REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A Add device type 02. - ro 15-10-21 C. SAFFLE
REV
SHEET
REV A A
SHEET 15 16
REV STATUS REV A A A A A A A A A A A A A A
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14
PMIC N/A PREPARED BY
RICK OFFICER
DLA LAND AND MARITIME
COLUMBUS, OHIO 4321 8-3990
http://www.landandmaritime.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
APPROVED BY
CHARLES F. SAFFLE
MICROCIRCUIT, LINEAR, HIGH VOLTAGE
BIDIRECTIONAL CURRENT SHUNT MONITOR,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
14-02-20
AMSC N/A
REVISION LEVEL
A
SIZE
A
CAGE CODE
67268
5962-12233
SHEET 1 OF 16
DSCC FORM 2233
APR 97 5962-E032-16
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962 R 12233 01 V X A
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ / (see 1.2.3)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 AD8210 High voltage bidirectional current shunt monitor
02 AD8210 High voltage bidirectional current shunt monitor
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class Device requirements documentation
Q or V Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X CDFP3-F10 10 Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
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1.3 Absolute maximum ratings. 1/
Supply voltage (VS) .................................................................................................................. 12.5 V
Continuous input voltage (VCM on +INPUT, -INPUT) ............................................................... -5 V to +68 V
Reverse supply voltage ............................................................................................................ 0.3 V
Sensing input differential voltage (+INPUT to –INPUT) ............................................................ 500 mV
Output short circuit duration ...................................................................................................... Indefinite
Power dissipation (PD) ............................................................................................................. 80 mW
Junction temperature range (TJ) ............................................................................................... 150C
Lead temperature range (soldering, 10 seconds) ..................................................................... 300C
Storage temperature range (TSTG) .......................................................................................... -65C to +150C
Thermal resistance, junction to ambient (JC) .......................................................................... 50C/W 2/
Thermal resistance, junction to ambient (JA) .......................................................................... 75C/W 2/
1.4 Recommended operating conditions.
Supply voltage (VS) .................................................................................................................. 4.5 V to 5.5 V
Operating ambient temperature range (TA) .............................................................................. -55C to +125C
1.4.1 Operating performance characteristics.
Input / output characteristics: (TA = +25C, +VS = 5 V)
Input impedance differential ................................................................................................. 2 k
Input impedance common mode (VCM on +INPUT,-INPUT = 5 V to 65 V) .............................. 5 M
Input impedance common mode (VCM on +INPUT,-INPUT = -2 V to 5 V) ............................... 1.5 k
Output impedance ................................................................................................................ 2
Input to output gain ............................................................................................................... 20 V / V
Common mode rejection (f = 100 kHz, VCM 5 V, source imbalance 2 ........................ 95 dB
Common mode rejection (f = 100 kHz, VCM 5 V, source imbalance 2 ........................ 80 dB
Output offset adjustment range ............................................................................................ 0.05 V to 4.9 V
V
REF input voltage range ..................................................................................................... 0 V to +VS
V
REF divider resistor values ................................................................................................. 24 k to 40 k
Dynamic response: (TA = +25C, +VS = 5 V) 3/
Small signal bandwidth – 3 dB .............................................................................................. 575 kHz
Step response settling time positive current sense (within 1 % of true output) ..................... 3 s
Step response settling time negative current sense (within 1% of true output) ..................... 6 s
Noise performance: (TA = +25C, +VS = 5 V)
Voltage noise (referred to input (RTI), f = 0.1 Hz to 10 Hz) .................................................. 7 Vp-p
Voltage noise (referred to input (RTI), special density, f = 1 kHz) ........................................ 70 nV / Hz
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Measurement taken under absolute worst case condition. Data taken with a thermal camera for highest power density
location. See MIL-STD-1835 for average package JC thermal numbers.
3/ External input filtering should be considered to trade off desired dynamic response versus undesired response to system
transients and electromagnetic interference (EMI). Refer to paragraph 6.7 for more information.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
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APR 97
1.5 Radiation features.
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .............................................. 100 krads(Si) 4/
Device type 02:
Maximum total dose available (dose rate 10 mrads(Si)/s) ..................................................... 50 krads(Si) 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
______
4/ Device type 01 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
For device type 01, radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
5/ For device type 02, radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition D.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
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3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Block diagram. The block diagram shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
6
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APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55C TA +125C
VS = VREF1 = + 5 V,
Group A
subgroups
Device
type
Limits
Unit
VREF2 = GND,
VCM = -2 V and 65 V
unless otherwise specified
Min Max
Gain section.
