MT9V024IA7XTR-TR - ON SEMICONDUCTOR

November, 2018 − Rev. 8

1Publication Order Number:

MT9V024/D

1/3-Inch Wide VGA CMOS

Digital Image Sensor

Description

The MT9V024 is a 1/3−inch wide−VGA format CMOS active−pixel

digital image sensor with global shutter and high dynamic range

(HDR) operation. The sensor has specifically been designed to support

the demanding interior and exterior automotive imaging needs, which

makes this part ideal for a wide variety of imaging applications in

real−world environments.

Table 1. KEY PERFORMANCE PARAMETERS

Parameter Value

Optical Format 1/3-inch

Active Imager Size 4.51 mm (H) × 2.88 mm (V)

5.35 mm Diagonal

Active Pixels 752 H × 480 V

Pixel Size 6.0 m × 6.0 m

Color Filter Array Monochrome or Color RGB Bayer or RCCC Pattern

Shutter Type Global Shutter

Maximum Data Rate

Master Clock

27 Mp/s

27 MHz

Full Resolution 752 × 480

Frame Rate 60 fps (at Full Resolution)

ADC Resolution 10−bit Column−Parallel

Responsivity 4.8 V/lux−sec (550 nm)

Dynamic Range > 55 dB Linear;

> 100 dB in HDR Mode

Supply Voltage 3.3 V ±0.3 V (All Supplies)

Power Consumption < 160 mW at Maximum Data Rate (LVDS

Disabled);

120 W Standby Power at 3

Operating Tempera-

ture

−40°C to + 105°C

Packaging 52−ball iBGA, Automotive−qualified; Wafer or Die

Features

•Array Format: Wide−VGA, Active 752 H x 480 V

(360,960 pixels)

•Global Shutter Photodiode Pixels; Simultaneous Integration and

Readout

•RGB Bayer, Monochrome, or RCCC: NIR Enhanced Performance

for Use with Non−visible NIR Illumination

•Readout Modes: Progressive or Interlaced

•Shutter Efficiency: >99%

•Simple Two−Wire Serial Interface

•Real−Time Exposure Context Switching−Dual Register Set

•Register Lock Capability

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See detailed ordering and shipping information on page2 of

this data sheet.

ORDERING INFORMATION

Features (continued)

•Window Size: User Programmable to Any

Smaller Format (QVGA, CIF, QCIF). Data

Rate Can Be Maintained Independent of

Window Size

•Binning: 2 x 2 and 4 x 4 of The Full Resolu-

tion

•ADC: On−Chip, 10−bit Column−Parallel

(Option to Operate in 12−bit to 10−bit

Companding Mode)

•Automatic Controls: Auto Exposure Control

(AEC) and Auto Gain Control (AGC); Vari-

able Regional and Variable Weight AEC/

AGC

•Support for Four Unique Serial Control

the Same Bus

•Data Output Formats:

♦Single Sensor Mode:

10−bit Parallel/Stand−Alone

8−bit or 10−bit Serial LVDS

♦Stereo Sensor Mode: Interspersed 8−bit

Serial LVDS

•High Dynamic Range (HDR) Mode

IBGA52

CASE 503AA

MT9V024/D

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Applications

•Automotive

•Unattended Surveillance

•Stereo Vision

•Smart vision

•Automation

•Video as input

•Machine vision

ORDERING INFORMATION

Table 2. AVAILABLE PART NUMBERS

Part Number Product Description Orderable Product Attribute Description

MT9V024D00XTCC13CC1−200 VGA 1/3” GS CIS Die Sales, 200m Thickness

MT9V024D00XTMC13CC1−200 VGA 1/3” GS CIS Die Sales, 200m Thickness

MT9V024D00XTRC13CC1-200 VGA 1/3” GS CIS Die Sales, 200m Thickness

MT9V024D00XTRC13CC1-400 VGA 1/3” GS CIS Die Sales, 400m Thickness

MT9V024IA7XTC-DP VGA 1/3” GS CIS Dry Pack with Protective Film

MT9V024IA7XTC-DR VGA 1/3” GS CIS Dry Pack without Protective Film

MT9V024IA7XTM-DP VGA 1/3” GS CIS Dry Pack with Protective Film

MT9V024IA7XTM-DR VGA 1/3” GS CIS Dry Pack without Protective Film

MT9V024IA7XTM-TP WVGA 1/3” GS CIS Tape & Reel with Protective Film

MT9V024IA7XTM-TR WVGA 1/3” GS CIS Tape & Reel without Protective Film

MT9V024IA7XTR-DP VGA 1/3” GS CIS Dry Pack with Protective Film

MT9V024IA7XTR-DR VGA 1/3” GS CIS Dry Pack without Protective Film

MT9V024IA7XTR-TP VGA 1/3” GS CIS Tape & Reel with Protective Film

MT9V024IA7XTR-TR VGA 1/3” GS CIS Tape & Reel without Protective Film

GENERAL DESCRIPTION

The MT9V024 is a 1/3−inch wide−VGA format CMOS

active−pixel digital image sensor with global shutter and

high dynamic range (HDR) operation. The sensor has

specifically been designed to support the demanding interior

and exterior automotive imaging needs, which makes this

part ideal for a wide variety of imaging applications in

real−world environments.

This wide−VGA CMOS image sensor features ON

Semiconductor’s breakthrough low−noise CMOS imaging

technology that achieves CCD image quality (based on

signal−to−noise ratio and low−light sensitivity) while

maintaining the inherent size, cost, and integration

advantages of CMOS.

The active imaging pixel array is 752H x 480V. It

incorporates sophisticated camera functions on−chip−such

as binning 2 x 2 and 4 x 4, to improve sensitivity when

operating in smaller resolutions−as well as windowing,

column and row mirroring. It is programmable through a

simple two−wire serial interface.

The MT9V024 can be operated in its default mode or be

programmed for frame size, exposure, gain setting, and

other parameters. The default mode outputs

a wide−VGA−size image at 60 frames per second (fps).

An on−chip analog−to−digital converter (ADC) provides

10 bits per pixel. A 12−bit resolution companded for 10 bits

for small signals can be alternatively enabled, allowing more

accurate digitization for darker areas in the image.

In addition to a traditional, parallel logic output the

MT9V024 also features a serial low−voltage differential

signaling (LVDS) output. The sensor can be operated in

a stereo−camera, and the sensor, designated as

a stereo−master, is able to merge the data from itself and the

stereo−slave sensor into one serial LVDS stream.

The sensor is designed to operate in a wide temperature

range (–40_C to + 105_C).

MT9V024/D

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Active−Pixel

Sensor (APS)

Array

752 H x 480 V

Analog

Processing

ADCs

Timing and Control

Control Register

Digital Processing

Slave Video LVDS In

(for stereo applications only)

Serial Video

LVDS Out

Parallel

Video

Data Out

Serial

I/O

Figure 1. Block Diagram

Figure 2. Top View (Ball Down)

SER

DATA

OUT P

VDD

LVDS

VDD

LVDS

SER

DATA

OUT N

SYS−

CLK DOUT0

AGND VAA

DOUT2D

OUT3

DOUT1D

OUT4 VAAPIX

DGND

PIXCLKVDD

SHFT_

CLKOUT

SHFT

CLKOUT

LVDS

GND

BYPASS

_CLKIN

BYPASS

_CLKIN

LVDS

GND

NC NCVDD

DOUT5

DOUT6DOUT7DGND AGND VAA

SER

DATA IN

SER

DATIN

STAND−

RESET_

BAR

S_CTRL

_ADR1

RSVDOE

ERRORSCLK

EXPO−

SURE

LINE_

VALID

DOUT9

DOUT8FRAME_

VALID

STLN_

OUT

SDATA STFRM_

OUT

LED_

OUT

S_CTRL

_ADR0

12 345 67 8

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BALL DESCRIPTIONS

Table 3. BALL DESCRIPTIONS

52−Ball IBA

Numbers Symbol Type Descriptions

H7 RSVD Input Connect to DGND

D2 SER_DATAIN_N Input Serial data in for stereoscopy (differential negative). Tie to 1 k pull−up (to 3.3 V)

in non−stereoscopy mode

D1 SER_DATAIN_P Input Serial data in for stereoscopy (differential positive). Tie to DGND in non−stere-

oscopy mode

C2 BYPASS_CLKIN_N Input Input bypass shift−CLK (differential negative). Tie to 1 k pull−up (to 3.3 V) in

non−stereoscopy mode

C1 BYPASS_CLKIN_P Input Input bypass shift−CLK (differential positive). Tie to DGND in non−stereoscopy

mode

H3 EXPOSURE Input Rising edge starts exposure in snapshot and slave modes

H4 SCLK Input Two−wire serial interface clock. Connect to VDD with 1.5 k resistor even when no

other two−wire serial interface peripheral is attached

H6 OE Input DOUT enable pad, active HIGH

G7 S_CTRL_ADR0 Input Two−wire serial interface slave address select (see Table 6 on page 10)

H8 S_CTRL_ADR1 Input Two−wire serial interface slave address select (see Table 6 on page 10)

G8 RESET_BAR Input Asynchronous reset. All registers assume defaults

F8 STANDBY Input Shut down sensor operation for power saving

A5 SYSCLK Input Master clock (26.6 MHz; 13 MHz – 27 MHz)

G4 SDATA I/O Two−wire serial interface data. Connect to VDD with 1.5 k resistor even when no

other two−wire serial interface peripheral is attached

G3 STLN_OUT I/O Output in master mode−start line sync to drive slave chip in−phase; input in slave

mode

G5 STFRM_OUT I/O Output in master mode−start frame sync to drive a slave chip in−phase; input in

slave mode

H2 LINE_VALID Output Asserted when DOUT data is valid

G2 FRAME_VALID Output Asserted when DOUT data is valid

E1 DOUT5 Output Parallel pixel data output 5

F1 DOUT6 Output Parallel pixel data output 6

F2 DOUT7 Output Parallel pixel data output 7

G1 DOUT8 Output Parallel pixel data output 8

H1 DOUT9 Output Parallel pixel data output 9

H5 ERROR Output Error detected. Directly connected to STEREO ERROR FLAG

G6 LED_OUT Output LED strobe output

B7 DOUT4 Output Parallel pixel data output 4

A8 DOUT3 Output Parallel pixel data output 3

A7 DOUT2 Output Parallel pixel data output 2

B6 DOUT1 Output Parallel pixel data output 1

A6 DOUT0 Output Parallel pixel data output 0

B5 PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock

B3 SHFT_CLKOUT_N Output Output shift CLK (differential negative)

B2 SHFT_CLKOUT_P Output Output shift CLK (differential positive)

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Table 3. BALL DESCRIPTIONS

52−Ball IBA

Numbers DescriptionsTypeSymbol

A3 SER_DATAOUT_N Output Serial data out (differential negative)

A2 SER_DATAOUT_P Output Serial data out (differential positive)

B4, E2 VDD Supply Digital power 3.3 V

C8, F7 VAA Supply Analog power 3.3 V

B8 VAAPIX Supply Pixel power 3.3 V

A1, A4 VDDLVDS Supply Dedicated power for LVDS pads

B1, C3 LVDSGND Ground Dedicated GND for LVDS pads

C6, F3 DGND Ground Digital GND

C7, F6 AGND Ground Analog GND

E7, E8, D7, D8 NC NC No connect (Note 3)

1. Pin H7 (RSVD) must be tied to GND.

2. Output enable (OE) tri−states signals DOUT0−DOUT9, LINE_VALID, FRAME_VALID, and PIXCLK.

3. No connect. These pins must be left floating for proper operation.

Master Clock

STANDBY from

Controller or

Digital GND

Two−Wire

Serial Interface

SYSCLK

RESET_BAR

EXPOSURE

STANDBY

S_CTRL_ADR0

S_CTRL_ADR1

SCLK

SDATA

RSVD LVDSGNDDGND AGND

LINE_VALID

FRAME_VALID

PIXCLK

LED_OUT

ERROR

To Controller

To LED Output

VDD VAA

VAAPIX

10K

1.5K

0.1F

Figure 3. Typical Configuration (Connection)−Parallel Output Mode

NOTE: LVDS signals are to be left floating.

