CMC-050/225KX2225TF - Tecate Group

Surface Mount (SMD)

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TOL. ±0.1pf ±.25pf ±.50pf ±1.0% ±2.0% ±5% ±10% ±20% -0 + 100% -20% - +80%

CODE B C D F G J K M P (GMV) Z

TYPE

SURFACE MOUNT

MULTILAYER CERAMIC

GENERAL INFORMATION

CMC Chips can be supplied with established reliability screening per

MIL-C 55681, or high reliability screening upon request.

Storage: Parts should be stored in an environment where humidity is

less than 80% and not exposed to harmful gas such a chlorine or

sulfurous gas which can effect solderability

Parts should be used within 6 months after being opened or unpacked

from original reel or bulk packaging. After being unpacked for more

than 90 days, solderability should be checked before using.

SIZE AND CAPACITANCE SPECIFICATIONS Dimensions: Millimeters (Inches)

CMC

CMC - 016 / 104 K X 0603 T

CERAMIC DC Voltage EIA EIA DIELECTRIC CASE PKG CODE

MONO 200 STD. CODE TOL MATERIAL SIZE T = 7" Tape & Reel

CHIP 6R3 IN P.F. CODE N = NPO *T13 = 13" Tape & Reel

X = X7R W = WAFFLE

Z = Z5U

Y = Y5V

X5 = X5R

Capacitance Range (pF-EIA)

EIA/TC WVDC 0201 0402 0603 0805 1206 1210 1812 1825 2225

NPO 200 - 0R1-221 0R1-561 0R1-182 0R5-562 3R0-103 150-123 390-393 390-473

100 - 0R1-221 0R1-102 0R1-392 0R5-103 3R0-183 150-183 390-563 390-683

50 - 0R1-221 0R1-102 0R1-392 0R5-123 3R0-223 150-333 390-823 390-104

25 R50-33 0R1-221 0R1-222 0R1-562 0R5-123 3R0-273 150-393 390-823 390-104

16 390-101 0R1-271 0R1-222 0R1-103 0R5-153 - - - -

X7R 100 - 121-472 121-223 121-104 121-184 121-474 471-564 821-155 821-155

50 - 121-472 121-393 121-474 121-474 121-105 471-824 821-155 821-185

25 150-102 121-103 121-104 121-474 121-225 121-335 471-105 821-185 821-185

16 152-222 121-333 121-104 121-105 121-335 121-475 471-125 821-185 821-225

10 332 121-104 121-224 121-225 121-475 121-106 - - 821-225

6.3 470-103 - - 474-106 474-106 - - - -

X5R 25 - - 563-104 334-105 105-106 225-106 106 - -

16 - 273-473 124-105 564-475 225-106 475-476 226 - -

10 - 473-104 274-225 125-106 335-226 476 226 - 476

6.3 - 224-105 474-475 225-226 335-476 107 107 - -

Z5U 50 - 121-183 121-683 391-334 561-105 561-185 272-395 822-825 822-106

25 - 121-273 121-104 391-474 561-125 561-225 272-475 822-106 822-126

Y5V 50 - 121-473 121-154 471-105 681-225 681-475 332-475 103-106 103-126

25 - 121-473 121-154 471-105 681-106 681-226 332-565 103-126 103-156

16 - 121-104 121-225 471-225 681-106 681-226 332-106 103-126 103-186

10 - 222-104 222-225 103-106 103-226 103-107 332-476 103-126 103-186

6.3 - 222-104 222-225 103-106 103-226 103-107 103-107 103-126 103-107

EIA: 0201 0402 0603 0805 1206 1210 1812 1825 2225

Length 0.60 ± .03 1.00 ± .10 1.60 ± .15 2.01 ± .20 3.2 ± .20 3.20 ± .20 4.5 ± .30 4.5 ± .30 5.72 ± .25

(.0236 ± .001) (040 ± .004) (.063 ± .006) (.079 ± .008) (.126 ± .008) (.126 ± .008) (.177 ± .012) (.177 ± .012) (.225 ± .010)

Width 0.30 ± .03 .50 ±.10 .81 + .15 1.25 ± .20 1.60 ±.20 2.50 ± .20 3.20 ±.20 6.40 ±.40 6,35 ±.25

(.0118 ± .001) (020 ± .004) (.032 ± .006) (.049 ± .008) (.063 ± .008) (.098 ± .008) (.126 ± .008) (.252 ± .016) (.25 ± .010)

Thickness 0.30 ± .03 .60 .90 1.4 1.78 2.70 3.05 2.30 2.30

(.0118 ± .001) (.024) (.035) (.068) (.068) (.106) (.106) (.O8) (.08)

Endband 0:15 ± .05 .25 ± .15 .35 ± .15 .50 + .25 .50 ± .25 :50 ± .25 .60 ± .35 .60 ± .35 .64 ± .39

(.006 ± .005) (.010 ± .006) (.014 ± .006) (.020 ± .10) (.020 ± .010) (.020 ± .010) (.024 ± .014) (.024 ± .014) (.025 ± .015)

Part Number Example:

Surface Mount (SMD)

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TYPE CMC

SURFACE MOUNT

MULTILAYER CERAMIC

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with

RS481.

