935272395118 - NXP SEMICONDUCTORS

1. General description

The PCA9552 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is

necessary to limit bus trafﬁc or free up the I2C-bus master's (MCU, MPU, DSP, chip set,

etc.) timer. The uniqueness of this device is the internal oscillator with two programmable

blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the

bus master must send repeated commands to turn the LED on and off. This greatly

increases the amount of trafﬁc on the I2C-bus and uses up one of the master's timers. The

PCA9552 LED blinker instead requires only the initial setup command to program

BLINK RATE 1 and BLINK RATE 2 (that is, the frequency and duty cycle) for each

individual output. From then on, only one command from the bus master is required to

turn each individual open-drain output on, off, or to cycle at BLINK RATE 1 or

BLINK RATE 2. Maximum output sink current is 25 mA per bit and 200 mA per package.

Any bits not used for controlling the LEDs can be used for General Purpose Parallel

Input/Output (GPIO) expansion.

The active LOW hardware reset pin (RESET) and Power-On Reset (POR) initializes the

registers to their default state, all zeroes, causing the bits to be set HIGH (LED off).

Three hardware address pins on the PCA9552 allow eight devices to operate on the same

bus.

2. Features

■16 LED drivers (on, off, ﬂashing at a programmable rate)

■2 selectable, fully programmable blink rates (frequency and duty cycle) between

0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds)

■Input/outputs not used as LED drivers can be used as regular GPIOs

■Internal oscillator requires no external components

■I2C-bus interface logic compatible with SMBus

■Internal power-on reset

■Noise ﬁlter on SCL/SDA inputs

■Active LOW reset input

■16 open-drain outputs directly drive LEDs to 25 mA

■Edge rate control on outputs

■No glitch on power-up

■Supports hot insertion

■Low standby current

■Operating power supply voltage range of 2.3 V to 5.5 V

■0 Hz to 400 kHz clock frequency

PCA9552

16-bit I2C-bus LED driver with programmable blink rates

Rev. 05 — 9 March 2006 Product data sheet

Product data sheet Rev. 05 — 9 March 2006 2 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

■ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per

JESD22-A115 and 1000 V CDM per JESD22-C101

■Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

■Packages offered: SO24, TSSOP24, HVQFN24

3. Ordering information

4. Block diagram

Table 1: Ordering information

amb

−

C to +85

Type number Topside mark Package

Name Description Version

PCA9552D PCA9552D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

PCA9552PW PCA9552 TSSOP24 plastic thin shrink small outline package; 24 leads;

body width 4.4 mm SOT355-1

PCA9552BS 9552 HVQFN24 plastic thermal enhanced very thin quad ﬂat package;

no leads; 24 terminals; body 4 ×4×0.85 mm SOT616-1

Remark: Only one I/O shown for clarity.

Fig 1. Block diagram of PCA9552

A0 A1 A2

002aac168

I2C-BUS

CONTROL

INPUT

FILTERS

PCA9552

POWER-ON

RESET

SCL

SDA

VDD

VSS

LEDn

RESET

OSCILLATOR PRESCALER 1

PRESCALER 0

PWM1

PWM0

INPUT

LED SELECT (LSn)

BLINK0

BLINK1

Product data sheet Rev. 05 — 9 March 2006 3 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

5. Pinning information

5.1 Pinning

Fig 2. Pin conﬁguration for SO24 Fig 3. Pin conﬁguration for TSSOP24

Fig 4. Pin conﬁguration for HVQFN24

PCA9552D

A0 VDD

A1 SDA

A2 SCL

LED0 RESET

LED1 LED15

LED2 LED14

LED3 LED13

LED4 LED12

LED5 LED11

LED6 LED10

LED7 LED9

VSS LED8

002aac165

23 VDD

SDA

SCL

RESET

LED15

LED14

LED13

LED12

LED11

LED10

LED9

LED8

PCA9552PW

002aac166

LED0

LED1

LED2

LED3

LED4

LED5

LED6

LED7

VSS

002aac167

PCA9552BS

Transparent top view

LED11

LED4

LED5

LED12

LED3 LED13

LED2 LED14

LED1 LED15

LED0 RESET

LED6

LED7

VSS

LED8

LED9

LED10

VDD

SDA

SCL

terminal 1

index area

613

514

4 15

3 16

2 17

118

Product data sheet Rev. 05 — 9 March 2006 4 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

5.2 Pin description

[1] HVQFN package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be

connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level

performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the

board and for proper heat conduction through the board, thermal vias need to be incorporated in the

printed-circuit board in the thermal pad region.

