GT24C02A Advanced GT24C02A 2-WIRE 2K Bits Serial EEPROM Copyright (c) 2014 Giantec Semiconductor Inc. (Giantec). All rights reserved. Giantec reserves the right to make changes to this specification and its products at any time without notice. Giantec products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical equipment, aerospace or military, or other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for the best performance and optimization on the functionality and etc. Giantec assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for products. Giantec Semiconductor, Inc. C2 www.giantec-semi.com 1/26 GT24C02A Table of Contents 1. 2. 3. 4. Features ..................................................................................................................................................................................................... 3 General Description............................................................................................................................................................................. 3 Functional Block Diagram ................................................................................................................................................................ 4 Pin Configuration .................................................................................................................................................................................. 5 4.1 8-Pin SOIC, TSSOP, MSOP and PDIP ............................................................................................................................. 5 4.2 8-Lead UDFN and XDFN.................................................................................................................................................. 5 4.3 5-Pin SOT23 ..................................................................................................................................................................... 5 4.4 Pin Definition .................................................................................................................................................................... 5 4.5 Pin Descriptions................................................................................................................................................................ 6 5. Device Operation .................................................................................................................................................................................. 7 5.1 2-WIRE Bus ...................................................................................................................................................................... 7 5.2 The Bus Protocol .............................................................................................................................................................. 7 5.3 Start Condition .................................................................................................................................................................. 7 5.4 Stop Condition .................................................................................................................................................................. 7 5.5 Acknowledge .................................................................................................................................................................... 7 5.6 Reset ................................................................................................................................................................................ 7 5.7 Standby Mode................................................................................................................................................................... 7 5.8 Device Addressing ............................................................................................................................................................ 7 5.9 Write Operation ................................................................................................................................................................ 7 5.10 Read Operation .............................................................................................................................................................. 8 5.11 Diagrams ........................................................................................................................................................................ 9 5.12 Timing Diagrams........................................................................................................................................................... 12 6. Electrical Characteristics .............................................................................................................................................................. 13 6.1 Absolute Maximum Ratings ............................................................................................................................................ 13 6.2 Operating Range ............................................................................................................................................................ 13 6.3 Capacitance.................................................................................................................................................................... 13 6.4 DC Electrical Characteristic ............................................................................................................................................ 14 6.5 AC Electrical Characteristic ............................................................................................................................................ 15 7. Ordering Information ........................................................................................................................................................................ 16 8. Top Markings......................................................................................................................................................................................... 17 8.1 SOIC Package ................................................................................................................................................................ 17 8.2 TSSOP Package ............................................................................................................................................................ 17 8.3 UDFN Package............................................................................................................................................................... 17 8.4 MSOP Package .............................................................................................................................................................. 17 8.5 XDFN Package ............................................................................................................................................................... 18 8.6 PDIP Package ................................................................................................................................................................ 18 8.7 SOT23 Package ............................................................................................................................................................. 18 9. Package Information ......................................................................................................................................................................... 19 9.1 SOIC............................................................................................................................................................................... 19 9.2 TSSOP ........................................................................................................................................................................... 20 9.3 UDFN ............................................................................................................................................................................. 21 9.4 MSOP ............................................................................................................................................................................. 22 9.5 XDFN.............................................................................................................................................................................. 23 9.6 PDIP ............................................................................................................................................................................... 24 9.7 SOT23 .............................................................................................................................. Error! Bookmark not defined. 10. Revision History ................................................................................................................................................................................ 26 Giantec Semiconductor, Inc. C2 www.giantec-semi.com 2/26 GT24C02A 1. Features 2 - TM Two-Wire Serial Interface, I C Compatible Page write mode - Bi-directional data transfer protocol Partial page writes allowed Wide-voltage Operation Self timed write cycle: 5 ms (max.) - Noise immunity on inputs, besides Schmitt trigger High-reliability VCC = 1.7V to 5.5V Speed: 400 KHz (1.7V) and 1 MHz (2.5V~5.5V) Standby current (max.): 1 A, 1.7V Read current (max.): 0.5 mA, 5.5V Write current (max.): 0.5 mA, 5.5V ESD Protection > 4000V Hardware Data Protection Industrial grade - Packages: SOIC, TSSOP, UDFN, MSOP, XDFN, Write Protect Pin Sequential & Random Read Features Memory organization: 2Kb (256 x 8) Page Size: 16 bytes - - Endurance: 1 million cycles Data retention: 100 years PDIP and SOT23 Lead-free, RoHS, Halogen free, Green 2. General Description The GT24C02A is an industrial standard electrically function via WP pin to cease from overwriting the data erasable programmable read only memory (EEPROM) stored inside the memory array. device that utilizes the industrial standard 2-wire interface In order to refrain the state machine entering into a wrong for communications. The GT24C02A contains a memory state during power-up sequence or a power toggle off-on array of 2K bits (256x8), which is organized in 16-byte per condition, a power on reset circuit is embedded. During page. power-up, the device does not respond to any instructions The EEPROM operates in a wide voltage range from 1.7V until the supply voltage (VCC) has reached an acceptable to 5.5V, which fits most application. The product provides stable level above the reset threshold voltage. Once VCC low-power operations and low standby current. The device passes the power on reset threshold, the device is reset is offered in Lead-free, RoHS, halogen free or Green and enters into the Standby mode. This would also avoid package. The available package types are 8-pin SOIC, any inadvertent Write operations during power-up stage. TSSOP, UDFN, MSOP, XDFN, PDIP and SOT23. During power-down process, the device will enter into The GT24C02A is compatible to the standard 2-wire bus standby mode, once VCC drops below the power on reset protocol. The simple bus consists of Serial Clock (SCL) and threshold voltage. In addition, the device will be in standby Serial Data (SDA) signals. Utilizing such bus protocol, a mode after receiving the Stop command, provided that no Master device, such as a microcontroller, can usually internal write operation is in progress. Nevertheless, it is not control one or more Slave devices, alike this GT24C02A. recommended to send a command until the VCC reaches its The bit stream over the SDA line includes a series of bytes, operating level. which identifies a particular Slave device, an instruction, an address within that Slave device, and a series of data, if appropriate. The GT24C02A also has a Write Protect . Giantec Semiconductor, Inc. C2 www.giantec-semi.com 3/26 GT24C02A 3. Functional Block Diagram 8 SDA 5 SCL 6 WP 7 X DECODER VCC HIGH VOLTAGE GENERATOR TIMING & CONTROL CONTROL LOGIC SLAVE ADDRESS REGISTER & COMPARATOR A0 1 A1 2 A2 3 WORD ADDRESS COUNTER ACK Y DECODER CLOCK DI GND 4 nMOS Giantec Semiconductor, Inc. C2 EEPROM ARRAY DATA REGISTER DO www.giantec-semi.com 4/26 GT24C02A 4. Pin Configuration 4.1 8-Pin SOIC, TSSOP, MSOP and PDIP 4.2 8-Lead UDFN and XDFN Top View Top View A0 1 8 VCC A0 1 8 VCC A1 2 7 WP A1 2 7 WP A2 3 6 SCL A2 3 6 SCL GND 4 5 SDA GND 4 5 SDA 4.3 5-Pin SOT23 Top View SCL 1 GND 2 SDA 3 5 WP 4 VCC 4.4 Pin Definition Pin Name I/O A0 I Device Address Input A1 I Device Address Input A2 I Device Address Input GND - Ground SDA I/O SCL I Serial Clock Input WP I Write Protect Input VCC - Power Supply Giantec Semiconductor, Inc. C2 Definition Serial Address and Data input and Data out put www.giantec-semi.com 5/26 GT24C02A 4.5 Pin Descriptions SCL the inputs are defaulted to zero. This input clock pin is used to synchronize the data transfer WP to and from the device. WP is the Write Protect pin. While the WP pin is connected SDA to the power supply of GT24C02A, the entire array The SDA is a bi-directional pin used to transfer addresses becomes Write Protected (i.e. the device becomes Read and data into and out of the device. The SDA pin is an open only). When WP is tied to Ground or left floating, the normal drain output and can be wired with other open drain or open write operations are allowed. collector outputs. However, the SDA pin requires a pull-up VCC resistor connected to the power supply. Supply voltage A0, A1, A2 GND The A0, A1 and A2 are the device address inputs. Ground of supply voltage Typically, the A0, A1, and A2 pins are for hardware addressing and a total of 8 devices can be connected on a single bus system. When A0, A1, and A2 are left floating, Giantec Semiconductor, Inc. C2 www.giantec-semi.com 6/26 GT24C02A 5. Device Operation The GT24C02A serial interface supports communications 2 loss), or needs to be terminated mid-stream. The reset is using industrial standard 2-wire bus protocol, such as I C. initiated when the Master device creates a Start condition. 5.1 2-WIRE Bus To do this, it may be necessary for the Master device to The two-wire bus is defined as Serial Data (SDA), and monitor the SDA line while cycling the SCL up to nine times. Serial Clock (SCL). The protocol defines any device that (For each clock signal transition to High, the Master checks sends data onto the SDA bus as a transmitter, and the for a High level on SDA.) receiving devices as receivers. The bus is controlled by 5.7 Standby Mode Master device that generates the SCL, controls the bus While in standby mode, the power consumption is minimal. access, and generates the Start and Stop conditions. The The GT24C02A enters into standby mode during one of the GT24C02A is the Slave device. following conditions: a) After Power-up, while no Op-code is 5.2 The Bus Protocol sent; b) After the completion of an operation and followed Data transfer may be initiated only when the bus is not busy. by the Stop signal, provided that the previous operation is During a data transfer, the SDA line must remain stable not Write related; or c) After the completion of any internal whenever the SCL line is high. Any changes in the SDA line write operations. while the SCL line is high will be interpreted as a Start or 5.8 Device Addressing Stop condition. The Master begins a transmission on by sending a Start The state of the SDA line represents valid data after a Start condition, then sends the address of the particular Slave condition. The SDA line must be stable for the duration of devices to be communicated. The Slave device address is 8 the High period of the clock signal. The data on the SDA line bits format as shown in Figure. 5-5. may be changed during the Low period of the clock signal. The four most significant bits of the Slave address are fixed There is one clock pulse per bit of data. Each data transfer (1010) for GT24C02A. is initiated with a Start condition and terminated by a Stop The next three bits, A0, A1 and A2, of the Slave address are condition. specifically related to EEPROM. Up to eight GT24C02A 5.3 Start Condition units can be connected to the 2-wire bus. The Start condition precedes all commands to the device The last bit of the Slave address specifies whether a Read and is defined as a High to Low transition of SDA when SCL or Write operation is to be performed. When this bit is set to is High. The EEPROM monitors the SDA and SCL lines and 1, Read operation is selected. While it is set to 0, Write will not respond until the Start condition is met. operation is selected. 5.4 Stop Condition After the Master transmits the Start condition and Slave The Stop condition is defined as a Low to High transition of address byte appropriately, the associated 2-wire Slave SDA when SCL is High. All operations must end with a Stop device, GT24C02A, will respond with ACK on the SDA line. condition. Then GT24C02A will pull down the SDA on the ninth clock 5.5 Acknowledge cycle, signaling that it received the eight bits of data. After a successful data transfer, each receiving device is The GT24C02A then prepares for a Read or Write operation required to generate an ACK. The Acknowledging device by monitoring the bus. pulls down the SDA line. 5.9 Write Operation 5.6 Reset 5.9.1 Byte Write The GT24C02A contains a reset function in case the 2-wire In the Byte Write mode, the Master device sends the Start bus transmission on is accidentally interrupted (e.g. a power Giantec Semiconductor, Inc. C2 www.giantec-semi.com 7/26 GT24C02A condition and the Slave address information (with the R/W completed the Write operation, an ACK will be returned and set to Zero) to the Slave device. After the Slave generates the host can then proceed with the next Read or Write an ACK, the Master sends the byte address that is to be operation. written into the address pointer of the GT24C02A. After 5.10 Read Operation receiving another ACK from the Slave, the Master device Read operations are initiated in the same manner as Write transmits the data byte to be written into the address operations, except that the (R/W) bit of the Slave address is memory location. The GT24C02A acknowledges once more set to 1. There are three Read operation options: current and the Master generates the Stop condition, at which time address read, random address read and sequential read. the device begins its internal programming cycle. While this 5.10.1 Current Address Read internal cycle is in progress, the device will not respond to any request from the Master device. The GT24C02A contains an internal address counter which maintains the address of the last byte accessed, 5.9.2 Page Write incremented by one. For example, if the previous operation The GT24C02A is capable of 16-byte Page-Write operation. is either a Read or Write operation addressed to the A Page-Write is initiated in the same manner as a Byte address location n, the internal address counter would Write, but instead of terminating the internal Write cycle increment to address location n+1. When the EEPROM after the first data word is transferred, the Master device receives the Slave Addressing Byte with a Read operation can transmit up to 15 more bytes. After the receipt of each (R/W bit set to 1), it will respond an ACK and transmit the data word, the EEPROM responds immediately with an 8-bit data byte stored at address location n+1. The Master ACK on SDA line, and the four lower order data word should not acknowledge the transfer but should generate a address bits are internally incremented by one, while the Stop condition so the GT24C02A discontinues transmission. higher order bits of the data word address remain constant. If 'n' is the last byte of the memory, the data from location '0' If a byte address is incremented from the last byte of a page, will be transmitted. (Refer to Figure 5-8. Current Address it returns to the first byte of that page. If the Master device Read Diagram.) should transmit more than 16 bytes prior to issuing the Stop 5.10.2 Random Address Read condition, the address counter will roll over, and the previously written data will be overwritten. Once all 16 bytes are received and the Stop condition has been sent by the Master, the internal programming cycle begins. At this point, all received data is written to the GT24C02A in a single Write cycle. All inputs are disabled until completion of the internal Write cycle. Selective Read operations allow the Master device to select at random any memory location for a Read operation. The Master device first performs a 'dummy' Write operation by sending the Start condition, Slave address and byte address of the location it wishes to read. After the GT24C02A acknowledges the byte address, the Master device resends the Start condition and the Slave address, 5.9.3 Acknowledge (ACK) Polling this time with the R/W bit set to one. The EEPROM then The disabling of the inputs can be used to take advantage responds with its ACK and sends the data requested. The of the typical Write cycle time. Once the Stop condition is Master device does not send an ACK but will generate a issued to indicate the end of the host's Write operation, the Stop condition. (Refer to Figure 5-9. Random Address Read GT24C02A initiates the internal Write cycle. ACK polling Diagram.) can be initiated immediately. This involves issuing the Start 5.10.3 Sequential Read condition followed by the Slave address for a Write operation. If the EEPROM is still busy with the Write operation, no ACK will be returned. If the GT24C02A has Giantec Semiconductor, Inc. C2 Sequential Reads can be initiated as either a Current Address Read or Random Address Read. After the GT24C02A sends the initial byte sequence, the Master www.giantec-semi.com 8/26 GT24C02A device now responds with an ACK indicating it requires address n+1,n+2 ... etc. The address counter increments by additional data from the GT24C02A. The EEPROM one automatically, allowing the entire memory contents to continues to output data for each ACK received. The Master be serially read during sequential Read operation. When device terminates the sequential Read operation by pulling the memory address boundary of the array is reached, the SDA High (no ACK) indicating the last data word to be read, address counter rolls over to address 0, and the device followed by a Stop condition. The data output is sequential, continues to output data. (Refer to Figure 5-10. Sequential with the data from address n followed by the data from Read Diagram). 5.11 Diagrams Figure 5-1. Typical System Bus Configuration VCC SDA SCL Master Transmitter/Receiver GT24CXX Figure 5-2. Output Acknowledge SCL from Master 1 8 9 Data Output from Transmitter TAA Data Output from Receiver TDH ACK SDA Giantec Semiconductor, Inc. C2 STOP CONDITION SCL START CONDITION Figure 5-3. Start and Stop Conditions www.giantec-semi.com 9/26 GT24C02A Figure 5-4. Data Validity Protocol Data Change SCL Data Stable Data Stable SDA Figure 5-5. Slave Address Bit 7 6 5 4 3 2 1 0 1 0 1 0 A2 A1 A0 R/W Figure 5-6. Byte Write S T A R T Device Address SDA Bus Activity W R I T E Byte Address A C K M S B S T O P Data A C K A C K L S B R/W Figure 5-7. Page Write S T A R T W R I T E Byte Address(n) A A C C K K Device Address SDA Bus Activity M S B Data(n+1) A C K Data(n+15) A C K A C K L S B R/W Giantec Semiconductor, Inc. C2 Data(n) S T O P www.giantec-semi.com 10/26 GT24C02A Figure 5-8. Current Address Read S T A R T R E A D Device Address S T O P Data A C K SDA Bus Activity M S B L S B N O A C K R/W Figure 5-9. Random Address Read S T A R T Device Address SDA Bus Activity W R I T E Byte Address(n) A C K M S B S T A R T Device Address A C K R E A D S T O P Data n A C K N O L S B R/W A C K DUMMY WRITE Figure 5-10. Sequential Read Device Address SDA Bus Activity R E A D Data Byte n A C K Data Byte n+1 A C K S T O Data Byte n+x P Data Byte n+2 A C K A C K N O R/W Giantec Semiconductor, Inc. C2 A C K www.giantec-semi.com 11/26 GT24C02A 5.12 Timing Diagrams Figure 5-11. Bus Timing TR TF THIGH TLOW TSU:STO SCL TSU:STA THD:STA TSU:DAT THD:DAT TBUF SDAIN TAA TDH SDAOUT TSU:WP THD:WP WP Figure 5-12. Write Cycle Timing SCL SDA ACK Word n TWR STOP Condition Giantec Semiconductor, Inc. C2 START Condition www.giantec-semi.com 12/26 GT24C02A 6. Electrical Characteristics 6.1 Absolute Maximum Ratings Symbol Parameter Value Unit VS Supply Voltage -0.5 to + 6.5 V VP Voltage on Any Pin -0.5 to + 6.5 V TBIAS Temperature Under Bias -55 to +125 C TSTG Storage Temperature -65 to +150 C IOUT Output Current 5 mA Note: Stress greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 6.2 Operating Range Range Ambient Temperature (TA) VCC Industrial -40C to +85C 1.7V to 5.5V Note: Giantec offers Industrial grade for Commercial applications (0C to +70C). 6.3 Capacitance Symbol Parameter[1,2] Conditions Max. Unit CIN Input Capacitance VIN = 0V 6 pF CI/O Input / Output Capacitance VI/O = 0V 8 pF Notes: [1] Tested initially and after any design or process changes that may affect these parameters and not 100% tested. Test conditions: TA = 25C, f = 1 MHz, VCC = 5.0V [2] Giantec Semiconductor, Inc. C2 www.giantec-semi.com 13/26 GT24C02A 6.4 DC Electrical Characteristic Industrial: TA = -40C to +85C, VCC = 1.7V ~ 5.5V Symbol Parameter [1] VCC Test Conditions Min. Max. Unit 1.7 5.5 V VCC Supply Voltage VIH Input High Voltage 0.7*VCC VCC+1 V VIL Input Low Voltage -1 0.3* VCC V ILI Input Leakage Current 5V -- 2 A ILO Output Leakage Current 5V -- 2 A VIN = VCC max VOL1 Output Low Voltage 1.7V IOL = 0.15 mA -- 0.2 V VOL2 Output Low Voltage 2.5V IOL = 2.1 mA -- 0.4 V ISB1 Standby Current 1.7V VIN = VCC or GND 0.2 1 A ISB2 Standby Current 2.5V VIN = VCC or GND 0.3 1 A ISB3 Standby Current 5.5V VIN = VCC or GND 0.5 1 A 1.7V Read at 400 KHz -- 0.15 mA 2.5V Read at 1 MHz -- 0.2 mA 5.5V Read at 1 MHz -- 0.5 mA 1.7V Write at 400 KHz -- 0.3 mA 2.5V Write at 1 MHz -- 0.4 mA 5.5V Write at 1 MHz -- 0.5 mA ICC1 ICC2 Read Current Write Current Note: The parameters are characterized but not 100% tested. Giantec Semiconductor, Inc. C2 www.giantec-semi.com 14/26 GT24C02A 6.5 AC Electrical Characteristic Industrial: TA = -40C to +85C, Supply voltage = 1.7V to 5.5V Symbol Parameter [1] [2] 1.7VVCC<2.5V Min. Max. FSCL SCK Clock Frequency TLOW Clock Low Period 1200 -- THIGH Clock High Period 600 2.5VVCC5.5V Min. 400 Max. Unit 1000 KHz 400 -- ns -- 400 -- ns TR Rise Time (SCL and SDA) -- 300 -- 300 ns TF Fall Time (SCL and SDA) -- 300 -- 100 ns TSU:STA Start Condition Setup Time 500 -- 200 -- ns TSU:STO Stop Condition Setup Time 500 -- 200 -- ns THD:STA Start Condition Hold Time 500 -- 200 -- ns TSU:DAT Data In Setup Time 100 -- 40 -- ns THD:DAT Data In Hold Time 0 -- 0 -- ns 100 900 50 400 ns 100 -- 50 -- ns -- 5 -- 5 ms 1000 -- 400 -- ns TAA Clock to Output Access time (SCL Low to SDA Data Out Valid) TDH Data Out Hold Time (SCL Low to SDA Data Out Change) TWR Write Cycle Time TBUF Bus Free Time Before New Transmission TSU:WP WP pin Setup Time 1000 -- 400 THD:WP WP pin Hold Time 1200 -- 1200 -- ns -- 100 -- 50 ns T Notes: Noise Suppression Time [1] [2] The parameters are characterized but not 100% tested. AC measurement conditions: RL (connects to VCC): 1.3 k (2.5V, 5.0V), 10 k (1.7V) CL = 100 pF Input pulse voltages: 0.3*VCC to 0.7*VCC Input rise and fall times: 50 ns Timing reference voltages: half VCC level Giantec Semiconductor, Inc. C2 ns www.giantec-semi.com 15/26 GT24C02A 7. Ordering Information Industrial Grade: -40C to +85C, Lead-free Voltage Range Part Number* Package 1.7V to 5.5V GT24C02A-2GLI-TR 150-mil SOIC GT24C02A-2ZLI-TR 3 x 4.4 mm TSSOP GT24C02A-2UDLI-TR 2 x 3 x 0.55 mm UDFN GT24C02A-2SLI-TR 3 x 3 mm MSOP GT24C02A-2XDLI-TR 1.8 x 2.2 x 0.4 mm XDFN GT24C02A-2PLI 300mil PDIP GT24C02A-2TFLI-TR 2.9 x 1.6 mm SOT23 * 1. Contact Giantec Sales Representatives for availability and other package information. 2. The product is packed in tape and reel -TR (4K per reel), except UDFN is 5K per reel and SOT23 is 3K per reel. 3. Refer to Giantec website for related declaration document on lead free, RoHS, halogen free or Green, whichever is applicable. 4. Giantec offers Industrial grade for Commercial applications (0C to +70C). Giantec Semiconductor, Inc. C2 www.giantec-semi.com 16/26 GT24C02A 8. Top Markings 8.1 SOIC Package G: Giantec Logo 402A-2GLI: GT24C02A-2GLI-TR YWW: Date Code, Y=year, WW=week 8.2 TSSOP Package GT: Giantec Logo 402A-2ZLI: GT24C02A-2ZLI-TR YWW: Date Code, Y=year, WW=week 8.3 UDFN Package GT: Giantec Logo 41A: GT24C02A-2UDLI-TR YWW: Date Code, Y=year, WW=week 8.4 MSOP Package GT: Giantec Logo 402A2SU: GT24C02A-2SLI-TR YWW: Date Code, Y=year, WW=week Giantec Semiconductor, Inc. C2 www.giantec-semi.com 17/26 GT24C02A 8.5 XDFN Package GT: Giantec Logo 41A: GT24C02A-2XDLI YWW: Date Code, Y=year, WW=week 8.6 PDIP Package GT: Giantec Logo 2402A-2PLI: GT24C02A-2PLI YWW: Date Code, Y=year, WW=week 8.7 SOT23 Package 402A: GT24C02A-2TFLI-TR YW: Date Code, Y=year, W=week Giantec Semiconductor, Inc. C2 www.giantec-semi.com 18/26 GT24C02A 9. Package Information 9.1 SOIC 8L 150mil SOIC Package Outline Detail A D E E1 b ZD Detail A GAUGE PLANE A SEATING PLANE e SYMBOLS A1 DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES MIN NOM MAX MIN NOM MAX A 1.35 -- 1.75 0.053 -- 0.069 A1 0.10 -- 0.25 0.004 -- 0.010 b 0.33 -- 0.51 0.013 -- 0.020 D 4.80 -- 5.00 0.189 -- 0.197 Note: E 5.80 -- 6.20 0.228 -- 0.244 1. Controlling Dimension:MM E1 3.80 -- 4.00 0.150 -- 0.157 2. Dimension D and E1 do not include Mold protrusion 3. Dimension b does not include dambar protrusion/intrusion. 4. Refer to Jedec standard MS-012 5. Drawing is not to scale e L 1.27 BSC. 0.38 L1 -- 0.050 BSC. 1.27 0.015 0.25 BSC. ZD -- 0.050 0.010 BSC. 0.545 REF. 0 Giantec Semiconductor, Inc. C2 L L1 0.021 REF. 8 0 -- 8 www.giantec-semi.com 19/26 GT24C02A 9.2 TSSOP 8L 3x4.4mm TSSOP Package Outline D C e 8 L E E1 1 12(4X) A2 0.10mm b A1 A SYMBOLS A A1 A2 b c D E E1 e L DIMENSIONS IN MILLIMETERS MIN -0.05 0.80 0.19 0.09 2.90 4.30 0.45 0 Giantec Semiconductor, Inc. C2 Note: 1. Controlling Dimension:MM 2. Dimension D and E do not include Mold protrusion 3. Dimension b does not include dambar protrusion/intrusion. 4. Refer to Jedec standard MO-153 AA 5. Drawing is not to scale 6. Package may have exposed tie bar. NOM --1.00 --3.00 4.40 6.4 BSC 0.65 BSC 0.60 -- DIMENSIONS IN INCHES MAX 1.20 0.15 1.05 0.30 0.20 3.10 4.50 MIN -0.002 0.031 0.007 0.004 0.114 0.169 0.75 8 0.018 0 NOM --0.039 --0.118 0.173 0.252 BSC 0.026 BSC 0.024 -- MAX 0.047 0.006 0.041 0.012 0.008 0.122 0.177 0.030 8 www.giantec-semi.com 20/26 GT24C02A 9.3 UDFN 8L 2x3mm UDFN Package Outline D2 D e K E2 E PIN#1 IDENTIFICATION CHAMFER L b PIN#1 DOT BY MARKING BOTTOM VIEW TOP VIEW A A1 A2 SIDE VIEW SYMBOLS DIMENSIONS IN MILLIMETERS A A1 b A2 D D2 E E2 e K L MIN 0.50 0.00 0.18 1.25 1.15 0.40 0.20 NOM 0.55 -0.25 0.152 REF 2.00 BSC 1.40 3.00 BSC 1.30 0.50 BSC. -0.30 DIMENSIONS IN INCHES MAX 0.60 0.05 0.30 MIN 0.020 0.000 0.007 1.50 0.049 1.40 0.045 -0.40 0.016 0.008 NOM 0.022 -0.010 0.006 REF 0.079 BSC 0.055 0.118 BSC 0.051 0.020 BSC. -0.012 MAX 0.024 0.002 0.012 0.059 0.055 -0.016 Note: 1. Controlling Dimension:MM 2. Drawing is not to scale Giantec Semiconductor, Inc. C2 www.giantec-semi.com 21/26 GT24C02A 9.4 MSOP 8L 120mil MSOP package Outline D C e L E 12(4X) E1 A2 A A1 b SYMBOLS DIMENSIONS IN MILLIMETERS A A1 A2 b C D E E1 e L DIMENSIONS IN INCHES MIN NOM MAX MIN NOM MAX -0.05 0.75 0.25 0.13 2.90 2.90 --0.85 --3.00 3.00 4.90 BSC 0.65 BSC --- 1.10 0.15 0.95 0.40 0.23 3.10 3.10 -0.002 0.030 0.010 0.005 0.114 0.114 0.043 0.006 0.037 0.016 0.009 0.122 0.122 0.55 7 -0 --0.033 --0.118 0.118 0.193 BSC 0.026 BSC --- -0 0.022 7 Note: 1. Controlling Dimension:MM 2. Dimension D and E do not include Mold protrusion 3. Refer to Jedec standard MO187 4. Drawing is not to scale Giantec Semiconductor, Inc. C2 www.giantec-semi.com 22/26 GT24C02A 9.5 XDFN 8L 1.8x2.2mm XDFN Package Outline e1 e D L E1 E 0.10 PIN#1 ID 0.10 0.15 b D1 PIN#1 DOT BY MARKING TOP VIEW SYMBOLS A1 SIDE VIEW MIN NOM MAX DIMENSIONS IN INCHES MIN NOM MAX A -- -- 0.40 -- -- 0.016 0.00 -- 0.05 0.000 -- 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.70 1.80 1.90 0.067 0.071 0.075 E 2.10 2.20 2.30 0.083 0.087 0.091 D1 1.30BSC 0.05BSC E1 1.00BSC 0.04BSC e1 1.20REF 0.047REF e 0.40TYP 0.26 0.30 0.02TYP 0.35 0.010 0.012 0.014 Note: 1. Controlling Dimension:MM 2. Drawing is not to scale Giantec Semiconductor, Inc. C2 DIMENSIONS IN MILLIMETERS A1 L A BOTTOM VIEW www.giantec-semi.com 23/26 GT24C02A 9.6 PDIP 8L 300mil PDIP Package Outline D E E1 eB ZD A2 A1 A L Note: 1. Controlling Dimension:MM 2. Dimension D and E1 do not include Mold protrusion 3. Dimension b2 and b3 do not include dambar protrusion/instrusion 4. Drawing is not to scale b3 e SYMBOLS b DIMENSIONS IN MILLIMETERS A A1 A2 b b2 b3 D E E1 e eB L ZD Giantec Semiconductor, Inc. C2 MIN 3.60 0.38 3.25 0.36 1.40 0.81 9.01 7.49 6.20 8.12 3.18 NOM ---------2.54 BSC. --0.825 REF. DIMENSIONS IN INCHES MAX 4.20 0.75 3.45 0.56 1.65 1.17 9.53 8.26 6.60 MIN 0.142 0.015 0.128 0.014 0.055 0.032 0.355 0.295 0.244 9.65 3.80 0.320 0.125 NOM ---------0.100 BSC. --0.032 REF. MAX 0.165 0.030 0.136 0.022 0.065 0.046 0.375 0.325 0.260 0.380 0.150 www.giantec-semi.com 24/26 GT24C02A 9.7 SOT23 5L 2.9x1.6mm SOT23 D 0.25 b L E1 E c e e1 Note: 1. Dimension D and E1 do not include Mold protrusion 2. Dimension b does not include dambar protrusion/intrusion. A2 A 3. Refer to Jedec standard MO-193 AB 4. Drawing is not to scale A1 SYMBOLS DIMENSIONS IN MILLIMETERS MIN NOM MAX NOM MAX A -- -- 1.250 -- -- 0.049 A1 0.000 -- 0.150 0.000 -- 0.006 A2 1.000 1.100 1.200 0.039 0.043 0.047 b 0.360 -- 0.500 0.014 -- 0.020 c 0.140 -- 0.200 0.006 -- 0.008 D 2.826 2.926 3.026 0.111 0.115 0.119 E 2.600 2.800 3.000 0.102 0.110 0.118 E1 1.526 1.626 1.726 0.060 0.064 0.068 e 0.95(BSC) e1 0.037(BSC) 1.90(BSC) 0.075(BSC) L 0.350 0.450 0.600 0.014 0.018 0.024 0 -- 8 0 -- 8 Giantec Semiconductor, Inc. C2 DIMENSIONS IN INCHES MIN www.giantec-semi.com 25/26 GT24C02A 10. Revision History Revision Date Descriptions C0 Jan. 2014 Initial draft C1 Jun. 2016 Update table6.1 and table6.4 C2 May.2017 Change SOT23-5 package thickness from 0.9mm to 1.25mm Giantec Semiconductor, Inc. C2 www.giantec-semi.com 26/26