VDD VAA

VDDLVDS

DOUT(9:0)

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PIXEL DATA FORMAT

PIXEL ARRAY STRUCTURE

The MT9V024 pixel array is configured as 809 columns

by 499 rows, shown in Figure 4. The dark pixels are

optically black and are used internally to monitor black

level. Of the left 52 columns, 36 are dark pixels used for row

noise correction. Of the top 14 rows of pixels, two of the dark

rows are used for black level correction. Also, three black

rows from the top black rows can be read out by setting the

show dark rows bit in the Read Mode register; setting show

dark columns will display the 36 dark columns. There are

753 columns by 481 rows of optically active pixels. While

the sensor’s format is 752 x 480, one additional active

column and active row are included for use when horizontal

or vertical mirrored readout is enabled, to allow readout to

start on the same pixel. This one pixel adjustment is always

performed, for monochrome or color versions. The active

area is surrounded with optically transparent dummy pixels

to improve image uniformity within the active area. Neither

dummy pixels nor barrier pixels can be read out.

Active pixel

Light dummy

pixel

Dark pixel

Barrier pixel

(0, 0)

2 barrier + 8 (2 + 4 addressed + 2 light dummy)

2 barrier + 2 light dummy)

3 barrier + 36 addressed +1) dark

+ 9 barrier + light dummy

4.92 x 3.05 mm2

Pixel Array

809 x 499 (753 x 481 active)

6.0 m pixel

Figure 4. Pixel Array Description

Active Pixel (0, 0)

Array Pixel (4, 14)

Figure 5. Pixel Color Pattern Detail

(Top Right Corner)

Column Readout Direction

Row

Readout

Direction

Active Pixel (0, 0)

Array Pixel (4, 14)

Figure 6. Pixel Color Pattern Detail RCCC

Column Readout Direction

Row

Readout

Direction

CC C C CC C

CC C C

CCCC

CC C

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COLOR (RGB BAYER) DEVICE LIMITATIONS

The color version of the MT9V024 does not support or

offers reduced performance for the following

functionalities.

Pixel Binning

Pixel binning is done on immediate neighbor pixels only,

no facility is provided to skip pixels according to a Bayer

pattern. Therefore, the result of binning combines pixels of

different colors. See “Pixel Binning” for additional

information.

Interlaced Readout

Interlaced readout yields one field consisting only of red

and green pixels and another consisting only of blue and

green pixels. This is due to the Bayer pattern of the CFA.

Automatic Black Level Calibration

When the color bit is set (R0x0F[1]=1), the sensor uses

black level correction values from one green plane, which

are applied to all colors. To use the calibration value based

on all dark pixels’ offset values, the color bit should be

cleared.

Defective Pixel Correction

For defective pixel correction to calculate replacement

pixel values correctly, for color sensors the color bit must be

set (R0x0F[1] = 1). However, the color bit also applies

unequal offset to the color planes, and the results might not

be acceptable for some applications.

Other Limiting Factors

Black level correction and row−wise noise correction are

applied uniformly to each color. The row−wise noise

correction algorithm does not work well in color sensors.

Automatic exposure and gain control calculations are made

based on all three colors, not just the green channel. High

dynamic range does operate in color; however,

ON Semiconductor strongly recommends limiting use to

linear operation where good color fidelity is required.

OUTPUT DATA FORMAT

The MT9V024 image data can be read out in a progressive

scan or interlaced scan mode. Valid image data is surrounded

by horizontal and vertical blanking, as shown in Figure 7.

The amount of horizontal and vertical blanking is

programmable through R0x05 and R0x06, respectively

(R0xCD and R0xCE for context B). LV is HIGH during the

shaded region of the figure. See “Output Data Timing” for

the description of FV timing.

VALID iMAGE HORIZONTAL

BLANKING

VERTICAL/HORIZONTAL

BLANKING

VERTICAL BLANKING

00 00 00 ………… 00 00 00

P0,0 P0,1 P0,2…………P0,n−1 P0,n

P1,0 P1,1 P1,2…………P1,n−1 P1,n

Pm−1,0 Pm−1,1…………Pm−1,n−1 Pm−1,n

Pm,0 Pm,1…………Pm,n−1 Pm,n

Figure 7. Spatial Illustration of Image Readout

Output Data Timing

The data output of the MT9V024 is synchronized with the

PIXCLK output. When LINE_VALID (LV) is HIGH, one

10−bit pixel datum is output every PIXCLK period.

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LINE_VALID

PIXCLK

Blanking Valide Image Data Blanking

(9:0) P1

(9:0) P2

(9:0) P3

(9:0) P4

(9:0)

Pn−1

(9:0)

…

Figure 8. Timing Example of Pixel Data

DOUT(9:0)

The PIXCLK is a nominally inverted version of the master

clock (SYSCLK). This allows PIXCLK to be used as a clock

to latch the data. However, when column bin 2 is enabled, the

PIXCLK is HIGH for one complete master clock master

period and then LOW for one complete master clock period;

when column bin 4 is enabled, the PIXCLK is HIGH for two

complete master clock periods and then LOW for two

complete master clock periods. It is continuously enabled,

even during the blanking period. Setting R0x72 bit[4] = 1

causes the MT9V024 to invert the polarity of the PIXCLK.

The parameters P1, A, Q, and P2 in Figure 9 are defined

in Table 4.

Figure 9. Row Timing and FRAME_VALID/LINE_VALID Signals

P1 A QA QAP2

FRAME_VALID

LINE_VALID

...

Number of master clocks

Table 4. FRAME TIME

Parameter Name Equation Default Timing at 26.66 MHz

AActive data time Context A: R0x04

Context B: R0xCC

752 pixel clocks

= 752 master = 28.20 s

P1 Frame start blanking Context A: R0x05 − 23

Context B: R0xCD − 23

71 pixel clocks

= 71master = 2.66 s

P2 Frame end blanking 23 (fixed) 23 pixel clocks

= 23 master = 0.86 s

QHorizontal blanking Context A: R0x05

Context B: R0xCD

94 pixel clocks

= 94 master = 3.52 s

A+Q Row time Context A: R0x04 + R0x05

Context B: R0xCC + R0xCD

846 pixel clocks

= 846 master = 31.72 s

VVertical blanking Context A: (R0x03) x (A + Q) + 4

Context B: (R0xCB) x (A + Q) + 4

38,074 pixel clocks

= 38,074 master = 1.43 ms

Nrows x (A + Q) Frame valid time Context A: (R0x03) x (A + Q)

Context B: (R0xCB) x (A + Q)

406,080 pixel clocks

= 406,080 master = 15.23 ms

FTotal frame time V + (Nrows x (A + Q)) 444,154 pixel clocks

= 444,154 master = 16.66 ms

Sensor timing is shown above in terms of pixel clock and

master clock cycles (refer to Figure 8). The recommended

master clock frequency is 26.66 MHz. The vertical blanking

and the total frame time equations assume that the

integration time (coarse shutter width plus fine shutter

width) is less than the number of active rows plus the

blanking rows minus the overhead rows:

Window Height )Vertical Blanking *2(eq. 1)

If this is not the case, the number of integration rows must

be used instead to determine the frame time, as shown in

Table 4. In this example, it is assumed that the coarse shutter

width control is programmed with 523 rows and the fine

shutter width total is zero.

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For Simultaneous mode, if the exposure time registers

(coarse shutter width total plus Fine Shutter Width Total)

exceed the total readout time, then the vertical blanking time

is internally extended automatically to adjust for the

additional integration time required. This extended value is

not written back to the vertical blanking registers. The

vertical blank register can be used to adjust frame−to−frame

readout time. This register does not affect the exposure time

but it may extend the readout time.

Table 5. FRAME TIME − LONG INTEGRATION TIME

Parameter Name

Equation

(Number of Master Clock Cycles) Default Timing at 26.66 MHz

V’ Vertical blanking (long integration

time)

Context A: (R0x0B + 2 − R0x03) ×

(A + Q) + R0xD5 + 4

Context B: (R0xD2 + 2 − R0xCB) ×

(A + Q) + R0xD8 + 4

38,074 pixel clocks

= 38,074 master = 1.43ms

F” Total frame time (long integration

exposure time)

(R0x0B + 2) × (A + Q) + 4 444,154 pixel clocks

= 444,154 master = 16.66ms

4. The MT9V024 uses column parallel analog−digital converters; thus short row timing is not possible. The minimum total row time is 704

columns (horizontal width + horizontal blanking). The minimum horizontal blanking is 61 for normal mode, 71 for column bin 2 mode, and 91

for column bin 4 mode. When the window width is set below 643, horizontal blanking must be increased. In binning mode, the minimum row

time is R0x04+R0x05 = 704.

SERIAL BUS DESCRIPTION

Registers are written to and read from the MT9V024

through the two−wire serial inter−face bus. The MT9V024

is a serial interface slave with four possible IDs (0x90, 0x98,

0xB0 and 0xB8) determined by the S_CTRL_ADR0 and

S_CTRL_ADR1 input pins. Data is transferred into the

MT9V024 and out through the serial data (SDATA) line. The

SDATA line is pulled up to VDD off−chip by a 1.5 k resistor.

Either the slave or master device can pull the SDATA line

down−the serial interface protocol determines which device

is allowed to pull the SDATA line down at any given time. The

registers are 16−bit wide, and can be accessed through 16−or

8−bit two−wire serial interface sequences.

Protocol

1. a start bit

2. the slave device 8−bit address

3. a(n) (no) acknowledge bit

4. an 8−bit message

5. a stop bit

Start Bit

The start bit is defined as a HIGH−to−LOW transition of

the data line while the clock line is HIGH.

