TP3064, TP3067 Enhanced Serial Interface CMOS CODEC/Filter COMBO Literature Number: SNAS570 TP3064, TP3067 ``Enhanced'' Serial Interface CMOS CODEC/Filter COMBOE General Description Features The TP3064 (m-law) and TP3067 (A-law) are monolithic PCM CODEC/Filters utilizing the A/D and D/A conversion architecture shown in Figure 1 , and a serial PCM interface. The devices are fabricated using National's advanced double-poly CMOS process (microCMOS). Similar to the TP305X family, these devices feature an additional Receive Power Amplifier to provide push-pull balanced output drive capability. The receive gain can be adjusted by means of two external resistors for an output level of up to g 6.6V across a balanced 600X load. Also included is an Analog Loopback switch and a TSX output. See also AN-370, ``Techniques for Designing with CODEC/ Filter COMBO Circuits.'' Y Y Y Y Y Y Y Y Y COMBOE and TRI-STATEE are registered trademarks of National Semiconductor Corporation. Y Complete CODEC and filtering system including: Transmit high-pass and low-pass filtering Receive low-pass filter with sin x/x correction Active RC noise filters m-law or A-law compatible COder and DECoder Internal precision voltage reference Serial I/O interface Internal auto-zero circuitry Receive push-pull power amplifiers m-lawTP3064 A-lawTP3067 Designed for D3/D4 and CCITT applications g 5V operation Low operating powertypically 70 mW Power-down standby modetypically 3 mW Automatic power-down TTL or CMOS compatible digital interfaces Maximizes line interface card circuit density Block Diagram TL/H/5070 - 1 FIGURE 1 C1995 National Semiconductor Corporation TL/H/5070 RRD-B30M115/Printed in U. S. A. TP3064, TP3067 ``Enhanced'' Serial Interface CMOS CODEC/Filter COMBO October 1991 Connection Diagrams Plastic Chip Carrier Dual-In-Line Package TL/H/5070 - 6 Top View Order Number TP3064J or TP3067J See NS Package J20A Order Number TP3064WM or TP3067WM See NS Package M20B Order Number TP3064N or TP3067N See NS Package N20A TL/H/5070-2 Top View Order Number TP3064V or TP3067V See NS Package V20A Pin Description Symbol VPO a GNDA VPOb VPI VFRO VCC FSR DR BCLKR/ CLKSEL MCLKR/ PDN Symbol MCLKX Function The non-inverted output of the receive power amplifier. Analog ground. All signals are referenced to this pin. The inverted output of the receive power amplifier. Inverting input to the receive power amplifier. Analog output of the receive filter. Positive power supply pin. VCC e a 5V g 5%. Receive frame sync pulse which enables BCLKR to shift PCM data into DR. FSR is an 8 kHz pulse train. See Figures 2 and 3 for timing details. Receive data input. PCM data is shifted into DR following the FSR leading edge. The bit clock which shifts data into DR after the FSR leading edge. May vary from 64 kHz to 2.048 MHz. Alternatively, may be a logic input which selects either 1.536 MHz/1.544 MHz or 2.048 MHz for master clock in synchronous mode and BCLKX is used for both transmit and receive directions (see Table I). Receive master clock. Must be 1.536 MHz, 1.544 MHz or 2.048 MHz. May be asynchronous with MCLKX, but should be synchronous with MCLKX for best performance. When MCLKR is connected continuously low, MCLKX is selected for all internal timing. When MCLKR is connected continuously high, the device is powered down. BCLKX DX FSX TSX ANLB GSX VFXIb VFXI a VBB 2 Function Transmit master clock. Must be 1.536 MHz, 1.544 MHz or 2.048 MHz. May be asynchronous with MCLKR. Best performance is realized from synchronous operation. The bit clock which shifts out the PCM data on DX. May vary from 64 kHz to 2.048 MHz, but must be synchronous with MCLKX. The TRI-STATEE PCM data output which is enabled by FSX. Transmit frame sync pulse input which enables