© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 8 1Publication Order Number:
MC74VHC373/D
MC74VHC373
Octal D-Type Latch
with 3-State Output
The MC74VHC373 is an advanced high speed CMOS octal latch
with 3−state output fabricated with silicon gate CMOS technology. It
achieves high speed operation similar to equivalent Bipolar Schottky
TTL while maintaining CMOS low power dissipation.
This 8−bit D−type latch is controlled by a latch enable input and an
output enable input. When the output enable input is high, the eight
outputs are in a high impedance state.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V
systems to 3.0 V systems.
Features
High Speed: tPD = 5.0 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 4.0 mA (Max) at TA = 25°C
High Noise Immunity: VNIH = VNIL = 28% VCC
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2.0 V to 5.5 V Operating Range
Low Noise: VOLP = 0.9 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance: HBM > 2000 V; Machine Model > 200 V
Chip Complexity: 186 FETs or 46.5 Equivalent Gates
These Devices are Pb−Free and are RoHS Compliant
PIN ASSIGNMENT
Q2
D1
D0
Q0
OE
GND
Q3
D3
D2
Q1 5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q6
D6
D7
Q7
VCC
LE
Q4
D4
D5
Q5
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See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
SOIC−20
DW SUFFIX
CASE 751D
VHC373
AWLYYWWG
1
20
1
20
VHC373 = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G= Pb−Free Package
(Note: Microdot may be in either location)
MC74VHC373
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Figure 1. Logic Diagram
DATA
INPUTS
D0
D1
D2
D3
D4
D5
D6
D7 18
17
14
13
8
7
4
3
1
OE
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
16
15
12
9
6
5
2
NONINVERTING
OUTPUTS
11
LE
OE LE Q
L
L
L
H
H
H
L
X
H
L
No Change
Z
INPUTS OUTPUT
FUNCTION TABLE
D
H
L
X
X
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage – 0.5 to + 7.0 V
Vin DC Input Voltage – 0.5 to + 7.0 V
Vout DC Output Voltage – 0.5 to VCC + 0.5 V
IIK Input Diode Current − 20 mA
IOK Output Diode Current ±20 mA
Iout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, VCC and GND Pins ±75 mA
PDPower Dissipation in Still Air, SOIC Package† 500 mW
Tstg Storage Temperature – 65 to + 150 _C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
Derating SOIC Package: – 7 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage 2.0 5.5 V
Vin DC Input Voltage 0 5.5 V
Vout DC Output Voltage 0 VCC V
TAOperating Temperature − 40 + 85 _C
tr, tfInput Rise and Fall Time VCC = 3.3 V
VCC = 5.0 V 0
0100
20 ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions VCC
V
TA = 25°C TA = − 40 to 85°C
Uni
t
Min Typ Max Min Max
VIH Minimum High−Level
Input Voltage 2.0
3.0 to
5.5
1.50
VCC x 0. 7 1.50
VCC x 0. 7 V
VIL Maximum Low−Level
Input Voltage 2.0
3.0 to
5.5
0.50
VCC x 0. 3 0.50
VCC x 0. 3 V
VOH Minimum High−Level
Output Voltage Vin = VIH or VIL
IOH = − 50 mA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
V
Vin = VIH or VIL
IOH = − 4 mA
IOH = − 8 mA 3.0
4.5 2.58
3.94 2.48
3.80
VOL Maximum Low−Level
Output Voltage Vin = VIH or VIL
IOL = 50 mA2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL
IOL = 4 mA
IOL = 8 mA 3.0
4.5 0.36
0.36 0.44
0.44
Iin Maximum Input
Leakage Current Vin = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA
IOZ Maximum
Three−State Leakage
Current
Vin = VIL or VIH
Vout = VCC or GND 5.5 ±0.25 ±2.5 mA
ICC Maximum Quiescent
Supply Current Vin = VCC or GND 5.5 4.0 40.0 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