Slave Address

The 8−bit address of a two−wire serial interface device

consists of 7 bits of address and

1 bit of direction. A “0” in the LSB of the address indicates

write mode, and a “1” indicates read mode. As indicated

above, the MT9V024 allows four possible slave addresses

determined by the two input pins, S_CTRL_ADR0 and

S_CTRL_ADR1.

Acknowledge Bit

The master generates the acknowledge clock pulse. The

transmitter (which is the master when writing, or the slave

when reading) releases the data line, and the receiver

indicates an acknowledge bit by pulling the data line LOW

during the acknowledge clock pulse.

No−Acknowledge Bit

The no−acknowledge bit is generated when the data line

is not pulled down by the receiver during the acknowledge

clock pulse. A no−acknowledge bit is used to terminate

a read sequence.

Stop Bit

The stop bit is defined as a LOW−to−HIGH transition of

the data line while the clock line is HIGH.

Sequence

A typical READ or WRITE sequence begins by the

master sending a start bit. After the start bit, the master sends

the slave device’s 8−bit address. The last bit of the address

determines if the request is a read or a write, where a “0”

indicates a WRITE and a “1” indicates a READ. The slave

device acknowledges its address by sending an

acknowledge bit back to the master.

If the request was a WRITE, the master then transfers the

8−bit register address to which a WRITE should take place.

The slave sends an acknowledge bit to indicate that the

the data 8 bits at a time, with the slave sending an

acknowledge bit after each 8 bits. The MT9V024 uses

16−bit data for its internal registers, thus requiring two 8−bit

transfers to write to one register. After 16 bits are transferred,

the register address is automatically incremented, so that the

next 16 bits are written to the next register address. The

master stops writing by sending a start or stop bit.

A typical READ sequence is executed as follows. First the

master sends the write mode slave address and 8−bit register

address, just as in the write request. The master then sends

a start bit and the read mode slave address. The master then

clocks out the register data 8 bits at a time. The master sends

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an acknowledge bit after each 8−bit transfer. The register

address is automatically incremented after every 16 bits is

transferred. The data transfer is stopped when the master

sends a no−acknowledge bit. The MT9V024 allows for 8−bit

data transfers through the two−wire serial interface by

writing (or reading) the most significant 8 bits to the register

and then writing (or reading) the least significant 8 bits to

byte−wise address register (0x0F0).

Bus Idle State

The bus is idle when both the data and clock lines are

HIGH. Control of the bus is initiated with a start bit, and the

bus is released with a stop bit. Only the master can generate

the start and stop bits.

Table 6. SLAVE ADDRESS MODES

{S_CTRL_ADR1, S_CTRL_ADR0} Slave Address Write/Read Mode

00 0x90 Write

0x91 Read

01 0x98 Write

0x99 Read

10 0xB0 Write

0xB1 Read

11 0xB8 Write

0xB9 Read

Data Bit Transfer

One data bit is transferred during each clock pulse. The

two−wire serial interface clock pulse is provided by the

master. The data must be stable during the HIGH period of

the serial clock−it can only change when the two−wire serial

interface clock is LOW. Data is transferred 8 bits at a time,

followed by an acknowledge bit.

TWO−WIRE SERIAL INTERFACE SAMPLE READ

AND WRITE SEQUENCES

16−Bit Write Sequence

A typical write sequence for writing 16 bits to a register

is shown in Figure 10. A start bit given by the master,

followed by the write address, starts the sequence. The

image sensor then gives an acknowledge bit and expects the

After each 8−bit word is sent, the image sensor gives an

acknowledge bit. All 16 bits must be written before the

address is automatically incremented, so that the next 16 bits

are written to the next register. The master stops writing by

sending a start or stop bit.

Figure 10. Timing Diagram Showing a Write to R0x09 with Value 0x0284

SCLK

START ACK

0xB8 ADDR 0000 0010

R0x09

ACK ACK ACK

STOP

1000 0100

SDATA

16−Bit Read Sequence

A typical read sequence is shown in Figure 11. First the

master has to write the register address, as in a write

sequence. Then a start bit and the read address specify that

a read is about to happen from the register. The master then

clocks out the register data 8 bits at a time. The master sends

an acknowledge bit after each 8−bit transfer. The register

address is auto−incremented after every 16 bits is

transferred. The data transfer is stopped when the master

sends a no−acknowledge bit.

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Figure 11. Timing Diagram Showing a Read from R0x09; Returned Value 0x0284

SCLK

START ACK

0xB8 ADDR 0xB9 ADDR 0000 0010

R0x09

ACK ACK ACK

STOP

1000 0100

NACK

SDATA

8−Bit Write Sequence

To be able to write 1 byte at a time to the register, a special

writing the upper 8 bits to the desired register and then

writing the lower 8 bits to the special register address

(R0xF0). The register is not updated until all 16 bits have

been written. It is not possible to just update half of a register.

In Figure 12, a typical sequence for 8−bit writing is shown.

The second byte is written to the special register (R0xF0).

Figure 12. Timing Diagram Showing a Bytewise Write to R0x09 with Value 0x0284

STOP

ACKSTART

0xB8 ADDR

ACK

SCLK

ACKACKACKACK

R0x09

0xB8 ADDR 0000 0010 1000 0100

START

SDATA R0xF0

8−Bit Read Sequence

To read one byte at a time the same special register address

is used for the lower byte. The upper 8 bits are read from the

desired register. By following this with a read from the

byte−wise address register (R0xF0) the lower 8 bits are

accessed (Figure 13). The master sets the no−acknowledge

bits shown.

Figure 13. Timing Diagram Showing a Bytewise Read from R0x09; Returned Value 0x0284

START

0xB9 ADDR

SCLK

STOP

ACKACKACK

R0x09

START

0xB8 ADDR 0000 0010

START

0xB9 ADDR

SCLK

NACKACKACKACKSTART

0xB8 ADDR 1000 0100

SDATA

NACK

R0xF0

Included in the MT9V024 is a register lock (R0xFE)

feature that can be used as a solution to reduce the

probability of an inadvertent noise−triggered two−wire

serial interface write to the sensor. All registers, or only read

mode registers − R0x0D and R0x0E can be locked. It is

important to prevent an inadvertent two−wire serial

interface write to the read mode registers in automotive

applications since this register controls the image

orientation and any unintended flip to an image can cause

serious results.

At power−up, the register lock defaults to a value of

0xBEEF, which implies that all registers are unlocked and

any two−wire serial interface writes to the register get

committed.

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Lock All Registers

If a unique pattern (0xDEAD) to R0xFE is programmed,

any subsequent two−wire serial interface writes to registers

(except R0xFE) are NOT committed. Alternatively, if the

user writes a 0xBEEF to the register lock register, all

registers are unlocked and any subsequent two−wire serial

interface writes to the register are committed.

Lock Only Read More Registers (R0x0D and R0x0E)

If a unique pattern (0xDEAF) to R0xFE is programmed,

any subsequent two−wire serial interface writes to register

13 are NOT committed. Alternatively, if the user writes

a 0xBEEF to register lock register, register 13 is unlocked

and any subsequent two−wire serial interface writes to this

REAL-TIME CONTEXT SWITCHING

In the MT9V024, the user may switch between two full

change bit in register 0x07. This context switch will change

all registers (no shadowing) at the frame start time and have

the new values apply to the immediate next exposure and

readout time (frame n+1), except for shutter width and

V1−V4 control, which will take effect for next exposure but

will show up in the n+2 image.

Table 7. REAL−TIME CONTEXT−SWITCHABLE REGISTERS

Context B

Column Start 0x01 0xC9

Row Start 0x02 0xCA

Window Height 0x03 0xCB

Window Width 0x04 0xCC

Horizontal Blanking 0x05 0xCD

Vertical Blanking 0x06 0xCE

Coarse Shutter Width 1 0x08 0xCF

Coarse Shutter Width 2 0x09 0xD0

Coarse Shutter Width Control 0x0A 0xD1

Coarse Shutter Width Total 0x0B 0xD2

Fine Shutter Width 1 0xD3 0xD6

Fine Shutter Width 2 0xD4 0xD7

Fine Shutter Width Total 0xD5 0xD8

Read Mode 0x0D [5:0] 0x0E [5:0]

High Dynamic Range enable 0x0F [0] 0x0F [8]

ADC Resolution Control 0x1C [1:0] 0x1C [9:8]

V1 Control − V4 Control 0x31 − 0x34 0x39 − 0x3C

Analog Gain Control 0x35 0x36

Row Noise Correction Control 1 0x70 [1:0] 0x70 [9:8]

Tiled Digital Gain 0x80 [3:0] − 0x98 [3:0] 0x80 [11:8] − 0x98 [11:8]

AEC/AGC Enable 0xAF [1:0] 0xAF [9:8]

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Recommended Register Settings

Table 8 describes new suggested register settings, and

descriptions of performance improvements and conditions:

Table 8. RECOMMENDED REGISTER SETTINGS AND PERFORMANCE IMPACT

(RESERVED REGISTERS)

R0x20 0x01C1 0x03C7 Recommended by design to improve performance in HDR

mode and when frame rate is low. We also recommended

using R0x13 = 0x2D2E with this setting for better column

FPN. NOTE: When coarse integration time set to 0 and fine

integration time less than 456, R0x20 should be set to

0x01C7

R0x24 0x0010 0x001B Corrects pixel negative dark offset when global reset in

R0x20[9] is enabled.

R0x2B 0x0004 0x0003 Improves column FPN.

R0x2F 0x0004 0x0003 Improves FPN at near−saturation.

FEATURE DESCRIPTION

Operational Modes

The MT9V024 works in master, snapshot, or slave mode.

In master mode the sensor generates the readout timing. In

snapshot mode it accepts an external trigger to start

integration, then generates the readout timing. In slave mode

the sensor accepts both external integration and readout

controls. The integration time is programmed through the

two−wire serial interface during master or snapshot modes,

or controlled through an externally generated control signal

during slave mode.

Master Mode

There are two possible operation methods for master

mode: simultaneous and sequential. One of these operation

modes must be selected through the two−wire serial

inter−face. Additional details on this mode can be found in

AND9255/D Master Exposure Mode Operation.

Simultaneous Master Mode

In simultaneous master mode, the exposure period occurs

during readout. The frame synchronization waveforms are

shown in Figure 14 and Figure 15. The exposure and readout

happen in parallel rather than sequential, making this the

fastest mode of operation.

EXPOSURE TIME

FRAME TIME

tVBLANK

tLED2FV−SIM

LED_OUT

FRAME_VALID

LINE_VALID

Figure 14. Simultaneous Master Mode Synchronization Waveforms #1

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EXPOSURE TIME

FRAME TIME

tLED2FV−SIM tLEDOFF

tVBLANK

LED_OUT

FRAME_VALID

LINE_VALID

Figure 15. Simultaneous Master Mode Synchronization Waveforms #2

When exposure time is greater than the sum of vertical

blank and window height, the number of vertical blank rows

is increased automatically to accommodate the exposure

time.

