LM3435
LM3435 Compact Sequential Mode RGB LED Driver with I 2 C Control Interface
Literature Number: SNVS724A
LM3435
October 4, 2011
Compact Sequential Mode RGB LED Driver with I2C Control
Interface
General Description
The LM3435, a Synchronously Rectified non-isolated Flyback
Converter, features all required functions to implement a high-
ly efficient and cost effective RGB LED driver. Different from
conventional Flyback converter, LEDs connect across the
VOUT pin and the VIN pin through internal passing elements
at corresponding LED pins. Thus, voltage across LEDs can
be higher than, equal to or lower than the input supply voltage.
Load current to LEDs is up to 2A with voltage across LEDs
ranging from 2.0V to 4.5V. Integrated N-Channel main MOS-
FET, P-Channel synchronous MOSFET and three N-Channel
current regulating pass switches allow low component count,
thus reducing complexity and minimize board size. The
LM3435 is designed to work exceptionally well with ceramic
output capacitors with low output ripple voltage. Loop com-
pensation is not required resulting in a fast load transient
response. Non-overlapping RGB LEDs are driven sequen-
tially through individual control. Output voltage hence can be
optimized for different forward voltage of LEDs during the
non-overlapping period. I2C interface eases the programming
of the individual RGB LED current up to 1,024 levels per
channel.
The LM3435 is available in the thermally enhanced LLP-40
package.
Key Specifications
Support up to 2A LED current
Typical ±3% LED current accuracy
Integrated N-Channel main and P-Channel synchronous
MOSFETs
3 Integrated N-Channel current regulating pass switches
LED Currents programmable via I2C bus independently
Input voltage range 2.7V - 5.5V
Thermal shutdown
Thermally enhanced LLP-40 package
Features
Sequential RGB driving mode
Low component count and small solution size
Stable with ceramic and other low ESR capacitors, no loop
compensation required
Fast transient response
Programmable converter switching frequency up to 1 MHz
MCU interface ready with I2C bus
Peak current limit protection for the switcher
LED fault detection and reporting via I2C bus
Applications
Li-ion batteries / USB Powered RGB LED driver
Pico / Pocket RGB LED Projector
© 2011 National Semiconductor Corporation 301625 www.national.com
LM3435 Compact Sequential Mode RGB LED Driver with I2C Control Interface
Typical Application Circuit
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LM3435
Connection Diagram
Top View
30162502
40-pin Leadless Leadframe Package (LLP)
5.0 x 5.0 x 0.8mm, 0.4mm pitch
NS Package Number SQF40A
Ordering Information
Order Number Spec. Package Type NSC Package Drawing Supplied As
LM3435SQ NOPB LLP-40 SQF40A 1000 Units, Tape and Reel
LM3435SQX NOPB LLP-40 SQF40A 4500 Units, Tape and Reel
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LM3435
Pin Descriptions
Pin Name Type Description Application Information
1, 2, 38, 39,
40
PGND Ground Power Ground Ground for power devices, connect to GND.
3 CG Output GREEN LED capacitor Connect a capacitor to Ground for GREEN LED.
Minimum 1nF.
4 CB Output BLUE LED capacitor Connect a capacitor to Ground for BLUE LED. Minimum
1nF.
5 CR Output RED LED capacitor Connect a capacitor to Ground for RED LED. Minimum
1nF.
6 IREFG Output Current Reference for GREEN LED Connect a resistor to Ground for GREEN LED current
reference generation.
7 IREFB Output Current Reference for BLUE LED Connect a resistor to Ground for BLUE LED current
reference generation.
8 IREFR Output Current Reference for RED LED Connect a resistor to Ground for RED LED current
reference generation.
9 GND Ground Ground
10, 29 SGND Ground I2C Ground Ground for I2C control, connect to GND.
11 SVDD Power I2C VDD VDD for I2C control.
12 SDATA Input /
Output
DATA bus Data bus for I2C control.
13 SCLK Input CLOCK bus Clock bus for I2C control.
14, 15, 16,
17, 37
VIN Power Input supply voltage Supply pin to the device. Nominal input range is 2.7V to
5.5V.
18 GCTRL Input GREEN LED control On/Off control signal for GREEN LED. Internally pull-low.
19 BCTRL Input BLUE LED control On/Off control signal for BLUE LED. Internally pull-low.
20 RCTRL Input RED LED control On/Off control signal for RED LED. Internally pull-low.
21, 22 RLED Output RED LED cathode Connect RED LED cathode to this pin.
23, 24 BLED Output BLUE LED cathode Connect BLUE LED cathode to this pin.
25, 26 GLED Output GREEN LED cathode Connect GREED LED cathode to this pin.
27 FAULT Output Fault indicator Pull-up when LED open or short is being detected.
28 EN Input Enable pin Internally pull-up. Connect to a voltage lower than 0.2 x
VIN to disable the device.
30, 31, 32 VOUT Input /
Output
Output voltage Connect anodes of LEDs to this pin.
33 RT Input ON-time control An external resistor connected from VOUT to this pin sets
the main MOSFET on-time, hence determine the
switching frequency.