BCLKX to shift out the PCM data on DX. FSX is an 8 kHz pulse train, see Figures 2 and 3 for timing details. Open drain output which pulses low during the encoder time slot. Analog Loopback control input. Must be set to logic `0' for normal operation. When pulled to logic `1', the transmit filter input is disconnected from the output of the transmit preamplifier and connected to the VPO a output of the receive power amplifier. Analog output of the transmit input amplifier. Used to externally set gain. Inverting input of the transmit input amplifier. Non-inverting input of the transmit input amplifier. Negative power supply pin. VBB eb5V g 5%. Functional Description sion performance, however, MCLKR should be synchronous with MCLKX, which is easily achieved by applying only static logic levels to the MCLKR/PDN pin. This will automatically connect MCLKX to all internal MCLKR functions (see Pin Description). For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame. FSX starts each encoding cycle and must be synchronous with MCLKX and BCLKX. FSR starts each decoding cycle and must be synchronous with BCLKR. BCLKR must be a clock, the logic levels shown in Table I are not valid in asynchronous mode. BCLKX and BCLKR may operate from 64 kHz to 2.048 MHz. POWER-UP When power is first applied, power-on reset circuitry initializes the COMBOTM and places it into a power-down state. All non-essential circuits are deactivated and the DX, VFRO, VPOb and VPO a outputs are put in high impedance states. To power-up the device, a logical low level or clock must be applied to the MCLKR/PDN pin and FSX and/or FSR pulses must be present. Thus, 2 power-down control modes are available. The first is to pull the MCLKR/PDN pin high; the alternative is to hold both FSX and FSR inputs continuously lowthe device will power-down approximately 2 ms after the last FSX or FSR pulse. Power-up will occur on the first FSX or FSR pulse. The TRI-STATE PCM data output, DX, will remain in the high impedance state until the second FSX pulse. SHORT FRAME SYNC OPERATION The COMBO can utilize either a short frame sync pulse (the same as the TP3020/21 CODECs) or a long frame sync pulse. Upon power initialization, the device assumes a short frame mode. In this mode, both frame sync pulses, FSX and FSR, must be one bit clock period long, with timing relationships specified in Figure 2 . With FSX high during a falling edge of BCLKX, the next rising edge of BCLKX enables the DX TRI-STATE output buffer, which will output the sign bit. The following seven rising edges clock out the remaining seven bits, and the next falling edge disables the DX output. With FSR high during a falling edge of BCLKR (BCLKX in synchronous mode), the next falling edge of BCLKR latches in the sign bit. The following seven falling edges latch in the seven remaining bits. All devices may utilize the short frame sync pulse in synchronous or asynchronous operating mode. SYNCHRONOUS OPERATION For synchronous operation, the same master clock and bit clock should be used for both the transmit and receive directions. In this mode, a clock must be applied to MCLKX and the MCLKR/PDN pin can be used as a power-down control. A low level on MCLKR/PDN powers up the device and a high level powers down the device. In either case, MCLKX will be selected as the master clock for both the transmit and receive circuits. A bit clock must also be applied to BCLKX and the BCLKR/CLKSEL can be used to select the proper internal divider for a master clock of 1.536 MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame. With a fixed level on the BCLKR/CLKSEL pin, BLCKX will be selected as the bit clock for both the transmit and receive directions. Table I indicates the frequencies of