Gain accuracy GA V
OUT 0.1 V dc, 1 01,02 -0.5 0.5 %
VCM = 0 V, 65 V,
nominal gain = 20 V/V
2,3 -0.7 0.7
P, L, R 1 01 -0.5 0.5
P, L 1 02 -0.5 0.5
Gain drift 3/ G VOUT 0.1 V dc,
VCM = 0 V, 65 V,
nominal gain = 20 V/V
1,2,3 01,02 20
ppm/C
Voltage offset section.
Offset voltage, referred to input VOS V
CM = 0 V, 5 V 1,2,3 01,02 -1.8 1.8 mV
P, L, R 1 01 -6 6
P, L 1 02 -6 6
Offset voltage drift 3/ VOS V
CM = 0 V, 5 V 1,2,3 01,02 -8 8 V/C
Input section.
Common mode input voltage VICM Continuous common mode 1,2,3 01,02 -2 65 V
range P, L, R 1 01 -2 65
P, L 1 02 -2 65
Differential input voltage range VID 4/ 1,2,3 01,02 0 250 mV
P, L, R 1 01 0 250
P, L 1 02 0 250
Common mode rejection ratio CMRR VCM 4 V 1,2,3 01,02 100 dB
P, L, R 1 01 100
P, L 1 02 100
VCM 4 V 5/ 1,2,3 01,02 80
P, L, R 1 01 80
P, L 1 02 80
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
7
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APR 97
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/ 2/
-55C TA +125C
VS = VREF1 = + 5 V,
Group A
subgroups
Device
type
Limits
Unit
VREF2 = GND,
VCM = -2 V and 65 V
unless otherwise specified
Min Max
Output section.
Output voltage range VOUT RL = 25 k 1,2,3 01,02 0.05 4.9
V
P, L, R 1 01 0.06 4.9
P, L 1 02 0.06 4.9
Dynamic response section.
Slew rate 3/ 6/ SR 100 mV input step, 4 01,02 2.4 V/s
measured at 20 % to 80 % 5 2.8
of output 6 1.8
Offset adjustment section.
Radiometric accuracy 7/ RAC Divider to supplies, VS = 5 V,
VREF1 = 5 V and 0 V,
VREF2 = 0 V and 5 V
1,2,3 01,02 0.499 0.501 V/V
P, L, R 1 01 0.499 0.501
P, L 1 02 0.499 0.501
Accuracy, referred to output VOACC V
S = 0.5 V to 5.5 V 1,2,3 01,02 -0.6 0.6 mV/V
P, L, R 1 01 -0.6 0.6
P, L 1 02 -0.6 0.6
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/ 2/
-55C TA +125C
VS = VREF1 = + 5 V,
Group A
subgroups
Device
type
Limits
Unit
VREF2 = GND,
VCM = -2 V and 65 V
unless otherwise specified
Min Max
Power supply, VS
Quiescent current IQ V
CM 5 V 8/ 1,2,3 01,02 2 mA
P, L, R 1 01 4
P, L 1 02 4
VCM 5 V 1,2,3 01,02 7.6
P, L, R 1 01 9
P, L 1 02 9
Power supply rejection ratio PSRR VS = 4.5 V to 5.5 V 1,2,3 01,02 80 dB
P, L, R 1 01 65
P, L 1 02 65
1/ Device type 01 supplied to this drawing has been characterized through all levels P, L, and R of irradiation.
Device type 02 supplied to this drawing has been characterized through all levels P and L of irradiation.
However, device type 01 is only tested at the “R” level and device type 02 is only tested at the “L” level.
Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation
electrical measurements for any RHA level, TA = +25C.
2/ Device type 01 may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A for device type 01 and condition D for device type 02. Device type 02 has been tested at low
dose rate.
3/ Parameter not tested post irradiation.
4/ Differential input voltage range = 125 mV with half scale output offset. Refer to paragraph 6.7 for more information.
5/ Source imbalance 2 .
6/ Parameter is guaranteed by engineering characterization, not production tested. Characterization repeated after major
design or process changes or with subsequent wafer lots.
7/ The offset adjustment is a ratio of the power supply when VREF1 and VREF2 are used as divider between the supplies.
