DATA SH EET
Product specification
Supersedes data of 1998 Dec 04 1999 Nov 11
DISCRETE SEMICONDUCTORS
BYD57 series
Ultra-fast soft-recovery
controlled avalanche rectifiers
b
ook, halfpage
M3D121
1999 Nov 11 2
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Shipped in 8 mm embossed tape
Smallest surface mount rectifier
outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec(1)
technology. The SOD87 is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
BYD57D 200 V
BYD57G 400 V
BYD57J 600 V
BYD57K 800 V
BYD57M 1000 V
BYD57U 1200 V
BYD57V 1400 V
VRcontinuous reverse voltage
BYD57D 200 V
BYD57G 400 V
BYD57J 600 V
BYD57K 800 V
BYD57M 1000 V
BYD57U 1200 V
BYD57V 1400 V
IF(AV) average forward current Ttp =85°C; see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD57D to M 1.0 A
BYD57U and V 1.2 A
IF(AV) average forward current Tamb =60°C; PCB mounting (see
Fig.17); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD57D to M 0.4 A
BYD57U and V 0.4 A
IFRM repetitive peak forward current Ttp =85°C; see Figs 6 and 7
BYD57D to M 8.5 A
BYD57U and V 11 A
1999 Nov 11 3
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
ELECTRICAL CHARACTERISTICS
Tj=25°C unless otherwise specified.
IFRM repetitive peak forward current Tamb =60°C; see Figs 8 and 9
BYD57D to M 3.0 A
BYD57U and V 3.7 A
IFSM non-repetitive peak forward current t = 10 ms half sinewave; Tj=25°C
prior to surge; VR=V
RRMmax
5.0 A
ERSM non-repetitive peak reverse
avalanche energy L = 120 mH; Tj=T
j max prior to
surge; inductive load switched off 10 mJ
Tstg storage temperature 65 +175 °C
Tjjunction temperature see Fig.12 65 +175 °C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VFforward voltage IF= 1 A; Tj=T
j max;
see Figs 13 and 14
BYD57D to M −−2.1 V
BYD57U and V −−1.7 V
VFforward voltage IF=1A;
see Figs 13 and 14
BYD57D to M −−3.6 V
BYD57U and V −−2.3 V
V(BR)R reverse avalanche breakdown
voltage IR= 0.1 mA
BYD57D 300 −−V
BYD57G 500 −−V
BYD57J 700 −−V
BYD57K 900 −−V
BYD57M 1100 −−V
BYD57U 1300 −−V
BYD57V 1500 −−V
I
Rreverse current VR=V
RRMmax;
see Fig.15 −− 5µA
V
R
=V
RRMmax;
Tj= 165 °C; see Fig.15 −−100 µA
trr reverse recovery time when switched from
IF= 0.5 A to IR=1A;
measured at IR= 0.25 A;
see Fig.18
BYD57D to J −−30 ns
BYD57K and M −−75 ns
BYD57U and V −−150 ns
Cddiode capacitance f = 1 MHz; VR=0;
see Fig.16 20 pF
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
1999 Nov 11 4
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.17.
For more information please refer to the
‘General Part of associated Handbook’
.
maximum slope of reverse recovery
current when switched from
IF=1AtoV
R30 V and
dIF/dt = 1A/µs;
see Fig.19
BYD57D to J −− 7A/µs
BYD57K and M −− 6A/µs
BYD57U and V −− 5A/µs
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-tp thermal resistance from junction to tie-point 30 K/W
Rth j-a thermal resistance from junction to ambient note 1 150 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dIR
dt
--------
1999 Nov 11 5
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
GRAPHICAL DATA
BYD57D to M
a = 1.42; VR=V
RRMmax;δ= 0.5.
Switched mode application.
Fig.2 Maximum permissible average forward
currentasafunctionoftie-pointtemperature
(including losses due to reverse leakage).
0 40 80 120 160 200
0
0.4
0.8
1.2
1.6
2.0
T ( C)
tp o
IF(AV)
(A)
MSA961
BYDU and V
a = 1.42; VR=V
RRMmax;δ= 0.5.
Switched mode application.
handbook, halfpage
0 200
2.0
0
0.4
MGM273
0.8
1.2
1.6
40 80 120 160
IF(AV)
(A)
Ttp (°C)
Fig.3 Maximum permissible average forward
currentasafunctionoftie-pointtemperature
(including losses due to reverse leakage).
BYD57D to M
a = 1.42; VR=V
RRMmax;δ= 0.5.
Device mounted as shown in Fig.17.
Switched mode application.
Fig.4 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
0 40 80 120 160 200
0
0.1
0.2
0.3
0.4
0.5
Tamb ( C)
o
IF(AV)
(A)
MSA960
Fig.5 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
BYD57U and V
a = 1.42; VR=V
RRMmax;δ= 0.5.