operation which can be selected, depending on the state of BCLKR/ CLKSEL. In this synchronous mode, the bit clock, BCLKX, may be from 64 kHz to 2.048 MHz, but must be synchronous with MCLKX. Each FSX pulse begins the encoding cycle and the PCM data from the previous encode cycle is shifted out of the enabled DX output on the positive edge of BCLKX. After 8 bit clock periods, the TRI-STATE DX output is returned to a high impedance state. With an FSR pulse, PCM data is latched via the DR input on the negative edge of BCLKX (or BCLKR if running). FSX and FSR must be synchronous with MCLKX/R. LONG FRAME SYNC OPERATION To use the long (TP5116A/56 CODECs) frame mode, both the frame sync pulses, FSX and FSR, must be three or more bit clock periods long, with timing relationships specified in Figure 3 . Based on the transmit frame sync, FSX, the COMBO will sense whether short or long frame sync pulses are being used. For 64 kHz operation, the frame sync pulse must be kept low for a minimum of 160 ns. The DX TRISTATE output buffer is enabled with the rising edge of FSX or the rising edge of BCLKX, whichever comes later, and the first bit clocked out is the sign bit. The following seven BCLKX rising edges clock out the remaining seven bits. The DX output is disabled by the falling BCLKX edge following the eighth rising edge, or by FSX going low, whichever comes later. A rising edge on the receive frame sync pulse, FSR, will cause the PCM data at DR to be latched in on the next eight falling edges of BCLKR(BCLKX in synchronous mode). All devices may utilize the long frame sync pulse in synchronous or asynchronous mode. TABLE I. Selection of Master Clock Frequencies BCLKR/CLKSEL Clocked 0 1 Master Clock Frequency Selected TP3067 TP3064 2.048 MHz 1.536 MHz or 1.544 MHz 2.048 MHz 1.536 MHz or 1.544 MHz 2.048 MHz TRANSMIT SECTION The transmit section input is an operational amplifier with provision for gain adjustment using two external resistors, see Figure 4 . The low noise and wide bandwidth allow gains in excess of 20 dB across the audio passband to be realized. The op amp drives a unity-gain filter consisting of RC active pre-filter, followed by an eighth order switched-capacitor bandpass filter clocked at 256 kHz. The output of this filter directly drives the encoder sample-and-hold circuit. The A/D is of companding type according to m-law (TP3064) or A-law (TP3067) coding conventions. A precision voltage reference is trimmed in manufacturing to provide an input overload (tMAX) of nominally 2.5V peak (see 1.536 MHz or 1.544 MHz ASYNCHRONOUS OPERATION For asynchronous operation, separate transmit and receive clocks may be applied. MCLKX and MCLKR must be 2.048 MHz for the TP3067, or 1.536 MHZ, 1.544 MHz for the TP3064, and need not be synchronous. For best transmis3 Functional Description (Continued) table of Transmission Characteristics). The FSX frame sync pulse controls the sampling of the filter output, and then the successive-approximation encoding cycle begins. The 8-bit code is then loaded into a buffer and shifted out through DX at the next FSX pulse. The total encoding delay will be approximately 165 ms (due to the transmit filter) plus 125 ms (due to encoding delay), which totals 290 ms. Any offset voltage due to the filters or comparator is cancelled by sign bit integration. ods. At the end of the decoder time slot, the decoding cycle begins, and 10 ms later the decoder DAC output is updated. The total decoder delay is E 10 ms (decoder update) plus 110 ms (filter delay) plus 62.5 ms ((/2 frame), which gives approximately 180 ms. RECEIVE POWER AMPLIFIERS Two inverting mode power amplifiers are provided for directly driving a matched line interface transformer. The gain of the first power