LM392-N www.ti.com SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 lm392-N Low Power Operational Amplifier/Voltage Comparator Check for Samples: LM392-N FEATURES DESCRIPTION * The lm392-N series consists of 2 independent building block circuits. One is a high gain, internally frequency compensated operational amplifier, and the other is a precision voltage comparator. Both the operational amplifier and the voltage comparator have been specifically designed to operate from a single power supply over a wide range of voltages. Both circuits have input stages which will commonmode input down to ground when operating from a single power supply. Operation from split power supplies is also possible and the low power supply current is independent of the magnitude of the supply voltage. 1 2 * * * * * * * * Wide Power Supply Voltage Range - Single Supply: 3V to 32V - Dual Supply: 1.5V to 16V Low Supply Current Drain--Essentially Independent of Supply Voltage: 600 A Low Input Biasing Current: 50 nA Low Input Offset Voltage: 2 mV Low Input Offset Current: 5 nA Input Common-Mode Voltage Range Includes Ground Differential Input Voltage Range Equal to the Power Supply Voltage ADDITIONAL OP AMP FEATURES - Internally Frequency Compensated for Unity Gain - Large DC Voltage Gain: 100 dB - Wide Bandwidth (Unity Gain): 1 MHz - Large Output Voltage Swing: 0V to V+ - 1.5V ADDITIONAL COMPARATOR FEATURES - Low Output Saturation Voltage: 250 mV at 4 mA - Output Voltage Compatible with all Types of Logic Systems Application areas include transducer amplifier with pulse shaper, DC gain block with level detector, VCO, as well as all conventional operational amplifier or voltage comparator circuits. Both circuits can be operated directly from the standard 5 VDC power supply voltage used in digital systems, and the output of the comparator will interface directly with either TTL or CMOS logic. In addition, the low power drain makes the lm392-N extremely useful in the design of portable equipment. ADVANTAGES * * * * * Eliminates Need for Dual Power Supplies An Internally Compensated Op Amp and a Precision Comparator in the Same Package Allows Sensing at or Near Ground Power Drain Suitable for Battery Operation Pin-Out is the Same as Both the LM358 Dual Op Amp and the LM393 Dual Comparator 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1998-2013, Texas Instruments Incorporated LM392-N SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 www.ti.com Connection Diagram Top View (Amplifier A = Comparator) (Amplifier B = Operational Amplifier) Figure 1. SOIC and PDIP Packages See Package Numbers D0008A and P0008E These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N LM392-N www.ti.com SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) lm392-N Supply Voltage, V+ 32V or 16V Differential Input Voltage 32V -0.3V to +32V Input Voltage Power Dissipation (3) Molded DIP (LM392N) 820 mW Small Outline Package (LM392M) Output Short-Circuit to Ground (4) Input Current (VIN < -0.3 VDC) (5) 530 mW Continuous 50 mA Operating Temperature Range 0C to +70C -65C to +150C Storage Temperature Range Lead Temperature (Soldering, 10 seconds) 260C ESD rating to be determined. Soldering Information Dual-in-Line Package Soldering (10 seconds) 260C Small Outline Package (1) (2) (3) (4) (5) Vapor Phase (60 seconds) 215C Infrared (15 seconds) 220C "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. For operating at temperatures above 25C, the lm392-N must be derated based on a 125C maximum junction temperature and a thermal resistance of 122C/W which applies for the device soldered in a printed circuit board, operating in still air ambient. The dissipation is the total of both amplifiers--use external resistors, where possible, to allow the amplifier to saturate or to reduce the power which is dissipated in the integrated circuit. Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground, the maximum output current is approximately 40 mA for the op amp and 30 mA for the comparator independent of the magnitude of V+. At values of supply voltage in excess of 15V, continuous short circuits can exceed the power dissipation ratings and cause eventual destruction. This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the amplifiers to go to the V+ voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than -0.3V (at 25C). Electrical Characteristics (V+ = 5 VDC; specifications apply to both amplifiers unless otherwise stated) Parameter Input Offset Voltage (1) Conditions TA = 25C, lm392-N Min (2) Input Bias Current IN(+) or IN(-), TA =25C, Input Offset Current IN(+) - IN(-), TA = 25C Input