Device mounted as shown in Fig.17.
Switched mode application.
handbook, halfpage
0
0.6
0.4
0.2
020040 80 120 160
MGM272
IF(AV)
(A)
Tamb (°C)
1999 Nov 11 6
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
handbook, full pagewidth
10 2
0
2
4
6
8
10
IFRM
(A)
10 111010
2103104
tp (ms)
MSA964
0.1
0.5
1
δ = 0.05
0.2
BYD57D to M
Ttp =85°C; Rth j-tp = 30 K/W.
VRRMmax during 1 −δ; curves include derating for Tj max at VRRM = 1000 V.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
16
4
0
12
8
MGM275
10210111010
2103104
IFRM
(A)
tp (ms)
δ = 0.05
0.1
0.2
0.5
1
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
BYD57U and V
Ttp =85°C; Rth j-tp = 30 K/W.
VRRMmax during 1 −δ; curves include derating for Tj max at VRRM = 1000 V.
1999 Nov 11 7
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
handbook, full pagewidth
10 2
0
1
2
3
4
IFRM
(A)
10 111010
2103104
MSA965
0.1
0.5
1
δ = 0.05
0.2
tp (ms)
BYD57D to M
Tamb =60°C; Rth j-a = 150K/W.
VRRMmax during 1 −δ; curves include derating for Tj max at VRRM = 1000 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
4
1
0
3
2
MGM274
10210111010
2103104
IFRM
(A)
tp (ms)
δ = 0.05
0.1
0.2
0.5
1
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
BYD57U and V
Tamb =60°C; Rth j-a = 150K/W.
VRRMmax during 1 −δ; curves include derating for Tj max at VRRM = 1000 V.
1999 Nov 11 8
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
BYD57D to M
a=I
F(RMS)/IF(AV); VR=V
RRMmax;δ= 0.5.
Fig.10 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
handbook, halfpage
0
3
2
1
01.0
MGC525
0.5
P
(W)
IF(AV) (A)
2
a=3 1.57
2.5 1.42
Fig.11 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
BYD57U and V
a=I
F(RMS)/IF(AV); VR=V
RRMmax;δ= 0.5.
handbook, halfpage
02
5
0
1
MGM271
2
3
4
0.8 1.2 1.60.4
P
(W)
IF(AV) (A)
1.42
a = 3 2.5 2 1.57
Solid line = VR.
Dotted line = VRRM;δ= 0.5.
Fig.12 Maximumpermissiblejunctiontemperature
as a function of reverse voltage.
handbook, halfpage
200
0 2000
0
MBK457
1000
100
V (V)
R
Tj
( C)
o
UV
DGJKM
BYD57D to M
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
Fig.13 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
024 86
1
2
3
4
I
F
(A)
V (V)
F
MSA963
1999 Nov 11 9
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
BYD57U and V
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
Fig.14 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
01234
4
3
1
0
2
MGM270
IF
(A)
VF (V)
VR=V
RRMmax.
Fig.15 Reverse current as a function of junction
temperature; maximum values.
handbook, halfpage
2000
103
MGC532
102
10
1100 Tj ( C)
o
IR
(µA)
f = 1 MHz; Tj=25°C.
Fig.16 Diode capacitance as a function of reverse
voltage; typical values.
handbook, halfpage
1
MGC524
10 102103
1
102
10
Cd
(pF)
VR (V)
MSB213
4.5
2.5
1.25
50
50
Fig.17 Printed-circuit board for surface mounting.
Dimensions in mm.
1999 Nov 11 10
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
handbook, full pagewidth
10
1
50
25 V
DUT
MAM057
+trr
0.5
0
0.5
1.0
IF
(A)
IR
(A)
t
0.25
Fig.18 Test circuit and reverse recovery time waveform and definition.
Input impedance oscilloscope: 1 M, 22 pF; tr7 ns.
Source impedance: 50 ; tr15 ns.
Fig.19 Reverse recovery definitions.
n
dbook, halfpage
10%
100%
dI
dt
t
trr
IF
IR
MGC499
F
dI
dt
R
1999 Nov 11 11
Philips Semiconductors Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers BYD57 series
PACKAGE OUTLINE
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOD87 100H03 99-03-31
99-06-04
Hermetically sealed glass surface mounted package;
ImplotecTM(1) technology; 2 connectors SOD87
UNIT D
mm 2.1
2.0 2.0
1.8 3.7
3.3 0.3
D1 HL
DIMENSIONS (mm are the original dimensions) H
DD1
LL
(2)
0 1 2 mm
scale
Notes
1. Implotec is a trademark of Philips.
2. The marking indicates the cathode.
ka
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999 68
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Printed in The Netherlands 135002/04/pp12 Date of release: 1999 Nov 11 Document order number: 9397 750 06267