amplifier can be adjusted to boost the g 2.5V peak output signal from the receive filter up to g 3.3V peak into an unbalanced 300X load, or g 4.0V into an unbalanced 15 kX load. The second power amplifier is internally connected in unity-gain inverting mode to give 6 dB of signal gain for balanced loads. Maximum power transfer to a 600X subscriber line termination is obtained by differentially driving a balanced transformer with a S2:1 turns ratio, as shown in Figure 4 . A total peak power of 15.6 dBm can be delivered to the load plus termination. RECEIVE SECTION The receive section consists of an expanding DAC which drives a fifth order switched-capacitor low pass filter clocked at 256 kHz. The decoder is A-law (TP3067) or m-law (TP3064) and the 5th order low pass filter corrects for the sin x/x attenuation due to the 8 kHz sample/hold. The filter is then followed by a 2nd order RC active post-filter with its output at VFRO. The receive section is unity-gain, but gain can be added by using the power amplifiers. Upon the occurrence of FSR, the data at the DR input is clocked in on the falling edge of the next eight BCLKR (BCLKX) peri- ENCODING FORMAT AT DX OUTPUT TP3067 A-Law (Includes Even Bit Inversion) TP3064 m-Law VIN e a Full-Scale VIN e 0V VIN e bFull-Scale 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 4 0 1 1 0 1 1 0 0 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 1 0 1 1 0 1 0 0 1 0 1 1 0 Absolute Maximum Ratings Voltage at any Digital Input or Output If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. VCC to GNDA VBB to GNDA Voltage at any Analog Input or Output VCC a 0.3V to GNDAb0.3V Operating Temperature Range Storage Temperature Range Lead Temp. (Soldering, 10 sec.) ESD (Human Body Model) J ESD (Human Body Model) N Latch-Up Immunity 7V b 7V VCC a 0.3V to VBBb0.3V b 25 C to a 125 C b 65 C to a 150 C 300 C 1000V 1500V 100 mA on Any Pin Electrical Characteristics Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b 5.0V g 5%; TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GNDA. Typicals specified at VCC e a 5.0V, VBB e b5.0V, TA e 25 C. Symbol Parameter Conditions Min Typ Max Units (Note) 0.5 1.5 mA POWER DISSIPATION (ALL DEVICES) ICC0 Power-Down Current IBB0 Power-Down Current (Note) 0.05 0.3 mA ICC1 Active Current VPI e 0V; VFRO, VPO a and VPOb unloaded 7.0 10.0 mA IBB1 Active Current VPI e 0V; VFRO, VPO a and VPOb unloaded 7.0 10.0 mA 0.6 V 0.4 0.4 V V DIGITAL INTERFACE VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage DX, IL e 3.2 mA TSX, IL e 3.2 mA, Open Drain VOH Output High Voltage DX, IH eb3.2 mA IIL Input Low Current GNDAsVINsVIL, All Digital Inputs b 10 10 mA IIH Input High Current VIHsVINsVCC b 10 10 mA IOZ Output Current in High Impedance State (TRI-STATE) DX, GNDAsVOsVCC b 10 10 mA 2.2 Note: ICC0 and IBB0 are measured after first achieving a power-up state. 5 V 2.4 V Electrical Characteristics (Continued) Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b5.0V g 5%; TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GNDA. Typicals specified at VCC e a 5.0V, VBB e b 5.0V, TA e 25 C. Symbol Parameter Conditions Min Typ Max Units ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (ALL DEVICES) IIXA Input Leakage Current b 2.5V s V s a 2.5V, VFXI a or VFXI b b 200 RIXA Input Resistance b 2.5V s V s a 2.5V, VFXI a or VFXI b 10 ROXA Output Resistance Closed Loop, Unity Gain RLXA Load Resistance GSX CLXA Load Capacitance GSX VOXA Output Dynamic Range GSX, RLt10 kX b 2.8 AVXA Voltage Gain VFXI a to GSX 5000 200 1 3 10 X kX 50 1 nA MX a 2.8 pF V V/V FUXA Unity-Gain Bandwidth VOSXA Offset Voltage 2 MHz VCMXA Common-Mode Voltage CMRRXA l 60 dB CMRRXA Common-Mode Rejection Ratio DC Test 60 dB PSRRXA Power Supply Rejection Ratio DC Test 