Common-Mode Voltage Range V+ = 30 VDC, TA = 25C, (3) , VCM = 0V (4) + Units Typ Max 2 5 mV 50 250 nA 5 50 nA V+-1.5 V 0 Supply Current RL = , V = 30 V 1 2 mA Supply Current RL = , V+= 5 V 0.5 1 mA (1) (2) (3) (4) These specifications apply for V+ = 5V, unless otherwise stated. For the lm392-N, temperature specifications are limited to 0C TA +70C. At output switch point, VO 1.4V, RS = 0 with V+ from 5V to 30V; and over the full input common-mode range (0V to V+ - 1.5V). The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the state of the output so no loading change exists on the input lines. The input common-mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common-mode voltage range is V+ - 1.5V, but either or both inputs can go to 32V without damage. Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N 3 LM392-N SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) (V+ = 5 VDC; specifications apply to both amplifiers unless otherwise stated) (1) Parameter lm392-N Conditions Amplifier-to-Amplifier Coupling Min f = 1 kHz to 20 kHz, TA = 25C, Input Referred, (5) Typ -100 (2) Input Offset Voltage Input Bias Current IN(+) or IN(-) Input Offset Current IN(+) - IN(-) Input Common-Mode Voltage Range V+ = 30 VDC, Differential Input Voltage Keep All VIN's 0 VDC (or V-, if used ) (4) Units Max 0 (6) dB 7 mV 400 nA 150 nA V+-2 V 32 V OP AMP ONLY Large Signal Voltage Gain V+ = 15 VDC, Vo swing = 1 VDC to 11 VDC, RL = 2 k, TA = 25C 25 Output Voltage Swing RL = 2 k, TA = 25C 0 + 100 V/mV V+-1.5 V Common-Mode Rejection Ratio DC, TA = 25C, VCM= 0, VDC to V -1.5 VDC 65 70 dB Power Supply Rejection Ratio DC, TA = 25C 65 100 dB Output Current Source VIN(+) = 1 VDC, VIN(-) = 0 VDC, V+ = 15 VDC, Vo = 2 VDC, TA = 25C 20 40 mA Output Current Sink VIN(-) = 1 VDC, VIN(+) = 0 VDC, V+ = 15 VDC, Vo =2VDC, TA = 25C 10 20 mA VIN(-) = 1 VDC, VIN(+) = 0 VDC, V+ = 15 VDC, Vo =200 mV, TA = 25C 12 50 A Input Offset Voltage Drift RS = 0 7 V/C Input Offset Current Drift RS = 0 10 pADC/C 200 V/mV 300 ns COMPARATOR ONLY RL 15 k, V+ = 15 VDC, TA = 25C Voltage Gain Large Signal Response Time (7) 50 VIN = TTL Logic Swing, VREF = 1.4 VDC VRL = 5 VDC, RL = 5.1 k, TA = 25C Response Time VRL = 5 VDC, RL = 5.1 k, TA = 25C Output Sink Current VIN(-) =1 VDC, VIN(+) = 0 VDC, VO 1.5 VDC, TA = 25C Saturation Voltage VIN(-) 1 VDC, VIN(+) = 0, ISINK 4 mA, TA = 25C 6 1.3 s 16 mA 250 VIN(-) 1 VDC, VIN(+) = 0, ISINK 4 mA Output Leakage Current VIN(-) = 0, VIN(+) 1 VDC, Vo = 5 VDC, TA = 25C VIN(-) = 0, VIN(+) 1 VDC, Vo = 30 VDC (5) (6) (7) 4 400 mV 700 mV 0.1 nA 1.0 A Due to proximity of external components, insure that coupling is not originating via the stray capacitance between these external parts. This typically can be detected as this type of capacitive coupling increases at higher frequencies. Positive excursions of input voltage may exceed the power supply level. As long as the other input voltage remains within the commonmode range, the comparator will provide a proper output state. The input voltage to the op amp should not exceed the power supply level. The input voltage state must not be less than -0.3V (or 0.3V below the magnitude of the negative power supply, if used) on either amplifier. The response time specified is for a 100 mV input step with 5 mV overdrive. For larger overdrive signals 300 ns can be obtained. Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N LM392-N www.ti.com SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 Schematic Diagram Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N 5 LM392-N SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 www.ti.com APPLICATION HINTS Please refer to the application hints section of the LM193 and the LM158 datasheets. 6 Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N LM392-N www.ti.com SNOSBT5D - APRIL 1998 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision C (March 2013) to Revision D * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 6 Submit Documentation Feedback Copyright (c) 1998-2013, Texas Instruments Incorporated Product Folder Links: LM392-N 7 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM392M ACTIVE SOIC D 8 95 Non-RoHS & Green Call TI Call TI 0 to 70 LM392 M LM392M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM392 M LM392MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM392 M LM392N/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM 0 to 70 LM 392N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM392MX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM392MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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