IXD_614 14-Ampere Low-Side Ultrafast MOSFET Drivers Features Description * 14A Peak Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Low Propagation Delay Time: 30ns * Low, 10A Supply Current * Low Output Impedance The IXDD614 / IXDI614 / IXDN614 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each output can source and sink 14A of peak current while producing voltage rise and fall times of less than 30ns. Internal circuitry eliminates cross-conduction and current "shoot-through," and the driver is virtually immune to latch up. Low propagation delay and fast rise and fall times make the IXD_614 family ideal for high-frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver Pb RoHS 2002/95/EC e3 The IXDD614 is configured as a non-inverting driver with an enable. The IXDN614 is configured as a non-inverting driver, and the IXDI614 is configured as an inverting driver. The IXD_614 family is available in an 8-lead DIP (PI), an 8-lead DFN (D2), an 8-lead Power SOIC with an exposed metal back (SI), a 5-lead TO-220 (CI), and a 5-lead TO-263 (YI) package. Ordering Information Part Number IXDD614PI IXDD614D2TR IXDD614SI IXDD614SITR IXDD614CI IXDD614YI IXDI614PI IXDI614SI IXDI614SITR IXDI614CI IXDI614YI IXDN614PI IXDN614SI IXDN614SITR IXDN614CI IXDN614YI DS-IXD_614-R00H Logic Configuration IN OUT EN IN OUT IN OUT Package Type Packing Method Quantity 8-Lead DIP 8-Lead DFN 8-Lead Power SOIC with Exposed Metal Back 8-Lead Power SOIC with Exposed Metal Back 5-Lead TO-220 5-Lead TO-263 8-Lead DIP 8-Lead Power SOIC with Exposed Metal Back 8-Lead Power SOIC with Exposed Metal Back 5-Lead TO-220 5-Lead TO-263 8-Lead DIP 8-Lead Power SOIC with Exposed Metal Back 8-Lead Power SOIC with Exposed Metal Back 5-Lead TO-220 5-Lead TO-263 Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tube 50 2000 100 2000 50 50 50 100 2000 50 50 50 94 2000 50 50 PRELIMINARY 1 IXD_614 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40C to +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 5 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 IXDD614 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 IXDI614 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 IXDN614 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 3. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 R00H PRELIMINARY 2 IXD_614 1 Specifications 1.1 Lead Configurations 1.2 Lead Definitions IXDD614 D2 / PI / SI IXDD614 CI / YI Lead Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 EN 5 IXDI614 PI / SI VCC 1 8 VCC IN 2 7 OUT NC GND 3 4 IN Logic Input EN Output Enable - Drive lead low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI614 CI / YI 6 OUT 5 GND VCC 1 OUT 2 GND 3 IN 4 NC 5 NC IXDN614 PI / SI Description Not connected IXDN614 CI / YI VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 NC 5 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC All Other Leads - - 40 V -0.3 VCC+0.3 Output Current IOUT V - 14 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Unless stated otherwise, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R00H PRELIMINARY 3 IXD_614 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol Minimum Maximum Units VCC 4.5 35 V TA -40 +125 C 1.5 Electrical Characteristics: TA = 25C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 Input Current 0V < VIN < VCC