© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1Publication Order Number:
MBRA320/D
MBRA320T3G
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
Employing the Schottky Barrier principle in a large area
metal-to-silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•Small Compact Surface Mountable Package with J-Bent Leads
•Rectangular Package for Automated Handling
•Highly Stable Oxide Passivated Junction
•Very Low Forward Voltage Drop
•Guardring for Stress Protection
•Pb-Free Package is Available
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 70 mg (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Shipped in 12 mm tape, 5000 units per 13 inch reel
•Polarity: Cathode Lead Indicated by Polarity Band
•ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
•Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20 V
Average Rectified Forward Current
(At Rated VR, TL = 100°C)
IO3.0 A
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 80 A
Storage Temperature Tstg -65 to +150 °C
Operating Junction Temperature TJ-65 to +125 °C
Voltage Rate of Change
(Rated VR, TJ = 25°C)
dv/dt 10,000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping†
ORDERING INFORMATION
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERES
20 VOLTS
MARKING DIAGRAM
SMA
CASE 403D
PLASTIC
A32
AYWWG
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRA320T3G SMA
(Pb-Free)
5000/Tape & Reel
Cathode Anode
A32 = Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb-Free Package
12
1
2
MBRA320T3G
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance - Junction-to-Lead (Note 1)
Thermal Resistance - Junction-to-Ambient (Note 1)
RθJL
RθJA
15
80
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2) (IF = 3.0 A, TJ = 25°C) VF0.50 Volts
Maximum Instantaneous Reverse Current (Note 2)
(VR = 20 V)
IRTJ = 25°C TJ = 100°CmA
2.0 20
1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤2.0%.
TYPICAL CHARACTERISTICS
10
0.1
0.20.0 0.4 0.6
VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
1
0.8
IF
, FORWARD CURRENT (AMPS)
TJ = 25°C
TJ = 125°C
TJ = 100°C
TJ = -65°C
VF
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V)
IF
, FORWARD CURRENT (AMPS)
1.00.30.1 0.5 0.7 0.9
10
0.1
0.20.0 0.4 0.6
1
0.8
TJ = 25°C
TJ = 125°C
TJ = 100°C
TJ = -65°C
0.30.1 0.5 0.7 0.9 1.0
MBRA320T3G
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3
TYPICAL CHARACTERISTICS
02010
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
IR, REVERSE CURRENT (AMPS)
TJ = 25°C
TJ = 100°C
1.E-06
1.E-04
1.E-03
1.E-02
1.E-01
02010
VR, REVERSE VOLTAGE (V)
IR, MAXIMUM REVERSE CURRENT (AMPS)
TJ = 25°C
TJ = 100°C
1.E-06
1.E-04
1.E-03
1.E-02
1.E-01
013050 60 70 80
TL, LEAD TEMPERATURE (°C)
Figure 5. Current Derating Figure 6. Forward Power Dissipation
100 110
IO, AVERAGE FORWARD CURRENT (AMPS)
0
40123
IO, AVERAGE FORWARD CURRENT (A)
5
5
PFO, AVERAGE POWER DISSIPATION (W)
1
2
3
4
5
SQUARE WAVE
dc
1
2
6
6
RqJL = 15°C/W
SQUARE
WAVE
dc
1.E-05
515 515
3
4
1.E-05
Figure 7. Typical Capacitance
700
0
360162024
VR, REVERSE VOLTAGE (V)
100
28 32 40
C, CAPACITANCE (pF)
TJ = 25°C
200
300
400
500
600
4812
90 120
MBRA320T3G
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4
TYPICAL CHARACTERISTICS
Figure 8. Thermal Response, Junction-to-Ambient (min pad)
t, TIME (S)
0.0001 0.001 0.10.000001 0.01 1 10 100 1000
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
0.01
1
10
1000
D = 0.5
0.2
0.1
SINGLE PULSE
0.05
0.02
0.01
Figure 9. Thermal Response, Junction to Ambient (1 inch pad)
t, TIME (S)
0.0001 0.001 0.10.000001 0.01 1 10 100 1000
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
0.01
1
10
100
D = 0.5
0.2
0.1
SINGLE PULSE
0.05
0.02
0.01
100
0.1
0.00001
0.1
0.00001
MBRA320T3G
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5
PACKAGE DIMENSIONS
SMA
CASE 403D-02
ISSUE C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.91 2.16 2.41 0.075
INCHES
A1 0.05 0.10 0.15 0.002
b1.27 1.45 1.63 0.050
c0.15 0.28 0.41 0.006
D2.29 2.60 2.92 0.090
E4.06 4.32 4.57 0.160
L0.76 1.14 1.52 0.030
0.085 0.095
0.004 0.006
0.057 0.064
0.011 0.016
0.103 0.115
0.170 0.180
0.045 0.060
NOM MAX
4.83 5.21 5.59 0.190 0.205 0.220
HE
E
bD
Lc
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02.
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
4.0
0.157
2.0
0.0787
2.0
0.0787
ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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Phone: 81-3-5773-3850
MBRA320T3/D
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