Table 2: Pin description

Symbol Pin Description

SO24, TSSOP24 HVQFN24

A0 1 22 address input 0

A1 2 23 address input 1

A2 3 24 address input 2

LED0 4 1 LED driver 0

LED1 5 2 LED driver 1

LED2 6 3 LED driver 2

LED3 7 4 LED driver 3

LED4 8 5 LED driver 4

LED5 9 6 LED driver 5

LED6 10 7 LED driver 6

LED7 11 8 LED driver 7

VSS 12 9[1] ground supply

LED8 13 10 LED driver 8

LED9 14 11 LED driver 9

LED10 15 12 LED driver 10

LED11 16 13 LED driver 11

LED12 17 14 LED driver 12

LED13 18 15 LED driver 13

LED14 19 16 LED driver 14

LED15 20 17 LED driver 15

RESET 21 18 active LOW reset input

SCL 22 19 serial clock line

SDA 23 20 serial data line

VDD 24 21 supply voltage

Product data sheet Rev. 05 — 9 March 2006 5 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

6. Functional description

Refer to Figure 1 “Block diagram of PCA9552”.

6.1 Device address

Following a START condition, the bus master must output the address of the slave it is

accessing. The address of the PCA9552 is shown in Figure 5. To conserve power, no

internal pull-up resistors are incorporated on the hardware selectable address pins and

they must be pulled HIGH or LOW.

The last bit of the address byte deﬁnes the operation to be performed. When set to logic 1

a read is selected, while a logic 0 selects a write operation.

6.2 Control Register

Following the successful acknowledgement of the slave address, the bus master will send

a byte to the PCA9552, which will be stored in the Control Register. This register can be

read and written via the I2C-bus.

The lowest 3 bits are used as a pointer to determine which register will be accessed.

If the Auto-Increment ﬂag (AI) is set, the four low order bits of the Control Register are

automatically incremented after a read or write. This allows the user to program the

registers sequentially. The contents of these bits will rollover to ‘0000’ after the last

When the Auto-Increment ﬂag is set (AI = 1) and a read sequence is initiated, the

sequence must start by reading a register different from ‘0' (B3 B2 B1 B0 ≠0000).

Only the 4 least signiﬁcant bits are affected by the AI ﬂag. Unused bits must be

programmed with zeroes.

Fig 5. PCA9552 address

002aac169

1 1 0 0 A2 A1 A0 R/W

fixed

slave address

programmable

Reset state: 00h

Fig 6. Control Register

002aac170

0 0 0 AI B3 B2 B1 B0

Auto-Increment flag

Product data sheet Rev. 05 — 9 March 2006 6 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

6.2.1 Control Register deﬁnition

6.3 Register descriptions

6.3.1 INPUT0 - Input register 0

The Input register 0 reﬂects the state of the device pins (inputs LED0 to LED7). Writes to

this register will be acknowledged but will have no effect.

Remark: The default value ‘X’ is determined by the externally applied logic level (normally

logic 1) when used for directly driving LED with pull-up to VDD.

6.3.2 INPUT1 - Input register 1

The Input register 1 reﬂects the state of the device pins (inputs LED8 to LED15). Writes to

this register will be acknowledged but will have no effect.

Remark: The default value ‘X’ is determined by the externally applied logic level (normally

logic 1) when used for directly driving LED with pull-up to VDD.

Table 3: Register summary

B3 B2 B1 B0 Symbol Access Description

0000INPUT0 read only input register 0

0001INPUT1 read only input register 1

0010PSC0 read/write frequency prescaler 0

0011PWM0 read/write PWM register 0

0100PSC1 read/write frequency prescaler 1

0101PWM1 read/write PWM register 1

0110LS0 read/write LED0 to LED3 selector

0111LS1 read/write LED4 to LED7 selector

1000LS2 read/write LED8 to LED11 selector

1001LS3 read/write LED12 to LED15 selector

Table 4: INPUT0 - input register 0 description

Bit 76543210

Symbol LED7 LED6 LED5 LED4 LED3 LED2 LED1 LED0

Default XXXXXXXX

Table 5: INPUT1 - input register 1 description

Bit 76543210

Symbol LED15 LED14 LED13 LED12 LED11 LED10 LED9 LED8

Default XXXXXXXX

Product data sheet Rev. 05 — 9 March 2006 7 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

6.3.3 PCS0 - Frequency Prescaler 0

PSC0 is used to program the period of the PWM output.

