FODM3022R2V_NF098 - Fairchild Semiconductor Corporation

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

FODM30XX Rev. 1.0.6

April 2009

FODM3011, FODM3012, FODM3022, FODM3023,

FODM3052, FODM3053

4-Pin Full Pitch Mini-Flat Package Random-Phase Triac

Driver Output Optocouplers

Features

■

Compact 4-pin surface mount package (2.4 mm

maximum standoff height)

■

Peak blocking voltage

250V (FODM301X)

400V (FODM302X)

600V (FODM305X)

■

Available in tape and reel quantities of 2500.

■

Add “NF098” for new construction version with 260°C

max. reﬂow temperature rating

■

UL, C-UL and VDE certiﬁcations pending

Applications

■

Industrial controls

■

Trafﬁc lights

■

Vending machines

Applications

(Continued)

■

Solid state relay

■

Lamp ballasts

■

Solenoid/valve controls

■

Static AC power switch

■

Incandescent lamp dimmers

■

Motor control

Description

The FODM301X, FODM302X, and FODM305X series

consists of a GaAs infrared emitting diode driving a

silicon bilateral switch housed in a compact 4-pin

mini-ﬂat package. The lead pitch is 2.54mm. They are

designed for interfacing between electronic controls and

power triacs to control resistive and inductive loads for

115V/240V operations.

Package Dimensions

MAIN

TERMINAL

MAIN

TERMINAL

ANODE

CATHODE

Note:

All dimensions are in millimeters.

4.40±0.20

2.54±0.25

3.60±0.30

2.00±0.20

0.10±0.10 0.40±0.10

5.30±0.30

7.00+0.2

–0.7

0.20±0.05

FODM30XX Rev. 1.0.6 2

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Absolute Maximum Ratings

= 25°C unless otherwise speciﬁed)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol Parameter Value Units

TOTAL PACKAGE

STG

Storage Temperature -55 to +150 °C

OPR

Operating Temperature -40 to +100 °C

EMITTER

F (avg)

Continuous Forward Current 60 mA

F (pk)

Peak Forward Current (1µs pulse, 300pps.) 1 A

Reverse Input Voltage 3 V

Power Dissipation (No derating required over operating temp. range) 100 mW

DETECTOR

T(RMS)

On-State RMS Current 70 mA (RMS)

DRM

Off-State Output Terminal Voltage FODM3011/FODM3012 250 V

FODM3022/FODM3023 400

FODM3052/FODM3053 600

Power Dissipation (No derating required over operating temp. range) 300 mW

FODM30XX Rev. 1.0.6 3

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Electrical Characteristics

= 25°C)

Individual Component Characteristics

Transfer Characteristics

Isolation Characteristics

*All typicals at T

= 25°C

Notes:

1. Test voltage must be applied within dv/dt rating.

2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.

3. All devices are guaranteed to trigger at an I

value less than or equal to max I

. Therefore, recommended operating

lies between max I

(10mA for FODM3011, FODM3022, and FODM3052, 5mA for FODM3012, FODM3023,

and FODM3053) and absolute max I

(60mA).

Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit

EMITTER

Input Forward Voltage I

= 10mA All 1.20 1.5 V

Reverse Leakage Current V

= 3V, T

= 25°C All 0.01 100 µA

DETECTOR

DRM

Peak Blocking Current Either

Direction

Rated V

DRM

, I

= 0

(1)

All 2 100 nA

dV/dt Critical Rate of Rise of

Off-State Voltage

= 0 (Figure 8)

(2)

FODM3011,

FODM3012,

FODM3022,

FODM3023

10 V/µs

FODM3052,

FODM3053

1,000

Symbol DC Characteristics Test Conditions Device Min. Typ.* Max. Unit

LED Trigger Current Main Terminal

Voltage = 3V

(3)

FODM3011,

FODM3022,

FODM3052

10 mA

FODM3012,

FODM3023,

FODM3053

Holding Current, Either

Direction

All 300 µA

Peak On-State Voltage Either

Direction

= 100mA peak All 1.7 3 V

Symbol Characteristic Test Conditions Device Min. Typ.* Max. Unit

ISO

Steady State Isolation

Voltage

1 Minute,

R.H. = 40% to 60%

All 3750 VRMS

FODM30XX Rev. 1.0.6 4

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Typical Performance Curves

Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Leakage Current vs. Ambient Temperature