RECOMMENDED PAD DIMENSIONS (inches)

Chip Size L W S T

0201 0.012 0.016 0.010 0.040

0402 0.021 0.022 0.017 0.059

0504 0.035 0.050 0.020 0.090

0603 0.035 0.030 0.030 0.100

0805 0.040 0.050 0.040 0.120

1005 0.040 0.050 0.060 0.140

0907 0.040 0.070 0.050 0.130

1206 0.040 0.065 0.080 0.160

1505 0.040 0.050 0.110 0.190

1805 0.040 0.050 0.130 0.210

1210 0.040 0.100 0.080 0.160

1808 0.050 0.080 0.130 0.230

1812 0.050 0.120 0.130 0.230

1825* 0.050 0.250 0.130 0.230

2225* 0.050 0.250 0.170 0.270

3640* 0.060 0.400 0.300 0.420

*These sizes are recommended for use with IR and vapor phase soldering only

and with the use of stress relieving lead frames is recommended.

Sizes Standard Termination

8mm 12mm

Embossed Carrier

Punched Carrier 0201 0603-1210 1812-1825

Punched Only - 0402-0603 -

“Pieces/7”” Reel” 15,000 2000 (4000 low T) 1,000

“Pieces/13”” Reel” - 10,000 4,000

Surface Mount (SMD)

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TYPE CMC

NPO ceramics, Class I, offer one of the most stable capacitor dielectric available. Typical capacitance change with

life is less than ±0.1% for NPOs, one-fifth that shown by most other dielectrics.

The NPO formulation usually has Qs (Quality Factor) in excess of 1000 and show little capacitance or Q changes

with frequency.

The inherent stability of these devices makes them ideally suited for use in precision applications such as oscillator,

filtering and timing circuits.

Temperature Coefficient: 0 ±30 ppm / °C from -55°C to +125°C

Dissipation Factor: >0.1% @ 25°C

Insulation Resistance: 100,000 MΩmin. or 1000 MΩxF whichever is less @WVDC, 25°C

10,000 MΩmin. or 100 MΩxF whichever is less @WVDC, 125°C

Dielectric Strength: 2.5 times WVDC, 50 mA MAX.

Testing Conditions: 1MHz ±50KHz, @ 1.0 ± .20 Vrms @ 25°C for values ≤100pF

1KHz ±50Hz @ 1.0 ± .20 Vrms @ 25°C for values >100pF

Capacitance Tolerance: Values < 10pF: B (±0.1pF), C (±0.25pF) and D (±0.50pF)

Values ≥10pF: F (±1%), G (±2%), J (±5%) and K (±10%)

Operating Temperature: -55°C to +125°C

SURFACE MOUNT

MULTILAYER CERAMIC

Surface Mount (SMD)

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TYPE CMC

X7R ceramics, “Mid-K”, Class II, are the most temperature-stable ceramics in their class. Capacitance for X7R

varies under the influence of electrical operating conditions such as voltage and frequency. It also varies with time,

approximately 2.5% ∆C per decade.

These devices are suited for bypass and decoupling applications, filtering, frequency discrimination, DC blocking,

and voltage suppression.

Temperature Coefficient: X7R: ±15% ∆°C Max from -55°C to +125°C

X5R±15% ∆°C Max from -55°C to +85°C

Dissipation Factor: X7R: ≤2.5% @ 1KHz, 1.0 Vrms, 25°C, Except 16V & 25V ≤3.5% Max

X5R: ≤5% @ 1KHz, 1.0 Vrms, 25°C

Insulation Resistance: 100,000 MΩmin. or 1000MΩµf whichever is less @WVDC, 25°C

10,000 MΩmin. or 100MΩµf whichever is less @WVDC, 125°C

Dielectric Strength: 2.5 times WVDC, 50 mA MAX.