The period of BLINK0 = (PSC0 + 1) / 44.

6.3.4 PWM0 - Pulse Width Modulation 0

The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)

when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is

programmed with 00h, then the PWM0 output is always LOW.

The duty cycle of BLINK0 = (256 −PWM0) / 256.

6.3.5 PCS1 - Frequency Prescaler 1

PSC1 is used to program the period of the PWM output.

The period of BLINK1 = (PSC1 + 1) / 44.

6.3.6 PWM1 - Pulse Width Modulation 1

The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)

when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is

programmed with 00h, then the PWM1 output is always LOW.

The duty cycle of BLINK1 = (256 −PWM1) / 256.

Table 6: PSC0 - Frequency Prescaler 0 register description

Bit 76543210

Symbol PSC0[7] PSC0[6] PSC0[5] PSC0[4] PSC0[3] PSC0[2] PSC0[1] PSC0[0]

Default 11111111

Table 7: PWM0 - Pulse Width Modulation 0 register description

Bit 76543210

Symbol PWM0

[7] PWM0

[6] PWM0

[5] PWM0

[4] PWM0

[3] PWM0

[2] PWM0

[1] PWM0

[0]

Default 10000000

Table 8: PSC1 - Frequency Prescaler 1 register description

Bit 76543210

Symbol PSC1[7] PSC1[6] PSC1[5] PSC1[4] PSC1[3] PSC1[2] PSC1[1] PSC1[0]

Default 11111111

Table 9: PWM1 - Pulse Width Modulation 1 register description

Bit 76543210

Symbol PWM1

[7] PWM1

[6] PWM1

[5] PWM1

[4] PWM1

[3] PWM1

[2] PWM1

[1] PWM1

[0]

Default 10000000

Product data sheet Rev. 05 — 9 March 2006 8 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

6.3.7 LS0 to LS3 - LED selector registers

The LSn LED select registers determine the source of the LED data.

00 = output is set LOW (LED on)

01 = output is set high-impedance (LED off; default)

10 = output blinks at PWM0 rate

11 = output blinks at PWM1 rate

Table 10: LS0 to LS3 - LED selector registers bit description

Legend: * default value

LS0 - LED0 to LED3 selector

LS0 7:6 01* LED3 selected

5:4 01* LED2 selected

3:2 01* LED1 selected

1:0 01* LED0 selected

LS1 - LED4 to LED7 selector

LS1 7:6 01* LED7 selected

5:4 01* LED6 selected

3:2 01* LED5 selected

1:0 01* LED4 selected

LS2 - LED8 to LED11 selector

LS2 7:6 01* LED11 selected

5:4 01* LED10 selected

3:2 01* LED9 selected

1:0 01* LED8 selected

LS3 - LED12 to LED15 selector

LS3 7:6 01* LED15 selected

5:4 01* LED14 selected

3:2 01* LED13 selected

1:0 01* LED12 selected

Product data sheet Rev. 05 — 9 March 2006 9 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

6.4 Pins used as GPIOs

LED pins not used to control LEDs can be used as general purpose I/Os (GPIOs).

For use as input, set LEDn to high-impedance (01) and then read the pin state via the

input register.

For use as output, connect external pull-up resistor to the pin and size it according to the

DC recommended operating characteristics. LED output pin is HIGH when the output is

programmed as high-impedance, and LOW when the output is programmed LOW through

the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or

PWM1 are used.

6.5 Power-on reset

When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9552 in

a reset condition until VDD has reached VPOR. At that point, the reset condition is released

and the PCA9552 registers are initialized to their default states. Thereafter, VDD must be

lowered below 0.2 V to reset the device.

6.6 External RESET

A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The

PCA9552 registers and I2C-bus state machine will be held in their default states until the

RESET input is once again HIGH.

This input requires a pull-up resistor to VDD if no active connection is used.