Fig. 3 Holding Current vs. Ambient Temperature Fig. 4 Trigger Current vs. Ambient Temperature

IF - FORWARD CURRENT (mA)

110100

VF - FORWARD VOLTAGE (V)

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.8

1.7

= -40°C

= 25°C

= 100°C

TA - AMBIENT TEMPERATURE (°C)

-40 -20 0 20 406080100

IDRM - LEAKAGE CURRENT (nA)

0.1

100

1000

VDRM = 600V

TA - AMBIENT TEMPERATURE (°C)

-40 -20 100

IH - HOLDING CURRENT (NORMALIZED)

0.1

1.0

020406080

NORMALIZED TO T

= 25°C

TA - AMBIENT TEMPERATURE (°C)

-40 -20 0 20 40 60 80

IFT - TRIGGER CURRENT (NORMALIZED)

0.8

0.6

0.8

1.0

1.2

1.4

1.6

= 3V

NORMALIZED TO T

= 25°C

100

FODM30XX Rev. 1.0.6 5

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Typical Performance Curves

(Continued)

Fig. 7 On-State Characteristics

VTM - ON-STATE VOLTAGE (V)

-4 -3 -2 -1 0 1 2 3 4

ITM - ON-STATE CURRENT (mA)

-800

-600

-400

-200

200

400

600

800

TA = 25°C

Fig. 5 LED Current Required to Trigger vs. LED Pulse Width Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature

PWIN

- LED TRIGGER PULSE WIDTH (°C)

110100

IFT - LED TRIGGER CURRENT (NORMALIZED)

IN >> 100µsNORMALIZED TO PW

T= 25°CA

NORMALIZED TO T = 25°C

TA - AMBIENT TEMPERATURE (°C)

VDRM

- OFF-STATE OUTPUT TERMINAL VOLTAGE

(NORMALIZED)

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

-40 -20

020406080100

FODM30XX Rev. 1.0.6 6

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Typical Application Information

Figure 8. Static dv/dt Test Circuit

Figure 9. Resistive Load

Vdc

600V (FODM3052)

(FODM3053)

400V (FODM3022)

(FODM3023)

250V (FODM3011)

(FODM3012)

R = 10 kΩ

CTEST

X100

SCOPE

PROBE

PULSE

INPUT MERCURY

WETTED

RELAY

378 V

(FODM3052, FODM3053)

252 V

(FOMD3022, FODM3023)

158 V

(FODM3011, FODM3012)

0 VOLTS

APPLIED VOLTAGE

WAVEFORM

Vmax =

dv/dt = 0.63 Vmax

RTEST

D.U.T.D.U.T.

τRC

Figure 10. Inductive Load with Sensitive Gate Triac (I

≤ 15 mA)

VCC

Rin 1

0.1 µF

180

2.4k

120 V

60 Hz

FODM3011

FODM3012

FODM3022

FODM3023

FODM3052

FODM3053

VCC

Rin 1

120 V

60 Hz

180

FODM3011

FODM3012

FODM3022

FODM3023

FODM3052

FODM3053

600 V (FODM3052, FODM3053)

= 400 V (FODM3022, FODM3023)

= 250 V (FODM3011, FODM3012)

= 378

τRC (FODM3053)

(FODM3052)

= 252

τRC (FODM3023)

(FODM3022)

= 158

τRC (FODM3011)

(FODM3012)

1. The mercury wetted relay provides a high speed

repeated pulse to the D.U.T.

2. 100x scope probes are used, to allow high speeds and

voltages.

3. The worst-case condition for static dv/dt is established by

triggering the D.U.T. with a normal LED input current,

then removing the current. The variable RTEST allows the

dv/dt to be gradually increased until the D.U.T. continues

to trigger in response to the applied voltage pulse, even

after the LED current has been removed. The dv/dt is

then decreased until the D.U.T. stops triggering. τRC is

measured at this point and recorded.

