and roll for m
• With or without pressure sensitive adhesive
Building a Part Number Standard Options
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
TYPICAL PROPERTIES OF Q-PAD II
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carr ier Aluminum Aluminum —
Thickness (inch) / (mm) 0.006 0.152 ASTM D374
Hardness (Shore A) 93 93 ASTM D2240
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) Non-Insulating Non-Insulating ASTM D149
Dielectric Constant (1000 Hz) NA NA ASTM D150
Volume Resistivity (Ohm-meter) 102102ASTM D257
Flame Rating V-O V-O U.L.94
THERMAL
Thermal Conductivity (W/m-K) 2.5 2.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Perfor mance (°C/W) 2.44 1.73 1.23 1.05 0.92
Thermal Impedance (°C-in2/W) (1) 0.52 0.30 0.22 0.15 0.12
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance .These values are provided for
reference only.Actual application perfor mance is directly related to the surface roughness, flatness and pressure applied.