Product data sheet Rev. 05 — 9 March 2006 10 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

7. Characteristics of the I2C-bus

The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two

lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be

connected to a positive supply via a pull-up resistor when connected to the output stages

of a device. Data transfer may be initiated only when the bus is not busy.

7.1 Bit transfer

One data bit is transferred during each clock pulse. The data on the SDA line must remain

stable during the HIGH period of the clock pulse as changes in the data line at this time

will be interpreted as control signals (see Figure 7).

7.1.1 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW

transition of the data line while the clock is HIGH is deﬁned as the START condition (S). A

LOW-to-HIGH transition of the data line while the clock is HIGH is deﬁned as the STOP

condition (P) (see Figure 8.)

7.2 System conﬁguration

A device generating a message is a ‘transmitter'; a device receiving is the ‘receiver'. The

device that controls the message is the ‘master' and the devices which are controlled by

the master are the ‘slaves' (see Figure 9).

Fig 7. Bit transfer

mba607

data line

stable;

data valid

change

of data

allowed

SDA

SCL

Fig 8. Deﬁnition of START and STOP conditions

mba608

SDA

SCL P

STOP condition

SDA

SCL

START condition

Product data sheet Rev. 05 — 9 March 2006 11 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

7.3 Acknowledge

The number of data bytes transferred between the START and the STOP conditions from

transmitter to receiver is not limited. Each byte of eight bits is followed by one

acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,

whereas the master generates an extra acknowledge related clock pulse.

A slave receiver which is addressed must generate an acknowledge after the reception of

each byte. Also a master must generate an acknowledge after the reception of each byte

that has been clocked out of the slave transmitter. The device that acknowledges has to

pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable

LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold

times must be taken into account.

A master receiver must signal an end of data to the transmitter by not generating an

acknowledge on the last byte that has been clocked out of the slave. In this event, the

transmitter must leave the data line HIGH to enable the master to generate a STOP

condition.

Fig 9. System conﬁguration

002aaa966

MASTER

TRANSMITTER/

RECEIVER

SLAVE

RECEIVER SLAVE

TRANSMITTER/

RECEIVER

MASTER

TRANSMITTER MASTER

TRANSMITTER/

RECEIVER

SDA

SCL

I2C-BUS

MULTIPLEXER

SLAVE

Fig 10. Acknowledgement on the I2C-bus

002aaa987

START

condition

9821

clock pulse for

acknowledgement

not acknowledge

acknowledge

data output

by transmitter

data output

by receiver

SCL from master

Product data sheet Rev. 05 — 9 March 2006 12 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

7.4 Bus transactions

Fig 11. Write to register

0 AS

slave address

START condition R/W acknowledge

from slave

002aac185

0 0 AI B3 B2 B1 B00

command byte

acknowledge

from slave

12345678SCL 9

SDA DATA 1 A

write to register

data out from port

tv(Q)

acknowledge

from slave

DATA 1 VALID

data to register

1 0 0 A2 A1 A01

Fig 12. Read from register

1 0 0 A2 A1 A0 0 AS1

START condition R/W

acknowledge

from slave

002aac186

acknowledge

from slave

SDA

A P

acknowledge

from master

data from register

DATA (first byte)

slave address

STOP

condition

(repeated)

START condition

(cont.)

(cont.) 1 0 0 A2 A1 A0 1 A1

R/W

acknowledge

from slave

slave address

at this moment master-transmitter becomes master-receiver

and slave-receiver becomes slave-transmitter

no acknowledge

from master

data from register

DATA (last byte)

command byte

0 0 AI B3 B2 B10B0

Auto-Increment

if AI = 1

Remark: This ﬁgure assumes the command byte has previously been programmed with 00h.

Fig 13. Read Input Port register

1 0 0 A2 A1 A0 1 AS1

START condition R/W acknowledge

from slave

002aac187

acknowledge

from master

SDA NA

read from

port

data into

port

th(D)

data from port

no acknowledge

from master

data from port

DATA 4

slave address

DATA 1

STOP

condition

DATA 2 DATA 3 DATA 4

tsu(D)

Product data sheet Rev. 05 — 9 March 2006 13 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

8. Application design-in information

8.1 Minimizing IDD when the I/O is used to control LEDs

When the I/Os are used to control LEDs, they are normally connected to VDD through a

resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O

VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower

than VDD and is speciﬁed as ∆Istb in Table 13 “Static characteristics”.

