Product Family Data Sheet Rev. 2.0 2018. 10.1 High Voltage LED Series Chip on Board LC006D - Gen.2 High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits Chip on Board (COB) solution makes it easy to design in Simple assembly reduces manufacturing cost Low thermal resistance InGaN/GaN MQW LED with long time reliability Applications Spotlight / Downlight LED Retrofit Bulbs Outdoor Illumination 1 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 8 4. Outline Drawing & Dimension ----------------------- 10 5. Reliability Test Items & Conditions ----------------------- 11 6. Label Structure ----------------------- 12 7. Packing structure ----------------------- 13 8. Precautions in Handling & Use ----------------------- 14 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 C - Storage Temperature Tstg -40 ~ +120 C - LED Junction Temperature TJ 150 C - Case Temperature Tc 115 C Forward Current IF 460 mA - Power Dissipation PD 17.2 W - ESD (HBM) - 2 kV - ESD (MM) - 0.5 kV - b) Electro-optical Characteristics (IF = 180 mA, TJ = 85 C) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YZ 31.8 34.6 37.5 5 80 - - Color Rendering Index (Ra) 7 90 Thermal Resistance (junction to case point) C/W - 1.48 - Beam Angle - 115 - Nominal Power W 6.2 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 C) 2) Samsung maintains measurement tolerance of: forward voltage = 5 %, CRI = 1 3) Refer to the derating curve, `3. Typical Characteristics Graph' designed within the range. 4 c) Luminous Flux Characteristics CRI (Ra) Min. 80 90 (IF = 180 mA) Nominal CCT (K) Flux Rank 2700 Flux @ TJ = 85 C (lm) Min. Typ. Max. D2 877 924 - 3000 D2 922 971 - 3500 D2 951 1001 - 4000 D2 973 1024 - 5000 D2 979 1030 - 5700 D2 979 1030 - 6500 D2 967 1018 - 2700 D2 747 786 - 3000 D2 783 824 - 3500 D2 810 853 - 4000 D2 827 870 - 5000 D2 830 874 - Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = 85 C). 2) Samsung maintains measurement tolerance of: Luminous flux = 7 %, CRI = 1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H A H D N B 2 5 Y Z W 3 D 2 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version A Form Factor HD 9 Lens Type N No lens 10 Wattage or Model B LC006D 11 Internal Code 2 12 CRI & Sorting Temperature 1 2 3 4 5 6 7 8 13 14 15 CCT (K) 16 17 Forward Voltage (V) Specification White COB 5 Min. 80 (85) 7 Min. 90 (85) YZ 31.8~37.5 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K 2 MacAdam 2-step 3 MacAdam 3-step MacAdam Step 18 Luminous Flux (Lm) D2 COB D-series Gen.2 level 6 a) Binning Structure CRI (Ra) Min. (IF = 180 mA, TJ = 85 C) Nominal CCT (K) Product Code VF Rank SPHWHAHDNB25YZW2D2 2700 SPHWHAHDNB25YZV3D2 877 ~ D2 922 ~ D2 951 ~ D2 973 ~ V3 SPHWHAHDNB25YZU2D2 U2 YZ SPHWHAHDNB25YZU3D2 U3 SPHWHAHDNB25YZT2D2 4000 D2 V2 YZ 3500 Flux Range (v, lm) W3 SPHWHAHDNB25YZV2D2 3000 Flux Rank W2 YZ SPHWHAHDNB25YZW3D2 80 Color Rank T2 YZ SPHWHAHDNB25YZT3D2 T3 5000 SPHWHAHDNB25YZR3D2 YZ R2 D2 979 ~ 5700 SPHWHAHDNB25YZQ3D2 YZ Q2 D2 979 ~ 6500 SPHWHAHDNB25YZP3D2 YZ P2 D2 967 ~ D2 747 ~ D2 783 ~ D2 810 ~ D2 827 ~ D2 830 ~ SPHWHAHDNB27YZW2D2 2700 W2 YZ SPHWHAHDNB27YZW3D2 W3 SPHWHAHDNB27YZV2D2 3000 V2 YZ SPHWHAHDNB27YZV3D2 V3 SPHWHAHDNB27YZU2D2 3500 U2 YZ SPHWHAHDNB27YZU3D2 U3 SPHWHAHDNB27YZT2D2 4000 T2 YZ SPHWHAHDNB27YZT3D2 5000 SPHWHAHDNB27YZR3D2 T3 YZ R3 7 b) Chromaticity Region & Coordinates (IF = 180 mA, TJ = 85 C) CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y a b Step CIE x CIE y a b 2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y a b Step CIE x CIE y a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y a b Step CIE x CIE y a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032 MacAdam Ellipse (P3) Step CIE x CIE y a b 3-step 0.3123 0.3282 58.5700 0.0067 0.0029 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 8 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 180 mA, TJ = 85 C) CRI Ra 80+ b) CRI Ra 90+ Forward Current Characteristics (TJ = 85 C) Forward Voltage vs. Forward Current 250 40 200 38 Forward Voltage