60 dB b 20 20 b 2.5 2.5 mV V ANALOG INTERFACE WITH RECEIVE FILTER (ALL DEVICES) RORF Output Resistance Pin VFRO RLRF Load Resistance VFRO e g 2.5V 1 CLRF Load Capacitance Connect from VFRO to GNDA VOSRO Output DC Offset Voltage Measure from VFRO to GNDA 3 10 X kX 25 pF b 200 200 mV 100 ANALOG INTERFACE WITH POWER AMPLIFIERS (ALL DEVICES) IPI Input Leakage Current b 1.0V s VPI s 1.0V b 100 RIPI Input Resistance b 1.0V s VPI s 1.0V 10 VIOS Input Offset Voltage ROP Output Resistance Inverting Unity-Gain at VPO a or VPOb FC Unity-Gain Bandwidth Open Loop (VPOb) CLP Load Capacitance GAP a Gain from VPOb to VPO a RL e 600X VPO a to VPOb Level at VPOb e 1.77 Vrms PSRRP Power Supply Rejection of VCC or VBB VPOb Connected to VPI 0 kHzb4 kHz 4 kHzb50 kHz 60 36 dB dB Load Resistance Connect from VPO a to VPOb 600 X RLP b 25 25 1 400 b1 mV X kHz 100 6 nA MX pF V/V Timing Specifications Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b5.0V g 5%, TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals are referenced to GNDA. Typicals specified at VCC e a 5.0V, VBB e b 5.0V, TA e 25 C. All timing parameters are measured at VOH e 2.0V and VOL e 0.7V. See Definitions and Timing Conventions section for test methods information. Symbol 1/tPM Parameter Conditions Min Frequency of Master Clock Typ Max 1.536 1.544 2.048 MCLKX and MCLKR Units MHz MHz MHz tRM Rise Time of Master Clock MCLKX and MCLKR 50 ns tFM Fall Time of Master Clock MCLKX and MCLKR 50 ns tPB Period Bit of Clock tRB Rise Time of Bit Clock tFB Fall Time of Bit Clock BCLKX and BCLKR tWMH Width of Master Clock High MCLKX and MCLKR 160 ns tWML Width of Master Clock Low MCLKX and MCLKR 160 ns tSBFM Set-Up Time from BCLKX High to MCLKX Falling Edge 100 ns tSFFM Set-Up Time from FSX High to MCLKX Falling Edge 100 ns tWBH Width of Bit Clock High 160 ns tWBL Width of Bit Clock Low 160 ns tHBFL Holding Time from Bit Clock Low to Frame Sync Long Frame Only 0 ns tHBFS Holding Time from Bit Clock High to Frame Sync Short Frame Only 0 ns tSFB Set-Up Time for Frame Sync to Bit Clock Low Long Frame Only 80 ns tDBD Delay Time from BCLKX High to Data Valid Load e 150 pF plus 2 LSTTL Loads tDBTS Delay Time to TSX Low Load e 150 pF plus 2 LSTTL Loads tDZC Delay Time from BCLKX Low to Data Output Disabled tDZF Delay Time to Valid Data from FSX or BCLKX, Whichever Comes Later tSDB Set-Up Time from DR Valid to BCLKR/X Low 50 ns tHBD Hold Time from BCLKR/X Low to DR Invalid 50 ns tSF Set-Up Time from FSX/R to BCLKX/R Low Short Frame Sync Pulse (1 Bit Clock Period Long) 50 ns tHF Hold Time from BCLKX/R Low to FSX/R Low Short Frame Sync Pulse (1 Bit Clock Period Long) 100 ns tHBFI Hold Time from 3rd Period of Bit Clock Low to Frame Sync (FSX or FSR) Long Frame Sync Pulse (from 3 to 8 Bit Clock Periods Long) 100 ns tWFL Minimum Width of the Frame Sync Pulse (Low Level) 64k Bit/s Operating Mode 160 ns 485 BCLKX and BCLKR Long Frame Only CL e 0 pF to 150 pF 7 488 15725 ns 50 ns 50 0 ns 180 ns 140 ns 50 165 ns 20 165 ns FIGURE 2. Short Frame Sync Timing TL/H/5070 - 3 Timing Diagrams 8 FIGURE 3. Long Frame Sync Timing TL/H/5070 - 4 Timing Diagrams (Continued) 9 Transmission Characteristics Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b5.0V g 5%; TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. GNDA e 0V, f e 1.02 kHz, VIN e 0 dbm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e a 5.0V, VBB e b5.0V, TA e 25 C. Symbol Parameter Conditions Min Typ Max Units AMPLITUDE RESPONSE tMAX Absolute Levels (Definition of nominal gain) Nominal 0 dBm0 Level is 4 dBm (600X) 0 dBm0 1.2276 Vrms Virtual Decision Value Defined per CCITT Rec. G711 Max Transmit Overload Level TP3064 (3.17 dBm0) TP3067 (3.14 dBm0) 2.501 2.492 VPK VPK GXA Transmit Gain, Absolute TA e 25 