Designs needing to minimize current consumption, such as battery power applications,

should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.

Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less

than the LED supply voltage by at least 1.2 V. Both of these methods maintain the

input/output VIat or above VDD and prevents additional supply current consumption when

the LED is off.

LED0 to LED12 are used as LED drivers.

LED13 to LED15 are used as regular GPIOs.

Fig 14. Typical application

PCA9552

LED0

LED1

SDA

SCL

RESET

5 V

I2C-BUS/SMBus

MASTER

002aac188

SDA

SCL

VDD

VSS

5 V

10 kΩ

(3×)

LED2

LED3

LED4

LED5

LED6

LED7

LED8

LED9

LED10

LED11

LED12

LED13

LED14

LED15

GPIOs

Product data sheet Rev. 05 — 9 March 2006 14 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

8.2 Programming example

The following example will show how to set LED0 to LED3 on. It will then set LED4 and

LED5 to blink at 1 Hz at a 50 % duty cycle. LED6 and LED7 will be set to blink at 4 Hz and

at a 25 % duty cycle. LED8 to LED15 will be set to off.

Fig 15. High value resistor in parallel with

the LED Fig 16. Device supplied by a lower voltage

002aac189

LED

VDD

LEDn

100 kΩ

VDD

002aac190

LED

VDD

LEDn

3.3 V 5 V

Table 11: Programming PCA9552

Program sequence I2C-bus

START S

PCA9552 address with A0 to A2 = LOW C0h

PSC0 subaddress + Auto-Increment 12h

Set prescaler PSC0 to achieve a period of 1 second:

PSC0 = 43

2Bh

Set PWM0 duty cycle to 50 %:

PWM0 = 128

80h

Set prescaler PCS1 to achieve a period of 0.25 seconds:

PSC1 = 10

0Ah

Set PWM1 output duty cycle to 25 %:

PWM1 = 192

C0h

Set LED0 to LED3 on 00h

Set LED4 and LED5 to PWM0, and LED6 or LED7 to PWM1 FAh

Set LED8 to LED11 off 55h

Set LED12 to LED15 off 55h

STOP P

Blink period 1PSC0 1+

-----------------------

256 PWM0–

256

--------------------------------0.5=

Blink period 0.25 PSC1 1+

-----------------------

256 PWM1–

256

--------------------------------0.25=

Product data sheet Rev. 05 — 9 March 2006 15 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

9. Limiting values

10. Static characteristics

Table 12: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage −0.5 +6.0 V

VI/O voltage on an input/output pin LEDn used as an I/O VSS −0.5 5.5 V

IO(LEDn) output current on pin LEDn LEDn used as an I/O - ±25 mA

ISS ground supply current - 200 mA

Ptot total power dissipation - 400 mW

Tstg storage temperature −65 +150 °C

Tamb ambient temperature operating −40 +85 °C

Table 13: Static characteristics

= 2.3 V to 5.5 V; V

=0V; T

amb

−

C to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ [1] Max Unit

Supply

VDD supply voltage 2.3 - 5.5 V

IDD supply current Operating mode; VDD = 5.5 V; no load;

VI=V

DD or VSS; fSCL = 100 kHz - 350 550 µA

Istb standby current Standby mode; VDD = 5.5 V; no load;

VI=V

DD or VSS; fSCL = 0 kHz - 2.1 5.0 µA

∆Istb additional standby current Standby mode; VDD = 5.5 V;

every LED I/O at VI= 4.3 V;

fSCL = 0 kHz

--2mA

VPOR power-on reset voltage[2] VDD = 3.3 V; no load; VI=V

DD or VSS - 1.7 2.2 V

Input SCL; input/output SDA

VIL LOW-level input voltage −0.5 - 0.3VDD V

VIH HIGH-level input voltage 0.7VDD - 5.5 V

IOL LOW-level output current VOL = 0.4 V 3 6.5 - mA

ILleakage current VI=V

DD =V

SS −1- +1µA

Ciinput capacitance VI=V

SS - 4.4 5 pF

I/Os

VIL LOW-level input voltage −0.5 - 0.8 V

VIH HIGH-level input voltage 2.0 - 5.5 V

IOL LOW-level output current VOL = 0.4 V; VDD = 2.3 V [3] 9--mA

VOL = 0.4 V; VDD = 3.0 V [3] 12--mA

VOL = 0.4 V; VDD = 5.0 V [3] 15--mA

VOL = 0.7 V; VDD = 2.3 V [3] 15--mA

VOL = 0.7 V; VDD = 3.0 V [3] 20--mA

VOL = 0.7 V; VDD = 5.0 V [3] 25--mA

ILI input leakage current VDD = 3.6 V; VI= 0 V or VDD −1- +1µA

Cio input/output capacitance - 2.6 5 pF

Product data sheet Rev. 05 — 9 March 2006 16 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