8/ When the input common mode is less than 5 V, the supply current increases. This can be calculated with the following
formula: IQ (mA) = -0.7 * VCM + 4.2. Refer to paragraph 6.7 for more information.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
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Device types 01, 02
Case outline X
Terminal number Terminal symbol Description
1 NC/GND Unused pin.
2 -INPUT Sensing negative input voltage.
Rshunt x Ishunt between INPUTs sets this voltage.
3 GND Supply ground.
4 VREF2 Low side output reference setting voltage input.
5 NC/GND Unused pin.
6 OUT Output voltage for sensed input.
(+INPUT - -INPUT) x 20.
7 +VS Supply voltage.
8 VREF1 High side output reference setting voltage input.
9 +INPUT Sensing positive input voltage.
Rshunt x Ishunt between INPUTs sets this voltage.
10 NC/GND Unused pin.
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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REVISION LEVEL
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FIGURE 2. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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REVISION LEVEL
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4. VERIFICATION.
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein.
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroups 4, 5, 6 are tested as part of device initial characterization and after design and process changes or with
subsequent wafers lots as indicated in table I.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
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COLUMBUS, OHIO 43218-3990
REVISION LEVEL
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TABLE IIA. Electrical test requirements.
Test requirements Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
Device
class V
Interim electrical parameters
(see 4.2)
1 1
Final electrical parameters
(see 4.2)
1, 2, 3, 1/ 3/
4, 5, 6
1, 2, 3, 1/ 2/ 3/
4, 5, 6
Group A test requirements
(see 4.4)
1, 2, 3, 3/
4, 5, 6
1, 2, 3, 3/
4, 5, 6
Group C end-point electrical
parameters (see 4.4)
1,2,3 1, 2, 3 2/
Group D end-point electrical
parameters (see 4.4)
1,2,3 1,2,3
Group E end-point electrical
parameters (see 4.4)
--- 1
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified,
and the delta limits shall be completed with reference to the zero hour
electrical parameters (see table I).
3/ See table I for parameters tested or characterized for subgroups 4, 5, 6.
TABLE IIB. Burn-in and operating life test delta parameters. TA = +25C. 1/ 2/
Parameters Symbol Delta limits Units
Quiescent current IQ 0.1 mA
Offset voltage VOS 0.5 mV
Gain accuracy GA 0.1 %
1/ If device is tested at or below delta limit in table, no deltas are required.
Deltas are performed at room temperature.
2/ Delta parameters are performed per table I conditions.
STANDARD
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SIZE
A
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REVISION LEVEL
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4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point
electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in
table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883,
method 1019 condition A for device type 01 and condition D for device type 02 and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein)
to DLA Land and Maritime-VA and have agreed to this drawing.
STANDARD
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6.7 Application notes.
6.7.1 Normal operation (-2 V to 65 V supply range). In normal applications, the device amplifies a small differential input
voltage generated by the load current flowing through a shunt resistor. The device rejects high common-mode voltages
(up to 65 V) and provides a ground referenced buffered output that interfaces with an analog-to-digital converter (ADC).
The device is comprised of two main blocks, a differential amplifier and an instrumentation amplifier. A load current flowing
through the external shunt resistor produces a voltage at the input terminals of the device. The input terminals are connected to
the differential amplifier (A1) by R1 and R2. A1 nulls the voltage appearing across its own input terminals by adjusting the
current through R1 and R2 with Q1 and Q2. When the input signal to the device is 0 V, the currents in R1 and R2 are equal.
When the differential signal is nonzero, the current increases through one of the resistors and decreases in the other. The
current difference is proportional to the size and polarity of the input signal.
The differential currents through Q1 and Q2 are converted into a differential voltage by R3 and R4. A2 is configured as an
instrumentation amplifier. The differential voltage is converted into a single-ended output voltage by A2. The gain is internally
set with precision-trimmed, thin film resistors to 20 V/V.
The output reference voltage is easily adjusted by the VREF1 pin and the VREF2 pin. In a normal configuration, VREF1 is
connected to VCC while VREF2 is connected to GND. In this case, the output is centered at VCC/2 when the input signal is 0 V.
The device can be adjusted for unidirectional or bidirectional operation.
6.7.2 Unidirectional operation. Unidirectional operation allows the device to measure currents through a resistive shunt in
one direction. The basic modes for unidirectional operation are ground referenced output mode and +VS referenced output
mode. In unidirectional operation, the output can be set at the negative rail (near ground) or at the positive rail (near +VS) when
the differential input is 0 V. The output moves to the opposite rail when a correct polarity differential input voltage is applied.