34, 35, 36 SW Output Switch node Internally connected to the drain of the main N-channel
MOSFET and the P-channel synchronous MOSFET.
Connect to the output inductor.
EP EP Ground Exposed Pad Thermal connection pad, connect to the GND pin.
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LM3435
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN to GND -0.3V to 6.0V
VOUT, RT to VIN -0.3V to 5.5V
RLED, GLED, BLED to VIN -0.3V to 5.5V
SW to GND -0.3V to 11.5V
SW to GND (Transient) -2V to 13V
(<100 ns)
All other inputs to GND -0.3V to 6.0V
ESD Rating (Note 2)
Human Body Model ±1.5 kV
Storage Temperature -65°C to +150°C
Junction Temperature (TJ) -40°C to +125°C
Operating Ratings (Note 1)
Supply Voltage Range (VIN) 2.7V to 5.5V
Junction Temp. Range (TJ) -40°C to +125°C
Thermal Resistance (θJB)
(Note 3)
28°C/W
Electrical Characteristics Specification with standard type are for TA = TJ = +25°C only; limits in boldface type
apply over the full Operating Junction Temperature (TJ) range. Minimum and Maximum are guaranteed through test, design or
statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference
purposes only. Unless otherwise stated the following conditions apply: VIN = 5V and VOUT – VIN = 3V.
Symbol Parameter Conditions Min Typ Max Units
Supply Characteristics
IIN IIN operating current No switching 5 10 mA
IIN-SD IIN Shutdown current VEN = 0V 8 30 µA
ISVDD SVDD standby supply current VSVDD = 5V, I2C Bus idle 1µA
VINUVLO VIN under-voltage lock-out VIN decreasing 2.5 V
VINUVLO_hys VIN under-voltage lock-out hysteresis VIN increasing 0.2 V
Enable Input
VEN EN Pin input threshold VEN rising 0.8 x
VIN
V
VEN falling 0.2 x
VIN
V
IEN Enable Pull-up Current VEN = 0V 5 µA
Logic Inputs (RCTRL, GCTRL and BCTRL)
VCTRL CTRL pins input threshold VCTRL rising
(VIN = 2.7V to 5.5V)
1.35 V
VCTRL falling
(VIN = 2.7V to 5.5V)
0.63
Switching Characteristics
RDS-M-ON Main MOSFET RDS(ON) VGS(MAIN) =VIN = 5.0V
ISW(sink) = 100mA
0.04 0.1
RDS-S-ON Syn. MOSFET RDS(ON) VGS(SYN) = VOUT - 5.0V
ISW(source) = 100mA
0.06 0.2
Current Limit
ICL Peak current limit through main MOSFET
threshold
6 8.5 A
ON/OFF Timer
tON ON timer pulse width RRT = 499 k 750 ns
tON-MIN ON timer minimum pulse width 80 ns
tOFF OFF timer minimum pulse width 155 ns
RGB Driver Characteristics (RLED, BLED and GLED)
RDS(RED) Red LED Switch RDS VOUT - VIN = 3.3V
ILED = 1.5A
I2C code = 3FFh
0.1 0.2
RDS(BLU) Blue LED Switch RDS VOUT - VIN = 3.3V
ILED = 1.5A
I2C code = 3FFh
0.1 0.2
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LM3435
Symbol Parameter Conditions Min Typ Max Units
RDS(GRN) Green LED Switch RDS VOUT - VIN = 3.3V
ILED = 1.5A
I2C code = 3FFh
0.1 0.2
ILEDMAX Max. LED current (Note 4) VIN = 4.5V to 5.5V,
0°C TA 50°C
2 A
I1.5A,3FFh Current accuracy (3FFh) VIN = 2.7V to 5.5V
RIREF = 16.5 kΩ,
VOUT – VIN = 2.4V (RLED),
3.3V (GLED/BLED)
1.455 1.5 1.545 A
1.425 1.575 A
I1.5A,1FFh Current (1FFh) 0.8 A
I1.5A,001h Current (001h) 1.2 mA
FAULT Output Characteristics
VOH Output high voltage VIN = 2.7V to 5.5V,
IOH = -100µA
VIN –
0.1
V
VIN = 2.7V to 5.5V,
IOH = -5mA
VIN –
0.5
V
VOL Output low voltage VIN = 2.7V to 5.5V,
IOL = 100µA
0.1 V
VIN = 2.7V to 5.5V,
IOL = 5mA
0.5 V
Thermal Shutdown
TSD Thermal shutdown temperature TJ rising 163 °C
TSD-HYS Thermal shutdown temperature hysteresis TJ falling 20 °C
I2C Logic Interface Electrical Characteristics (1.7 V < SVDD < VIN )
Logic Inputs SCL, SDA
VIL Input Low Level 0.2 x
SVD
D
V
VIH Input High Level 0.8 x
SVDD
V
ILLogic Input Current -1 1 µA
fSCL Clock Frequency 400 kHz
Logic Output SDA
VOL Output Low Level ISDA = 3mA 0.3 0.5 V
ILOutput Leakage Current VSDA = 2.8V 2 µA
Note 1: Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of the device is
intended to be functional. For guaranteed specifications and test conditions, see the electrical characteristics.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin.