[1] All typical values at 3.3 V and 25 °C.

[2] VDD must be lowered to 0.2 V in order to reset part.

[3] Each I/O must be externally limited to a maximum of 25 mA and each octal ([LED0 to LED7] and [LED8 to LED15]) must be limited to a

maximum current of 100 mA for a device total of 200 mA.

Select inputs A0, A1, A2; RESET

VIL LOW-level input voltage −0.5 - 0.8 V

VIH HIGH-level input voltage 2.0 - 5.5 V

ILI input leakage current −1- +1µA

Ciinput capacitance VI=V

SS - 2.3 5 pF

Table 13: Static characteristics

…continued

= 2.3 V to 5.5 V; V

=0V; T

amb

−

C to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ [1] Max Unit

(1) maximum

(2) average

(3) minimum

(1) maximum

(2) average

(3) minimum

Fig 17. Typical frequency variation over process at

VDD = 2.3 V to 3.0 V Fig 18. Typical frequency variation over process at

VDD = 3.0 V to 5.5 V

−20 %

0 %

20 %

percent

variation

−40 %

Tamb (°C)

−40 100−20

002aac191

0 20406080

(2)

(1)

(3)

−20 %

0 %

20 %

percent

variation

−40 %

Tamb (°C)

−40 100−20

002aac192

0 20406080

(1)

(2)

(3)

Product data sheet Rev. 05 — 9 March 2006 17 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

11. Dynamic characteristics

[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.

[2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.

[3] Cb= total capacitance of one bus line in pF.

[4] Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions.

[5] Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.

Table 14: Dynamic characteristics

Symbol Parameter Conditions Standard mode

I2C-bus Fast mode I2C-bus Unit

Min Max Min Max

fSCL SCL clock frequency 0 100 0 400 kHz

tBUF bus free time between a STOP and

START condition 4.7 - 1.3 - µs

tHD;STA hold time (repeated) START condition 4.0 - 0.6 - µs

tSU;STA set-up time for a repeated START

condition 4.7 - 0.6 - µs

tSU;STO set-up time for STOP condition 4.0 - 0.6 - µs

tHD;DAT data hold time 0 - 0 - ns

tVD;ACK data valid acknowledge time [1] - 600 - 600 ns

tVD;DAT data valid time LOW-level [2] - 600 - 600 ns

HIGH-level [2] - 1500 - 600 ns

tSU;DAT data set-up time 250 - 100 - ns

tLOW LOW period of the SCL clock 4.7 - 1.3 - µs

tHIGH HIGH period of the SCL clock 4.0 - 0.6 - µs

tffall time of both SDA and SCL signals - 300 20 + 0.1Cb[3] 300 ns

trrise time of both SDA and SCL signals - 1000 20 + 0.1Cb[3] 300 ns

tSP pulse width of spikes that must be

suppressed by the input ﬁlter - 50 - 50 ns

Port timing

tv(Q) data output valid time - 250 - 250 ns

tsu(D) data input setup time 100 - 100 - ns

th(D) data input hold time 1 - 1 - µs

Reset

tw(rst) reset pulse width 10 - 10 - ns

trec(rst) reset recovery time 0 - 0 - ns

trst reset time [4] [5] 400 - 400 - ns

Product data sheet Rev. 05 — 9 March 2006 18 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

Fig 19. Deﬁnition of timing on the I2C-bus

tSP

tBUF

tHD;STA PP S

tLOW

tHD;DAT

tHIGH tSU;DAT tSU;STA

tHD;STA

tSU;STO

SDA

SCL

002aaa986

Rise and fall times refer to VIL and VIH.

