Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) Series/Type: Ordering code: B32354S B32354S3* Date: Version: July 2020 4 TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Typical applications Output AC filtering for power converters, UPS, motor drives Climatic Max. operating temperature: +85 C Climatic category (IEC 60068-1:2013): 40/085/21 Construction Dielectric: polypropylene (PP) Electrode: metallized segmented film Dry type capacitor Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0) Dimension drawing Features Humidity protected: +85C / 85% rel. humidity (RH) at 350 VRMS for 1000 hour THB Grade III Test B (Refer to IEC60384-14:2013/AMD1:2016) Optimized AC voltage performance High ripple current/frequency handling capability Highest safety level 10 000 AFC to UL 810 For PCB mounting Terminals Parallel wire leads, lead-free tinned 4 pins version Special lead lengths available on request Dimensions (in mm) Version Lead space Lead Type (e0.4) diameter*) d10.05 4 pins 52.5 1.2 B32354S Marking/Approval See picture CE compliance to LV directive 2014/35/EU UL approved (UL File E238746) *) B32354S3106K010 Lead diameter = 1.0 Delivery mode Bulk (untapped, lead length 6-1mm) July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Ordering code examples B 32354 S 3 106 K 01 Components class Series Special construction Rated voltage Rated capacitance Capacitance tolerance Passive components MKP Segmented Segmented 3 =350 V AC 106 =10 uF K =10% Lead space (mm) 01 = 52.5 11 = 37.5 Voltage ratings VNDC 500 V DC VNAC 480 V AC VRMS 350 V AC Note: VNAC is maximum operating peak recurrent voltage of either polarity of a reversing type waveform, not an r.m.s value. Overview available types Lead spacing 52.5 mm Type B32354S VNDC (V DC) 500 VRMS (V AC) 350 CR (F) 10 15 20 25 30 35 40 July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Ordering codes and packing units (lead spacing 52.5 mm) VRMS VNDC CR Ordering code Nom. dimensions P1 w x h x l tolerance 1mm V AC V DC F I max RMS 1) 85C hotspot ESR (Typical) 10kHz Packing units A m pcs 10kHz mm mm I peak A 350 1) 500 10 B32354S3106K010 28.0 x 35.0 x 57.5 10.2 7 300 14 33 15 B32354S3156K010 35.0 x 45.0 x 57.5 20.3 11 450 11 27 20 B32354S3206K010 35.0 x 45.0 x 57.5 20.3 11 600 8 27 25 B32354S3256K010 40.0 x 50.0 x 57.5 20.3 14 700 8 24 30 B32354S3306K010 45.0 x 50.0 x 57.5 20.3 14 900 8 24 35 B32354S3356K010 50.0 x 55.0 x 57.5 20.3 17 1000 6 18 40 B32354S3406K010 50.0 x 55.0 x 57.5 20.3 17 1100 6 18 Imax - Maximum RMS current for continuous operation defined for a hotspot of 85C, case temperature of 80C, at frequency of 10 kHz July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Technical data Reference standard: IEC 61071:2007, all data given at T = +20 C unless otherwise specified. Upper category temperature Tmax +85 C Rated temperature TR +85 C Lower category temperature Tmin -40 C Dissipation factor tan (in 10-3) at +20 C and 1 kHz (upper limit values) 1.2 Insulation resistance Rins after 1 min, given as time constant = CR Rins, (Minimum as-delivered values with rel. humidity 65%) Measuring voltage: 100VDC AC testing voltage between terminals 10000s Testing voltage between terminal to case 1.65 VNAC for 2 s 2000 V AC at 50/60 Hz, 60 s (typical test) Maximum peak current (A) IP,max=CR dv/dt Reliability: Failure rate Service life tSL 5 fit ( 5 x 10-9/h) at 0.5 VRMS, +40 C 100 000 h at VRMS (50/60 Hz) For conversion to other operating conditions, refer to chapter "Quality, 2 Reliability" Failure criteria Total failure Failure due to variation of parameters Short circuit or open circuit Capacitance change IC/C0I 10% Dissipation factor tan > 4 upper limit values Insulation resistance Rins or time constant = CR Rins < 500 s July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/s. Note: The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the capacitor. These parameters are given for isolated pulses in such a way that the heat generated by one pulse will be completely dissipated before applying the next pulse. For a train of pulses, please refer to the curves of permissible AC voltage-current versus frequency dV/dt values Lead spacing 52.5 mm VRMS