© Semiconductor Components Industries, LLC, 2012
November, 2012− Rev. 0
1Publication Order Number:
NYE08−10B6/D
NYE08-10B6TG
Protected TRIAC
Silicon Bidirectional Thyristor
Designed for use in solid state relays, MPU interface, TTL logic and
any other light industrial or consumer application. Supplied in an
inexpensive TO−92 package which is readily adaptable for use in
automatic insertion equipment.
Features
•One−Piece, Injection−Molded Package
•Blocking Voltage to 600 V
•Sensitive Gate Triggering in Two Trigger Modes (Quadrants)
•Improved Noise Immunity (dv/dt Minimum of 500 V/msec at 125°C)
•Compliant with IEC6100−4−5
•High Surge Current of 8 A
•These are Pb−Free Devices
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1)
(Sine Wave, 50 to 60 Hz, Gate Open,
TJ = 25 to 125°C)
VDRM,
VRRM
600 V
On−State Current RMS (TC = 80°C)
(Full Sine Wave 50 to 60 Hz)
IT(RMS) 0.8 A
Peak Non−repetitive Surge Current (One
Full Cycle Sine Wave, 60 Hz, TC = 25°C)
ITSM 8.0 A
Circuit Fusing Considerations
(Pulse Width = 8.3 ms)
I2t 0.4 A2s
Peak Gate Power
(TC = 80°C, Pulse Width v 1.0 ms)
PGM 5.0 W
Average Gate Power
(TC = 80°C, t = 8.3 ms)
PG(AV) 0.1 W
Non−Repetitive Line Peak Voltage
(IEC6100−4−5)
VPP 2.0 kV
Critical Rate of Rise of All−State Current
(IG = 2 x IGT
, tr < 100 ms, TJ = 125°C)
di/dt 100 A/ms
Operating Junction Temperature Range TJ−40 to +125 °C
Storage Temperature Range Tstg −40 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
PROTECTED TRIAC
0.8 AMPERE RMS
600 VOLTS
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See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
COM
G
OUT
TO−92 (TO−226AA)
CASE 029−11
PIN ASSIGNMENT
1
2
3
Gate
COM
OUT
123
12
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
123
E08
10B6
YWW G
G
MARKING DIAGRAM
x = 3,7,9
Y = Year
WW = Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
NYE08−10B6TG
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure TBD RqJA 156 °C/W
Thermal Resistance, Junction−to−Tab Measured on OUT Tab Adjacent to Epoxy RqJT 25 °C/W
Maximum Device Temperature for
Soldering Purposes for 10 Secs Maximum
TL260 °C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Blocking Current TJ = 25°C
(VD = Rated VDRM/VRRM; Gate Open) TJ = +125°C
IDRM, IRRM −
−
−
−
2.0
200
mA
mA
ON CHARACTERISTICS
Peak On−State Voltage
(ITM = "1.1 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%)
VTM − − 1.3 V
Gate Trigger Current (dc)
(VD = 12 Vdc, RL = 30 W)
OUT(+), G(−)
OUT(−), G(−)
IGT
0.15
0.15
−
−
10
10
mA
Latching Current (VD = 12 V, IG = 1.2 x IGT)
OUT(+), G(−) All Types
OUT(−), G(−) All Types
IL
−
−
−
−
30
30
mA
Gate Trigger Voltage (dc) (VD = 12 Vdc, RL = 30 W)VGT − − 1.0 V
Gate Non−Trigger Voltage (VD = 12 V, RL = 30 W, TJ = 125°C)
Quadrants 2, 3
VGD 0.15 − − V
Dynamic Resistance RD− − 300 mW
Holding Current (VD = 12 Vdc, Initiating Current = 50 mA, Gate Open) IH− − 25 mA
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current
(Commutating dv/dt = 15 V/ms, Gate Open, TJ = 125°C, f = 250 Hz,
without Snubber)
di/dt(c) 0.3 − − A/ms
Critical Rate of Rise of Off−State Voltage (VD = 67% VDRM, Exponential
Waveform, Gate Open, TJ = 125°C)
dv/dt
500 − −
V/ms
Clamping Voltage (ICL = 1.0 mA, tp = 1 ms, TJ = 125°C) VCL 650 − − V
NYE08−10B6TG
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3
+ Current
+ Voltage
VTM
IH
Symbol Parameter
VDRM Peak Repetitive Forward Off State Voltage
IDRM Peak Forward Blocking Current
VRRM Peak Repetitive Reverse Off State Voltage
IRRM Peak Reverse Blocking Current
Voltage Current Characteristic of Triacs
(Bidirectional Device)
IDRM at VDRM
on state
off state
IRRM at VRRM
Quadrant 1
OUT+
Quadrant 3
OUT−VTM
IH
VTM Maximum On State Voltage
IHHolding Current
COM
(+) IGT
GATE
(+) OUT
REF
COM
(−) IGT
GATE
(+) OUT
REF
COM
(+) IGT
GATE
(−) OUT
REF
COM
(−) IGT
GATE
(−) OUT
REF
−
OUT NEGATIVE
(Negative Half Cycle)
OUT POSITIVE
(Positive Half Cycle)
+
Quadrant III Quadrant IV
Quadrant II Quadrant I
Quadrant Definitions for a Triac
IGT −+ IGT
All polarities are referenced to COM.
