OT413,127 - WEEN SEMICONDUCTOR(HONG KONG)CO.,LIMITED

TO-

OT413

3Q Hi-Com Triac

14 July 2014 Product data sheet

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1. General description

Planar passivated high commutation three quadrant triac in a SOT78D (TO-220AB)

internally insulated plastic package intended for use in circuits where high static and

dynamic dV/dt and high dI/dt can occur. This "series B" triac will commutate the full RMS

current at the maximum rated junction temperature without the aid of a snubber. This

device has high Tj operating capability and an internally isolated mounting base.

2. Features and benefits

•3Q technology for improved noise immunity

•High commutation capability with maximum false trigger immunity

•High surge capability

•High Tj(max)

•Isolated mounting base with 2500 V (RMS) isolation

•Planar passivated for voltage ruggedness and reliability

•Triggering in three quadrants only

•Very high immunity to false turn-on by dV/dt

3. Applications

•Electronic thermostats (heating and cooling)

•High power motor controls

•Rectifier-fed DC inductive loads e.g. DC motors and solenoids

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak off-

state voltage

- - 600 V

ITSM non-repetitive peak on-

state current

full sine wave; Tj(init) = 25 °C;

tp = 20 ms; Fig. 4; Fig. 5

- - 140 A

Tjjunction temperature - - 150 °C

IT(RMS) RMS on-state current full sine wave; Tmb ≤ 116 °C; Fig. 1;

Fig. 2; Fig. 3

- - 12 A

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3Q Hi-Com Triac

Product data sheet 14 July 2014 2 / 13

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 7

2 - 50 mA

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 7

2 - 50 mA

IGT gate trigger current

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 7

2 - 50 mA

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 T1 main terminal 1

2 T2 main terminal 2

3 G gate

mb n.c. mounting base; isolated

1 2

TO-220AB (SOT78D)

sym051

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

OT413 TO-220AB plastic single-ended package; isolated heatsink mounted; 1

mounting hole; 3-lead TO-220

SOT78D

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3Q Hi-Com Triac

Product data sheet 14 July 2014 3 / 13

7. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 600 V

IT(RMS) RMS on-state current full sine wave; Tmb ≤ 116 °C; Fig. 1;

Fig. 2; Fig. 3

- 12 A

full sine wave; Tj(init) = 25 °C;

tp = 20 ms; Fig. 4; Fig. 5

- 140 AITSM non-repetitive peak on-state

current

full sine wave; Tj(init) = 25 °C;

tp = 16.7 ms

- 153 A

I2t I2t for fusing tp = 10 ms; SIN - 98 A2s

dIT/dt rate of rise of on-state current IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs

IGM peak gate current - 2 A

PG(AV) average gate power over any 20 ms period - 0.5 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 150 °C

003aab813

10-2 10-1 1 10

surge duration (s)

IT(RMS)

(A)

f = 50 Hz; Tmb = 116 °C

Fig. 1. RMS on-state current as a function of surge

duration; maximum values

003aab814

-50 0 50 100 150

Tmb (°C)

IT(RMS)

(A)

Fig. 2. RMS on-state current as a function of mounting

base temperature; maximum values

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3Q Hi-Com Triac

Product data sheet 14 July 2014 4 / 13

003aab810

0 3 6 9 12

IT(RMS) (A)

Ptot

(W)

α = 180°

120°

90°

60°

30°

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

α = conduction angle

a = form factor = IT(RMS) / IT(AV)

Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

003aab811

120

160

1 10 102103

number of cycles (n)

ITSM

(A)

j(init)

C m

f = 50 Hz

Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum

values

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3Q Hi-Com Triac

Product data sheet 14 July 2014 5 / 13

003aab812

102

103

10-5 10-4 10-3 10-2 10-1

tp(s)

ITSM

(A)

j(init)

C m

(1)

tp ≤ 20 ms

(1) dIT/dt limit

Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values

NXP Semiconductors OT413

3Q Hi-Com Triac

Product data sheet 14 July 2014 6 / 13

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-mb) thermal resistance

from junction to

mounting base

full cycle; Fig. 6 - - 2.1 K/W

Rth(j-a) thermal resistance

from junction to

ambient

in free air - 60 - K/W

003aab815

10- 1

10- 2

Zth(j-mb)

(K/W)

10- 3

tp(s)

10- 5 1 1010- 1

10- 2

10- 4 10- 3

Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration

9. Isolation characteristics

Table 6. Isolation characteristics

Symbol Parameter Conditions Min Typ Max Unit

Visol(RMS) RMS isolation voltage from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;

Tmb = 25 °C

- - 2500 V

Cisol isolation capacitance from main terminal 2 to external

heatsink; f = 1 MHz; Tmb = 25 °C

- 10 - pF

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3Q Hi-Com Triac

Product data sheet 14 July 2014 7 / 13

10. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 7

2 - 50 mA

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 7

2 - 50 mA

IGT gate trigger current

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 7

2 - 50 mA

VD = 12 V; IG = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 8

- - 60 mA

VD = 12 V; IG = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 8

- - 90 mA

ILlatching current

VD = 12 V; IG = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 8

- - 60 mA

IHholding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 60 mA

VTon-state voltage IT = 18 A; Tj = 25 °C; Fig. 10 - 1.3 1.5 V

VD = 12 V; IT = 0.1 A; Tj = 25 °C;

Fig. 11

- 0.8 1 VVGT gate trigger voltage

VD = 400 V; IT = 0.1 A; Tj = 150 °C;

Fig. 11

0.25 0.4 - V

VD = 600 V; Tj = 125 °C - 0.1 0.5 mAIDoff-state current

VD = 600 V; Tj = 150 °C - 0.4 2 mA

Dynamic characteristics

VDM = 402 V; Tj = 125 °C; (VDM = 67%

of VDRM); exponential waveform; gate

open circuit

1000 - - V/µsdVD/dt rate of rise of off-state

voltage

VDM = 402 V; Tj = 150 °C; (VDM = 67%

of VDRM); exponential waveform; gate

open circuit

600 - - V/µs

VD = 400 V; Tj = 125 °C; IT(RMS) = 12 A;

dVcom/dt = 20 V/µs; (snubberless

condition); gate open circuit

20 - - A/msdIcom/dt rate of change of

commutating current

VD = 400 V; Tj = 150 °C; IT(RMS) = 12 A;

dVcom/dt = 20 V/µs; (snubberless

condition); gate open circuit

8 - - A/ms

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3Q Hi-Com Triac

Product data sheet 14 July 2014 8 / 13

Tj(°C)

- 50 1501000 50

001aag165

(1)

(2)

(3)

IGT

IGT(25°C)

(1) T2- G-

(2) T2+ G-

(3) T2+ G+

Fig. 7. Normalized gate trigger current as a function of

junction temperature

Tj(°C)

- 50 1501000 50

001aag166

IL(25°C)

Fig. 8. Normalized latching current as a function of

junction temperature

Tj(°C)

- 50 1501000 50

001aag167

IH(25°C)

Fig. 9. Normalized holding current as a function of

junction temperature

003aab666

0 0.5 1 1.5 2

VT(V)

(A)

(1) (2) (3)

Vo = 1.024 V; Rs = 0.021 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig. 10. On-state current as a function of on-state

voltage

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3Q Hi-Com Triac

Product data sheet 14 July 2014 9 / 13

Tj(°C)

- 50 150100500

001aag168

0.8

1.2

1.6

VGT

0.4

VGT(25°C)

Fig. 11. Normalized gate trigger voltage as a function of junction temperature

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3Q Hi-Com Triac

Product data sheet 14 July 2014 10 / 13

11. Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT78D TO-220

SOT78D

07-04-04

07-07-10

UNIT A

mm 4.7

4.3

1.40

1.25

0.9

0.6

0.4

16.0

15.2 6.5 10.3

9.7 3.0 0.2

DIMENSIONS (mm are the original dimensions)

Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220

0 5 10 mm

scale

b c D D1

ref E e

2.54

14.0

12.8

ref p

3.7

3.5

2.6

2.2

3.0

2.7

wb2

1.72

1.32

1.4

1.1

mounting

base

e e

123

Fig. 12. Package outline TO-220AB (SOT78D)

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3Q Hi-Com Triac

Product data sheet 14 July 2014 11 / 13

12. Legal information

12.1 Data sheet status

Document

status [1][2]

Product

status [3]

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

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customer have explicitly agreed otherwise in writing. In no event however,

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is deemed to offer functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

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or completeness of such information and shall have no liability for the

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Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

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make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

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inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

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applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

NXP Semiconductors OT413

3Q Hi-Com Triac

Product data sheet 14 July 2014 12 / 13

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

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the product is not suitable for automotive use. It is neither qualified nor

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NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without NXP Semiconductors’ warranty

of the product for such automotive applications, use and specifications, and

(b) whenever customer uses the product for automotive applications beyond

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liability, damages or failed product claims resulting from customer design and

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standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-

CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,

MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,

TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP

Semiconductors N.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

NXP Semiconductors OT413

3Q Hi-Com Triac

Product data sheet 14 July 2014 13 / 13

13. Contents

1 General description ............................................... 1

2 Features and benefits ............................................1

3 Applications ........................................................... 1

4 Quick reference data ............................................. 1

5 Pinning information ............................................... 2

6 Ordering information .............................................2

7 Limiting values .......................................................3

8 Thermal characteristics .........................................6

9 Isolation characteristics ........................................6

10 Characteristics .......................................................7

11 Package outline ................................................... 10

12 Legal information .................................................11

12.1 Data sheet status ............................................... 11

12.2 Definitions ...........................................................11

12.3 Disclaimers .........................................................11

12.4 Trademarks ........................................................ 12

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 July 2014