Test Conditions: 1KHz ±50 Hz, @ 1.0 ± .20 Vrms @ 25°C

Capacitance Tolerance: J (±5%), K (±10%), and M (±20%)

Operating Temperature: X7R: -55°C to +125°C

X5R: -55°C to +85°C

SURFACE MOUNT

MULTILAYER CERAMIC

Surface Mount (SMD)

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TYPE CMC

Z5U ceramics, “High-K”, Class III, general purpose ceramics. They provide the highest capacitance possible in a

given size. They show wide variation in capacitance under influence of environmental and electrical operating

condition. Their aging rate is approximately 5% per decade.

Despite their capacitance instability, Z5U are very popular because of low ESR, low ESL, and excellent frequency

response.

Typical applications are as bypass and decoupling with best performance being obtained at or near room

temperature and low DC bias.

Temperature Coefficient: +22% to -56% ∆°C max from +10°C to +85°C

Dissipation Factor: 4.0% @ 1KHz, 0.5 Vrms, 25°C

Insulation Resistance: 10,000 MΩmin. or 100MΩµf whichever is less @WVDC, 25°C

Dielectric Strength: 2.5 times WVDC, 50 mA MAX.

Test Conditions: 1KHz ± 50 Hz @ 1.0 ± 0.2 Vrms @ 25°C

Capacitance Tolerance: M (±20%), P (-0 +100%), and Z (-20% to +80%)

Operating Temperature: +10°C to +85°C

SURFACE MOUNT

MULTILAYER CERAMIC

Surface Mount (SMD)

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TYPE CMC

Y5V ceramics, Class III dielectric offer the highest capacitance values available. Ideally suited for bypass and

decoupling applications where space is at a premium or as replacements for tantalum capacitors. Best performance

is obtained at or near room temperature and at low DC bias conditions. Their aging rate is approximately 7% per

decade.

Temperature Coefficient: + 22% - 82%, -30°C to +85°C

Dissipation Factor: .05 (5%) max, 25°C

Insulation Resistance: 10K MΩ min or 1000 MΩx µf min. Whichever is less.

Dielectric Strength: 2.5 x WVDC min, 25°C, 50 mA max.

Test Conditions: 1KHz ±50Hz, @ 1.0 ± 0.2 Vrms @ 25°C

Capacitance Tolerance: Z (-20 to +80%)

Operating Temperature: -30°C to +85°C

SURFACE MOUNT

MULTILAYER CERAMIC

SURFACE MOUNT

MULTILAYER CERAMIC TYPES CMC and CMT

SHELF LIFE IN REGARDS TO SOLDERING

Although multilayer ceramics chip capacitors have a long shelf

life (up to 5 years if stored in original packaging)

under ideal conditions, (25°C & <40% RH) it is recommended

that for best soldering results, to use the capacitors within one

year.

PREHEATING

Multilayer ceramics chip MUST be preheated prior to being

immersed in solder, to prevent thermal stress cracks. The

temperature should be elevated at a maximum rate of 2°C per

second until the temperature of the capacitors reach 150°C to

160°C.

(See fig. 1.0 &. 1.1)

SOLDERING

A mild rosin flux should be used and the soldering time should

be 5 to 10 seconds for reflow and 3 seconds max for wave

soldering. It is not recommended to extend the soldering time

to more than 10 seconds (for reflow) to minimize the risk of

thermal shock and thermal stress cracking. The soldering

temperature should not exceed 250°C. Be careful not too have

too much solder on the connections.

(See Fig. 2.0)

Excessive solder can lead to stress cracks.

These capacitors are rated for one soldering only.

WARNING

LARGER SIZE CHIPS (LARGER THAN SZ 1210) REQUIRE

SPECIAL PRECAUTIONS DURING THE SOLDER PROCESS.

THIS IS DUE TO DIFFERENCES IN THE COEFFICIENT OF

THERMAL EXPANSION BETWEEN THE CHIP &

SUBSTRATE MATERIALS. DO NOT EXCEED 4-C PER

SECOND & 230°C MAX.

DO NOT WAVE SOLDER UNITS THAT ARE LARGER

THAN SIZE 1210

COOLING

When capacitors are removed from the solder, they

should be allowed to cool naturally. Do not immerse

in liquid or cool in a cooling chamber where the

temperature would be less than 25°C. Forced air

should not be used if the rate of cooling exceeds 4°C

per second.

CLEANING

Most solvents can be used to remove any flux

residue that may be present after soldering. Please

refer to MIL-STD 202 or EIA-RS-198.

RECOMMENDED IR REFLOW & WAVE SOLDER PROCEEDURES