VNDC V AC V DC 350 500 dV/dt in V/s 30 Impedance Z versus frequency f (typical values) July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, Tcase +80 C) For Tcase > +80 C, please refer to de-rating factor FT. Lead spacing 52.5 mm July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Permissible current IRMS versus frequency f (for sinusoidal waveforms, Tcase +80 C) For Tcase > +80 C, please refer to de-rating curve. Lead spacing 52.5 mm Maximum AC current (IRMS) vs. temperature for Tcase > +80 C The graphs described in the previous section for the permissible AC voltage (VRMS) or current (IRMS) vs. frequency (f > 50/60 Hz) are given for a maximum case temperature Tcase +80 C. In case of higher capacitor surface temperatures (Tcase), to avoid the temperature of the hottest spot above maximum operating temperature, the de-rating factor FT shall be applied in the following way: IRMS(Tcase) = IRMS,Tcase80C*FT(Tcase) And FT is given by the following curve: July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Typical test Test description Reference Electricity parameters IEC 61071: Voltage between terminals: 1.5 VNAC, 60 s; Within specified limits 2007 Terminals and enclosure: 2000 V AC, 60 s; No visible damage Insulation resistance RINS No flashover Capacitance CR Dissipation factor tan Test conditions Performance requirements 1 -Robustness IEC 60068- Tensile strength (test Va1) of terminations 2-21:2006 Wire diameter Section 0.5 < d1 0.8 mm 0.5 m2 0.8 < d1 1.25 mm 1.2 m2 Duration 10 s +/-1 s Bending Vb method 1 Wire diameter Section Within specified limits Tensile force 10 N 20 N Tensile force 0.5 < d1 0.8 mm 0.5 m2 10 N 0.8 < d1 1.25 mm 1.2 m2 20 N 4 90 C, Duration 2 s to 3 s/bend 2 - Resistance IEC 60068- Solder bath temperature at 260 5 C, 2-20:2008 immersion for 10 seconds to soldering heat 3 - Vibration IC/C0I 0.5% Increase of tan(10 kHz) 0.005 compared to initial value IEC 60068- 10 Hz to 55 Hz No visible damage Amplitude 0.35mm or acceleration 2-6:2007 98 m/s2 Test duration: 10 frequency cycles, 3 axes offset from each other by 90 1 octave/min Visual examination 4 - Shocks or IEC 60068- Pulse shape: half sine 2-6:2007 impact Acceleration: 490 m/s2 Duration of pulse: 11 ms Visual examination IEC 60384- 85 C/85% relative humidity/VRMS /1000 h 5 - THB test (Grade III Test 14:2013/AM D1:2016 B, high robustness under high humidity) No visible damage IC/C0I 0.5% Increase of tan(10kHz)0.005 compared to initial value No visible damage IC/C0I 10% tan(1 kHz) 0.005 RINS 50% specified limit July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) 6 - Surge test IEC 61071: 1.1 VNDC or Itest = 1.1 Imax 2007 Number of discharges: 5 Time lapse: every 2 min (10 min total) Within 5 min after the surge discharge test Duration 10 s, 1.5 VNAC at Tamb. B32354S3* B32354S No visible damage IC/C0 I 1.0% tan(10 kHz) 1.2 initial tan +0.0001 IC/C0 I 0.5% 7 - Self-healing IEC 61071: 1.5 VNAC 2007 Duration 10 s Number of clearings 5 Increase the voltage at 100 V/s till 5 clearings occur with a max. of 2.5 VNAC for a duration of 10 s tan (10 kHz) 1.2 initial tan +0.0001 8- IEC 61071: Change of temperature acc. to IEC 60068-2-14 Environmental 2007 Test Nb Tmax= +105 C Tmin. = -40 C Transition time: 1 h, equivalent to 1 C/min 5 cycles Damp heat steady state acc. to IEC 60068-2-78 Test Ca T = 40 C 2 C RH = 93% 3 % Duration 56 days High voltage between terminal: 1.5 VNDC at ambient temperature Duration 10 s No puncturing or flashover Self-healing punctures permitted 9 - Thermal IEC 61071: Natural cooling Tamb 5 C stability test 2007 1.21 Pmax. = (U2/2) W2 C tan = under overload 1.21 (I2max./W2 C) tan2 conditions W2 = 2 x f2 Imax. (see specific reference data) f2 = 10 kHz Temperature rise < 1C IC/C0 I 2% Increase of tan (10 kHz) 0.015 IC/C0 I 2% Increase of tan(10 kHz) 1.2 initial tan (10 kHz)+ 0.015 tan2= tanat 10 kHz Duration 48 h Measure the temperature every 1.5 h during the last 6 h July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) 10 - IEC 61071: Endurance test 2007 between terminal B32354S3* B32354S Sequence 1.25 VRMS at Tcase = 85 C Duration 500 h 1000 x discharge cycles at 1.4 (maximum repetitive peak