C, VCC e 5V, VBB eb5V GXR Transmit Gain, Relative to GXA f e 16 Hz f e 50 Hz f e 60 Hz f e 200 Hz f e 300 Hz-3000 Hz f e 3300 Hz f e 3400 Hz f e 4000 Hz f e 4600 Hz and Up, Measure Response from 0 Hz to 4000 Hz b 0.15 b 1.8 b 0.15 b 0.35 b 0.7 0.15 dB b 40 b 30 b 26 b 0.1 0.15 0.05 0 b 14 b 32 dB dB dB dB dB dB dB dB dB GXAT Absolute Transmit Gain Variation with Temperature Relative to GXA b 0.1 0.1 dB GXAV Absolute Transmit Gain Variation with Supply Voltage Relative to GXA b 0.05 0.05 dB GXRL Transmit Gain Variations with Level Sinusoidal Test Method Reference Level eb10 dBm0 VFXI a eb40 dBm0 to a 3 dBm0 VFXI a eb50 dBm0 to b40 dBm0 VFXI a eb55 dBm0 to b50 dBm0 b 0.2 b 0.4 b 1.2 0.2 0.4 1.2 dB dB dB GRA Receive Gain, Absolute TA e 25 C, VCC e 5V, VBB eb5V Input e Digital Code Sequence for 0 dBm0 Signal b 0.15 0.15 dB GRR Receive Gain, Relative to GRA f e 0 Hz to 3000 Hz f e 3300 Hz f e 3400 Hz f e 4000 Hz b 0.15 b 0.35 b 0.7 0.15 0.05 0 b 14 dB dB dB dB GRAT Absolute Receive Gain Variation with Temperature Relative to GRA b 0.1 0.1 dB GRAV Absolute Receive Gain Variation with Supply Voltage Relative to GRA b 0.05 0.05 dB GRRL Receive Gain Variations with Level Sinusoidal Test Method; Reference Input PCM Code Corresponds to an Ideally Encoded b 10 dBm0 Signal PCM Level eb40 dBm0 to a 3 dBm0 PCM Level eb50 dBm0 to b40 dBm0 PCM Level eb55 dBm0 to b50 dBm0 b 0.2 b 0.4 b 1.2 0.2 0.4 1.2 dB dB dB RL e 10 kX b 2.5 2.5 V VRO Receive Filter Output at VFRO 10 Transmission Characteristics (Continued) Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b5.0V g 5%; TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. GNDA e 0V, f e 1.02 kHz, VIN e 0 dbm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e a 5.0V, VBB e b5.0V, TA e 25 C. Symbol Parameter Conditions Min Typ Max Units ENVELOPE DELAY DISTORTION WITH FREQUENCY DXA Transmit Delay, Absolute f e 1600 Hz 290 315 ms DXR Transmit Delay, Relative to DXA f e 500 Hzb600 Hz f e 600 Hzb800 Hz f e 800 Hzb1000 Hz f e 1000 Hzb1600 Hz f e 1600 Hzb2600 Hz f e 2600 Hzb2800 Hz f e 2800 Hzb3000 Hz 195 120 50 20 55 80 130 220 145 75 40 75 105 155 ms ms ms ms ms ms ms DRA Receive Delay, Absolute f e 1600 Hz 180 200 ms DRR Receive Delay, Relative to DRA f e 500 Hzb1000 Hz f e 1000 Hzb1600 Hz f e 1600 Hzb2600 Hz f e 2600 Hzb2800 Hz f e 2800 Hzb3000 Hz 70 100 145 90 125 175 ms ms ms ms ms b 40 b 30 b 25 b 20 NOISE NXC Transmit Noise, C Message Weighted TP3064 (Note 1) 12 15 dBrnC0 NXP Transmit Noise, Psophometric Weighted TP3067 (Note 1) b 74 b 67 dBm0p NRC Receive Noise, C Message Weighted PCM Code Equals Alternating Positive and Negative Zero TP3064 8 11 dBrnCO NRP Receive Noise, Psophometric Weighted PCM Code Equals Positive Zero TP3067 b 82 b 79 dBm0p NRS Noise, Single Frequency f e 0 kHz to 100 kHz, Loop Around Measurement, VFXI a e 0 Vrms b 53 dBm0 PPSRX Positive Power Supply Rejection, Transmit VCC e 5.0 VDC a 100 mVrms f e 0 kHzb50 kHz (Note 2) 40 dBC NPSRX Negative Power Supply Rejection, Transmit VBB eb5.0 VDC a 100 mVrms f e 0 kHzb50 kHz (Note 2) 40 dBC Positive Power Supply Rejection, Receive PCM Code Equals Positive Zero VCC e 5.0 VDC a 100 mVrms Measure VFRO f e 0 Hzb4000 Hz f e 4 kHzb50 kHz 38 25 dBC dB PCM Code Equals Positive Zero VBB eb5.0 VDC a 100 mVrms Measure VFRO f e 0 Hzb4000 Hz f e 4 kHzb25 kHz f e 25 kHzb50 kHz 40 40 36 dBC dB dB PPSRR NPSRR SOS Negative Power Supply Rejection, Receive Spurious Out-of-Band Signals at the Channel Output 0 dBm0, 300 Hzb3400 Hz Input PCM Code Applied at DR Measure Individual Image Signals at VFRO 4600 Hz - 7600 Hz 7600 Hz - 8400 Hz 8400 Hz - 100,000 Hz 11 b 32 b 40 b 32 dB dB dB Transmission Characteristics (Continued) Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e a 5.0V g 5%, VBB e b5.0V g 