NCP4810DR2G - ON SEMICONDUCTOR

October, 2014 − Rev. 1 1Publication Order Number:

NCP4810/D

NCP4810

X2 Capacitors Discharger

The NCP4810 is a HV switch suitable for implementation of the X2

capacitor discharge function in applications with extremely low

standby consumption requirements. It contains two high voltage

MOSFETs with 700 V peak capabilities that can be connected directly

to AC line voltage. Implementing this IC helps to design optimized

EMI filter with appropriate X2 capacitor and reduced EMI coil

volume and losses.

Features

•Build−in 700 V MOSFET

•Minimum Discharge Capability 0.85 mA

•Self Consumption Below 11 mW @ 700 V

•NoVCC Necessary

•Compact SOIC−8 Package

•−40°C to + 125°C Operating Temperature Range

•This is a Pb−Free Device

Typical Applications

•Auxiliary Power Supply

•AC−DC Adapter

•Standby Power Supply

•Offline Battery Charger

Device Package Shipping†

ORDERING INFORMATION

NCP4810DR2G SOIC−8

(Pb−Free) 2500 /

Tape & Reel

SOIC−8

D SUFFIX

CASE 751

MARKING

DIAGRAM

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

X = Assembly Lot

G = Pb−Free Package

http://onsemi.com

8NCP4810G

ALYWX

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer t o our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

PINOUT

AC1

AC2

NCP4810

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NCP4810

Figure 1. Typical Application Example of the X2 Discharger GND

DC output

X2−2

X2−1

AC1

AC2

CX2

CX1

AC input

X1−1

X1−2

PIN FUNCTION DESCRIPTION

Pin N5Pin Name Function Pin Description

1 NC Not connected −

2 AC1 Alternate Current 1 Terminal for connections AC line

3 AC1 Alternate Current 1 Terminal for connections AC line

4 NC Not connected −

5 NC Not connected −

6 AC2 Alternate Current 2 Terminal for connections AC line

7 AC2 Alternate Current 2 Terminal for connections AC line

8 NC Not connected −

Figure 2. Simplified Circuit Architecture

AC1

AC2

−

SET

CLR

SET

CLR

Tdel

delay

Tdel

delay

Idisch

VAC(start)

Idisch

NCP4810

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MAXIMUM RATINGS

Rating Symbol Value Unit

AC1 pin Voltage related to AC2 pin VHV −700 to 700 V

Thermal Resistance, Junction−to−Air (50 mm2 x 35 mm Cu) RqJ−A 162 °C/W

Junction Temperature TJ−40 to +150 °C

Storage Temperature Range Tstg −60 to +150 °C

ESD Capability, HBM model per JEDEC standard JESD22, Method A114E VESD−HBM 4 kV

ESD Capability, Machine Model per JEDEC standard JESD22, Method A115A VESD−MM 600 V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The latchup tests were not provided on this device because of two function pins only.

ELECTRICAL CHARACTERISTICS

(for typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, unless otherwise noted.)

Parameter Conditions Symbol Min Typ Max Unit

HV PIN

Discharge current capability VAC = 400 Vdc Idisch 0.85 − − mA

Minimum HV voltage IAC = Idisch * 0.95 VAC(start) − − 29 Vdc

IHV or IHV(start) leakage current VAC = 700 Vdc IAC(leak) − 7 15 mA

INTERNAL TIMER

Internal timer − Tdel 15 − − ms

NCP4810

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TYPICAL CHARACTERISTICS

TEMPERATURE (°C)

−40 110−25 −10 9580655203550

Figure 3. IHV or IHV(start) Leakage Current,

IAC(Leak)

IAC(Leak) (mA)

9.5

9.0

8.5

8.0

7.5

7.0

TEMPERATURE (°C)

−40 110−25 −10 9580655203550

Figure 4. Discharge Current Capability, Idisch

Idisch (mA)

1.75

1.50

1.25

1.00

0.75

TEMPERATURE (°C)

−40 110−25 −10 9580655203550

Figure 5. Minimum HV Voltage, VAC(start)

VAC(start) (V)

25.00

24.75

24.50

24.25

24.00

TEMPERATURE (°C)

−40 110−25 −10 9580655203550

Figure 6. Internal Timer, Tdel

Tdel (ms)

125 125

VAC1−AC2 (V)

−100 200−50 1500 100

Figure 7. Typical Behavior of Discharge

Current versus DC Voltage between AC pins

IAC (mA)

1.0

0.2

−0.6

−1.4

1.2

0.4

−0.4

−1.2

1.4

0.6

−0.2

−1.0

0.8

0.0

−0.8

50−150−200

NCP4810

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Function Description:

The input sinusoidal voltage resets the relevant internal

timer by transitioning across zero level at each its half wave.

If no zero cross is detected, the internal timer expires and the

appropriate current sink is turned on. This discharging path

(the current sink and opposite diode) is established until the

X2 capacitors are discharged (the input terminal voltage

VAC drops to zero) or the input AC voltage is restored by

re−plugging the mains. The minimum discharge voltage is

defined by VAC(start). Low VAC(start) allows to use serial

resistors to distribute loss during discharging process. The

recommended resistors values (R1 and R2) for any X2

capacitor are mentioned in Table 1. Every possibility of IC

function refer to the input voltage behavior is described on

Figure 8.

Table 1. RECOMMENDED SERIES RESISTORS

VALUES

X2 Capacitance Total Series Resistance (R1 + R2)

≤500 nF 1.5 MW

750 nF 1.02 MW

1 mF780 kW

1.5 mF480 kW

2 mF360 kW

Figure 8. Function Description

Discharge

Current

Mains Plugged Unplugged

VAC

VAC(start)

Idisch t = Tdel t < Tdel t + Tdel

NCP4810

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PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AK

SEATING

PLANE

X 45_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

AMIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024 1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NCP4810/D

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