Note 3: θJB is junction-to-board thermal characteristic parameter. For packages with exposed pad, θJB is significantly dependent on PC boards. So, only when
the PC board under end-user environments is similar to the 2L JEDEC board, the corresponding θJB can be used to predict the junction temperature. θJB value
is obtained by NS Thermal Calculator© for reference only.
Note 4: Maximum LED current measured at VIN = 4.5V to 5.5V with heat sink on top of LM3435 with no air flow at 0°C TA 50°C. Operating conditions differ
from the above is not guaranteed.
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LM3435
Typical Performance Characteristics All curves taken at VIN = 5V with configuration in typical application
for driving one red (OSRAM LRW5AP-KZMX), one green (OSRAM LTW5AP-LZMY) and one blue (OSRAM LBW5AP-JYKX) LEDs
with IOUT per channel = 1.5A under TA = 25°C, unless otherwise specified.
IIN-SD vs VIN
23456
0
2
4
6
8
10
12
IIN-SD (μA)
VIN (V)
-40°C
25°C
125°C
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IIN (no switching) vs VIN
23456
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IIN (mA)
VIN (V)
125°C
25°C
-40°C
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ISVDD vs VIN
23456
0
5
10
15
20
25
ISVDD (nA)
VSVDD (V)
125°C
25°C
-40°C
30162504
RDS-M-ON vs VIN
23456
20
30
40
50
60
70
RDS-M-ON (mΩ)
VIN (V)
125°C
25°C
-40°C
30162503
RDS-S-ON vs VIN
23456
30
40
50
60
70
80
90
RDS-S-ON (mΩ)
VIN (V)
125°C
25°C
-40°C
30162507
RIREFx vs ILEDx
5 15 25 35 45 55
0.0
0.5
1.0
1.5
2.0
2.5
ILEDx(A)
RIREFx (kΩ)
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LM3435
ILED(RED) vs VIN
23456
1.46
1.48
1.50
1.52
1.54
ILED(RED) (A)
VIN (V)
125°C
25°C
-40°C
30162508
RDS(RED) vs VIN
23456
40
60
80
100
120
140
160
RDS(RED) (mΩ)
VIN (V)
125°C
25°C
-40°C
30162509
ILED(GRN) vs VIN
23456
1.46
1.48
1.50
1.52
1.54
ILED(GRN) (A)
VIN (V)
125°C
-40°C
25°C
30162510
RDS(GRN) vs VIN
23456
40
60
80
100
120
140
160
RDS(GRN) (mΩ)
VIN (V)
125°C
25°C
-40°C
30162511
ILED(BLU) vs VIN
23456
1.46
1.48
1.50
1.52
1.54
ILED(BLU) (A)
VIN (V)
125°C
25°C
-40°C
30162512
RDS(BLU) vs VIN
23456
40
60
80
100
120
140
160
RDS(BLU) (mΩ)
VIN (V)
125°C
25°C
-40°C
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LM3435
RED Efficiency vs VIN @ TA = 25°C
23456
50
60
70
80
90
100
RED EFFICIENCY, ηRED(%)
VIN (V)
30162528
GREEN Efficiency vs VIN @ TA = 25°C
23456
50
60
70
80
90
100
GREEN EFFICIENCY, ηGRN(%)
VIN (V)
30162529
BLUE Efficiency vs VIN @ TA = 25°C
23456
50
60
70
80
90
100
BLUE EFFICIENCY, ηBLU(%)
VIN (V)
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Power Up Transient
30162524
10ms/DIV
RGB Sequential Mode Operation
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1ms/DIV
Color Transition Delay
30162526
100µs/DIV
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LM3435
Simplified Functional Block Diagram
30162514
Operation Description
INTRODUCTION
The LM3435 is a sequential LED driver for portable and pico
projectors. The device is integrated with three high current
regulators, low side MOSFETs and a synchronous flyback
DC-DC converter. Only single LED can be enabled at any
given time. The DC-DC converter quickly adjusts the output
voltage to an optimal level based on each LED’s forward volt-
age. This minimizes the power dissipation at the current
regulators and maximizes the system efficiency. The I2C com-
patible synchronous serial interface provides access to the
programmable functions and registers of the device. I2C pro-
tocol uses a two-wire interface for bi-directional communica-
tions between the devices connected to the bus. The two
interface lines are the Serial Data Line (SDA), and the Serial
Clock Line (SCL). These lines should be connected to a pos-
itive supply, via a pull-up resistor and remain HIGH even when
the bus is idle. Every device on the bus is assigned an unique
address and acts as either a Master or a Slave depending on
whether it generates or receives the serial clock (SCL).
SYNCHRONOUS FLYBACK CONVERTER
The LM3435 integrates a synchronous flyback DC-DC con-
verter to power the three-channel current regulator. The LEDs
are connected across VOUT of the flyback converter and VIN
through an internal power MOSFET connecting to corre-
sponding LED channel. The maximum current to LED is 2A
and the maximum voltage across VOUT and VIN is limited at
around 4.7V. The LM3435 integrates the main N-channel
MOSFET, the synchronous P-channel MOSFET of the fly-
back converter and three N-channel MOSFETs as internal
passing elements connecting to LED channels in order to
minimize the solution components count and PCB space.