Symbol Parameter Test Conditions
TA = 25°C TA = − 40 to 85°C
Uni
t
Min Typ Max Min Max
tPLH,
tPHL Maximum Propagation Delay,
D to Q VCC = 3.3 ± 0.3 V CL = 15 pF
CL = 50 pF 7.3
9.8 11.4
14.9 1.0
1.0 13.5
17.0 ns
VCC = 5.0 ± 0.5 V CL = 15 pF
CL = 50 pF 4.9
6.4 7.2
9.2 1.0
1.0 8.5
10.5
tPLH,
tPHL Maximum Propagation Delay,
LE to Q VCC = 3.3 ± 0.3 V CL = 15 pF
CL = 50 pF 7.0
9.5 11.0
14.5 1.0
1.0 13.0
16.5 ns
VCC = 5.0 ± 0.5 V CL = 15 pF
CL = 50 pF 5.0
6.5 7.2
9.2 1.0
1.0 8.5
10.5
tPZL,
tPZH Output Enable Time,
OE to Q VCC = 3.3 ± 0.3 V CL = 15 pF
RL = 1 kWCL = 50 pF 7.3
9.8 11.4
14.9 1.0
1.0 13.5
17.0 ns
VCC = 5.0 ± 0.5 V CL = 15 pF
RL = 1 kWCL = 50 pF 5.5
7.0 8.1
10.1 1.0
1.0 9.5
11.5
tPLZ,
tPHZ Output Disable Time,
OE to Q VCC = 3.3 ± 0.3 V CL = 50 pF
RL = 1 kW
9.5 13.2 1.0 15.0 ns
VCC = 5.0 ± 0.5V CL = 50 pF
RL = 1 kW
6.5 9.2 1.0 10.5
tOSLH,
tOSHL Output to Output Skew VCC = 3.3 ± 0.3 V CL = 50 pF
(Note 1) 1.5 1.5 ns
VCC = 5.5 ± 0.5 V CL = 50 pF
(Note 1) 1.0 1.0 ns
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
Symbol Unit
TA = − 40 to 85°CTA = 25°C
Test ConditionsParameter
Symbol Unit
MaxMinMaxTypMin
Test ConditionsParameter
Cin Maximum Input Capacitance 4 10 10 pF
Cout Maximum Three−State Output
Capacitance (Output in
High−Impedance State)
6 pF
CPD Power Dissipation Capacitance (Note 2)
Typical @ 25°C, VCC = 5.0 V
pF
27
1. Parameter guaranteed by design. tOSLH = |tPLHm − tPLHn|, tOSHL = |tPHLm − tPHLn|.
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC/8 (per latch). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50 pF, VCC = 5.0V)
Symbol Parameter
TA = 25°C
Unit
Typ Max
VOLP Quiet Output Maximum Dynamic VOL 0.6 0.9 V
VOLV Quiet Output Minimum Dynamic VOL − 0.6 − 0.9 V
VIHD Minimum High Level Dynamic Input Voltage 3.5 V
VILD Maximum Low Level Dynamic Input Voltage 1.5 V
TIMING REQUIREMENTS (Input tr = tf = 3.0 ns)
Symbol Parameter Test Conditions
TA = 25°CTA = − 40
to 85°C
Unit
Typ Limit Limit
tw(h) Minimum Pulse Width, LE VCC = 3.3 ± 0.3 V
VCC = 5.0 ±0.5 V 5.0
5.0 5.0
5.0 ns
tsu Minimum Setup Time, D to LE VCC = 3.3 ± 0.3 V
VCC = 5.0 ± 0.5 V 4.0
4.0 4.0
4.0 ns
thMinimum Hold Time, D to LE VCC = 3.3 ± 0.3 V
VCC = 5.0 ± 0.5 V 1.0
1.0 1.0
1.0 ns
ORDERING INFORMATION
Device Package Shipping
MC74VHC373DWR2G SOIC−20
(Pb−Free) 1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74VHC373
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SWITCHING WAVEFORMS
Figure 2. Figure 3.
VCC
GND
D
Q
50%
50% VCC
tPLH tPHL
VCC
GND
50%
LE
tPLH tPHL
Q
tw
50% VCC
Figure 4. Figure 5.
50%
50% VCC
50% VCC
Q
tPZL tPLZ
tPZH tPHZ
VOL +0.3V
VOL -0.3V
VCC
GND
HIGH
IMPEDANCE
HIGH
IMPEDANCE
Q
OE
50%
D
LE
VCC
VCC
GND
GND
VALID
th
tsu
50%
TEST CIRCUITS
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 6. Figure 7.
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
1 kW
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Figure 8. EXPANDED LOGIC DIAGRAM
D0
3
DQ
LE
2
Q0
11
1
D1
4
DQ
LE
5
Q1
D2
7
DQ
LE
6
Q2
D3
8
DQ
LE
9
Q3
D4
13
DQ
LE
12
Q4
D5
14
DQ
LE
15
Q5
D6
17
DQ
LE
16
Q6
D7
18
DQ
LE
19
Q7
LE
OE
Figure 9. INPUT EQUIVALENT CIRCUIT
INPUT
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PACKAGE DIMENSIONS
SOIC−20
DW SUFFIX
CASE 751D−05
ISSUE G
20
1
11
10
B20X
H10X
C
L
18X A1
A
SEATING
PLANE
q
hX 45_
E
D
M
0.25 M
B
M
0.25 S
AS
B
T
eT
B
A
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D12.65 12.95
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MC74VHC373/D
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