5%; TA e 0 C to 70 C by correlation with 100% electrical testing at TA e 25 C. All other limits are assured by correlation with other production tests and/or product design and characterization. GNDA e 0V, f e 1.02 kHz, VIN e 0 dbm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e a 5.0V, VBB e b5.0V, TA e 25 C. Symbol Parameter Conditions Min Typ Max Units DISTORTION STDX, STDR Signal to Total Distortion Transmit or Receive Half-Channel Sinusoidal Test Method (Note 3) Level e 3.0 dBm0 e 0 dBm0 to b 30 dBm0 eb 40 dBm0 XMT RCV eb 55 dBm0 XMT RCV SFDX Single Frequency Distortion, Transmit b 46 dB SFDR Single Frequency Distortion, Receive b 46 dB IMD Intermodulation Distortion b 41 dB b 90 b 75 dB b 90 b 70 dB 33 36 29 30 14 15 dBC dBC dBC dBC dBC dBC Loop Around Measurement, VFXI a eb4 dBm0 to b21 dBm0, Two Frequencies in the Range 300 Hzb3400 Hz CROSSTALK CTX-R CTR-X Transmit to Receive Crosstalk Receive to Transmit Crosstalk f e 300 Hzb3000 Hz DR e Quiet PCM Code f e 300 Hzb3000 Hz, VFXI e 0V (Note 2) POWER AMPLIFIERS VOPA S/DP Maximum 0 dBm0 Level (Better than g 0.1 dB Linearity over the Range b10 dBm0 to a 3 dBm0) Signal/Distortion Balanced Load, RL Connected Between VPO a and VPOb. RL e 600X RL e 1200X RL e 600X Note 1: Measured by extrapolation from the distortion test result at b 50 dBm0. Note 2: PPSRX, NPSRX, and CTRbX are measured with a b 50 dBm0 activation signal applied to VFXI a . Note 3: TP3064 is measured using C message weighted filter. TP3067 is measured using psophometric weighted filter. 12 3.3 3.5 Vrms Vrms 50 dB Applications Information POWER SUPPLIES While the pins of the TP3060 family are well protected against electrical misuse, it is recommended that the standard CMOS practice be followed, ensuring that ground is connected to the device before any other connections are made. In applications where the printed circuit board may be plugged into a ``hot'' socket with power and clocks already present, an extra long ground pin in the connector should be used. All ground connections to each device should meet at a common point as close as possible to the GNDA pin. This minimizes the interaction of ground return currents flowing through a common bus impedance. 0.1 mF supply decoupling capacitors should be connected from this common ground point to VCC and VBB, as close to the device as possible. For best performance, the ground point of each CODEC/ FILTER on a card should be connected to a common card ground in ``STAR'' formation, rather than via a ground bus. This common ground point should be decoupled to VCC and VBB with 10 mF capacitors. Note: See Application Note 370 for further details Typical Asynchronous Application TL/H/5070 - 5 Note 1: Transmit gain e 20 c log # J 2 R3 ,R4 # R4 J R1 a R2 R2 ,(R1 a R2) t 10 kX c Note 2: Receive gain e 20 c log FIGURE 4 13 t 10 kX Definitions and Timing Conventions TIMING CONVENTIONS DEFINITIONS VIH VIH is the d.c. input level above which an input level is guaranteed to appear as a logical one. This parameter is to be measured by performing a functional test at reduced clock speeds and nominal timing, (i.e. not minimum setup and hold times or output strobes), with the high level of all driving signals set to VIH and maximum supply voltages applied to the device VIL VIL is the d.c. input level below which an input level is guaranteed to appear as a logical zero to the device. This parameter is measured in the same manner as VIH but with all driving signal low levels set to VIL and minimum supply voltages applied to the device. VOH VOH is the minimum d.c. output level to which an output placed in a logical one state will converge when loaded at the maximum specified load current. VOL VOL is the maximum d.c. output level to which an