Sequential Master Mode

In sequential master mode the exposure period is followed

by readout. The frame synchronization waveforms for

sequential master mode are shown in Figure 16. The frame

rate changes as the integration time changes.

FRAME TIME

tLED2FV−SEQ t2FVLED−SEQ

EXPOSURE

TIME

tVBLANK

LED_OUT

FRAME_VALID

LINE_VALID

Figure 16. Simultaneous Master Mode Synchronization Waveforms

Snapshot Mode

In snapshot mode the sensor accepts an input trigger

signal which initiates exposure, and is immediately

followed by readout. Figure 17 shows the interface signals

used in snapshot mode. In snapshot mode, the start of the

integration period is determined by the externally applied

EXPOSURE pulse that is input to the MT9V024. The

integration time is preprogrammed at R0x0B or R0xD2

through the two−wire serial interface. After the frame’s

integration period is complete the readout process

commences and the syncs and data are output. Sensor in

snapshot mode can capture a single image or a sequence of

images. The frame rate may only be controlled by changing

the period of the user supplied EXPOSURE pulse train. The

frame synchronization waveforms for snapshot mode are

shown in Figure 18. Additional details on this mode can be

found in AND9248/D−Snapshot Exposure Mode

Operation.

CONTROLLER MT9V024

EXPOSURE

SYSCLK

DOUT(9:0

)

PIXCLK

LINE_VALID

FRAME_VALID

Figure 17. Snapshot Mode Interface Signals

DOUT(9:0)

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TLED2FV

TE2LED

TEW

TFV2E

TVBLANK

TE2E

FRAME TIME

EXPOSURE

TIME

EXPOSURE

LED_OUT

FRAME_VALID

LINE_VALID

Figure 18. Snapshot Mode Frame Synchronization Waveforms

Slave Mode

In slave mode, the exposure and readout are controlled

using the EXPOSURE, STFRM_OUT, and STLN_OUT

pins. When the slave mode is enabled, STFRM_OUT and

STLN_OUT become input pins.

The start and end of integration are controlled by

EXPOSURE and STFRM_OUT pulses, respectively. While

a STFRM_OUT pulse is used to stop integration, it is also

used to enable the readout process.

After integration is stopped, the user provides

STLN_OUT pulses to trigger row readout. A full row of data

is read out with each STLN_OUT pulse. The user must

provide enough time between successive STLN_OUT

pulses to allow the complete readout of one row.

It is also important to provide additional STLN_OUT

pulses to allow the sensors to read the vertical blanking rows.

It is recommended that the user program the vertical blank

vertical blanking between frames by delaying the

application of the STFRM_OUT pulse.

The elapsed time between the rising edge of STLN_OUT

and the first valid pixel data is calculated for context A by

[horizontal blanking register (R0x05) + 4] clock cycles. For

context B, the time is (R0xCD + 4) clock cycles.

Additional details on this mode can be found in

AND9241/D − Slave Exposure Mode Operation.

EXPOSURE

TIME

tSF2SF

tSFW

tFV2SF

tSF2FV

tSF2LED

tE2LED

tEW

TE2SF

EXPOSURE

STFRM_OUT

STLN_OUT

FRAME_VALID

LINE_VALID

LED_OUT

Figure 19. Exposure and Readout Timing (Simultaneous Mode)

NOTES: 1. No drawn to scale.

2. Frame readout shortened for clarity.

3. Simultaneous progressive scan readout mode shown.

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tSF2SF

tSFW

tFV2E

tSF2FV

tE2SF

tEW

tE2LED tSF2LED EXPOSURE

TIME

EXPOSURE

STFRM_OUT

STLN_OUT

FRAME_VALID

LINE_VALID

LED_OUT

Figure 20. Exposure and Readout Timing (Sequential Mode)

NOTES: 1. Not drawn to scale.

2. Frame readout shortened for clarity

3. STLN_OUT pulses are optional during exposure time.

4. Sequential progressive scan readout mode shown.

Signal Path

The MT9V024 signal path consists of a programmable

gain, a programmable analog offset, and a 10−bit ADC. See

“Black Level Calibration” for the programmable offset

operation description.

Figure 21. Signal Path

Pixel Output

(reset minus signal)

Offset Correction

Voltage (R0x48 or

result of BLC)

Gain Selection

(R0x35 or R0x36 or

result of AGC)

ADC Data

(9:0)

10 (12) bit ADC

VREF

(R0x2C)

ON−CHIP BIASES

ADC Voltage Reference

The ADC voltage reference is programmed through

R0x2C, bits 2:0. The ADC reference ranges from 1.0 V to

2.1 V. The default value is 1.4 V. The increment size of the

voltage reference is 0.1 V from 1.0 V to 1.6 V (R0x2C[2:0]

values 0 to 6). At R0x2C[2:0] = 7, the reference voltage

jumps to 2.1 V.

It is very important to preserve the correct values of the

other bits in R0x2C. The default register setting is 0x0004.

This corresponds to 1.4 V−at this setting 1 mV input to the

ADC equals approximately 1 LSB.

V_Step Voltage Reference

This voltage is used for pixel high dynamic range

operations, programmable from R0x31 through R0x34 for

context A, or R0x39 through R0x3B for context B.

Chip Version

Chip version register R0x00 is read−only.

WINDOW CONTROL

Registers column start A/B, row start A/B, window height

A/B (row size), and window width (column size) A/B

control the size and starting coordinates of the window.

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The values programmed in the window height and width

registers are the exact window height and width out of the

sensor. The window start value should never be set below

four.

To read out the dark rows set bit 6 of R0x0D. In addition,

bit 7 of R0x0D can be used to display the dark columns in

the image. Note that there are Show Dark settings only for

context A.

BLANKING CONTROL

Horizontal blank and vertical blank registers R0x05 and

R0x06 (B: 0xCD and R0xCE), respectively, control the

blanking time in a row (horizontal blanking) and between

frames (vertical blanking).

•Horizontal blanking is specified in terms of pixel

clocks.

•Vertical blanking is specified in terms of numbers of

rows.

The actual imager timing can be calculated using Tables 4

and 5, which describe “Row Timing and FV/LV signals.”

The minimum number of vertical blank rows is 4.

PIXEL INTEGRATION CONTROL

Total Integration

Total integration time is the result of coarse shutter width

and fine shutter width registers, and depends also on whether

manual or automatic exposure is selected.

The actual total integration time, tINT is defined as:

tINT +tINTCoarse )tINTint (eq. 1)

= (number of rows of integration × row time)

+ (number of pixels of integration × pixel time)

where:

•Number of Rows of Integration

(Auto Exposure Control: Enabled)

When automatic exposure control (AEC) is enabled, the

number of rows of integration may vary from frame to

frame, with the limits controlled by R0xAC (minimum

coarse shutter width) and R0xAD (maximum coarse

shutter width).

•Number of Rows of Integration

(Auto Exposure Control: Disabled)

If AEC is disabled, the number of rows of integration

equals the value in R0x0B. or

If context B is enabled, the number of rows of integration

equals the value in R0xD2.

•Number of pixels of Integration

The number of fine shutter width pixels is independent

of AEC mode (enabled or disabled):

♦Context A: the number of pixels of integration

equals the values in R0xD5.

♦Context B: the number of pixels of integration

equals the value in R0xD8.

Row Timing

Context A:

Row time +(R0x04 )R0x05)master clock periods (eq. 2)

Context B:

Row time +(R0xCC )R0xCD) master clock periods (eq. 3)

Typically, the value of the Coarse Shutter Width Total

registers is limited to the number of rows per frame (which

includes vertical blanking rows), such that the frame rate is

not affected by the integration time. If the Coarse Shutter

Width Total is increased beyond the total number of rows per

frame, the user must add additional blanking rows using the

Vertical Blanking registers as needed. See descriptions of

the Vertical Blanking registers, R0x06 and R0xCE in

Table 1and Table 2 of the MT9V024 register reference.

A second constraint is that tINT must be adjusted to avoid

banding in the image from light flicker. Under 60Hz flicker,

this means the frame time must be a multiple of 1/120 of a

second. Under 50Hz flicker, the frame time must be a

multiple of 1/100 of a second.

Changes to Integration Time

With automatic exposure control disabled (R0xAF[0] for

context A, or R0xAF[8] for context B) and if the total

integration time (R0x0B or R0xD2) is changed through the

two−wire serial interface while FV is asserted for frame n,

the first frame output using the new integration time is frame

(n + 2). Similarly, when automatic exposure control is

enabled, any change to the integration time for frame n first

appears in frame (n + 2) output. Additional details on this

latency can be found in AND9251/D − Latency of Exposure

or Gain Switch.

MT9V024/D

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The sequence is as follows:

1. During frame n, the new integration time is held

in the R0x0B or R0D2 live register.

2. Prior to the start of frame (n + 1) readout, the new

integration time is transferred to the exposure

control module. Integration for each row of frame

(n + 1) has been completed using the old

integration time. The earliest time that a row can

start integrating using the new integration time is

immediately after that row has been read for frame

(n + 1). The actual time that rows start integrating

using the new integration time is dependent on the

new value of the integration time.

3. When frame (n + 2) is read out, it is integrated

using the new integration time. If the integration

time is changed (R0x0B or R0xD2 written) on

successive frames, each value written is applied to

a single frame; the latency between writing a value

and it affecting the frame readout remains at two

frames.

frame n+1 frame n+2

frame n

write new exposure value (Exp “B”)

idle

Exp “A” Exp “A” Exp “B” Exp “B” Exp “B”

Readout Exp “B”Readout Exp “B”

Readout Exp “B”

Readout Exp “A”

New image available

at output

Frame start acti-

vates new exposure

value (Exp “B”)

AEC −sample writes

new exposure value

(Exp “B”)

AEC −sample writes

new exposure value

(Exp “B”)

Figure 22. Latency of Exposure Register in Master Mode

Two−wire

serial interface

(Input)

LED_OUT

(Output)

FRAME_VALID

(Output)

Exposure Indicator

The exposure indicator is controlled by:

•R0x1B LED_OUT Control

The MT9V024 provides an output pin, LED_OUT, to

indicate when the exposure takes place. When R0x1B

bit 0 is clear, LED_OUT is HIGH during exposure. By

using R0x1B, bit 1, the polarity of the LED_OUT pin

can be inverted.

High Dynamic Range

High dynamic range is controlled by:

Table 9. HIGH DYNAMIC RANGE

Context A Context B

High Dynamic Enable R0x0F[0] R0x0F[8]

Shutter Width 1 R0x08 R0xCF

Shutter Width 2 R0x09 R0xD0

Shutter Width Control R0x0A R0xD1

V_Step Voltages R0x31−R0x34 R0x39−R0x3C

In the MT9V024, high dynamic range (by setting R0x0F,

bit 0 or 8 to 1) is achieved by controlling the saturation level

of the pixel (HDR or high dynamic range gate) during the

exposure period. The sequence of the control voltages at the

HDR gate is shown in Figure 23. After the pixels are reset,

the step voltage, V_Step, which is applied to HDR gate, is

set up at V1 for integration time t1, then to V2 for time t2, then

V3 for time t3, and finally it is parked at V4, which also

serves as an antiblooming voltage for the photodetector.

