2016-04-01 1
2016-0 4-01
Silicon NPN Phototransistor with Vλ Characteristics
Version 1.3
SFH 3410
Ordering Information
Features:
Spectral range of sensitivity: (typ) 350 ... 970 nm
Package: Smart DIL
Especially suitable for applications from 350 nm to 970 nm
Adapted to human eye sensitivity (Vλ)
SMT package without base connection, suitable for IR reflow soldering
Only available on tape and reel
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
For control and drive circuits
Exposure meter for daylight and artificial light
Sensor for backlight-dimming
Ambient light detector
Type: Photocurrent Ordering Code
IPCE [µA]
Ev = 20 lx, Std. Light A, VCE = 5 V
SFH 3410 3.2 ... 25 Q65110A1211
SFH 3410-1/2 3.2 ... 10 Q65110A2653
SFH 3410-2/3 5 ... 16 Q65110A2654
SFH 3410-3/4 8 ... 25 Q65110A2655
2016-04-01 2
Version 1.3 SFH 3410
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 100 °C
Collector-emitter voltage VCE 5.5 V
Collector current IC20 mA
Emitter-collector voltage VEC 0.5 V
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2000 V
Parameter Symbol Values Unit
Wavelength of max. sensitivity (typ) λS max 570 nm
Spectral range of sensitivity (typ) λ10% (typ) 350
... 970
nm
Radiant sensitive area (typ) A 0.29 mm2
Dimensions of chip area (typ) L x W (typ) 0.75 x
0.75
mm x
mm
Half angle (typ) ϕ ± 60 °
Capacitance
(VCE = 0 V, f = 1 MHz, E = 0)
(typ) CCE 3.9 pF
Photocurrent
(Ev = 20 lx, Std. Light A, VCE = 5 V)
IPCE > 3.2 µA
Dark current
(VCE = 5 V, E = 0)
(typ (max)) ICE0 3 (≤ 50) nA
Version 1.3 SFH 3410
2016-04-01 3
Grouping (TA = 25 °C)
Group Min Photocurrent Max Photocurrent Collector-emitter
saturation voltage
EV = 20 lx, Std. Light A,
VCE = 5 V
EV = 20 lx, Std. Light A,
VCE = 5 V
IC = IPCEmin x 0.3,
EV = 20 lx
IPCE, min [µA] IPCE, max [µA] VCEsat [mV]
SFH 3410-1 3.2 6.3 100
SFH 3410-2 5 10 100
SFH 3410-3 8 16 100
SFH 3410-4 12.5 25 100
Note.: IPCEmin is the min. photocurrent of the specified group
Relative Spectral Sensitivity 1) page 12
Srel = f(λ)
Photocurrent 1) page 12
IPCE = f (EV), VCE = 5 V
rel
OHF00851
λ
S
400
0500 600 700 800 900 nm 1100
10
20
30
40
50
60
70
80
%
100
λ
V
PCE
OHF00852
I
1
1
V
E
Aµ
lx10 100 1000
10
100
1000
2016-04-01 4
Version 1.3 SFH 3410
Photocurrent 1) page 12
IPCE / IPCE(25°C) = f(TA), EV = 20 lx, VCE = 1 V ... 5 V
Collector-Emitter Capacitance 1) page 12
CCE = f(VCE), f = 1 MHz, E = 0
Collector-Emitter Current 1) page 12
ICE = f(VCE; EV)
OHF05722
-50 ˚C
A
T
0
(25 ˚C)
I
PCE
I
PCE
-25 0 25 50 100
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.4
0
pF
OHF04052
CE
C
CE
V
10-3 10-2 10-1 100101102
V
0.5
1.0
1.5
2.0
2.5
3.0
4.0
CE
OHF00854
I
0
0
A
CE
V
V
µ
1 2 3 4 5
10
20
30
40
50
60
70
80
200 lx
100 lx
20 lx
Version 1.3 SFH 3410
2016-04-01 5
Directional Characteristics 1) page 12
Srel = f(ϕ)
Package Outline
Dimensions in mm (inch).
Package
Smart DIL
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
2016-04-01 6
Version 1.3 SFH 3410
Approximate Weight:
12 mg
Recommended Solder Pad
Version 1.3 SFH 3410
2016-04-01 7
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to TP
Time within 5 °C of the specified peak
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
2016-04-01 8
Version 1.3 SFH 3410
Taping
Dimensions in mm (inch).
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 180 mm reel
D0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.3 SFH 3410
2016-04-01 9
Tape dimensions [mm]
Tape dim ensions in m m
Reel dimensions [mm]
Reel dim ensions in m m
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
WP0P1P2D0E F
12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1
or
8 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05
A W Nmin W1W2max
180 12 60 12.4 + 2 18.4
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
ML
XTemp ST
XXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
Semiconductors
OSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 XX_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
Pack: RXX
XXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
Pack: RXXPack: RXX
DEMY DEMY
EXAMPLE
1234
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12341234
EXAMPLE
Pack: RXXPack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
12345678901234567890
EXAMPLE
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EXAMPLE
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EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
SemiconductorsSemiconductors
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
EXAMPLE
SemiconductorsSemiconductors
OSRAM OptoOSRAM Opto
EXAMPLE
EXAMPLE
1234567890
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C:
1234
(9D) D/C:
1234567890
(6P) BATCH NO:
1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10% bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
2016-04-01 10
Version 1.3 SFH 3410
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
195 ± 5 195 ± 5 30 ± 5
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Version 1.3 SFH 3410
2016-04-01 11
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-04-01 12
Version 1.3 SFH 3410
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-04-01 13
Version 1.3 SFH 3410
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.