output placed in a logical zero state will converge when loaded at the maximum specified load current. Threshold Region The threshold region is the range of input voltages between VIL and VIH. Valid Signal A signal is Valid if it is in one of the valid logic states, (i.e. above VIH or below VIL). In timing specifiations, a signal is deemed valid at the instant it enters a valid state. Invalid Signal A signal is Invalid if it is not in a valid logic state, i.e. when it is in in the threshold region between VIL and VIH. In timing specifications, a signal is deemed Invalid at the instant it enters the threshold region. For the purposes of this timing specification, the following conventions apply: Input Signals All input signals may be characterized as: VL e 0.4V, VH e 2.4V, tR k 10 ns, tF k 10 ns. Period The period of clock signal is designated as tPxx where xx represents the mnemonic of the clock signal being specified. Rise Time Rise times are designated as tRyy, where yy represents a mnemonic of the signal whose rise time is being specified. tRyy is measured from VIL to VIH. Fall Time Fall times are designated as tFyy, where yy represents a mnemonic of the signal whose fall time is being specified. tFyy is measured from VIH to VIL. Pulse Width High The high pulse width is designated as tWzzH, where zz represents the mnemonic of the input or output signal whose pulse width is being specified. High pulse widths are measured from VIH to VIH. Pulse Width Low The low pulse width is designated as tWzzL, where zz represents the mnemonic of the input or output signal whose pulse width is being specified. Low pulse widths are measured from VIL to VIL. Setup Time Setup times are designated as tSwwxx, where ww represents the mnemonic of the input signal whose setup time is being specified relative to a clock or strobe input represented by mnemonic xx. Setup times are measured from the ww Valid to xx Invalid. Hold Time Hold times are designated as tHxxww, where ww represents the mnemonic of the input signal whose hold time is being specified relative to a clock or strobe input represented by mnemonic xx. Hold times are measured from xx Valid to ww Invalid. Delay Time Delay times are designated as tDxxyy Hi to Low, where xx represents the mnemonic of the input reference signal and yy represents the mnemonic of the output signal whose timing is being specified relative to xx. The mnemonic may optionally be terminated by an H or L to specify the high going or low going transition of the output signal. Maximum delay times are measured from xx Valid to yy Valid. Minimum delay times are measured from xx Valid to yy Invalid. This parameter is tested under the load conditions specified in the Conditions column of the Timing Specifications section of this data sheet. 14 15 Physical Dimensions inches (millimeters) Cavity Dual-In-Line Package (J) Order Number TP3064J or TP3067J NS Package Number J20A Molded Small Outline Package (WM) Order Number TP3064WM or TP3067WM NS Package Number M20B 16 Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number TP3064N or TP3067N NS Package Number N20A 17 TP3064, TP3067 ``Enhanced'' Serial Interface CMOS CODEC/Filter COMBO Physical Dimensions inches (millimeters) (Continued) Lit. Y 113975 Plastic Chip Carrier (V) Order Number TP3064V or TP3067V NS Package Number V20A LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Europe Fax: (a49) 0-180-530 85 86 Email: cnjwge @ tevm2.nsc.com Deutsch Tel: (a49) 0-180-530 85 85 English Tel: (a49) 0-180-532 78 32 Fran3ais Tel: (a49) 0-180-532 93 58 Italiano Tel: (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductor Japan Ltd. Tel: 81-043-299-2309 Fax: 81-043-299-2408 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated