KDZVTF2.0B
Zener Diode (AEC-Q101 qualified) Data sheet
                                                               Outline
PD1000 mW  
 
       
 
 
 
 
 
 
   
Features Inner Circuit
High reliability
Small power mold type
Application Packaging Specifications
Voltage regulation Packing Embossed Tape
Reel Size(mm) 180
Taping Width(mm) 8
Structure Quantity(pcs) 3000
Silicon Epitaxial Planar Taping Code TR
Marking AB
Absolute Maximum Ratings (Ta = 25)
Parameter Symbol Limits Unit
Power dissipation PD1000 mW
Junction temperature Tj150
Storage temperature Tstg -55 150 
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 2019/04/17_Rev.005
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KDZVTF Series                        Data sheet
Electrical Characteristics (Ta = 2C)
VZ Rank(V)
Symbol
Zener Voltage:VZ(V)(1) Reverse Current:IR
(μA)
MIN. MAX. IZ(mA) MAX. VR
(V)
2.0 2.000 2.240 40 200 0.5
2.2 2.200 2.450 40 200 0.7
2.4 2.400 2.700 40 200 1.0
2.7 2.700 3.100 40 200 1.0
3.0 3.000 3.400 40 100 1.0
3.3 3.300 3.700 40 80 1.0
3.6 3.600 4.000 40 60 1.0
3.9 3.900 4.400 40 40 1.0
4.3 4.300 4.800 40 20 1.0
4.7 4.700 5.200 40 20 1.0
5.1 5.100 5.700 40 20 1.0
5.6 5.600 6.300 40 20 1.5
6.2 6.200 7.000 40 20 3.0
6.8 6.800 7.700 40 20 3.5
7.5 7.500 8.400 40 20 4.0
8.2 8.200 9.300 40 20 5.0
9.1 9.100 10.200 40 20 6.0
10 10.000 11.200 40 10 7.0
11 11.000 12.300 20 10 8.0
12 12.000 13.500 20 10 9.0
13 13.300 15.000 20 10 10.0
15 14.700 16.500 20 10 11.0
16 16.200 18.300 20 10 12.0
18 18.000 20.300 20 10 13.0
20 20.000 22.400 20 10 15.0
22 22.000 24.500 10 10 17.0
24 24.000 27.600 10 10 19.0
27 27.000 30.800 10 10 21.0
30 30.000 34.000 10 10 23.0
33 33.000 37.000 10 10 25.0
36 36.000 40.000 10 10 27.0
Note(1) VZ test time is 40ms.
Markings
 VZ Rank(V) Marking VZ Rank(V) Marking
2.0 AB 9.1 SB
2.2 BB 10 TB
2.4 CB 11 UB
2.7 DB 12 VB
3.0 EB 13 WB
3.3 FB 15 XB
3.6 GB 16 YB
3.9 HB 18 ZB
4.3 JB 20 AD
4.7 KB 22 BD
5.1 LB 24 CD
5.6 MB 27 DD
6.2 NB 30 ED
6.8 PB 33 FD
7.5 QB 36 GD
8.2 RB
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KDZVTF Series                        Data sheet
Characteristic Curves
                                             
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KDZVTF2.0B                        Data sheet
Characteristic Curves
                                             
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2019/04/17_Rev.005
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KDZVTF2.0B                        Data sheet
Characteristic Curves
                                             
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2019/04/17_Rev.005
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KDZVTF2.0B                        Data sheet
Dimension
SOD-123FL, [SC-109B], (PMDU)
Taping (Unit:mm)
                                             
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2019/04/17_Rev.005
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Notice-PAA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
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bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
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ROHMs Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
CHINA
CLASS
CLASS
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
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H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
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[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6.In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.Confirm that operation temperature is within the specified range described in the product specification.
9.ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
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characteristics of the Products and external components, including transient characteristics, as well as static
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
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ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
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