© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 26
1Publication Order Number:
MC33269/D
MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
Features
•3.3 V, 5.0 V, 12 V and Adjustable Versions
2.85 V version available as MC34268
•Space Saving DPAK, SO−8 and SOT−223 Power Packages
•1.0 V Dropout
•Output Current in Excess of 800 mA
•Thermal Protection
•Short Circuit Protection
•Output Trimmed to 1.0% Tolerance
•Pb−Free Packages are Available
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269D−5.0
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
*NCV prefix is for automotive and other applications requiring site and change
control.
TO−220AB
T SUFFIX
CASE 221AB
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
1
8
7
6
5
1
2
3
4
GND/Adj
SO−8
D SUFFIX
CASE 751
DPAK
DT SUFFIX
CASE 369C
Vin
NC
NC
1. GND/Adj
2. Vout
3. Vin
1
(Top View)
Vout Vout
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
SOT−223
ST SUFFIX
CASE 318E
8
23
(Top View)
1
3
1
3
(Top View)
123
123123
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
See general marking information in the device marking
section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
1. GND/Adj
2. Vout
3. Vin
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MC33269, NCV33269
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Input Voltage Vin 20 V
Power Dissipation
Case 369C (DPAK) TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
Internally Limited
92
6.0
W
°C/W
°C/W
Case 751 (SO−8) TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
Internally Limited
160
25
W
°C/W
°C/W
Case 221A (TO−220) TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
Internally Limited
65
5.0
W
°C/W
°C/W
Case 318E (SOT−223) TA = 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
Internally Limited
156
15
W
°C/W
°C/W
Operating Die Junction Temperature Range TJ−40 to +150 °C
Operating Ambient Temperature Range MC33269
NCV33269
TA−40 to +125
−40 to +125
°C
Storage Temperature Tstg −55 to +150 °C
Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM)
Machine Model (MM)
ESD 4000
400
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (CO = 10 mF, TA = 25°C, for min/max values TA = −40°C to +125°C, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Output Voltage (Iout = 10 mA, TA = 25°C)
3.3 Suffix (VCC = 5.3 V)
5.0 Suffix (VCC = 7.0 V)
12 Suffix (VCC = 14 V)
VO3.27
4.95
11.88
3.3
5.0
12
3.33
5.05
12.12
V
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA)
(1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA)
3.3 Suffix
5.0 Suffix
12 Suffix
VO
3.23
4.9
11.76
3.3
5.0
12
3.37
5.1
12.24
V
Reference Voltage for Adjustable Voltage
(Iout = 10 mA, Vin − Vout = 2.0 V, TA = 25°C)
Vref 1.235 1.25 1.265 V
Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage
(1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA)
(1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA)
Vref 1.225 1.25 1.275 V
Line Regulation (Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25°C) Regline − − 0.3 %
Load Regulation (Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25°C) Regload − − 0.5 %
Dropout Voltage (Iout = 500 mA)
(Iout = 800 mA)
Vin −Vout −
−
1.0
1.1
1.25
1.35
V
Ripple Rejection (10 Vpp, 120 Hz Sinewave; Iout = 500 mA) RR 55 − − dB
Current Limit (Vin − Vout = 10 V) ILimit 800 − − mA
Quiescent Current (Fixed Output) (1.5 V ≤ Vout ≤ 3.3 V)
(5 V ≤ Vout ≤ 12 V)
IQ−
−
5.5
−
8.0
20
mA
Minimum Required Load Current Fixed Output Voltage
Adjustable Voltage
ILoad −
8.0
−
−
0
−
mA
Adjustment Pin Current IAdj − − 120 mA
1. The MC33269−12, Vin − Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin.
MC33269, NCV33269
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3
Vin
Vout
VAdj Gnd
Trim Links
This device contains 38 active transistors.