IIN -10 - 10 EN Input Voltage, High IXDD614 only VENH 2/3VCC - - EN Input Voltage, Low IXDD614 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 0.4 1 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 0.3 1 IDC - - 4 tR - 30 40 Input Voltage Range Units V A V V Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V Fall Time CLOAD=15nF, VCC=18V tF - 20 30 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDLY - 52 70 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDLY - 53 70 Enable to Output-High Delay Time IXDD614 only tENOH - - 70 Disable to High Impedance State Delay Time IXDD614 only tDOLD - - 70 Enable Pull-Up Resistor IXDD614 only REN - 200 - k - 1 3 mA - - 10 - - 10 Output Current, Continuous VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC 4 PRELIMINARY ICC A ns A R00H IXD_614 1.6 Electrical Characteristics: TA = - 40C to +125C Test Conditions: 4.5V < VCC < 35V, TJ<150C. Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 0V < VIN < VCC IIN -10 - 10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - - 1.25 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - - 1.25 IDC - - 1 tR Input Voltage Range Input Current Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V - - 40 Fall Time CLOAD=15nF, VCC=18V tF - - 30 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDLY - - 75 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDLY - - 75 Enable to Output-High Delay Time IXDD614 only tENOH - - 75 Disable to High Impedance State Delay Time IXDD614 only tDOLD - - 75 - 1 3 - - 150 - - 150 Output Current, Continuous VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V ICC VCC=18V, VIN=VCC Units V A V A ns mA A 1.7 Thermal Characteristics Package Parameter Symbol Rating D2 (8-Lead DFN) 35 CI (5-Lead TO-220) 36 PI (8-Lead DIP) Thermal Resistance, Junction-to-Ambient JA 125 SI (8-Lead Power SOIC) 85 YI (5-Lead TO-263) 46 CI (5-Lead TO-220) 3 SI (8-Lead Power SOIC) Thermal Resistance, Junction-to-Case YI (5-Lead TO-263) R00H JC 10 Units C/W C/W 2 PRELIMINARY 5 IXD_614 2 Functional Description 2.1 IXDD614 Block Diagram & Truth Table 2.3 IXDN614 Block Diagram & Truth Table IXDD614 IXDN614 VCC VCC IN OUT OUT IN GND EN GND IN EN OUT 0 1 or open 0 IN OUT 1 1 or open 1 0 0 0 0 Z 1 1 1 0 Z 2.2 IXDI614 Block Diagram & Truth Table IXDI614 VCC OUT IN GND 6 IN OUT 0 1 1 0 PRELIMINARY R00H IXD_614 3 Performance Data Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) 60 CL=15nF CL=7.5nF CL=3.6nF 60 50 40 30 20 CL=15nF CL=7.5nF CL=3.6nF 40 30 20 10 10 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 5 10 15 20 25 30 Supply Voltage (V) Rise Time vs. Load Capacitance 80 50 40 30 40 35 30 25 15 10 10 4 6 8 10 12 Load Capacitance (nF) Propagation Delay vs. Supply Voltage (VIN=0-5V, f=1kHz, CL=15nF) tOFFDLY 150 tONDLY 50 14 16 2 4 6 8 10 12 Load Capacitance (nF) Propagation Delay vs. Input Voltage (VIN=0-5V, f=1kHz, CL=15nF, VCC=12V) 160 Propagation Delay (ns) Propagation Delay (ns) -40 -20 140 120 100 80 70 tOFFDLY 60 tONDLY 0 10 35 40 Min VIH 2.5 Max VIL 2.0 1.5 4 6 8 10 Input Voltage (V) 12 0 100 120 140 20 40 60 80 Temperature (C) 100 120 140 16 Propogation Delay vs. Junction Temperature (VIN=0-5V, f=1kHz, CL=15nF, VCC=18V) tOFFDLY 65 60 tONDLY 55 50 45 -40 -20 14 0 20 40 60 80 Temperature (C) 100 120 140 Enable Threshold vs. Supply Voltage 25 3.5 3.0 Min VIH 2.5 Max VIL 2.0 20 Min VENH 15 Max VENL 10 5 0 1.5 -40 -20 14 Input Threshold vs. Supply Voltage Enable Threshold (V) 3.0 R00H 2 Input Threshold vs. Temperature (CL=3.6nF, VCC=18V) 3.5 Input Threshold (V) 15 20 25 30 Supply Voltage (V) Enable Threshold (V) 5 20 40 60 80 Temperature (C) 40 40 0 0 5 2 100 tF 20 20 0 200 tR VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 45 Fall Time (ns) Rise Time (ns) 60 40 Rise & Fall Time vs. Temperature (VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V) Fall Time vs. Load Capacitance 50 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 70 35 Propagation Delay (ns) 0 250 15 14 13 12 11 10 9 8 7 6 5 50 Fall Time (ns) Rise Time (ns) 70 Time (ns) 80 Fall Time vs. Supply Voltage (VIN=0V-5V, f=10kHz, TA=25C) 0 5 10 15 20 25 30 Supply Voltage (V) PRELIMINARY 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 7 IXD_614 f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1000 Supply Current vs. Load Capacitance (VCC=18V) f=2MHz f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1 f=1kHz 1000 Supply Current (mA) Supply Current (mA) f=2MHz Supply Current (mA) 1000 Supply Current vs. Load Capacitance (VCC=35V) Supply Current vs. Load Capacitance (VCC=12V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz f=10kHz 1 f=1kHz f=1kHz 16 Supply Current vs. Load Capacitance (VCC=8V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz 1 f=10kHz f=1kHz 0.1 2 18 2 18 10 1 16 100 10 1 10 100 1000 Frequency (kHz) 1 10 100 1000 Frequency (kHz) 1 0.1 1.0 0.8 0.6 0.4 0.2 100 1000 Frequency (kHz) -40 -20 0 20 40 60 80 Temperature (C) 100 120 140 10000 3.5V 5V 10V 0V & 18V 1.0 0.5 0.0 -10 -15 -20 -25 -30 0 20 40 60 80 Temperature (C) 100 120 140 Output Sink Current vs. Supply Voltage (CL=330nF) 45 -5 40 35 30 25 20 15 10 5 0 -35 0.0 100 1000 Frequency (kHz) 1.5 -0.5 -40 -20 10000 Output Source Current vs. Supply Voltage (CL=330nF) 0 Output Source Current (A) 1.2 10 10 2.0 10 1 Dynamic Supply Current vs. Temperature (VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V) 1 Quiescent Supply Current vs. Temperature CL=15nF CL=7.5nF CL=3.6nF 100 10000 18 10 1 0.01 0.1 16 CL=15nF CL=7.5nF CL=3.6nF 100 10000 Supply Current vs. Frequency (VCC=8V) 1000 CL=15nF CL=7.5nF CL=3.6nF 6 8 10 12 14 Load Capacitance (nF) 0.1 1 18 Supply Current (mA) 6 8 10 12 14 Load Capacitance (nF) 4 Supply Current vs. Frequency (VCC=18V) 1000 CL=15nF CL=7.5nF CL=3.6nF 100 Supply Current (mA) Supply Current (mA) 4 Supply Current vs. Frequency (VCC=12V) 1000 Dynamic Current (mA) 16 0.1 2 8 6 8 10 12 14 Load Capacitance (nF) Supply Current vs. Frequency (VCC=35V) 1000 0.01 1.4 4 Supply Current (mA) 6 8 10 12 14 Load Capacitance (pF) Output Sink Current (A) Supply Current (mA) 4 Supply Current (mA) 2 1000 0.1 0.1 1 0 5 10 15 20 25 30 Supply Voltage (V) PRELIMINARY 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 R00H IXD_614 Output Source Current vs. Temperature (CL=330nF, VCC=18V) 24 Output Sink Current (A) Output Source Current (A) -10 -12 -14 -16 -18 -20 -22 0 20 40 60 80 Temperature (C) 22 21 20 19 18 17 100 120 140 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140 Low-State Output Resistance @ +10mA vs. Supply Voltage High-State Output Resistance @ -10mA vs. Supply Voltage 0.7 1.0 0.9 Output Resistance () Output Resistance () 23 16 -40 -20 0.8 0.7 0.6 0.5 0.4 0.6 0.5 0.4 0.3 0.2 0.1 0.3 0 R00H Output Sink Current vs. Temperature (CL=330nF, VCC=18V) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 PRELIMINARY 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IXD_614 4 Manufacturing Information 4.1 Mechanical Dimensions 4.1.1 IXD_614SI (8-Lead Power SOIC with Exposed Metal Back) 3.80 (0.150) 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 1.55 (0.061) 2.75 5.40 (0.209) (0.108) PIN 1 0.31 / 0.51 (0.012 / 0.020) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 1.27 BSC (0.05 BSC) 0.60 (0.024) 1.27 (0.050) 0 / 8 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.29 / 2.79 (0.090 / 0.110) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation BA. 3.30 / 3.81 (0.130 / 0.150) 4.1.2 IXD_614YI (5-Lead TO-263) 1.00 / 1.40 (0.039 / 0.055) 9.65 / 10.30 (0.380 / 0.406) 8.80 / 9.50 (0.346 / 0.374) 1 2 3 4 5 1.20 / 1.40 (0.047 / 0.055) 4.20 / 4.80 (0.165 / 0.189) 10.40 (0.409) 3.65 (0.144) 14.80 / 15.80 (0.583 / 0.622) 3.85 (0.152) 0.40 / 0.70 (0.016 / 0.028) 1.70 (0.067) 2.24 / 2.84 (0.088 / 0.112) 7.50 / 8.20 (0.295 / 0.323) 9.15 (0.360) 6.35 (0.250) 1.70 BSC (0.067 BSC) 0.60 / 0.99 (0.024 / 0.039) Recommended PCB Pattern 1.05 (0.041) Optional 0 - 3 6.60 / 7.20 (0.260 / 0.283) 6 1.20 / 1.70 (0.047 / 0.067) 10 DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 2.10 / 2.70 (0.083 / 0.106) NOTES: 1. All metal surfaces are solder solder-plated except trimmed area. 2. Short lead of No. 3 is optional to IXYS. 3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally. PRELIMINARY R00H IXD_614 4.1.3 IXD_614CI (5-Lead TO-220) 1.14 / 1.40 (0.045 / 0.055) 4.32 / 4.83 (0.170 / 0.190) 9.91 / 10.54 (0.390 / 0.415) Recommended Hole Pattern Finished Hole Diameter = 1.45mm (0.057 in.) 14.73 / 15.75 (0.580 / 0.620) 11.94 / 12.95 (0.470 / 0.510) 1.70mm (0.067 in.) 8.64 / 9.40 (0.340 / 0.370) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 25.27 / 26.54 (0.995 / 1.045) 1.70 BSC (0.067 BSC) 0.64 / 1.02 (0.025 / 0.040) NOTES: 1. This drawing will meet all dimensions requirement of JEDEC outlines TS-001AA and 5-lead version TO-220AB. 2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156) 0.38 / 0.64 (0.015 / 0.025) 2.29 / 2.92 (0.090 / 0.115) 4.1.4 IXDD614D2 (8-Lead DFN) 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.158 BSC) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177) 3.05 (0.120) 0.45 (0.018) 0.00 / 0.05 (0.000 / 0.002) 0.76 / 0.81 (0.030 / 0.032) 1.20 (0.047) 2.55 (0.100) Recommended PCB Land Pattern 3.04 / 3.09 (0.120 / 0.122) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) R00H Pin 8 Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.54 / 2.59 (0.100 / 0.102) PRELIMINARY 11 IXD_614 4.1.5 IXD_614PI (8-Lead DIP) 9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 6.10 / 6.86 (0.240 / 0.270) 7.62 BSC (0.300 BSC) 2.540 BSC (0.100 BSC) 0.38 / 1.02 (0.015 / 0.040) 7.37 / 8.26 (0.290 / 0.325) 3.05 / 3.81 (0.120 / 0.150) 7.62 / 10.92 (0.300 / 0.430) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100) 7.50 (0.295) 1.40 (0.055) PC Board Pattern 3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023) 3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_614-R00H (c)Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 8/24/2010 12 PRELIMINARY R00H