In this case, full scale is approximately 250 mV. The required polarity of the differential input depends on the output voltage
setting. If the output is set at ground, the polarity needs to be positive to move the output up as shown in table III.
TABLE III. Reference output. +VS = 5 V
VIN (referred to –INPUT) VOUT
0 V 4.9 V
-125 mV 2.5 V
-250 mV 0.05 V
If the output is set at the positive rail, the input polarity needs to be negative to move the output down as shown in table IV.
TABLE IV. Bidirectional operation. +VS = 5 V
VIN (referred to –INPUT) VOUT
+125 mV 4.9 V
0 V 2.5 V
-125 mV 0.05 V
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
15
DSCC FORM 2234
APR 97
6.7.3 Ground referenced output. When using the device in the mode, both reference inputs are tied to ground, which causes
the output to sit at the negative rail when the differential input voltage is zero as shown in table V.
TABLE V. Ground reference output. +VS = 5 V
VIN (referred to –INPUT) VOUT
0 V 0.05 V
+125 mV 2.5 V
+250 mV 4.9 V
6.7.4 +VS referenced output. This mode is set when both reference pins are tied to the positive supply. It is normally used
when the diagnostic scheme requires detection of the amplifier and wiring before power is applied to the load. See table III.
6.7.5 Bidirectional operation. Bidirectional operation allows the device to measure currents through a resistive shunt in two
directions. The output offset can be set anywhere within the output range. Normally, it is set at half scale for equal
measurement range in both directions. In some cases, however, it is set at a voltage other than half scale when the bidirectional
current is nonsymmetrical. Adjusting the output can also be accomplished by applying voltage(s) to the reference inputs.
6.7.6 External referenced output. Tying both VREF pins together to an external reference produces an output offset at the
reference voltage when there is no differential input. The external reference replaces tying both to +VS. The external reference
value must be between 0 V and +VS. When the input is negative relative to the −INPUT pin, the output moves down from the
reference voltage. When the input is positive relative to the −INPUT pin, the output increases.
6.7.7 Splitting an external reference. In this case, an external reference is divided by two with an accuracy of approximately
0.2% by connecting one VREF pin to ground and the other VREF pin to the reference voltage. The external reference value
must be between 0 V and +VS. Note that pin VREF1 and pin VREF2 are tied to internal precision resistors that connect to an
internal offset node. There is no operational difference between the pins.
For proper operation, the device output offset should not be set with a resistor voltage divider. Any additional external
resistance could create a gain error. A low impedance voltage source should be used to set the output offset of the device.
6.7.8 Splitting the supply. By tying VREF1 to +VS and VREF2 to the GND pin, the output is set at mid-supply when there is no
differential input. This mode is beneficial because no external reference is required to offset the output for bidirectional current
measurement. This creates a midscale offset that is in ratio to the supply, meaning that if the supply increases or decreases,
the output still remains at half scale. For example, if the +VS supply = 5.0 V, the output is at half scale or 2.5 V.
If the supply increases by 10% (to 5.5 V), the output also increases by 10% (2.75 V).
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-12233
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
A
SHEET
16
DSCC FORM 2234
APR 97
6.7.9 Input filtering. In some applications, filtering at the input of the device can be beneficial in reducing differential noise, as
well as transients and current ripples flowing through the input shunt resistor. An input low-pass filter can be implemented as
shown in figure 3.
The 3 dB frequency for this filter can be calculated by using: 1 / ( 2 x 2 x RFILTER x CFILTER )
FIGURE 3. Input low pass filtering.
Adding outside components, such as RFILTER and CFILTER, introduces additional errors to the system. To minimize these
errors as much as possible, it is recommended that RFILTER be 10 or lower. By adding the RFILTER in series with the 2 k
internal input resistors of the device, a gain error is introduced.
This can be calculated by gain error (%) = 100 - (100 x ( 2 k / ( 2 k - RFILTER ))).
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-10-21
Approved sources of supply for SMD 5962-12233 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R1223301VXA 24355 AD8210AF/QMLR
5962L1223302VXA 24355 AD8210AF/QMLL
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE Vendor name
number and address
24355 Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 7910 Triad Center
Greensboro, NC 27409-9605
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