The flyback converter of LM3435 employs a proprietary Pro-
jected On-Time (POT) control scheme to determine the on-
time of the main N-channel MOSFET with respect to the input
and output voltages together with an external switching fre-
quency setting resistor connected to RT pin, RRT. POT control
use information of the current passing through RRT from
VOUT, voltage information of VOUT and VIN to find an ap-
propriate on-time for the circuit operations. During the on-time
period, the inductor connecting to the flyback converter is
charged up and the output capacitor is discharged to supply
power to the LED. A cycle-by-cycle current limit of typical 6A
is imposed on the main N-channel MOSFET for protection.
After the on-time period, the main N-channel MOSFET is
turned off and the synchronous P-channel MOSFET is turned
on in order to discharge the inductor. The off state will last
until VOUT is dropped below a reference voltage. Such ref-
erence voltage is derived from the required LED current to be
regulated at a particular LED channel. The flyback converter
under POT control can maintain a fairly constant switching
frequency that depends mainly on value of the resistor con-
nected across VOUT and RT pins, RRT. The relationship
between the flyback converter switching frequency, FSW and
RRT is approximated by the following relationship:
RRT in and FSW in kHz
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LM3435
In addition, POT control requires no external compensation
and achieves fast transient response of the output voltage
changes that perfectly matches the requirements of a se-
quential RGB LED driver. The POT flyback converter only
operates at Continuous Conduction Mode. Dead-time be-
tween main MOSFET and synchronous MOSFET switching
is adaptively controlled by a minimum non-overlap timer to
prevent current shoot through. Initial VOUT will be regulated
at around 3.2V to 3.5V above VIN before any control signals
being turned on. Three small capacitors connected to CR, CG
and CB pins are charged by an internal current source and
act as soft-start capacitors of the flyback converter during
start-up. Once initial voltage of VOUT is settled, the capaci-
tors will be used as a memory element to store the VOUT
information for each channel respectively. This information
will be used for VOUT regulation of respective LED channel
during channel switching. In between the channel switching,
a small I2C programmable blank out time of 5 µs to 35 µs is
inserted so that the LED current is available after the correct
VOUT for the color is stabilized. This control scheme ensures
the minimal voltage headroom for different color LED and
hence best conversion efficiency can be achieved.
HIGH CURRENT REGULATORS
The LM3435 contains three internal current regulators pow-
ered by the output of the synchronous Flyback Converter,
VOUT. Three low side power MOSFETs are included. These
current regulators control the current supplied to the LED
channels individually and maintain accurate current regula-
tion by internal feedback and control mechanism. The regu-
lation is achieved by a Gm-C circuit comparing the sensing
voltage of the internal passing N-channel MOSFET and an
internal LED current reference voltage generated from the
external reference current setting resistor, RIREFx connect to
IREFG, IREFB or IREFR pin, of the corresponding LED chan-
nel. The nominal maximum LED current is governed by the
equation in below:
RIREFx in and ILEDx in Ampere
The LED current setting can be in the range of 0.5A up to 2A
maximum. The nominal maximum of the device is 1.5A and
for applications need higher than 1.5A LED current, VIN and
thermal constrains must be complied. The actual LED current
can be adjusted on-the-fly by the internal ten bits register for
individual channel. The content of these registers are user
programmable via I2C bus connection. The user can control
the LED output current on-the-fly during normal operation.
The resolution is 1 out of 1024 part of the LED current setting.
The user can program the registers in the range of 1(001H)
to 1023(3FFH) for each channel independently, provided the
converter is not entered the Discontinuous Conduction Mode.
Whenever the converter operation entered the Discontinuous
Conduction Mode, the regulation will be deteriorated. A value
of “0” may cause false fault detection, so it must be avoided.
SEQUENTIAL MODE RGB TIMING
LM3435 is a sequential mode RGB driver dedicatedly de-
signed for pico and portable projector applications. By using
this device, the system only require one power driver stage
for three color LEDs. With LM3435, only single LED can be
enabled at any given time period and the DC-DC converter
can quickly adjusts the output voltage to an optimized level
by controlling the current flowing into the respective LED
channel. This approach minimizes the power dissipation of
the internal current regulator and effectively maximizes the
system efficiency. Timing of the RGB LEDs depends solely
on the RCTRL, GCTRL and BCTRL inputs. The Timing Chart
in below shows a typical timing of two cycles of even RGB
scan. In real applications, the RGB sequence is totally con-
trolled by the system or the video processor. It’s not manda-
tory to follow the simple RGB sequence, but for any change
instructed by the I2C control will only take place at the falling
edge of the corresponding CTRL signal.