This sequence of voltages leads to a piecewise linear pixel

response, illustrated (approximately) in Figure 23 and in

Figure 24.

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VAA(3.3V)

Figure 23. Sequence of Control Voltages at the HDR Gate

Exposure

HDR

Voltage

V1~1.4V V2~1.2V V3~1.0V

V4~0.8V

t1t2t3

VAA(3.3V)

V1~1.4V V2~1.2V V3~1.0V

t1t2t3

Output

Light Intensity

dV1

dV2

dV3

1/t 11/t 22 1/t 3

Figure 24. Sequence of Voltages in a Piecewise Linear Pixel Response

The parameters of the step voltage V_Step, which take

values V1, V2, and V3, directly affect the position of the

knee points in Figure 24.

Light intensities work approximately as a reciprocal of the

partial exposure time. Typically, t1 is the longest exposure,

t2 shorter, and so on. Thus the range of light intensities is

shortest for the first slope, providing the highest sensitivity.

The register settings for V_Step and partial exposures are:

V1 = R0x31, bits 5:0 (Context B: R0x39, bits 5:0)

V2 = R0x32, bits 5:0 (Context B: R0x3A, bits 5:0)

V3 = R0x33, bits 5:0 (Context B: R0x3B, bits 5:0)

V4 = R0x34, bits 5:0 (Context B: R0x3C, bits 5:0)

tINT = t1 + t2 + t3

There are two ways to specify the knee points timing, the

first by manual setting and the second by automatic knee

point adjustment. Knee point auto adjust is controlled for

context A by R0x0A[8] (where default is ON), and for

context B by R0xD1[8] (where default is OFF ).

When the knee point auto adjust enabler is enabled (set

HIGH), the MT9V024 calculates the knee points

automatically using the following equations:

t1+tINT *t2*t3(eq. 4)

t2+tINTx(1ń2)R0x0A[3:0]orR0xD1[3:0]

(eq. 5)

t3+tINTx(1ń2)R0x0A[7:4]orR0xD1[7:4]

(eq. 6)

As a default for auto exposure, t2 is 1/16 of tINT, t3 is 1/64

of tINT.

When the auto adjust enabler is disabled (set LOW ), t1, t2,

and t3 may be programmed through the two−wire serial

interface:

t1+Coarse SW1(row *times) )Fine SW1(pixel *times) (eq. 7)

t2+Coarse SW2 *Coarse SW1 )Fine SW2 *Fine SW1 (eq. 8)

t3+Total Integration *t1*t2+Coarse Total Shutter Width )Fine Shutter Width Totall *t1*t2(eq. 9)

For context A these become:

t1+R0x08 )R0xD3 (eq. 10)

t3+R0x09 *R0x08 )R0xD4 *R0xD3 (eq. 11)

t3+R0x0B )R0xD4 *t1*t2(eq. 12)

For context B these are:

t1+R0xCF )R0xD6 (eq. 13)

t3+R0xD0 *R0xCF )R0xD7 *R0xD6 (eq. 14)

t3+R0xD2 )R0xD8 *t1*t2(eq. 15)

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In all cases above, the coarse component of total

integration time may be based on the result of AEC or values

in R0x0B and R0xD2, depending on the settings.

Similar to Fine Shutter Width Total registers, the user

must not set the Fine Shutter Width 1 or Fine Shutter Width

2 register to exceed the row time (Horizontal Blanking +

Window Width). The absolute maximum value for the Fine

Shutter Width registers is 1774 master clocks.

ADC Companding Mode

By default, ADC resolution of the sensor is 10−bit.

Additionally, a companding scheme of 12−bit into 10−bit is

enabled by the ADC Companding Mode register. This mode

allows higher ADC resolution, which means less

quantization noise at low light, and lower resolution at high

light, where good ADC quantization is not so critical

because of the high level of the photon’s shot noise.

256 512 1,024 2,048 4,096

256

512

1,024

768

10−bit

Codes

12−bit

Codes

No companding (0 −255 0 −255)

256 −383)2 to 1 Companding (256− 511

4 to 1 Companding (512− 2047 384 − 767)

768 − 1023)8 to 1 Companding (2,048 − 4095

Figure 25. 12− to 10−Bit Companding Chart

GAIN SETTINGS

Changes to Gain Settings

When the analog gain (R0x35 for context A or R0x36 for

context B) or the digital gain settings (R0x80–R0x98) are

changed, the gain is updated on the next frame start. The gain

setting must be written before the frame boundary to take

effect the next frame. The frame boundary is slightly after

the falling edge of Frame_Valid. In Figure 26 this is shown

by the dashed vertical line labeled Frame Start.

Both analog and digital gain change regardless of whether

the integration time is also changed simultaneously. Digital

gain will change as soon as the register is written. Additional

details on this latency can be found in AND9251/D Latency

of Exposure or Gain Switch.

frame n+1 frame n+2

frame n

write new gain value (Gain “B”)

idleidle

Readout Gain “B”Readout Gain “B”

Readout Gain “B”

Readout Gain “A”

New image available

at output

Frame−start writes new

gain value (Exp “B”)

AGC −sample acti-

vates new gain

value (Gain “B”)

AEC −sample point

Figure 26. Latency of Gain Register(s) in Master Mode

Readout Gain “A”

Frame−start

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Analog Gain

Analog gain is controlled by:

•R0x35 Global Gain context A

•R0x36 Global Gain context B

The formula for gain setting is:

Gain +Bits[6 : 0] x 0.0625 (eq. 16)

The analog gain range supported in the MT9V024 is

1X–4X with a step size of 6.25 percent. To control gain

manually with this register, the sensor must NOT be in AGC

mode. When adjusting the luminosity of an image, it is

recommended to alter exposure first and yield to gain

increases only when the exposure value has reached

a maximum limit.

Analog gain = bits (6:0) x 0.0625 for values 16–31

Analog gain = bits (6:0)/2 x 0.125 for values 32–64

For values 16–31: each LSB increases analog gain

0.0625v/v. A value of 16 = 1X gain.

Range: 1X to 1.9375X.

For values 32–64: each 2 LSB increases analog gain

0.125v/v (that is, double the gain increase for 2 LSB).

Range: 2X to 4X. Odd values do not result in gain increases;

the gain increases by 0.125 for values 32, 34, 36, and so on.

Digital Gain

Digital gain is controlled by:

•R0x99−R0xA4 Tile Coordinates

•R0x80−R0x98 Tiled Digital Gain and Weight

In the MT9V024, the gain logic divides the image into 25

tiles, as shown in Figure 27. The size and gain of each tile can

be adjusted using the above digital gain control registers.

Separate tile gains can be assigned for context A and context

Registers 0x99–0x9E and 0x9F–0xA4 represent the

coordinates X0/5–X5/5 and Y0/5–Y5/5 in Figure 27,

respectively.

Digital gains of registers 0x80–0x98 apply to their

corresponding tiles. The MT9V024 supports a digital gain

of 0.25–3.75X.

When binning is enabled, the tile offsets maintain their

absolute values; that is, tile coordinates do not scale with row

or column bin setting. Digital gain is applied as soon as

NOTE: There is one exception, for the condition when

Column Bin 4 is enabled (R0x0D[3:2] or

R0x0E[3:2] = 2). For this case, the value for

Digital Tile Coordinate X–direction must be

doubled.

The formula for digital gain setting is:

Digital Gain +Bits[3 : 0] x 0.25 (eq. 17)

X0/5 X1/5 X2/5 X3/5 X4/5 X5/5

Y0/5

Y2/5

Y1/5

Y3/5

Y4/5

Y5/5

Figure 27. Tiled Sample

x0_y0 x1_y0 x4_y0

x0_y1 x1_y1 x4_y1

x0_y2 x1_y2 x4_y2

x0_y3 x1_y3 x4_y3

x0_y4 x1_y4 x4_y4

Black Level Calibration

Black level calibration is controlled by:

•Frame Dark Average: R0x42

•Dark Average Thresholds: R0x46

•Black Level Calibration Control: R0x47

•Black Level Calibration Value: R0x48

•Black Level Calibration Value Step Size: R0x4C

The MT9V024 has automatic black level calibration

on−chip, and if enabled, its result may be used in the offset

correction shown in Figure 28.

MT9V024/D

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Figure 28. Black Level Calibration Flow Chart

Pixel Output

(reset minus signal)

Offset Correction

Voltage (R0x48 or

result of BLC)

Gain Selection

(R0x35 or R0x36 or

result of AGC)

ADC Data

(9:0)

10 (12) bit ADC

VREF

(R0x2C)

The automatic black level calibration measures the

average value of pixels from 2 dark rows (1 dark row if row

bin 4 is enabled) of the chip. (The pixels are averaged as if

they were light−sensitive and passed through the appropriate

gain.)

This row average is then digitally low−pass filtered over

many frames (R0x47, bits 7:5) to remove temporal noise and

random instabilities associated with this measurement.

Then, the new filtered average is compared to a minimum

acceptable level, low threshold, and a maximum acceptable

level, high threshold.

If the average is lower than the minimum acceptable level,

the offset correction voltage is increased by a programmable

offset LSB in R0x4C. (Default step size is 2 LSB Offset =

1 ADC LSB at analog gain = 1X.)

If it is above the maximum level, the offset correction

voltage is decreased by 2 LSB (default).

To avoid oscillation of the black level from below to

above, the region the thresholds should be programmed so

the difference is at least two times the offset DAC step size.

In normal operation, the black level calibration

value/offset correction value is calculated at the beginning

of each frame and can be read through the two−wire serial

inter−face from R0x48. This register is an 8−bit signed two’s

complement value.

However, if R0x47, bit 0 is set to “1,” the calibration value

in R0x48 is used rather than the automatic black level

calculation result. This feature can be used in conjunction

with the “show dark rows” feature (R0x0D[6]) if using an

external black level calibration circuit.

The offset correction voltage is generated according to the

following formulas:

OffsetCorrectionVoltage +(8 *bit signed twoȀs complement calibration value, 127 0.25mV (eq. 18)

ADC input voltage +(Pixel Output Voltage) * Analog Gain )Offset Correction Voltage (AnalogGain )1) (eq. 19)

Defective Pixel Correction

Defective pixel correction is intended to compensate for

defective pixels by replacing their value with a value based

on the surrounding pixels, making the defect less notice−

able to the human eye. The locations of defective pixels are

stored in a ROM on chip during the manufacturing process;

the maximum number of defects stored is 32. There is no

provision for later augmenting the table of programmed

defects. In the defect correction block, bad pixels will be

substituted by either the average of its neighboring pixels, or

its nearest−neighbor pixel, depending on pixel location.

Defective Pixel Correction is enabled by R0x07[9]. By

default, correction is enabled, and pixels mapped in internal

ROM are replaced with corrected values. This might be

unacceptable to some applications, in which case pixel

correction should be disabled (R0x07[9] = 0).