Fig 20. I2C-bus timing diagram

SCL

SDA

tHD;STA tSU;DAT tHD;DAT

tBUF

tSU;STA tLOW tHIGH

tVD;ACK

002aab175

tSU;STO

protocol START

condition

(S)

bit 7

MSB

(A7)

bit 6

(A6) bit 0

(R/W) acknowledge

(A)

STOP

condition

(P)

1/fSCL

tVD;DAT

Fig 21. Reset timing

SDA

SCL

002aac193

trst

50 %

30 %

50 % 50 %

50 %

trec(rst) tw(rst)

RESET

LEDn LED off

START

trst

ACK or read cycle

Product data sheet Rev. 05 — 9 March 2006 19 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

12. Test information

RL= load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current)

CL= load capacitance includes jig and probe capacitance

RT= termination resistance should be equal to the output impedance Zo of the pulse

generators.

Fig 22. Test circuitry for switching times

PULSE

GENERATOR

50 pF

500 Ω

002aab284

VDD

D.U.T.

VDD

open

GND

Product data sheet Rev. 05 — 9 March 2006 20 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

13. Package outline

Fig 23. Package outline SOT137-1 (SO24)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 15.6

15.2 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT137-1

detail X

vMA

(A )

0.25

075E05 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.61

0.60 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

99-12-27

03-02-19

Product data sheet Rev. 05 — 9 March 2006 21 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

Fig 24. Package outline SOT355-1 (TSSOP24)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 7.9

7.7 4.5

4.3 0.65 6.6

6.2 0.4

0.3 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT355-1 MO-153 99-12-27

03-02-19

0.25 0.5

0.2

112

24 13

pin 1 index

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

max.

1.1

Product data sheet Rev. 05 — 9 March 2006 22 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

Fig 25. Package outline SOT616-1 (HVQFN24)

0.51 0.2

A1Eh

UNIT ye

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 4.1

3.9

2.25

1.95

4.1

3.9 2.25

1.95

2.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT616-1 MO-220 - - -- - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT616-1

HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4 x 4 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

712

24 19

01-08-08

02-10-22

terminal 1

index area

terminal 1

index area

1/2 e

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

Product data sheet Rev. 05 — 9 March 2006 23 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

14. Handling information

Inputs and outputs are protected against electrostatic discharge in normal handling.

However, to be completely safe you must take normal precautions appropriate to handling

integrated circuits.

15. Soldering

15.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

15.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °Cto270°C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

•below 225 °C (SnPb process) or below 245 °C (Pb-free process)

–for all BGA, HTSSON..T and SSOP..T packages

–for packages with a thickness ≥2.5 mm

–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called

thick/large packages.

•below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

15.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

Product data sheet Rev. 05 — 9 March 2006 24 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

•Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

15.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

15.5 Package related soldering information

[1] For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

Table 15: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package[1] Soldering method

Wave Reﬂow[2]

BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,

SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable[4] suitable

PLCC[5], SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended[5] [6] suitable

SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable

CWQCCN..L[8], PMFP[9], WQCCN..L[8] not suitable not suitable

Product data sheet Rev. 05 — 9 March 2006 25 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

16. Abbreviations

Table 16: Abbreviations

Acronym Description

CDM Charged Device Model

DSP Digital Signal Processor

ESD ElectroStatic Discharge

HBM Human Body Model

GPIO General Purpose Input/Output

IC Integrated Circuit

I2C-bus Inter IC bus

LED Light Emitting Diode

MCU Microcontroller

MM Machine Model

MPU Microprocessor

POR Power-On Reset

PWM Pulse Width Modulation

SMBus System Management Bus

Product data sheet Rev. 05 — 9 March 2006 26 of 28

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

17. Revision history

Table 17: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

PCA9552_5 20060309 Product data sheet - - PCA9552_4

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

•Table 1 “Ordering information”: changed Topside mark of TSSOP24 package from

‘PCA9552PW’ to ‘PCA9552’

•Table 2 “Pin description”: added Table note 1 regarding VSS pin on HVQFN24 package

•Section 6.6 “External RESET”: changed symbol “tW” to “tw(rst)”

•Figure 11: changed symbol “tpv” to “tv(Q)”

•Figure 13: changed symbol “tph” to “th(D)”; changed symbol “tps” to “tsu(D)”

•Section 8.1 “Minimizing IDD when the I/O is used to control LEDs”:

