Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module
Specifications
Core System
CPU Penryn SFF BGA type
Intel® Core™2 Duo SP9300, FSB 1066, 2.26 GHz
with 6MB L2 cache, 25 Watt
Intel® Core™2 Duo SL9400, FSB 1066, LV 1.86 GHz
with 6MB L2 cache, 17 Watt
Intel® Core™2 Duo SU9300, FSB 800, ULV 1.2 GHz
with 3MB L2 cache, 10 Watt
Intel® Celeron® M 722, FSB 800, ULV 1.2GHz
with 1MB L2 cache, 5.5 Watt
Memory Dual stacked SODIMM sockets supporting dual channel
memory, up to 8 GB of non-ECC, 800/1066 MHz DDR3
Chipset Intel® GS45 Express Graphics Memory Controller Hub SFF
(Small Form Factor) and Intel® I/O Controller Hub ICH9M-SFF
BIOS AMIBIOS®8 with CMOS backup in 16 Mbit SPI flash
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses Graphics PCI Express x16 bus for SDVO/HDMI/DisplayPort
or general purpose PCI Express (x8 / x4 / x1)
6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE;
0/1/2/3 x1 can be optionally configured as 1 x4
32-bit PCI 2.3 at 33MHz, supporting 4 bus masters
LPC, SMBus, I2C
Video
Chipset GS45 GMCH integrated Mobile Intel® Graphics Media
Accelerator 4500MHD with core render clock 533 MHz
@ 1.05-V core voltage or 266 MHz @ 1.025 L.P. Mode
Integrated Video Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
Feature Support Video capture via x1 concurrent PCI Express port
PAVP (Protected Audio-Video Path) support for Protected
Intel® HD Audio Playback
High performance MPEG-2 decoding
WMV9 (VC-1) and H.264 (AVC) support
Hardware acceleration for MPEG2 VLD/iDCT
Microsoft DirectX 10 support
Blu-ray support @ 40 Mb/s
Hardware motion compensation
Intermediate Z in classic rendering
VGA Interface Analog VGA support by 300MHz DAC
Analog monitor support up to QXGA, supports VGA hot plug
LVDS Interface Single / Dual channel 18/24-bit at 25~112 MHz
TV-out NTSC/PAL up to 1024x768 resolution supported
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® ICH9M
Audio Codec HDA codec on carrier
HDMI Audio routed to HDMI interface
LAN
Chipset Integrated on Intel® ICH9M with Intel® 82567LM PHY
Interface 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on Intel® ICH9M
USB Supports up to eight ports USB v. 2.0
SATA
Four ports SATA 3 Gb/s with (optional) support for RAID
0,1,5,10
PATA SATA to PATA JM20330 controller on SATA channel 3,
Master only
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Infineon SLB9635TT1.2 (optional)
Type TPM 1.2
Power Specications
Input Power AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 18 W (with Core™2 Duo SU9300 at 1.2 GHz and 2 GB
memory typical)
Mechanical and Environmental
Operating Temp. Standard: 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express® Type 2, Basic form factor,
95 mm x 125 mm
Certifications CE, FCC
Operating Systems
Standard Support Windows® XP 32/64-bit
Windows® Vista 32/64-bit
Windows® Server 2003/2008
Linux® 2.6.x
Extended Support Embedded XP BSP
Linux® 2.6.x BSP
WinCE 6.0 BSP
AIDI Library for Win32, WinCE and Linux®
COM Express® Module with Intel® Core™2 Duo
Processor and GS45 / ICH9M-SFF Chipset
Express-MV
Features
Intel® Core™2 Duo processor (up to 2.26 GHz)
Intel® GS45 and ICH9M-SFF chipset
Dual SODIMM for up to 8 GB DDR3
at 1066 MHz
Five PCIe x1, one PCIe x16 for graphics
(or general purpose x8, x4 or x1)
Single/dual channel 18/24-bit LVDS and TV-out
(SDTV and HDTV)
SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-MV-SP9300 COM Express
®
Module with Intel
®
Core™2 Duo
processor SP9300 at 2.26 GHz
Express-MV-SL9400 COM Express
®
Module with LV Intel® Core™2 Duo
processor SL9400 at 1.86 GHz
Express-MV-SU9300 COM Express
®
Module with ULV Intel® Core™2 Duo
processor SU9300 at 1.20 GHz
Express-MV-722 COM Express
®
Module with ULV Intel® Celeron® M
processor 722 at 1.20 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-MV-BL Low Profile Heatsink for Express-MV (BGA CPU) with
threaded standoffs for bottom mounting with long cooling
fins (incl screws for 5 and 8 mm btb)
Heatsink with Active Cooling
THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA
CPU) with threaded standoffs
JM30220
SATA / PATA
DDR3 800/1066
SODIMM socket
LM95245 LM87F75111R
BIOS
AB
Intel LAN
PHY
82567LM
ICH
Intel® ICH9M
Small Form Factor
CD
CPU
Celeron® M
Core™2 Duo
Small Form Factor:
22 x 22 mm BGA
GMCH
Intel®GS45
Small Form Factor
DMI
SPI
Six
PCIe x1
lanes
DDR-3
Memory
Controller
Analog
VGA
RTC
LVDS
dual 18/24-bit
PCIe x16 Gfx
PCIe x8/x4/x1
SDVO (2)
DisplayPort (3)
HDMI (2)
FSB
800/1066 MHz
PCI
Audio
SDTV
HDTV
PCI 33 MHz v2.3
LPC
Channel A
Channel B DDR3 800/1066
SODIMM socket
Gbe
MAC
SMBus
TPM
LPC
SMBus
Test
header
GPIO
I2CBC
PCIe x16 (multiplexed)
3x SATA
8x USB 2.0
SATA_0/1/2/3
USB_0/1/2/3/4/5/6/7
PCIe x1, lane 0/1/2/3/4 or PCIe x4
PCIe x1, lane 5
Audio
LVDS
TV-out
VGA
Graphics Core
4500MHD
1x SATA2 IDE