30162520
RGB Control Signals Timing Chart
PRIORITIES OF LED CONTROL SIGNALS
The LM3435 does not support color overlapping mode oper-
ation. At any instant, only one LED will be enabled even
overlapping control signals applied to the control inputs. The
decision logics of the device determine which LED channel
should be enabled in case overlapping control signals are
detected at the control inputs. The GREEN channel has the
higher priority over BLUE channel and the RED channel has
the lowest priority. However, if a low priority channel is already
turned on before the high priority channel control signal
comes in, the low priority channel will continue to take the
control until the control signal ceased. The timing diagram in
below illustrates some typical cases during operation.
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LM3435
30162521
Priorities of LED Control Signals
LED OPEN FAULT REPORTING
The fly-back converter tries to keep VOUT to the forward volt-
age required by the LED with the desired LED current output.
However, if the LED channel is being opened no matter it is
due to LED failure or no connection, the fly-back converter will
limit the VOUT voltage at around 4.7V above VIN. Once such
voltage is achieved, an open-fault-suspect signal will go high.
If this open-fault-suspect signal is being detected at 3 con-
secutive falling edges of the opened channel control signal,
“Fault” pin will be latched high and the corresponding channel
open fault will be reported through I2C. The open fault report
can be removed either by pulling EN pin low for less than
100ns (a true shutdown will be triggered if the negative pulse
on EN is more than 100ns) or by writing a “0” to “bit 0” of the
I2C register ”05h”. The “Fault” pin will be cleared and the I2C
fault register will be reset. In order to reinstate the fault re-
porting feature, the system need to write a “1” to “bit 0” of the
I2C register “05h”.
LED SHORT FAULT REPORTING
If the VOUT is prohibited to regulate at a potential higher than
1.5V above VIN at a LED channel, such LED is considered
being shorted and a short-fault-suspect signal will go high. If
this short-fault-suspect signal is being detected at 3 consec-
utive falling edges of the shorted channel control signal,
“Fault” pin will be latched high and the corresponding channel
short fault will be reported through I2C. The short fault report
can be removed either by pulling EN pin low for less than
100ns (a true shutdown will be triggered if the negative pulse
on EN is more than 100ns) or by writing a “0” to “bit 0” of the
I2C register ”05h”. The “Fault” pin will be cleared and the I2C
fault register will be reset. In order to reinstate the fault re-
porting feature, the system need to write a “1” to “bit 0” of the
I2C register “05h”. Persistently short of LED can cause per-
manent damage to the device. Whenever the short fault is
detected, the system should turn off the faulty channel imme-
diately by pulling the corresponding PWM control pin to GND.
THERMAL SHUTDOWN
Internal thermal shutdown circuitry is included to protect the
device in the event that the maximum junction temperature is
exceeded. The threshold for thermal shutdown in LM3435 is
around 160°C and it will be resumed to normal operation
again once the temperature cools down to below around 140°
C.
I2C Compatible Interface
INTERFACE BUS OVERVIEW
The I2C compatible synchronous serial interface provides ac-
cess to the programmable functions and registers on the
device. This protocol uses a two-wire interface for bi-direc-
tional communications between the devices connected to the
bus. The two interface lines are the Serial Data Line (SDA),
and the Serial Clock Line (SCL). These lines should be con-
nected to a positive supply, via a pull-up resistor and remain
HIGH even when the bus is idle. Every device on the bus is
assigned a unique address and acts as either a Master or a
Slave depending on whether it generates or receives the se-
rial clock (SCL).
DATA TRANSACTIONS
One data bit is transferred during each clock pulse. Data is
sampled during the high state of the serial clock (SCL). Con-
sequently, throughout the clock’s high period, the data should
remain stable. Any changes on the SDA line during the high
state of the SCL and in the middle of a transaction, aborts the
current transaction. New data should be sent during the low
SCL state. This protocol permits a single data line to transfer
both command/control information and data using the syn-
chronous serial clock.
I2C DATA VALIDITY
The data on SDA line must be stable during the HIGH period
of the clock signal (SCL). In other words, state of the data line
can only be changed when CLK is LOW.
30162515
I2C Signals : Data Validity
I2C START and STOP CONDITIONS
START and STOP bits classify the beginning and the end of
the I2C session. START condition is defined as SDA signal
transitioning from HIGH to LOW while SCL line is HIGH.
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LM3435
STOP condition is defined as the SDA transitioning from LOW
to HIGH while SCL is HIGH. The I2C master always generates
START and STOP bits. The I2C bus is considered to be busy
after START condition and free after STOP condition. During
data transmission, I2C master can generate repeated START
conditions. First START and repeated START conditions are
equivalent, function-wise.
30162516
I2C Start and Stop Conditions
I2C ADDRESSES AND TRANSFERRING DATA
Every byte put on the SDA line must be eight bits long, with
the most significant bit (MSB) being transferred first. Each
byte of data has to be followed by an acknowledge bit. The
acknowledge bit related clock pulse is generated by the mas-
ter. The transmitter releases the SDA line (HIGH) during the
acknowledge clock pulse. The receiver must pull down the
SDA line during the 9th clock pulse, signifying an acknowl-
edgement. A receiver which has been addressed must gen-
erate an acknowledge bit after each byte has been received.