For complete details on using Defective Pixel Correction,

refer to AND9554/D, “Defective Pixel Correction −

Description and Usage”.

Row−wise Noise Correction

Row−wise noise correction is controlled by the following

registers:

•R0x70 Row Noise Control

•R0x72 Row Noise Constant

Row−wise noise cancellation is performed by calculating

a row average from a set of optically black pixels at the start

of each row and then applying each average to all the active

pixels of the row. Read Dark Columns register bit and Row

Noise Correction Enable register bit must both be set to

enable row−wise noise cancellation to be performed. The

behavior when Read Dark Columns register bit = 0 and Row

Noise Correction Enable register bit = 1 is undefined.

The algorithm works as follows:

Logical columns 755−790 in the pixel array provide 36

optically black pixel values. Of the 36 values, two smallest

value and two largest values are discarded. The remaining

32 values are averaged by summing them and discarding the

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5 LSB of the result. The 10−bit result is subtracted from each

pixel value on the row in turn. In addition, a positive constant

will be added (Reg0x71, bits 7:0). This constant should be

set to the dark level targeted by the black level algorithm plus

the noise expected on the measurements of the averaged

values from dark columns; it is meant to prevent clipping

from negative noise fluctuations.

Pixel value +ADC value *dark column average )R0x71[9 : 0]

(eq. 20)

Note that this algorithm does not work in color sensor.

Automatic Gain Control and Automatic Exposure

Control

The integrated AEC/AGC unit is responsible for ensuring

that optimal auto settings of exposure and (analog) gain are

computed and updated every frame.

AEC and AGC can be individually enabled or disabled by

R0xAF. When AEC is disabled (R0xAF[0] = 0), the sensor

uses the manual exposure value in coarse and fine shutter

width registers. When AGC is disabled (R0xAF[1] = 0), the

sensor uses the manual gain value in R0x35 or R0x36. See

“Pixel Integration Control” for more information.

MAX. EXPOSURE

(R6xBD)

DESIRED BIN

(desired luminance)

(R0xA5)

MAX. GAIN

(R0x36)

EXP. LPF

(R6xA8)

EXP. SKIP

(R0xA6)

MANUAL EXP.

(R0x08)

AEC ENABLE

(R0Xaf[0])

To exposure

timing control

To analog

gain control

R0xBA

AEC

OUTPUT

R0xBB

AGC OUTPUT

MIN GAIN

MIN EXP

GAIN LPF

(R0xAB)

GAIN SKIP

(R0xA9)

MANUAL GAIN

(R0x35)

AGC ENABLE

(R0xAF[1])

CURRENT BIN

(current luminance

(R0xBC)

AEC

UNIT

HISTOGRAM

GENERATOR

UNIT

AGC

UNIT

Figure 29. Controllable and Observable AEC/AGC Registers

The exposure is measured in row−time by reading

R0xBB. The exposure range is 1 to 2047. The gain is

measured in gain−units by reading R0xBA. The gain range

is 16 to 63 (unity gain = 16 gain−units; multiply by 1/16 to

get the true gain).

When AEC is enabled (R0xAF), the maximum auto

exposure value is limited by R0xBD; minimum auto

exposure is limited by AEC Minimum Exposure, R0xAC.

NOTE: AEC does not support sub−row timing;

calculated exposure values are rounded down to

the nearest row−time. For smoother response,

manual control is recommended for short

exposure times.

When AGC is enabled (R0xAF), the maximum auto gain

value is limited by R0xAB; minimum auto gain is fixed to

16 gain−units.

The exposure control measures current scene luminosity

and desired output luminosity by accumulating a histogram

of pixel values while reading out a frame. All pixels are used,

whether in color or mono mode. The desired exposure and

gain are then calculated from this for subsequent frame.

When binning is enabled, tuning of the AEC may be

required. The histogram pixel count register, R0xB0, may be

adjusted to reflect reduced pixel count. Desired bin register,

R0xA5, may be adjusted as required.

Pixel Clock Speed

The pixel clock speed is same as the master clock

(SYSCLK) at 26.66 MHz by default. However, when

column binning 2 or 4 (R0x0D or R0x0E, bit 2 or 3) is

enabled, the pixel clock speed is reduced by half and

one−fourth of the master clock speed respectively. See

“Read Mode Options” and “Column Binning” for additional

information.

Hard Reset of Logic

The RC circuit for the MT9V024 uses a 10 k resistor and

a 0.1 F capacitor. The rise time for the RC circuit is 1 s

maximum.

Soft Reset of Logic

Soft reset of logic is controlled by:

•R0x0C Reset

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Bit 0 is used to reset the digital logic of the sensor while

preserving the existing two−wire serial interface

configuration. Furthermore, by asserting the soft reset, the

sensor aborts the current frame it is processing and starts

a new frame. Bit 1 is a shadowed reset control register bit to

explicitly reset the automatic gain and exposure control

feature.

These two bits are self−resetting bits and also return to “0”

during two−wire serial inter−face reads.

STANDBY Control

The sensor goes into standby mode by setting STANDBY

to HIGH. Once the sensor detects that STANDBY is

asserted, it completes the current frame before disabling the

digital logic, internal clocks, and analog power enable

signal. To release the sensor out from the standby mode,

reset STANDBY back to LOW. The LVDS must be powered

to ensure that the device is in standby mode. See ”Appendix

A: Power−On Reset and Standby Timing” for more

information on standby.

Monitor Mode Control

Monitor mode is controlled by:

•R0xD9 Monitor Mode Enable

•R0xC0 Monitor Mode Image Capture Control

The sensor goes into monitor mode when R0xD9[0] is set

to HIGH. In this mode, the sensor first captures

a programmable number of frames (R0xC0), then goes into

a sleep period for five minutes. The cycle of sleeping for five

minutes and waking up to capture a number of frames

continues until R0xD9[0] is cleared to return to normal

operation.

In some applications when monitor mode is enabled, the

purpose of capturing frames is to calibrate the gain and

exposure of the scene using automatic gain and exposure

control feature. This feature typically takes less than 10

frames to settle. In case a larger number of frames is needed,

the value of R0xC0 may be increased to capture more

frames.

During the sleep period, none of the analog circuitry and

a very small fraction of digital logic (including

a five−minute timer) is powered. The master clock

(SYSCLK) is therefore always required.

READ MODE OPTIONS

(Also see “Output Data Format” and “Output Data

Timing”.)

Column Flip

By setting bit 5 of R0x0D or R0x0E the readout order of

the columns is reversed, as shown in Figure 30.

Row Flip

By setting bit 4 of R0x0D or R0x0E the readout order of

the rows is reversed, as shown in Figure 31.

Figure 30. Readout of Six Pixels in Normal and Column Flip Output Mode

LINE_VALID

Normal readout

DOUT(9:0

)

Reverse readout

DOUT(9:0

)

P4,1

(9:0) P4,2

(9:0) P4,3

(9:0) P4,4

(9:0) P4,5

(9:0) P4,6

(9:0)

P4,n

(9:0) P4,n−1

(9:0) P4,n−2

(9:0) P4,n−3

(9:0)

P4,n−4

(9:0) P4,n−5

(9:0)

DOUT(9:0)

Figure 31. Readout of Six Rows in Normal and Row Flip Output Mode

FRAME_VALID

Normal readout

DOUT(9:0

)

Reverse readout

DOUT(9:0

)

Row4

(9:0) Row5

(9:0) Row6

(9:0) Row7

(9:0) Row8

7(9:0) Row9

(9:0)

Row484

(9:0)

Row483

(9:0)

Row482

(9:0) Row481

(9:0)

Row480

7(9:0) Row479

(9:0)

DOUT(9:0)

Pixel Binning

In addition to windowing mode in which smaller

resolutions (CIF, QCIF) are obtained by selecting a smaller

window from the sensor array, the MT9V024 also provides

the ability to down−sample the entire image captured by the

pixel array using pixel binning.

There are two resolution options: binning 2 and binning 4,

which reduce resolution by two or by four, respectively. Row

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and column binning are separately selected. Image

mirroring options will work in conjunction with binning.

For column binning, either two or four columns are

combined by averaging to create the resulting column. For

row binning, the binning result value depends on the

difference in pixel values: for pixel signal differences of less

than 200 LSBs, the result is the average of the pixel values.

For pixel differences of greater than 200 LSBs, the result is

the value of the darker pixel value.

Row Binning

By setting bit 0 or 1 of R0x0D or R0x0E, only half or

one−fourth of the row set is read out, as shown in Figure 32.

The number of rows read out is half or one−fourth of the

value set in R0x03. The row binning result depends on the

difference in pixel values: for pixel signal differences less

than 200 LSBs, the result is the average of the pixel values.

For pixel differences of 200 LSBs or more, the result is the

value of the darker pixel value.

Column Binning

For column binning, either two or four columns are

combined by averaging to create the result. In setting bit 2

or 3 of R0x0D or R0x0E, the pixel data rate is slowed down

by a factor of either two or four, respectively. This is due to

the overhead time in the digital pixel data processing chain.

As a result, the pixel clock speed is also reduced accordingly.

Row10

(9:0)

Row4

(9:0) Row5

(9:0) Row6

(9:0) Row7

(9:0) Row8

7(9:0) Row9

(9:0)

LINE_VALID

Normal readout

LINE_VALID

Row Bin 2 readout

LINE_VALID

Row Bin 4 readout

Row11

(9:0)

Row4

(9:0) Row6

(9:0) Row8

(9:0) Row10

(9:0)

Row4

(9:0) Row8

(9:0)

Figure 32. Readout of 8 Pixels in Normal and Row Bin Output Mode

DOUT(9:0)

Figure 33. Readout of 8 Pixels in Normal and Column Bin Output Mode

d1234

(9:0)

LINE_VALID

Normal readout

DOUT(9:0

)

PIXCLK

LINE_VALID

Column Bin 2 readout

DOUT(9:0

)

PIXCLK

LINE_VALID

Column Bin 4 readout

DOUT(9:0

)

PIXCLK

(9:0) D3

(9:0) D4

(9:0) D5

(9:0) D6

(9:0) D7

(9:0)

(9:0) D8

(9:0)

D12

(9:0) D34

(9:0) D56

(9:0) D78

(9:0)

d5678

(9:0)

DOUT(9:0)

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Interlaced Readout

The MT9V024 has two interlaced readout options. By

setting R0x07[2:0] = 1, all the even−numbered rows are read

out first, followed by a number of programmable field

blanking rows (set by R0xBF[7:0]), then the odd−numbered

rows, and finally the vertical blanking rows. By setting

R0x07[2:0] = 2 only one field row is read out.

Consequently, the number of rows read out is half what

is set in the window height register. The row start register

determines which field gets read out; if the row start register

is even, then the even field is read out; if row start address

is odd, then the odd field is read out.

VALID IMAGE − Even Field

00 00 00 ………… 00 00 00

P4,1 P4,2 P4,3…………P4,n−1 P4,n

P6,0 P6,1 P6,2…………P6,n−1 P6,n

00 00 00 …………………… 00 00 00

00 00 00 ………… 00 00 00

Pm−2,0 Pm−2,2………Pm−2,n−2 Pm−2,n

Pm,2 Pm,2…………Pm,n−1 Pm,n

VALID IMAGE − Odd Field

HORIZONTAL

BLANKING

FIELD BLANKING

VERTICAL BLANKING

P5,1 P5,2 P5,3…………P5,n−1 P5,n

P7,0 P7,1 P7,2…………P7,n−1 P7,n

Pm−3,1 Pm−3,2………Pm−3,n−1 Pm−3,n

Pm,1 Pm,1…………Pm,n−1 Pm,n

00 00 00 ……………………………… 00 00 00

Figure 34. Spatial Illustration of Interlaced Image Readout

When interlaced mode is enabled, the total number of

blanking rows are determined by both field blanking register

(R0xBF) and vertical blanking register (R0x06). The

followings are their equations.

Field Blanking +R0xBF[7 : 0] (eq. 21)

Vertical Blanking +R0x06[8 : 0] *R0xBF[7 : 0] (contextA) or R0xCE[8 : 0] *R0xBF[7 : 0] (contextB) (eq. 22)

with

minimum vertical blanking requirement +4(absolute minimum operate; see Vertical Blanking Registers

(eq. 23)

description for VBlank minimums for valid image output)

Similar to progressive scan, FV is logic LOW during the

valid image row only. Binning should not be used in

conjunction with interlaced mode.

LINE_VALID

By setting bit 2 and 3 of R0x72, the LV signal can get three

different output formats. The formats for reading out four

rows and two vertical blanking rows are shown in Figure 35.

In the last format, the LV signal is the XOR between the

continuous LV signal and the FV signal.

Default

FRAME_VALID

LINE_VALID

Continuously

FRAME_VALID

XOR

FRAME_VALID

LINE_VALID

Figure 35. Different LINE_VALID Formats

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LVDS Serial (Stand−Alone/Stereo) Output

The LVDS interface allows for the streaming of sensor

data serially to a standard off−the−shelf deserializer up to

eight meters away from the sensor. The pixels (and controls)

are packeted−12−bit packets for stand−alone mode and

18−bit packets for stereoscopy mode. All serial signaling

(CLK and data) is LVDS. The LVDS serial output could

either be data from a single sensor (stand−alone) or

stream−merged data from two sensors (self and its

stereoscopic slave pair). The appendices describe in detail

the topologies for both stand−alone and stereoscopic modes.

There are two standard deserializers that can be used. One

for a stand−alone sensor stream and the other from

a stereoscopic stream. The deserializer attached to a stand−

alone sensor is able to reproduce the standard parallel output

(8−bit pixel data, LV, FV, and PIXCLK). The deserializer

attached to a stereoscopic sensor is able to reproduce 8− bit

pixel data from each sensor (with embedded LV and FV )

and pixel−clk. An additional (simple) piece of logic is

required to extract LV and FV from the 8−bit pixel data.

Irrespective of the mode (stereoscopy/stand−alone), LV and

FV are always embedded in the pixel data.

In stereoscopic mode, the two sensors run in lock−step,

implying all state machines are in the same state at any given

time. This is ensured by the sensor−pair getting their

sys−clks and sys−resets in the same instance. Configuration

writes through the two−wire serial interface are done in such

a way that both sensors can get their configuration updates

at once. The inter−sensor serial link is designed in such

a way that once the slave PLL locks and the data−dly,

shft−clk−dly and stream−latency−sel are configured, the

master sensor streams valid stereo content irrespective of

any variation voltage and/or temperature as long as it is

within specification. The configuration values of data−dly,

shft−clk−dly and stream−latency−sel are either

predetermined from the board−layout or can be empirically

determined by reading back the stereo−error flag. This flag

is asserted when the two sensor streams are not in sync when

merged. The combo_reg is used for out−of−sync diagnosis.

Figure 36. Serial Output Format for 6x2 Frame

Internal

PIXCLK

Internal

Parallel

Data

Internal

Line_Valid

Internal

Frame_Valid

External

Serial

Data Out

NOTES: 1. External pixel values of 0, 1, 2, 3, are reserved (they only convey control information).

Any raw pixel of value 0, 1, 2 and 3 will be substituted with 4.

2. The external pixel sequence 1023, 0 1023 is a reserved sequence (conveys control

information). Any raw pixel sequence of 1023, 0, 1023 will be substituted with 1023, 4, 1023.

P42P41 P43 P44 P45 P46 P52 P53 P54 P56

P55

P51

1023 0 1023 1 P41 P42 P43 P44 P45 P46 2 1 P51 P52 P53 P54 P55 P56 3

LVDS Output Format

In stand−alone mode, the packet size is 12 bits (2 frame

bits and 10 payload bits); 10−bit pixels or 8−bit pixels can be

selected. In 8−bit pixel mode (R0xB6[0] = 0), the packet

consists of a start bit, 8−bit pixel data (with sync codes), the

line valid bit, the frame valid bit and the stop bit. For 10−bit

pixel mode (R0xB6[0] = 1), the packet consists of a start bit,

10−bit pixel data, and the stop bit.

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Table 10. LVDS PACKET FORMAT IN STAND−ALONE MODE (Stereoscopy Mode Bit De−Asserted)

12 Bit Packet

Use_10−bit_pixels Bit De−Asserted

(8−Bit Mode)

Use_10−bit_pixels Bit Asserted

(10−Bit Mode)

Bit [0] 1’b1(Start bit) 1’b1(Start bit)

Bit [1] Pixel Data [2] Pixel Data [0]

Bit [2] Pixel Data [3] Pixel Data [1]

Bit [3] Pixel Data [4] Pixel Data [2]

Bit [4] Pixel Data [5] Pixel Data [3]

Bit [5] Pixel Data [6] Pixel Data [4]

Bit [6] Pixel Data [7] Pixel Data [5]

Bit [7] Pixel Data [8] Pixel Data [6]

Bit [8] Pixel Data [9] Pixel Data [7]

Bit [9] Line_Valid Pixel Data [8]

Bit [10] Frame_Valid Pixel Data [9]

Bit [11] 1’b0(Stop bit) 1’b0(Stop bit)

5. In stereoscopic mode, the packet size is 18 bits (2 frame bits and 16 payload bits). The packet consists of a start bit, the master pixel byte

(with sync codes), the slave byte (with sync codes), and the stop bit.)

Table 11. LVDS PACKET FORMAT IN STEREOSCOPY MODE (Stereoscopy Mode Bit Asserted)

18−bit Packet Function

Bit [0] 1’b1 (Start bit)

Bit [1] Master Sensor Pixel Data [2]

Bit [2] Master Sensor Pixel Data [3]

Bit [3] Master Sensor Pixel Data [4]

Bit [4] Master Sensor Pixel Data [5]

Bit [5] Master Sensor Pixel Data [6]

Bit [6] Master Sensor Pixel Data [7]

Bit [7] Master Sensor Pixel Data [8]

Bit [8] Master Sensor Pixel Data [9]

Bit [9] Slave Sensor Pixel Data [2]

Bit [10] Slave Sensor Pixel Data [3]

Bit [11] Slave Sensor Pixel Data [4]

Bit [12] Slave Sensor Pixel Data [5]

Bit [13] Slave Sensor Pixel Data [6]

Bit [14] Slave Sensor Pixel Data [7]

Bit [15] Slave Sensor Pixel Data [8]

Bit [16] Slave Sensor Pixel Data [9]

Bit [17] 1’b0 (Stop bit)

Control signals LV and FV can be reconstructed from their

respective preceding and succeeding flags that are always

embedded within the pixel data in the form of reserved

words.

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Table 12. RESERVED WORDS IN THE PIXEL DATA STREAM

Pixel Data Reserved Word Flag

0Precedes frame valid assertion

1Precedes line valid assertion

2Succeeds line valid de−assertion

3Succeeds frame valid de−assertion

When LVDS mode is enabled along with column binning

(bin 2 or bin 4, R0x0D[3:2]), the packet size remains the

same but the serial pixel data stream repeats itself depending

on whether 2X or 4X binning is set:

•For bin 2, LVDS outputs double the expected data

(pixel 0,0 is output twice in sequence, followed by pixel

0, 1 twice, …).

•For bin 4, LVDS outputs 4 times the expected data

(pixel 0,0 is output 4 times in sequence followed by

pixel 0, 1 times 4, …).

The receiving hardware will need to undersample the

output stream,getting data either every 2 clocks (bin 2) or

every 4 (bin 4) clocks.

If the sensor provides a pixel whose value is 0, 1, 2, or 3

(that is, the same as a reserved word) then the outgoing serial

pixel value is switched to 4.

LVDS Enable and Disable

Tables 13 and 14 further explain the state of the LVDS

output pins depending on LVDS control settings. When the

LVDS block is not used, it may be left powered down to

reduce power consumption.

Table 13. SER_DATAOUT_*STATE

R0xB1[1]

LVDS power down

R0xB3[4]

LVDS data power down SER_DATAOUT_*

0 0 Active

0 1 Active

1 0 Z

1 1 Z

Table 14. SER_DATAOUT_*STATE

R0xB1[1]

LVDS power down

R0xB2[4]

LVDS shift−clk power down SHFT_CLKOUT_*

0 0 Active

0 1 Z

1 0 Z

1 1 Z

6. ERROR pin: When the sensor is not in stereo mode, the ERROR pin is at LOW.

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LVDS Data Bus Timing

The LVDS bus timing waveforms and timing

specifications are shown in Table 15 and Figure 37.

Figure 37. LVDS Timing

Data Rise/Fall Time

(10% − 90%) Data Setup Time Data Hold Time

LVDS Data Output

(SER_DATAOUT_N/P)

LVDS Clock Output

(Shift_CLKOUT_N/P)

Clock Rise/Fall Time

(10% − 90%)

Clock Jitter

Table 15. LVDS AC TIMING SPECIFICATIONS

(VPWR = 3.3V ±0.3V; TJ = –40_C to +105_C; output load = 100 ; frequency 27 MHz)

Parameter Minimum Typical Maximum Unit

LVDS clock rise time −0.22 0.30 ns

LVDS clock fall time −0.22 0.30 ns

LVDS data rise time −0.28 0.30 ns

LVDS data fall time −0.28 0.30 ns

LVDS data setup time 0.3 0.67 −ns

LVDS data hold time 0.1 1.34 −ns

LVDS clock jitter −92 ps

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ELECTRICAL SPECIFICATIONS

Table 16. DC ELECTRICAL CHARACTERISTICS OVER TEMPERATURE

(VPWR = 3.3V ± 0.3 V; TJ = −40°C to + 105°C; Output Load = 10pF; Frequency 13 MHz to 27 MHz; LVDS off)

Symbol Definition Condition Min Typ Max Unit

VIH Input HIGH Voltage VPWR − 1.4 −V

VIL Input LOW Voltage −1.3 V

IIN Input Leakage Current No pull−up resistor; VIN = VPWR or VGND −5 – 5 A

VOH Output HIGH Voltage IOH = –4.0 mA VPWR − 0.3 – – V

VOL Output LOW Voltage IOL = 4.0 mA – – 0.3V

IOH Output HIGH Current VOH = VDD - 0.7 −11 – – mA

IOL Output LOW Current VOL = 0.7 – – 11 mA

IPWRAAnalog Supply Current Default settings – 12 20 mA

IPIX Pixel Supply Current Default settings – 1.1 3 mA

IPWRDDigital Supply Current Default settings, CLOAD = 10 pF – 42 60 mA

ILVDS LVDS Supply Current Default settings with LVDS on – 13 16 mA

IPWRA

Standby

Analog Standby Supply Current STDBY = VDD −0.2 3 A

IPWRD

Standby

Clock Off

Digital Standby Supply Current with

Clock off

STDBY = VDD, CLKIN = 0 MHz −0.1 10 A

IPWRD

Standby

Clock On

Digital Standby Supply Current with

Clock on

STDBY= VDD, CLKIN = 27 MHz −1 2 mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

Table 17. DC ELECTRICAL CHARACTERISTICS (VPWR = 3.3 V ±0.3 V; TA = Ambient = 25 °C)

Symbol Definition Condition Min Typ Max Unit

LVDS DRIVER DC SPECIFICATIONS

|VOD|Output Differential Voltage RLOAD = 100 ±1% 250 – 400 mV

|DVOD|Change in VOD Between Complementary Output States − − 50 mV

VOS Output Offset Voltage 1.0 1.2 1.4 V

DVOS Pixel Array Current − − 35 mV

IOS Digital Supply Current ±10 mA

IOZ Output Current When Driver is Tristate ±1A

LVDS RECEIVER DC SPECIFICATIONS

VIDTH+Input Differential | VGPD| < 925 mV –100 – 100 mV

Iin Input Current – – ±20 A

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Table 18. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Minimum Maximum Unit

VSUPPLY Power supply voltage (all supplies) –0.3 4.5 V

ISUPPLY Total power supply current – 200 mA

IGND Total ground current – 200 mA

VIN DC input voltage –0.3 VDD + 0.3V

VOUT DC output voltage –0.3 VDD + 0.3V

TSTG (Note 7) Storage temperature –50 +150 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

7. This is a stress rating only, and functional operation of the device at these other conditions above those indicated in the operational sections

of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Table 19. AC ELECTRICAL CHARACTERISTICS (VPWR = 3.3 V ±0.3 V; TJ = −40°C to + 105°C; Output Load = 10pF)

Symbol Definition Condition Minimum Typical Maximum Unit

SYSCLK Input Clock Frequency 13.0 26.6 27.0 MHz

Clock Duty Cycle 45.0 50.0 55.0 %

tRInput Clock Rise Time – 3 5 ns

tFInput Clock Fall Time – 3 5 ns

tPLHPSYSCLK to PIXCLK Propagation Delay CLOAD = 10 pF 4 6 8 ns

tPD PIXCLK to Valid DOUT(9:0) Propagation Delay CLOAD = 10 pF –3 0.6 3 ns

tSD Data Setup Time 14 16 – ns

tHD Data Hold Time 14 16 –

tPFLR PIXCLK to LV Propagation Delay CLOAD = 10 pF 5 7 9 ns

tPFLF PIXCLK to FV Propagation Delay CLOAD = 10 pF 5 7 9 ns

Propagation Delays for PIXCLK and Data Out Signals

The pixel clock is inverted and delayed relative to the

master clock. The relative delay from the master clock

(SYSCLK) rising edge to both the pixel clock (PIXCLK)

falling edge and the data output transition is typically 7 ns.

Note that the falling edge of the pixel clock occurs at

approximately the same time as the data output transitions.

See Table 19 for data setup and hold times.

Figure 38. Propagation Delays for PIXCLK and Data Out Signals

DOUT(9:0)

tPLHP

SYSCLK

PIXCLK

tHDSD

tPDPD

DOUT(9:0)

MT9V024/D

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Propagation Delays for FRAME_VALID and

LINE_VALID Signals

The LV and FV signals change on the same rising master

clock edge as the data output. The LV goes HIGH on the

same rising master clock edge as the output of the first valid

pixel’s data and returns LOW on the same master clock

rising edge as the end of the output of the last valid pixel’s

data.

As shown in the “Output Data Timing”, FV goes HIGH

143 pixel clocks before the first LV goes HIGH. It returns

LOW 23 pixel clocks after the last LV goes LOW.

Figure 39. Propagation Delays for FRAME_VALID and LINE_VALID Signals

FRAME_VALID

LINE_VALID

FRAME_VALID

LINE_VALID

PIXCLK PIXCLK

tFLR FLF

Two-Wire Serial Bus Timing

Detailed timing waveforms and parameters for the

two−wire serial interface bus are shown in Figure 40 and

Table 20.

Figure 40. Two−Wire Bus Timing Parameters

SDATA

SCLK

tftLOW

THD;STA

tHD;DAT tHIGH

TSU;DAT tf

TSU;STA Sr

MT9V024/D

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Table 20. TWO−WIRE SERIAL BUS CHARACTERISTICS (VPWR = 3.3V +0.3V; TA = Ambient = 25°C)

Parameter Symbol

Standard−Mode Fast−Mode

Unit

Min Max Min Max

SCLK Clock Frequency fSCL 0 100 0 400 kHz

After this period, the first clock pulse is generated tHD;STA 4.0 −0.6 −s

LOW period of the SCLK clock tLOW 4.7 −1.3−s

HIGH period of the SCLK clock tHIGH 4.0 −0.6 −s

Set-up time for a repeated START condition tSU;STA 4.7 −0.6 −s

Data hold time tHD;DAT 0

(Note 11)

3.45

(Note 12)

(Note 13)

0.9

(Note 12)

s

Data set-up time tSU;DAT 250 −100

(Note 13)

−ns

Rise time of both SDATA and SCLK signals tr−1000 20 + 0.1Cb

(Note 14)

300 ns

Fall time of both SDATA and SCLK signals tf−300 20 + 0.1Cb

(Note 14)

300 ns

Set-up time for STOP condition tSU;STO 4.0 −0.6 −s

Bus free time between a STOP and START condition tBUF 4.7 −1.3 −s

Capacitive load for each bus line Cb −400 −400 pF

Serial interface input pin capacitance CIN_SI −3.3 −3.3 pF

SDATA max load capacitance CLOAD_SD −30 −30 pF

SDATA pull−up resistor RSD 1.5 4.7 1.5 4.7 k

8. This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.

9. Two-wire control is I2C-compatible.

10.All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.

11. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.

12.The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.

13.A Fast-mode I2C-bus device can be used in a Standard-mode I2C−bus system, but the requirement tSU;DAT 250 ns must then be met. This

will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period

of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard−mode

I2C−bus specification) before the SCLK line is released.

14. Cb = total capacitance of one bus line in pF.

Minimum Master Clock Cycles

In addition to the AC timing requirements described in

Table 20, the two−wire serial bus operation also requires

certain minimum master clock cycles between transitions.

These are specified in Figures 41 through 46, in units of

master clock cycles.

Figure 41. Serial Host Interface Start Condition Timing

SCLK

SDATA

MT9V024/D

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Figure 42. Serial Host Interface Stop Condition Timing

NOTE: All timing are in units of master clock cycle.

SCLK

SDATA

Figure 43. Serial Host Interface Data Timing for WRITE

SCLK

DATA

NOTE: SDATA is driven by an off-chip transmitter.

Figure 44. Serial Host Interface Data Timing for READ

SCLK

DATA

NOTE: SDATA is pulled LOW by the sensor, or allowed to be pulled HIGH by a pull-up resistor off-chip.

Figure 45. Acknowledge Signal Timing After an 8-Bit WRITE to the Sensor

SCLK

Sensor pulls down

DATA pin

DATA

MT9V024/D

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Figure 46. Acknowledge Signal Timing After an 8-Bit READ from the Sensor

SCLK

Sensor tri−states SDATA pin

(turns off pull down)

DATA

NOTE: After a READ, the master receiver must pull down SDATA to acknowledge receipt of data bits. When read sequence is

complete, the master must generate a “No Acknowledge” by leaving SDATA to float HIGH. On the following cycle,

a start or stop bit may be used.

Figure 47. Typical Quantum Efficiency−Monochrome

MT9V024/D

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350 450 550 650 750 850 950 1050

Wavelength (nm)

Quantum Efficiency (%)

Figure 48. Typical Quantum Efficiency − Monochrome

Figure 49. Typical Quantum Efficiency − RCCC

MT9V024/D

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Appendix A: Power−On Reset and Standby Timing

There are no constraints concerning the order in which the

various power supplies are applied; however, the MT9V024

requires reset to operate properly at power−up. Refer to

Figure 50 for the power−up, reset, and standby sequences.

Low−Power Non−Low−PowerNon−Low−Power

Active Pre−Standby Standby Active

Wake

up Power

down

MIN 20 SYSCLK cycles

Note 3

MIN 20 SYSCLK cycles

Does not

respond to

serial

Interface

when

STANDBY=1 DOUT [9:0]

Driven = 0

Power

VDD, VDDLVDS,

VAA, VAAPIX

RESET_BAR

STANDBY

SYSCLK

MIN 10 SYSCLK cycles

SCLK, SDATA

Twi−wire Serial I/F

DOUT [9:0]

DATA OUTPUT

Figure 50. Power−up, Reset, Clock, and Standby Sequence

NOTES: 1. All output signals are defined during initial power−up with RESET_BAR held LOW without SYSCLK being active. To

properly reset the rest of the sensor, during initial power−up, assert RESET_BAR (set to LOW state) for at least 750ns

after all power supplies have stabilized and SYSCLK is active (being clocked). Driving RESET_BAR to LOW state does

not put the part in a low power state.

2. Before using two−wire serial interface, wait for 10 SYSCLK rising edges after RESET_BAR is de−asserted.

3. Once the sensor detects that STANDBY has been asserted, it completes the current frame readout before entering

standby mode. The user must supply enough SYSCLKs to allow a complete frame readout. See Table 4, “Frame Time,”

for more information

4. In standby, all video data and synchronization output signals are driven to a low state.

5. In standby, the two−wire serial interface is not active.

APPENDIX B: ELECTRICAL IDENTIFICATION OF

CFA TYPE

In order to identify the CFA type (RGB Bayer,

Monochrome, RCCC) that a specific MT9V024 has been,

the following table may be used.

CFA R0x6B[11:9] R0x6B[8:0]

RGB 6 4

RCCC 5 4

Mono 0 4

IBGA52 9x9

CASE 503AA

ISSUE A DATE 25 JUN 201

MECHANICAL CASE OUTLINE

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