注記NOTES
1.使用材料
MATERIAL
ハウジング：46ナイロン、ガラス充填、UL94V-0、白
HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE
アクチュエータ：ポリフェニレンサルファイド（PPS）、ガラス充填、
UL94V-0、茶色
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,
UL94V-0,BROWN
ターミナル：リン青銅、ニッケル下地金めっき（t=0.2）
TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING
金具：リン青銅、ニッケル下地錫めっき（t=0.2）
FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING
2.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52746-**39 SHOULD BE LOCKED.
ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM
DATUM-H.
UPPER DIRECTON:0.1MAXIMUM
LOWER DIRECTION:0.15 MAXIMUM
偶数極に適用
APPLY FOR EVEN CIRCUIT.
ﾊﾟﾀｰﾝ剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの導体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.ELV 及び RoHS 適合品
ELV AND RoHS COMPLIANT
2.455
1.02 1.28
0.74
0.85
0.66
0.5 0.25
9.65
15.6 13.8 10.15 952746-1971
K
FITTING NAIL
金具
5
(DETAIL OF FITTING NAIL)
(金具部投影図)
VIEW K
52746-1571
52746-1471
52746-1371
52746-1271
52746-1171
52746-1071
52746-0971
52746-0871
52746-0771
52746-0671
52746-0471
EMBOSSED PACKAGE
ORDER No. オーダー番号
7
9
15
6
2.53.65
4.65 8
10
4.5
5.65
6.15 11
12
5.5
6.65
7.15 613
14
6.57.65
4
2.656.3
CONNECTOR SERIES NO. : 52746-**39
極数
CKT.
(A)BCD
1.5
5
3
3.5
4
7
4.15
5.15
7.3
7.8
8.3
8.8
9.3
9.8
10.3
10.8
11.3
11.8
8.1
9.1
9.6
10.1
10.6
11.1
11.6
12.1
12.6
13.1
13.6 16
17
18
20
52746-1671
52746-1771
52746-1871
52746-2071
7.5
8
8.5
9.5
12.3
12.8
13.3
14.3
14.1
14.6
15.1
16.1 10.65
9.15
8.65
8.15
19
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/02/27
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
HSHIMABUKURO
2004/02/05
APPR:
MSASAO
2004/02/06
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52746
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN. ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52746-025
PSD
001
K
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:50
3
5
6
4
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
THICKNESS: 0.3+0.03/-0.03
仕上がり厚さ：0.3
±
0.03
APPLICABLE FFC OF GOLD
PLATING RECOMMENDED DIMENSION
適合金めっきFFC推奨寸法
補強板
(STIFFENER BOARD)
(PITCH)
THICKNESS: 0.3+0.03/-0.03
仕上がり厚さ：0.3
±
0.03
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
適合金めっきFPC推奨寸法
補強板
(STIFFENER BOARD)
(PITCH)
6
ABOUT FPC :
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE.
RECOMMENDED MATERIAL :
STIFFNER FILM : POLYIMIDE
BONDING AGENT : THERMOSETTING BONDING AGENT
打ち抜き方向は導体側から補強板を推奨いたします。
補強フィルム材質はポリイミドを推奨いたします。
FPCについて
(FROM PATTERN EDGE)
VIEW M
M
PATTERN
BOARD
SOLDERING AREA
OF FITTING NAIL
金具パターンエリア
パターンおよび
半田禁止エリア
KEEPING OUT AREA OF
PATTERN AND SOLDERING
DETAIL L
(DETAIL OF FITTING NAIL
ON PATTERN)
CONNECTOR
POSITION
コネクタ位置
L
(PITCH)
(NON-ACCUMULATIVE)
参考基板レイアウト
(マウント面)
RECOMMENDED P.C.BOARD
PATTERN DIMENSION(REF.)
(MOUNTING SIDE)
0.3
±
0.03
0.5(N-1)
±
0.05
0.5
±
0.08
0.5
±
0.05
0.5
±
0.08
6
±
0.5
0.5(N+1)
±
0.07
4
±
0.5
6
±
0.5
4
±
0.5
0.35+0.04
-0.03
0.5(N+1)
±
0.07
0.5
±
0.1
0.5(N-1)
±
0.05
0.5
±
0.1
0.5
±
0.05
0.45MAX.
1.94MIN.
(0.3)
1.25
1.25
0.5
±
0.05
0.5(N-1)
±
0.05
3.65 3.65
(0.3)
(0.3)
(0.2)
0.83.05
2.2
1.1
(0.605)
0.6MAX.
(0.3)
R0.3
R0.303
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/02/27
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
HSHIMABUKURO
2004/02/05
APPR:
MSASAO
2004/02/06
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52746
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN. ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52746-025
PSD
001
K
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:50
導体部： 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
0.3
±
0.03
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
補強板：ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
仕上がり厚さ
THICKNESS
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
熱硬化接着剤
THERMOSETTING ADHESIVE
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
仕上がり厚さ
THICKNESS
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
0.3
±
0.03
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