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4
0.001
0.01
0.1
1
10
100
0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8
Figure 1. Maximum On−State Voltage
Characteristics
VT
, INSTANTANEOUS ON-STATE VOLTAGE (V)
IT
, INSTANTANEOUS ON−STATE CURRENT (A)
TJ = 125°C
TJ = 25°C
TJ = −40°C
0
5
10
15
20
25
−40 −25 −10 5 20 35 50 65 80 95 110 125
Figure 2. Typical Gate Trigger Current
TJ, JUNCTION TEMPERATURE (°C)
IGT
, GATE TRIGGER CURRENT (mA)
Q3
Q2
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
−40 −25 −105 203550658095110125
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Typical Gate Trigger Voltage
VGT
, GATE TRIGGER VOLTAGE (V)
Q3
Q2
0
10
20
30
40
50
60
−40 −25 −105 203550658095110125
Q3
Q2
IL, LATCHING CURRENT (mA)
Figure 4. Typical Latching Current
TJ, JUNCTION TEMPERATURE (°C)
0
5
10
15
20
25
30
35
−40 −25 −10 5 20 35 50 65 80 95 110 125
IH, HOLDING CURRENT (mA)
Figure 5. Typical Holding Current
TJ, JUNCTION TEMPERATURE (°C)
MTI1 Positive
MTI1 Negative
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5
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A
H
F1
F2
P2 P2
P1 P
D
W
W1
L1
W2
H2B H2B
T1
T
T2
H4 H5
H1
L
Figure 6. Device Positioning on Tape
Symbol Item
Specification
Inches Millimeter
Min Max Min Max
DTape Feedhole Diameter 0.1496 0.1653 3.8 4.2
D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51
F1, F2 Component Lead Pitch 0.0945 0.110 2.4 2.8
HBottom of Component to Seating Plane 0.059 0.156 1.5 4.0
H1 Feedhole Location 0.3346 0.3741 8.5 9.5
H2A Deflection Left or Right 0 0.039 0 1.0
H2B Deflection Front or Rear 0 0.051 0 1.0
H4 Feedhole to Bottom of Component 0.7086 0.768 18 19.5
H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5
LDefective Unit Clipped Dimension 0.3346 0.433 8.5 11
L1 Lead Wire Enclosure 0.09842 −2.5 −
PFeedhole Pitch 0.4921 0.5079 12.5 12.9
P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75
P2 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95
TAdhesive Tape Thickness 0.06 0.08 0.15 0.20
T1 Overall Taped Package Thickness −0.0567 −1.44
T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65
WCarrier Strip Width 0.6889 0.7481 17.5 19
W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3
W2 Adhesive Tape Position .0059 0.01968 0.15 0.5
2. Maximum alignment deviation between leads not to be greater than 0.2 mm.
3. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
4. Component lead to tape adhesion must meet the pull test requirements.
5. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
6. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
7. No more than 1 consecutive missing component is permitted.
8. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
9. Splices will not interfere with the sprocket feed holes.
NYE08−10B6TG
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6
ORDERING & SHIPPING INFORMATION: Packaging Options, Device Suffix
Device
Description of TO−92 Tape
Orientation Package Shipping
U.S.
Europe
Equivalent
NYE08−10B6RL1G Flat side of TO−92 and adhesive
tape visible
TO−92
(Pb−Free)
Radial 2000 / Tape and Reel
NYE08−10B6TG N/A, Bulk TO−92
(Pb−Free)
5000 Units / Box
NYE08−10B6RLRPG Round side of TO−92 and
adhesive tape visible
TO−92
(Pb−Free)
Radial Tape and Fan Fold Box
(2000 Units / Box)
NYE08−10B6RLRFG Round side of TO−92 and
adhesive tape on reverse side
TO−92
(Pb−Free)
Radial Tape and Fan Fold Box
(2000 Units / Box)
NYE08−10B6TG
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7
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
CASE 029−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X−X
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 --- 12.70 ---
L0.250 --- 6.35 ---
N0.080 0.105 2.04 2.66
P--- 0.100 --- 2.54
R0.115 --- 2.93 ---
V0.135 --- 3.43 ---
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
RA
P
J
B
K
G
SECTION X−X
C
V
D
N
XX
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A4.45 5.20
B4.32 5.33
C3.18 4.19
D0.40 0.54
G2.40 2.80
J0.39 0.50
K12.70 ---
N2.04 2.66
P1.50 4.00
R2.93 ---
V3.43 ---
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NYE08−10B6/D
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