BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Features: 1. Emitted Color : Super Orange Red,Green Package Dimensions: and Super Blue 2. Lens Appearance : Water Clear 3. Multi-color type. 4. 1.6x1.25x0.4mm(0605) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction Substance, comply ROHS standard. Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. Absolute Maximum Ratings(Ta=25) Parameter Symbol Super Orange Red Green Super Blue Unit Power Dissipation Pd 100 120 120 mW Forward Current IF 30 30 30 mA Peak Forward Current 1 IFP 100 100 100 mA Reverse Volage VR 5 V Operating Temperature Topr -25~80 - Storage Temperature Tstg -30~85 - Soldering Temperature Tsol See Page7 - 1 Condition for IFp is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Electrical and optical characteristics(Ta=25) Parameter Symbol Condition Forward Voltage Vf IF=20mA Luminous Intensity Iv IF=20mA Reverse Current IR VR=5V Peak Wave Length p IF=20mA Dominant Wave Length d IF=20mA Spectral Line Half-width IF=20mA Veiwing Angle 21/2 IF=20mA Color Min. Super Orange Red Green Super Blue Super Orange Red Green Super Blue Super Orange Red Green Super Blue Super Orange Red Green Super Blue Super Orange Red Green Super Blue Super Orange Red Green Super Blue Super Orange Red Green Super Blue Typ. Max. Unit 2.6 3.6 3.6 V 63 94 42 2.0 3.2 3.2 100 180 80 - mcd - - 100 1 1 A - 630 525 470 - nm 615 510 460 - 625 520 475 nm - 17 30 30 - nm - 120 - deg - Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength (B) (G) (R) Fig.2 Forward current derating curve vs. ambient temperature Forward Current (mA) 60 0.5 50 40 30 20 10 0 0 400 500 600 20 40 60 80 100 Ambient temperature Ta( C) 700 Wavelength (nm) 40 30 20 10 0 1 2 3 4 Forward voltage(V) Fig.4 Relative luminous intensity vs. ambient temperature Relative luminous intensity (Normalized @ 20mA) Forward current (mA) Fig.3 Forward current vs. forward voltage (R) (G)(B) 50 5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 Fig.6 Radiation diagram 0 (R) (G) (B) 2.0 1.0 5 10 20 30 40 50 Relative radlant intensity 3.0 Forward current (mA) 60 A 4.0 0 40 Ambient temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current Relative luminous intensity (@20mA) Relative radiant intensity 1.0 10 20 30 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0.5 0.3 0.1 0.2 0.4 0.6 Ver.1.0 Page 2 of 8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 13.00.5 0.70.1 1.73 0.1 4.0 0.1 TRAILER 1791 13.0 0.5 71.00.1 8.0 0.3 3.5 0.05 1.50.1 1.75 0.1 4.0 0.1 1.750.1 END 5.3 0.05 START LEADER 0.3 FIXING TAPE 2.00.05 NOTE: 3000 pcs PER REEL Package Method:(unit:mm) 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 187 645 6 box/carton 210 470 Ver.1.0 Page 3 of 8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Bin Limits I n t e n s i t y B i n L i m i ts ( J E ) ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) P 55.0 11 0 . 0 Q 82.0 160.0 R 120.0 240.0 S 180.0 360.0 I n t e n s i t y B i n L i m i ts ( G K ) ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) Q 82.0 160.0 R 120.0 240.0 S 180.0 360.0 T 280.0 550.0 C o l o r B i n L i m i ts ( G K ) ( A t 2 0 m A ) BIN CODE Min. (nm) Max. (nm) 4 509 516 5 514 521 Min.(v) Max.(v) 2.75 3.05 H 2.95 3.25 J 3.15 3.45 K 3.35 3.65 V F B i n L i m i ts ( G K ) ( A t 2 0 m A ) BIN CODE G Ver.1.0 Page 4 of 9 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Bin Limits I n t e n s i t y B i n L i m i ts ( B E ) ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) N 37.0 72.0 P 55.0 11 0 . 0 Q 82.0 160.0 R 120.0 240.0 C o l o r B i n L i m i ts ( B E ) ( A t 2 0 m A ) BIN CODE Min. (nm) 5 Max. (nm) 469 476 Min.(v) Max.(v) H 2.75 3.05 J 2.95 3.25 K 3.15 3.45 L 3.35 3.65 V F B i n L i m i ts ( B E ) ( A t 2 0 m A ) BIN CODE B IN x-x x x-x x x VF BIN CODE(BE) Color BIN CODE(BE) Intensity BIN CODE(BE) VF BIN CODE(GK) Color BIN CODE(GK) Intensity BIN CODE(GK) Intensity BIN CODE(JE) Ver.1.0 Page 6 of 8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+855 Test time=1,000hrs 0/20 Low Ta=-355 Test time=1,000hrs 0/20 -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 235(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA 1.U means the upper limit of specified characteristics. Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 7Of8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 235(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. Temperature 140~160 235 MAX. 4 /SEC. MAX. 4 /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 2455 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 245 5 within 5 sec. 120~150 Preheat 120~180 sec. Time Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1.0 Page 7 of 8 BRIGHT LED ELECTRONICS CORP. BL-HJEGKBE36T-TRB SINCE 1981 Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 603. Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver.1.0 Page 8 of 8