Relative Luminous Flux(%) Relative luminous Flux vs. Forward Current 150 100 50 0 36 34 32 30 0 0.1 0.2 0.3 0.4 0.5 0 0.1 Forward Current(A) 0.3 0.4 0.5 Forward Current(A) Temperature Characteristics (IF = 180mA) Relative Luminous Flux vs. Temperature Forward Voltage vs. Temperature 115 35.5 110 Forward Voltage(V) Relative Luminous Flux(%) c) 0.2 105 100 95 35.0 34.5 34.0 90 20 40 60 Tc() 80 100 20 40 60 Tc() 80 100 9 Color Shift Characteristics (TJ = 85 C, IF = 180mA, CRI = 80+) CIE x, CIE y CIE x,CIE y vs. Forward Current CIEx,CIEy vs. Temperature 0.005 0.005 0 0 CIE x, CIE y d) -0.005 -0.01 CIE x -0.015 CIE y 0 0.1 0.2 0.3 0.4 0.5 Relative Luminous Intensity Beam Angle Characteristics (IF = 180 mA, TJ = 85 C) 1.20 1.00 0.80 0.60 0.40 0.20 0.00 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle() Derating Characteristics Derating Curve 0.5 0.4 If [ mA ] CIE x -0.015 CIE y 0.3 0.2 0.1 0 0 20 40 60 Tc [ ] 80 20 40 60 Tc() Forward Current(A) f) -0.01 -0.02 -0.02 e) -0.005 100 120 80 100 10 4. Outline Drawing & Dimension Model Description LC006D28030 XXX.....XXXX LOT No. TC SAMSUNG 1. Unit: mm 2. Tolerance: 0.30 mm Note: Item Dimension Tolerance Unit Length 13.5 0.15 mm Width 13.5 0.15 mm Height 1.50 0.20 mm Light Emitting Surface (LES) Diameter 9.8 0.30 mm Denoted product information above is only an example ( LC006D28030 : LC006D, Gen2, CRI80+, 3000K ) 11 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 C, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 C, DC Derating, IF 1000 h Low Temperature Life Test -40 C, DC, Derating IF 1000 h High Temperature Storage 120 C 1000 h Low Temperature Storage -40 C 1000 h Temperature Humidity Storage 60 C, 90% RH 1000h Temperature Cycle On/Off Test -40 C / 85 C each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 M R2: 1.5 k C: 100 pF ESD (HBM) 5 times V: 2 kV R1: 10 M R2: 0 k C: 200 pF V: 0.2 kV 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency max. frequency 4 min transfer ESD (MM) Vibration Test 5 times 4 times 1500g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) Mechanical Shock Test Sulfur Resistance 25 C, 5 times 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 C) Limit Min. Max. Forward Voltage VF IF = 180 mA L.S.L. * 0.9 U.S.L. * 1.1 Luminous Flux v IF = 180 mA L.S.L * 0.7 U.S.L * 1.3 12 6. Label Structure a) Label Structure LC006D RA80 2700K YZW3D2 Bin Code SPHWHAHDNB25YZW3D2 YZW3D2 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code G4AZC4001 / 1001 / xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: : Forward Voltage bin : Chromaticity bin : Luminous Flux bin (refer to page 11) (refer to page 9-10) (refer to page 6) b) Lot Number The lot number is composed of the following characters: LC006D RA80 2700K YZW3D2 SPHWHAHDNB25YZW3D2 YZW3D2 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /1/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1 / xxxx pcs : Production site : 4 : Product state : Year : Month : Day (1~9, A, B~V) : Product serial number (S: Giheung, Korea, G: Tianjin, China) (LED) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Z: 2015, A: 2016, B: 2017...) (1~9, A, B, C) (001 ~ 999) 13 7. Packing Structure Packing material Max. quantity in pcs of COB Length Dimension(mm) Width Height Tray 50 200 200 8 1 Anti-Static Bag 250 (5 trays) 320 270 - +/- 0.5 Outer Box (Small) 500 (2 bags) 225 225 65 5 Outer Box (Middle) 1000 (4 bags) 225 225 130 5 a) Packing Structure Small Box b) Tray Middle Box Tolerance 14 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 C, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 6) Devices must be baked for 1 hour at 60 5 C, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction temperature should not exceed the absolute maximum rating while operation of LED lighting system. For more information, please refer to Application Note `Mechanical & Thermal Guide for COB'. 9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright (c) 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com