–1st paragraph, 3rd sentence: changed symbol “∆IDD” to “∆Istb”

–2nd paragraph, 4th sentence: changed symbol “VIN” to “VI”

•Table 12 “Limiting values”:

–changed parameter description of VI/O from “DC voltage on an I/O” to “voltage on an

input/output pin”

–changed symbol “II/O (DC output current on an I/O)” to ‘IO(LEDn) (output current on pin LEDn)

•Table 13 “Static characteristics”:

–moved second sentence of description below title to (new)Table note 1 and added its

reference at column “Typ”

–changed symbol “∆IDD” to “∆Istb”

–under subsection “I/Os”, changed symbol “IL” to “ILI”

•Table 14 “Dynamic characteristics”:

–updated parameter descriptions

–under subsection “Port timing”: changed symbol “tPV” to “tv(Q)”; changed symbol “tPS” to

“tsu(D)”; changed symbol “tPH” to “th(D)”

–under subsection “Reset”: changed symbol “tW”to“t

w(rst)”; changed symbol “tREC”to“t

rec(rst)”;

changed symbol “tRESET” to “trst” (also in Table note 5)

•Figure 21 “Reset timing” modiﬁed to harmonize letter symbols

PCA9552_4 20041001 Product data sheet - 9397 750 13727 PCA9552_3

PCA9552_3 20030502 Product data 853-2374 29857

of 2003 Apr 24 9397 750 11463 PCA9552_2

PCA9552_2 20030224 Product data 853-2374 29331

of 2002 Dec 20 9397 750 11156 PCA9552_1

PCA9552_1 20020927 Product data 853-2374 28878

of 2002 Sep 09 9397 750 10329 -

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

Product data sheet Rev. 05 — 9 March 2006 27 of 28

18. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

19. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

21. Trademarks

Notice — All referenced brands, product names, service names and

trademarks are the property of their respective owners.

I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.

22. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level Data sheet status[1] Product status[2] [3] Deﬁnition

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights. Date of release: 9 March 2006

Document number: PCA9552_5

Published in The Netherlands

Philips Semiconductors PCA9552

16-bit I2C-bus LED driver with programmable blink rates

23. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Functional description . . . . . . . . . . . . . . . . . . . 5

6.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Control Register . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2.1 Control Register deﬁnition . . . . . . . . . . . . . . . . 6

6.3 Register descriptions . . . . . . . . . . . . . . . . . . . . 6

6.3.1 INPUT0 - Input register 0 . . . . . . . . . . . . . . . . . 6

6.3.2 INPUT1 - Input register 1 . . . . . . . . . . . . . . . . . 6

6.3.3 PCS0 - Frequency Prescaler 0. . . . . . . . . . . . . 7

6.3.4 PWM0 - Pulse Width Modulation 0. . . . . . . . . . 7

6.3.5 PCS1 - Frequency Prescaler 1. . . . . . . . . . . . . 7

6.3.6 PWM1 - Pulse Width Modulation 1. . . . . . . . . . 7

6.3.7 LS0 to LS3 - LED selector registers . . . . . . . . . 8

6.4 Pins used as GPIOs . . . . . . . . . . . . . . . . . . . . . 9

6.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9

6.6 External RESET . . . . . . . . . . . . . . . . . . . . . . . . 9

7 Characteristics of the I2C-bus. . . . . . . . . . . . . 10

7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.1.1 START and STOP conditions . . . . . . . . . . . . . 10

7.2 System conﬁguration . . . . . . . . . . . . . . . . . . . 10

7.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11

7.4 Bus transactions. . . . . . . . . . . . . . . . . . . . . . . 12

8 Application design-in information . . . . . . . . . 13

8.1 Minimizing IDD when the I/O is used to control

LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

8.2 Programming example . . . . . . . . . . . . . . . . . . 14

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15

10 Static characteristics. . . . . . . . . . . . . . . . . . . . 15

11 Dynamic characteristics . . . . . . . . . . . . . . . . . 17

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

14 Handling information. . . . . . . . . . . . . . . . . . . . 23

15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

15.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

15.2 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 23

15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23

15.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24

15.5 Package related soldering information . . . . . . 24

16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 25

17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 26

18 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 27

19 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

22 Contact information . . . . . . . . . . . . . . . . . . . . 27