current in continuous operation 1.25 VRMS at Tcase = 85 C Duration 500 h IC/C0 I 3% Increase of tan(10kHz) 0.015 compared to initial value Mounting guidelines 1. Soldering 1.1 Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 600682-2:2007, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature 235 5 C Soldering time 2.0 0.5 s 2.0 +0/-0.5 mm from capacitor body or seating plane Immersion depth Evaluation criteria: Visual inspection 1.2 Wetting of wire surface by new solder 90%, free-flowing solder Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1A. Conditions: Series MKT boxed (except 2.5 6.5 7.2 mm) coated, uncoated (lead spacing > 10 mm) MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 6.5 7.2 mm) MKP (lead spacing 7.5 mm) MKT uncoated (lead spacing 10 mm) insulated (B32559) Solder bath temperature 260 5 C Soldering time 10 1 s 5 1 s <4s recommended soldering profile for MKT uncoated (lead spacing 10 mm) and insulated (B32559) July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) Immersion depth Shield B32354S3* B32354S 2.0 +0/-0.5 mm from capacitor body or seating plane Heat-absorbing board, 1.5 0.5 mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage C/C0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan As specified in sectional specification 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S countermeasures. For example, if a pre-heating step can't be avoided, an additional or reinforced cooling process may possibly have to be included. Recommends As a reference, the recommended wave soldering profile for our film capacitors is as follows: July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) B32354S3* B32354S Body temperature should follow the description below: MKP capacitor: During pre-heating: Tp 110 oC During soldering: Ts 120 oC, ts 45 s MKT capacitor: During preheating: Tp 125 oC During soldering: Ts 160 oC, ts 45 s When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. In order to ensure proper conditions for manual or selective soldering, the body temperature (Ts) must be 120oC. One recommended condition for manual soldering is that the tip of the soldering iron should be < 360 oC and the soldering contact time should be no longer than 3 seconds. For uncoated MKT capacitors with lead spacing <10 mm (B32560/B32561) the following measures are recommended: - Pre-heating to not more than 110 C in the preheater phase - Rapid cooling after soldering Please refer to the Film Capacitor Data Book in case more details are needed Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. Component is non-serviceable/non-repairable. The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 17 Film Capacitors - AC Capacitors Metallized Polypropylene Film Capacitors (MKP) Topic Safety information Storage conditions Make sure that capacitors are stored within the specified range of time, temperature and humidity conditions. Avoid external energy, such as fire or electricity (passive flammability), avoid overload of the capacitors (active flammability) and consider the flammability of materials. Do not exceed the tested ability to withstand vibration. The capacitors are tested to IEC 60068-2-6. We offer film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". Flammability Resistance to vibration B32354S3* B32354S Reference chapter "General technical information" 4.5 "Storage conditions" 5.3 "Flammability" 5.2 "Resistance to vibration" Topic Safety information Reference chapter "Mounting guidelines" Soldering Do not exceed the specified time or temperature limits during soldering. Use only suitable solvents for cleaning capacitors. When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types! 1 "Soldering" Cleaning Embedding of capacitors in finished assemblies 2 "Cleaning" 3 "Embedding of capacitors in finished assemblies" Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. July 2020 Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 17 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements ("CSR") TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. Page 16 of 17 Important notes 8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2020-06 Page 17 of 17