After the START condition, the I2C master sends a chip ad-
dress. This address is seven bits long followed by an eighth
bit which is a data direction bit (R/W). The LM3435 address
is 50h or 51H which is determined by the R/W bit. I2C address
(7 bits) for LM3435 is 28H. For the eighth bit, a “0” indicates
a WRITE and a “1” indicates a READ. The second byte se-
lects the register to which the data will be written. The third
byte contains data to write to the selected register.
30162517
I2C Chip Address
Register changes take an effect at the SCL rising edge during
the last ACK from slave.
30162532
w = write (SDA = “0”)
r = read (SDA = “1”)
ack = acknowledge (SDA pulled down by either master or slave)
rs = repeated start
id = 7-bit chip address, 50H (ADDR_SEL=0) or 51H (ADDR_SEL=1) for LM3435.
I2C Write Cycle
When a READ function is to be accomplished, a WRITE func-
tion must precede the READ function, as shown in the Read
Cycle waveform.
30162533
I2C Read Cycle
13 www.national.com
LM3435
I2C TIMING PARAMETERS (VIN = 2.7V to 5.5V, SVDD = 1.7V
to VIN)
30162534
I2C Timing Diagram
Symbol Parameter Limit Units
Min Max
1 Hold Time (repeated) START Condition 0.6 µs
2 Clock Low Time 1.3 µs
3 Clock High Time 600 ns
4 Setup Time for a Repeated START Condition 600 ns
5 Data Hold Time (Output direction) 300 ns
5 Data Hold Time (Input direction) 0 ns
6 Data Setup Time 100 ns
7 Rise Time of SDA and SCL 20+0.1Cb 300 ns
8 Fall Time of SDA and SCL 15+0.1Cb 300 ns
9 Set-up Time for STOP condition 600 ns
10 Bus Free Time between a STOP and a START
Condition
1.3 µs
Cb Capacitive Load for Each Bus Line 10 200 pF
Note: Data guaranteed by design.
www.national.com 14
LM3435
I2C REGISTER DETAILS
The I2C bus interacts with the LM3435 to realize the features
of LED current program inter-color delay time program and
Fault reporting function. The operation of these functions re-
quires the writing and reading of the internal registers of the
LM3435. In below is the master register map of the device.
Master Register Map
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
00h LEDLO 0 0 RLED[1:0] BLED[1:0] GLED[1:0] 0011 1111
01h GLEDH GLED[9:2] 1111 1111
02h BLEDH BLED[9:2] 1111 1111
03h RLEDH RLED[9:2] 1111 1111
05h FLT_RPT 0 0 0 0 0 0 0 FLT_RPT 0000 0001
06h DELAY RDLY[1:0] 1 BDLY[1:0] 1 GDLY[1:0] 1111 1111
07h FAULT GO GS 0 BO BS 0 RO RS 0000 0000
LED Current Register Definitions
The LED currents for each color can be accurately adjusted
by 10 bits resolution (1024 steps) independently. By writing
control bytes into the LM3435 LED current Registers, the LED
currents can be precisely set to any value in the range of
IMIN to IREF.
In below is the LED Current Low register bit definition:
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
00h LEDLO 0 0 RLED[1:0] BLED[1:0] GLED[1:0] 0011 1111
Bits Description
7:6 Reserved. These bits always read zeros.
5:4 The least significant bits of the 10-bit RLED register. This register is for programming the level of current for the
Red LED.
3:2 The least significant bits of the 10-bit BLED register. This register is for programming the level of current for the
Blue LED.
1:0 The least significant bits of the 10-bit GLED register. This register is for programming the level of current for the
Green LED.
In below is the LED Current High register bit definition:
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
01h GLEDH GLED[9:2] 1111 1111
02h BLEDH BLED[9:2] 1111 1111
03h RLEDH RLED[9:2] 1111 1111
Bits Description
7:0 The most 8 significant bits of the 10-bit GLED, BLED and RLED registers respectively. These registers are for
programming the level of current of the Green LED, Blue LED and Red LED independently.
Fault Reporting Register Definition
The fault reporting feature of the LM3435 can be selected by
the system designer according to their application needs. To
select or de-select this feature is realized by writing one bit
into the FLT_RPT register.
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
05h FLT_RPT 0 0 0 0 0 0 0 FLT_RPT 0000 0001
Bits Description
7:1 Reserved. These bits always read zeros.
0This bit defines the mode of fault report feature. Writing a “ 1 “ into this bit enables the fault reporting feature,
otherwise no Fault signal output at Pin 27.
Color Transition Delay Register Definition
The transition of one color into next color is not executed im-
mediately. Certain delay is inserted in between to guarantee
the LED rail voltage stabilized before turning the next LED on.
This delay is user programmable by writing control bits into
the DELAY register for each color individually. The power up
default delay time is 35µs and this delay can be programmed
from 5 µs to 35 µs maximum in step of 10 µs.
15 www.national.com
LM3435
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
06h DELAY RDLY[1:0] 1 BDLY[1:0] 1 GDLY[1:0] 1111 1111
Bits Description
7:6 These two bits are for programming the Red transition delay.
5 Reserved. This bit always read “ 1“.
4:3 These two bits are for programming the Blue transition delay.
2 Reserved. This bit always read “ 1“.
1:0 These two bits are for programming the Green transition delay.
Fault Register Definition
The LM3435 features LED fault detection capability. When-
ever a LED fault is detected (open or short), the FAULT output
(pin 27) will go high to indicate a LED fault is detected. The
details of the fault can be investigated by reading the FAULT
register. The FAULT register is read only. The fault status can
be cleared by clearing and then re-enabling the FLT_RPT
register or power up reset of the device.
ADDR REGISTER D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
07h FAULT GO GS 0 BO BS 0 RO RS 0000 0000
Bits Description
7 GO – Green Open. This read only register bit indicates the presence of an OPEN fault of the GREEN LED.
6 GS – Green Short. This read only register bit indicates the presence of an SHORT fault of the GREEN LED.
5 Reserved. This bit always read “ 0 “.
4 BO – Blue Open. This read only register bit indicates the presence of an OPEN fault of the BLUE LED.
3 BS – Blue Short. This read only register bit indicates the presence of an SHORT fault of the BLUE LED.
2 Reserved. This bit always read “ 0 “.
1 RO – Red Open. This read only register bit indicates the presence of an OPEN fault of the RED LED.
0 RS – Red Short. This read only register bit indicates the presence of an SHORT fault of the RED LED.
www.national.com 16
LM3435
Design Procedures
This section presents a design example of a typical pico pro-
jector application. By using LM3435, the system requires only
single DC-DC converter to drive three color LEDs instead of
using three DC-DC converters with conventional design. The
suggested approach not only saves components cost, but al-
so releases invaluable PCB space to the system and en-
hances system reliability. The handy projector is powered by
a single lithium battery cell or a 5Vdc wall mount adaptor. The
key specifications of the design are as in below:
Supply voltage range, VIN = 2.7V to 5.5V
Preset LED current per channel, ILED = 1.5A
Minimum LED current per channel, ILED(MIN) = 600mA
Maximum LED forward voltage drop, VLED = 3.5V @ 1.5A
Flyback converter switching Frequency, FSW = ~500kHz
SETTING THE FLYBACK CONVERTER SWITCHING
FREQUENCY, FSW
The LM3435 employs a proprietary Projected On-Time (POT)
control scheme, the switching frequency, FSW of the converter
is simply set by an external resistor, RRT across RT pin of
LM3435 and VOUT of the converter. The flyback converter
under POT control can maintain a fairly constant switching
frequency that depends mainly on the value of RRT. The re-
lationship between the flyback converter switching frequency,
FSW and RRT is approximated by the following relationship:
RRT in and FSW in kHz
In order to set the flyback converter switching frequency,
FSW to 500kHz, the value of RRT can be calculated as in be-
low:
A standard resistor value of 499k can be used in place and
the period of switching, TSW is about 2µs.
SETTING THE NOMINAL LED CURRENT
The nominal LED current of the LEDs are set by resistors
connected to IREFR, IREFG and IREFB pins. The current for
each channel can be set individually and it is not mandatory
that all channel currents are the same. Just for simplicity, we
assume all channels are set to 1.5A in this example. The LED
current and the value of RIREFR, RIREFG and RIREFB is gov-
erned by the following equation.
RIREFx in and ILEDx in Ampere
The resistance value for the current setting resistors is cal-
culated as in below:
In order to achieve the required LED current accuracy, high
quality resistors with tolerance not higher than +/-1% are rec-
ommended.
INDUCTOR SELECTION
Selecting the correct inductor is one of the major task in ap-
plication design of a LED driver system. The most critical
inductor parameters are inductance, current rating, DC resis-
tance and size. As an rule of thumb, for same physical size
inductor, higher the inductance means higher the DC resis-
tance, consequently more power loss with the inductor and
lower the DC-DC conversion efficiency. With LM3435, the in-
ductor governs the inductor ripple current and limits the min-
imum LED current that can be supported. However for the
POT control in LM3435, a minimum inductor ripple current of
about 300mApk-pk is required for proper operation. The rela-
tionship of the ON-Duty, D and the input/output voltages can
be derived by applying the Volt-Second Balance equation
across the inductor. The waveforms of the inductor current
and voltage are shown in below.
30162547
Inductor Switching Waveforms
Applying the Volt-Second Balance equation with the inductor
voltage waveform,
Referring to the inductor current waveform, the average in-
ductor current, IL(AVG) can be derived as in below:
17 www.national.com
LM3435
The minimum LED current, ILED(MIN) happens when the in-
ductor current just entered the Critical Conduction Mode op-
eration, i.e. ILripple(MIN)=0.
Applying this condition to the last equation:
The relationship of the LED current, ILED and the average in-
ductor current, IL(AVG) is shown in below:
By combining last two equations, the minimum LED current,
ILED(MIN) can be calculated as in below:
By rearranging the terms, the inductance, L required for any
specific minimum LED current, ILED(MIN) can be found with the
equation in below:
From the equation, it can be noted that for lower minimum
LED current, the inductance required will be higher. As men-
tioned in before, higher the inductance means higher DC
resistance in same size inductor. Additionally, the POT con-
trol in LM3435, a minimum inductor ripple current is required
to maintain proper operation. The restrictions limit the lowest
current can be programed by I2C control.
In this example, the ILED(MIN)=600mA and the highest ripple
will happen when the input voltage is maximum, i.e. VIN=5.5V.
The ON Duty, D with average LED forward voltage of 3.5V is
calculated in below:
The required inductance for this case is:
A standard inductance value of 2.2µH is suggested and the
minimum LED current, ILED(MIN) is about 595mA @ VIN=5.5V.
Other than the inductance, the worst case inductor current,
IL(MAX) must be calculated so that an inductor with appropriate
saturation current level can be specified. The maximum in-
ductor current, IL(MAX) can be calculated with the equation in
below:
The highest inductor current occurs when the input voltage is
minimum, i.e. VIN=2.7V. The ON Duty, D for this condition can
be calculated as in below:
The maximum inductor current, IL(MAX) is calculated in below:
The calculated maximum inductor current is 4.1A, however
the inductance can drop as temperature rise. In order to ac-
commodate all possible variations, an inductor with saturation
current specification not less than 5A is suggested.
INPUT CAPACITORS SELECTION
Input capacitors are required for all supply input pins to ensure
that VIN does not drop excessively during high current switch-
ing transients. LM3435 have supply input pins located in
different sides of the device. Individual capacitors are needed
for the supply input pins locally. All capacitors must be placed
as close as possible to the supply input pins and have low
impedance return ground path to the device grounds and
back to supply ground. Capacitors CIN1 and CIN2 are the main
input capacitors and additionally, CIN3 is added to de-couple
high frequency interference. The capacitance for CIN1 and
CIN2 is recommended in the range of 22μF to 47µF and CIN3
is 0.1µF. Compact applications normally have stringent space
limitations, small size surface mount capacitors are usually
preferred. Low ESR Multi-Layer Ceramic Capacitors (MLCC)
are the best choices. MLCC capacitors with X5R and X7R
dielectrics are recommended for its low leakage and low ca-
pacitance variation against temperature and frequency.
OUTPUT CAPACITORS SELECTION
Two output capacitors are required with LM3435 configura-
tion, one for VOUT to Ground, COUT2 and one for de-coupling
the LED current ripple, COUT1. The LM3435 operates at fre-
quencies high enough to allow the use of MLCC capacitors
without compromising transient response. Low ESR charac-
teristic of the MLCC allow higher inductor ripple without sig-
nificant increase of the output ripple. The capacitance
recommended for COUT1 is 10µF and COUT2 is 22µF. Again,
high quality MLCC capacitors with X5R and X7R dielectrics
are recommended. For certain conditions, acoustic problem
may be encountered with using MLCC, Low Acoustic Noise
Type capacitors are strongly recommended for all output ca-
pacitors. Alternatively, the acoustic noise can also be lowered
by using smaller size capacitors in parallel to achieve the re-
quired capacitance.
OTHER CAPACITORS SELECTION
Three small startup capacitors connected to CG, CB and CR
pins are needed for proper operation. The suggested capac-
itance for CCR, CCG and CCB is 1nF. Also three capacitors
connected to GLED, BLED and RLED pins to protect the de-
vice from high transient stress due to the inductance of the
connecting wires for the LEDs. The suggested capacitance
www.national.com 18
LM3435
for CG, CB and CR is 0.47µH. MLCC capacitors with X5R and
X7R dielectrics are recommended. All capacitors must be
placed as close as possible to the device pins.
DIODE SELECTION
A schottky barrier diode is added across the SW and VOUT
pins, equivalently, its across the internal P-channel MOSFET
of the synchronous converter, that can help to improve the
conversion efficiency by few percents. A very low forward
voltage and 1A rated forward current part is suggested in the
schematic diagram. The key selection criteria are the forward
voltage and the rated forward current.
PCB LAYOUT CONSIDERATIONS
The performance of any switching converters depends as
much upon the layout of the PCB as the component selection.
PCB layout considerations are therefore critical for optimum
performance. The layout must be as neat and compact as
possible, and all external components must be as close as
possible to their associated pins. The PGND connection to
CIN and VOUT connection to COUT should be as short and
direct as possible with thick traces. The inductor should con-
nect close to the SW pin with short and thick trace to reduce
the potential electro-magnetic interference.
It is expected that the internal power elements of the LM3435
will produce certain amount of heat during normal operation,
good use of the PC board's ground plane can help consider-
ably to dissipate heat. The exposed pad on the bottom of the
IC package can be soldered to a copper pad with thermal vias
that can help to conduct the heat to the bottom side ground
plane. The bottom side ground plane should be as large as
possible.
Schematic of the Example
Application for Pico Projector
30162535
19 www.national.com
LM3435
Physical Dimensions inches (millimeters) unless otherwise noted
LLP-40 Pin Package (SQF)
For Ordering, Refer to Ordering Information Table
NS Package Number SQF40A
www.national.com 20
LM3435
Notes
21 www.national.com
LM3435
Notes
LM3435 Compact Sequential Mode RGB LED Driver with I2C Control Interface
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