NOTE: This optoisolator should not be used to drive a load directly. It is

intended to be a trigger device only.

FODM30XX Rev. 1.0.6 7

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Typical Application Information

(Continued)

Figure 11. Typical Application Circuit

VCC

Rin 1

0.05 µF

0.01 µF

LOAD

360

470

240

VAC

HOT

GROUND

FODM3022

FODM3023

FODM3052

FODM3053

In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.

The 39Ω resistor and 0.01µF capacitor are for snubbing of the triac, and the 470Ω resistor and 0.05µF capacitor are for

snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.

FODM30XX Rev. 1.0.6 8

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Ordering Information

Note:

To specify the new construction version with 260°C max reflow peak temperature rating: Add "NF098" to the end of the

part number. The non NF098 version is rated for 230°C peak reflow temperature.

Marking Information

Option Description

V_NF098 VDE Approved

R2_NF098 Tape and Reel (2500 units)

R2V_NF098 Tape and Reel (2500 units) and VDE Approved

Deﬁnitions

1Fairchild logo

2Device number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4 One digit year code

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

3011

XVR

FODM30XX Rev. 1.0.6 9

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Tape Speciﬁcations

0PP

0B0

Reel Diameter

Devices Per Reel

Max. Component Rotation or Tilt

Cover Tape Thickness

Cover Tape Width

Pocket Hole Dia.

Pocket Dimension

Pocket Location

Sprocket Hole Location

Sprocket Hole Dia.

Sprocket Hole Pitch

Tape Thickness

Pocket Pitch

Tape Width

Description Symbol Dimensions

2.54 Pitch

330 mm (13")

12.00±0.4

7.30±0.20

20° max

1.55±0.20

2.30±0.20

0.065±0.02

9.20

1.75±0.20

8.00±0.20

2.00±0.20

5.50±0.20

4.75±0.20

1.55±0.20

4.00±0.20

0.35±0.02

2500

FODM30XX Rev. 1.0.6 10

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Footprint Drawing for PCB Layout

Note:

All dimensions are in mm.

0.80

6.50

2.54

1.00

FODM30XX Rev. 1.0.6 11

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Reﬂow Proﬁle

Proﬁle Freature Pb-Free Assembly Proﬁle

Temperature Min. (Tsmin) 150°C

Temperature Max. (Tsmax) 200°C

Time (t

) from (Tsmin to Tsmax) 60–120 seconds

Ramp-up Rate (t

to t

) 3°C/second max.

Liquidous Temperature (T

) 217°C

Time (t

) Maintained Above (T

) 60–150 seconds

Peak Body Package Temperature 260°C +0°C / –5°C

Time (t

) within 5°C of 260°C 30 seconds

Ramp-down Rate (T

to T

) 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

Time (seconds)

Temperature (°C)

Time 25°C to Peak

260

240

220

200

180

160

140

120

100

Tsmax

Tsmin

120

Preheat Area

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

240 360

FODM30XX Rev. 1.0.6 12

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intended to be an exhaustive list of all such trademarks.

Auto-SPM™

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Current Transfer Logic™

EcoSPARK®

EfficentMax™

EZSWITCH™*

™*

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FACT®

FAST®

FastvCore™

FETBench™

FlashWriter®*

FPS™

F-PFS™

FRFET®

Global Power ResourceSM

Green FPS™

Green FPS™e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

MicroPak™

MillerDrive™

MotionMax™

Motion-SPM™

OPTOLOGIC®

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Power-SPM™

PowerTrench®

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Programmable Active Droop™

QFET®

QS™

Quiet Series™

RapidConfigure™

™

Saving our world, 1mW/W/kW at a time™

SmartMax™

SMART START™

SPM®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

SyncFET™

Sync-Lock™

®*

ThePower Franchise®

TinyBoost™

TinyBuck™

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TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

TriFault Detect™

TRUECURRENT™*

µSerDes™

UHC®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

XS™

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life,

and (c) whose failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be reasonably

expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

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PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in

any manner without notice.

Preliminary Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes

at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I40

First Production

FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers