SURFACE MOUNT MULTILAYER CERAMIC Surface Mount (SMD) A GENERAL INFORMATION CMC Chips can be supplied with established reliability screening per MIL-C 55681, or high reliability screening upon request. Storage: Parts should be stored in an environment where humidity is less than 80% and not exposed to harmful gas such a chlorine or sulfurous gas which can effect solderability Parts should be used within 6 months after being opened or unpacked from original reel or bulk packaging. After being unpacked for more than 90 days, solderability should be checked before using. Part Number Example: CMC CERAMIC MONO CHIP 016 / DC Voltage 200 6R3 104 EIA STD. CODE IN P.F. K EIA TOL CODE X DIELECTRIC MATERIAL N = NPO X = X7R Z = Z5U Y = Y5V X5 = X5R 0603 CASE SIZE * T PKG CODE T = 7" Tape & Reel T13 = 13" Tape & Reel W = WAFFLE SIZE AND CAPACITANCE SPECIFICATIONS EIA: Length Width Thickness Endband Dimensions: Millimeters (Inches) 0201 0402 0603 0805 1206 1210 1812 1825 2225 0.60 .03 1.00 .10 1.60 .15 2.01 .20 3.2 .20 3.20 .20 4.5 .30 4.5 .30 5.72 .25 (.0236 .001) (040 .004) (.063 .006) (.079 .008) (.126 .008) (.126 .008) (.177 .012) (.177 .012) (.225 .010) 0.30 .03 .50 .10 .81 + .15 1.25 .20 1.60 .20 2.50 .20 3.20 .20 6.40 .40 6,35 .25 (.0118 .001) (020 .004) (.032 .006) (.049 .008) (.063 .008) (.098 .008) (.126 .008) (.252 .016) (.25 .010) 0.30 .03 .60 .90 1.4 1.78 2.70 3.05 2.30 2.30 (.0118 .001) (.024) (.035) (.068) (.068) (.106) (.106) (.O8) (.08) 0:15 .05 .25 .15 .35 .15 .50 + .25 .50 .25 :50 .25 .60 .35 .60 .35 .64 .39 (.006 .005) (.010 .006) (.014 .006) (.020 .10) (.020 .010) (.020 .010) (.024 .014) (.024 .014) (.025 .015) Capacitance Range EIA/TC WVDC NPO 200 100 50 25 16 X7R 100 50 25 16 10 6.3 X5R 25 16 10 6.3 Z5U 50 25 Y5V 50 25 16 10 6.3 34 TYPE CMC (pF-EIA) 0201 R50-33 390-101 150-102 152-222 332 470-103 - 0402 0R1-221 0R1-221 0R1-221 0R1-221 0R1-271 121-472 121-472 121-103 121-333 121-104 273-473 473-104 224-105 121-183 121-273 121-473 121-473 121-104 222-104 222-104 0603 0R1-561 0R1-102 0R1-102 0R1-222 0R1-222 121-223 121-393 121-104 121-104 121-224 563-104 124-105 274-225 474-475 121-683 121-104 121-154 121-154 121-225 222-225 222-225 0805 0R1-182 0R1-392 0R1-392 0R1-562 0R1-103 121-104 121-474 121-474 121-105 121-225 474-106 334-105 564-475 125-106 225-226 391-334 391-474 471-105 471-105 471-225 103-106 103-106 1206 0R5-562 0R5-103 0R5-123 0R5-123 0R5-153 121-184 121-474 121-225 121-335 121-475 474-106 105-106 225-106 335-226 335-476 561-105 561-125 681-225 681-106 681-106 103-226 103-226 1210 3R0-103 3R0-183 3R0-223 3R0-273 121-474 121-105 121-335 121-475 121-106 225-106 475-476 476 107 561-185 561-225 681-475 681-226 681-226 103-107 103-107 1812 150-123 150-183 150-333 150-393 471-564 471-824 471-105 471-125 106 226 226 107 272-395 272-475 332-475 332-565 332-106 332-476 103-107 TOL. 0.1pf .25pf .50pf 1.0% 2.0% 5% 10% 20% CODE B C D F G J K M Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com 1825 390-393 390-563 390-823 390-823 821-155 821-155 821-185 821-185 822-825 822-106 103-106 103-126 103-126 103-126 103-126 2225 390-473 390-683 390-104 390-104 821-155 821-185 821-185 821-225 821-225 476 822-106 822-126 103-126 103-156 103-186 103-186 103-107 -0 + 100% -20% - +80% P (GMV) Z SURFACE MOUNT MULTILAYER CERAMIC TYPE CMC Standard Termination 8mm 12mm Sizes Embossed Carrier 0201 0603-1210 1812-1825 Punched Carrier Punched Only 0402-0603 "Pieces/7"" Reel" 15,000 2000 (4000 low T) 1,000 "Pieces/13"" Reel" 10,000 4,000 RECOMMENDED PAD DIMENSIONS (inches) Chip Size 0201 0402 0504 0603 0805 1005 0907 1206 1505 1805 1210 1808 1812 1825* 2225* 3640* L 0.012 0.021 0.035 0.035 0.040 0.040 0.040 0.040 0.040 0.040 0.040 0.050 0.050 0.050 0.050 0.060 W 0.016 0.022 0.050 0.030 0.050 0.050 0.070 0.065 0.050 0.050 0.100 0.080 0.120 0.250 0.250 0.400 S 0.010 0.017 0.020 0.030 0.040 0.060 0.050 0.080 0.110 0.130 0.080 0.130 0.130 0.130 0.170 0.300 T 0.040 0.059 0.090 0.100 0.120 0.140 0.130 0.160 0.190 0.210 0.160 0.230 0.230 0.230 0.270 0.420 Surface Mount (SMD) TAPE & REEL QUANTITIES All tape and reel specifications are in compliance with RS481. A *These sizes are recommended for use with IR and vapor phase soldering only and with the use of stress relieving lead frames is recommended. Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com 35 SURFACE MOUNT MULTILAYER CERAMIC TYPE CMC NPO ceramics, Class I, offer one of the most stable capacitor dielectric available. Typical capacitance change with life is less than 0.1% for NPOs, one-fifth that shown by most other dielectrics. The NPO formulation usually has Qs (Quality Factor) in excess of 1000 and show little capacitance or Q changes with frequency. The inherent stability of these devices makes them ideally suited for use in precision applications such as oscillator, filtering and timing circuits. Surface Mount (SMD) Temperature Coefficient: Dissipation Factor: Insulation Resistance: Dielectric Strength: Testing Conditions: Capacitance Tolerance: Operating Temperature: 0 30 ppm / C from -55C to +125C >0.1% @ 25C 100,000 M min. or 1000 M xF whichever is less @WVDC, 25C 10,000 M min. or 100 M xF whichever is less @WVDC, 125C 2.5 times WVDC, 50 mA MAX. 1MHz 50KHz, @ 1.0 .20 Vrms @ 25C for values 100pF 1KHz 50Hz @ 1.0 .20 Vrms @ 25C for values >100pF Values < 10pF: B (0.1pF), C (0.25pF) and D (0.50pF) Values 10pF: F (1%), G (2%), J (5%) and K (10%) -55C to +125C A 36 Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com SURFACE MOUNT MULTILAYER CERAMIC TYPE CMC X7R ceramics, "Mid-K", Class II, are the most temperature-stable ceramics in their class. Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency. It also varies with time, approximately 2.5% C per decade. Dielectric Strength: Test Conditions: X7R: 15% C Max from -55C to +125C X5R15% C Max from -55C to +85C X7R: 2.5% @ 1KHz, 1.0 Vrms, 25C, Except 16V & 25V 3.5% Max X5R: 5% @ 1KHz, 1.0 Vrms, 25C 100,000 M min. or 1000M f whichever is less @WVDC, 25C 10,000 M min. or 100M f whichever is less @WVDC, 125C 2.5 times WVDC, 50 mA MAX. 1KHz 50 Hz, @ 1.0 .20 Vrms @ 25C Capacitance Tolerance: J (5%), K (10%), and M (20%) Operating Temperature: X7R: -55C to +125C X5R: -55C to +85C Temperature Coefficient: Dissipation Factor: Insulation Resistance: Surface Mount (SMD) These devices are suited for bypass and decoupling applications, filtering, frequency discrimination, DC blocking, and voltage suppression. A Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com 37 SURFACE MOUNT MULTILAYER CERAMIC TYPE CMC Z5U ceramics, "High-K", Class III, general purpose ceramics. They provide the highest capacitance possible in a given size. They show wide variation in capacitance under influence of environmental and electrical operating condition. Their aging rate is approximately 5% per decade. Despite their capacitance instability, Z5U are very popular because of low ESR, low ESL, and excellent frequency response. Typical applications are as bypass and decoupling with best performance being obtained at or near room temperature and low DC bias. Surface Mount (SMD) Temperature Coefficient: Dissipation Factor: Insulation Resistance: Dielectric Strength: Test Conditions: +22% to -56% C max from +10C to +85C 4.0% @ 1KHz, 0.5 Vrms, 25C 10,000 M min. or 100M f whichever is less @WVDC, 25C 2.5 times WVDC, 50 mA MAX. 1KHz 50 Hz @ 1.0 0.2 Vrms @ 25C Capacitance Tolerance: Operating Temperature: M (20%), P (-0 +100%), and Z (-20% to +80%) +10C to +85C A 38 Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com SURFACE MOUNT MULTILAYER CERAMIC TYPE CMC Temperature Coefficient: Dissipation Factor: Insulation Resistance: Dielectric Strength: Test Conditions: Capacitance Tolerance: Operating Temperature: + 22% - 82%, -30C to +85C .05 (5%) max, 25C 10K M min or 1000 M x f min. Whichever is less. 2.5 x WVDC min, 25C, 50 mA max. 1KHz 50Hz, @ 1.0 0.2 Vrms @ 25C Z (-20 to +80%) -30C to +85C Surface Mount (SMD) Y5V ceramics, Class III dielectric offer the highest capacitance values available. Ideally suited for bypass and decoupling applications where space is at a premium or as replacements for tantalum capacitors. Best performance is obtained at or near room temperature and at low DC bias conditions. Their aging rate is approximately 7% per decade. A Tecate Industries 858.513.2300 Fax 858.513.2345 Web Site: www.TecateGroup.com 39 TYPES CMC and CMT SURFACE MOUNT MULTILAYER CERAMIC RECOMMENDED IR REFLOW & WAVE SOLDER PROCEEDURES SHELF LIFE IN REGARDS TO SOLDERING Although multilayer ceramics chip capacitors have a long shelf life (up to 5 years if stored in original packaging) under ideal conditions, (25C & <40% RH) it is recommended that for best soldering results, to use the capacitors within one year. PREHEATING Multilayer ceramics chip MUST be preheated prior to being immersed in solder, to prevent thermal stress cracks. The temperature should be elevated at a maximum rate of 2C per second until the temperature of the capacitors reach 150C to 160C. (See fig. 1.0 &. 1.1) SOLDERING A mild rosin flux should be used and the soldering time should be 5 to 10 seconds for reflow and 3 seconds max for wave soldering. It is not recommended to extend the soldering time to more than 10 seconds (for reflow) to minimize the risk of thermal shock and thermal stress cracking. The soldering temperature should not exceed 250C. Be careful not too have too much solder on the connections. (See Fig. 2.0) Excessive solder can lead to stress cracks. These capacitors are rated for one soldering only. WARNING LARGER SIZE CHIPS (LARGER THAN SZ 1210) REQUIRE SPECIAL PRECAUTIONS DURING THE SOLDER PROCESS. THIS IS DUE TO DIFFERENCES IN THE COEFFICIENT OF THERMAL EXPANSION BETWEEN THE CHIP & SUBSTRATE MATERIALS. DO NOT EXCEED 4-C PER SECOND & 230C MAX. DO NOT WAVE SOLDER UNITS THAT ARE LARGER THAN SIZE 1210 COOLING When capacitors are removed from the solder, they should be allowed to cool naturally. Do not immerse in liquid or cool in a cooling chamber where the temperature would be less than 25C. Forced air should not be used if the rate of cooling exceeds 4C per second. CLEANING Most solvents can be used to remove any flux residue that may be present after soldering. Please refer to MIL-STD 202 or EIA-RS-198.