DATA SH EET
Product specification
Supersedes data of 1999 Aug 16 2004 Feb 11
DISCRETE SEMICONDUCTORS
BAP51-03
General purpose PIN diode
2004 Feb 11 2
Philips Semiconductors Product specification
General purpose PIN diode BAP51-03
FEATURES
•Low diode capacitance
•Low diode forward resistance.
APPLICATIONS
•General RF applications.
DESCRIPTION
General purpose PIN diode in a SOD323 small plastic
SMD package.
PINNING
PIN DESCRIPTION
1 cathode
2 anode
Top view
21
sym006
Marking code: A5.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD323) and symbol.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
BAP51-03 −plastic surface mounted package; 2 leads SOD323
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRcontinuous reverse voltage −50 V
IFcontinuous forward current −50 mA
Ptot total power dissipation TS=90°C−500 mW
Tstg storage temperature −65 +150 °C
Tjjunction temperature −65 +150 °C
2004 Feb 11 3
Philips Semiconductors Product specification
General purpose PIN diode BAP51-03
ELECTRICAL CHARACTERISTICS
Tj=25°C unless otherwise specified.
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VFforward voltage IF=50mA −0.95 1.1 V
VRreverse voltage IR=10µA50−−V
IRreverse current VR=50V −−100 nA
Cddiode capacitance VR= 0; f = 1 MHz −0.4 −pF
VR= 1 V; f = 1 MHz −0.3 0.55 pF
VR= 5 V; f = 1 MHz −0.2 0.35 pF
rDdiode forward resistance IF= 0.5 mA; f = 100 MHz; note 1 −5.5 9 Ω
IF= 1 mA; f = 100 MHz; note 1 −3.6 6.5 Ω
IF= 10 mA; f = 100 MHz; note 1 −1.5 2.5 Ω
τLcharge carrier life time when switched from IF=10mA
to IR= 6 mA; RL= 100 Ω;
measured at IR=3mA
−550 −ns
SYMBOL PARAMETER VALUE UNIT
Rth(j-s) thermal resistance from junction to soldering point 120 K/W
2004 Feb 11 4
Philips Semiconductors Product specification
General purpose PIN diode BAP51-03
GRAPHICAL DATA
Fig.2 Forward resistance as a function of forward
current; typical values.
Tj=25°C; f = 100 MHz.
handbook, halfpage
MGS322
10
2
5
1
10−1110
IF (mA)
rD
(Ω)
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
Tj=25°C; f = 1 MHz.
handbook, halfpage
020
VR (V)
Cd
(fF)
500
0
100
MGS323
200
300
400
4 8 12 16
handbook, halfpage
0.5 3
0
−2.5
−2
MGS659
−1.5
−1
−0.5
1 1.5 2 2.5 f (GHz)
|S21|2
(dB)
(2) (3)
(1)
Fig.4 Insertion loss (|S21|2) of the diode as a
function of frequency; typical values.
Diodeinsertedinserieswitha50 Ωstriplinecircuitandbiasedviathe
analyzer Tee network.
Tamb =25°C.
(1) IF= 10 mA. (2) IF= 1 mA. (3) IF= 0.5 mA.
handbook, halfpage
0.5 3
0
−25
−20
MGS660
−15
−10
−5
1 1.5 2 2.5 f (GHz)
|S21|2
(dB)
Fig.5 Isolation(|S21|2)ofthediode asafunction of
frequency; typical values.
Diode zero biased and inserted in series with a 50 Ωstripline circuit.
Tamb =25°C.
2004 Feb 11 5
Philips Semiconductors Product specification
General purpose PIN diode BAP51-03
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOD323 SC-76
SOD323
99-09-13
03-12-17
Note
1. The marking bar indicates the cathode
UNIT A
mm 0.05
1.1
0.8 0.40
0.25 0.25
0.10 1.8
1.6 1.35
1.15 2.7
2.3 0.45
0.15
A1
max
DIMENSIONS (mm are the original dimensions)
Plastic surface mounted package; 2 leads
01
(1)
21
2 mm
scale
bpc D E HDQ
0.25
0.15
Lpv
0.2
A
D
A
E
Lp
bp
detail X
A1c
Q
HDvA
M
X
2004 Feb 11 6
Philips Semiconductors Product specification
General purpose PIN diode BAP51-03
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese orat any otherconditions abovethosegiven inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warrantythatsuch applicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
© Koninklijke Philips Electronics N.V. 2004 SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a worldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands R77/04/pp7 Date of release: 2004 Feb 11 Document order number: 9397 750 12631