Figure 1. Internal Schematic
MC33269, NCV33269
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4
IO, OUTPUT LOAD CURRENT (mA)
in
Vout
-V
Figure 2. Dropout Voltage versus
Output Load Current
1.5
1.3
1.1
0.9
0.7
0.5 0 200 400 600 800 1000
Figure 3. Transient Load Regulation
, DROPOUT VOLTAGE (V)
20 ms/DIV
Cin = 10 mF
CO = 10 mF Tantalum
Vin = VO + 3.0 V
Preload = 0.1 A
0 A
0.5 A
100
, OUTPUTIOVO, OUTPUTΔ
VOLTAGE DEVIATIONCURRENT
TA = 25°CTA = -40°C
TA = 125°C
mV/Div
-55
900
-25 0 25 50 75 100 125
940
980
1020
1060
1100
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
V
TA, AMBIENT TEMPERATURE (°C)
IO = 800 mA
, OVERVOLTAGE INPUT THRESHOLD (%V )
FB(OV) FB
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
02.0 4.0 6.0 8.0 10 12 14 16
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
TA = 25°C
MC33269D-XX
L = 25 mm Copper
OUTPUT CURRENT (A)
70
0.1 1.0 10 100
60
50
40
30
20
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
RR, RIPPLE REJECTION RATIO (dB)
f, FREQUENCY (kHz)
20
30
40
50
60
70
RR, RIPPLE REJECTION RATIO (dB)
100101.0
f, FREQUENCY (kHz)
Vin = 8.0 V
Vout = 5.0 V
IL = 800 mA
CAdj = 22 mF
TA = 25°C
0.1
Vin = VO + 3.0 V
IL = 800 mA
TA = 25°C
VO = 12 V
VO = 3.3 V or 5.0 V
MC33269, NCV33269
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5
ÏÏÏ
ÏÏÏ
ÏÏÏ
R , THERMAL RESISTANCE
JAθ
JUNCTION‐TO‐AIR ( C/W)°
40
80
120
160
200
240
280
0.35
0.42
0.50
0.63
0.83
1.25
2.50
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
Minimum
Size Pad
PD
L
L
, MAXIMUM POWER DISSIPATION (W)
Free Air
Mounted
Vertically
RqJA
2.0 oz. Copper
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R , THERMAL RESISTANCE,
JAθJUNCTION-TO-AIR ( C/W)°
RqJA
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
2.0 oz.
Copper
Graph represents symmetrical layout
3.0 mmL
L
PD(max) for TA = 50°C
30
50
70
90
110
130
150
170
L, LENGTH OF COPPER (mm)
02030504010
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
R , THERMAL RESISTANCE,
JAθJUNCTION-TO-AIR ( C/W)°
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
L
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
2.0 oz. Copper
RqJA
Minimum
Size Pad
Free Air
Mounted
Vertically
PD(max) for TA = 50°C
L
40
50
60
70
80
90
100
010203025155.0
L, LENGTH OF COPPER (mm)
0
0.4
0.8
1.2
1.6
2.0
2.4
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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6
APPLICATIONS INFORMATION
Figures 11 through 15 are typical application circuits. The
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 mF with an
equivalent series resistance (ESR) of less than 10 W but
greater than 0.2 W over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170°C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat−sinking.
Figure 11. Typical Fixed Output Application
MC33269-XX
Vin Vout
GND
Co
10 mF
An input capacitor is not necessary for stability, however
it will improve the overall performance.
Figure 12. Typical Adjustable Output Application
MC33269
Vin Vout
Adj Co
10 mF
CAdj***
R1
R2
***CAdj is optional, however it will improve the ripple rejection.
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
Figure 13. Current Regulator
MC33269
Vin Iout
Adj
RS
Iout+
Figure 14. Battery Backed−Up Power Supply
MC33269-XX
Vin Vout
MC33269-XX
GND
Co
10 mF
Figure 15. Digitally Controlled Voltage Regulator
MC33269
Vin Vout
Adj
Co
10 mF
R1
R2
R2 sets the maximum output voltage. Each transistor
reduces the output voltage when turned on.
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
Vout+1.25ǒ1)R2
R1Ǔ)I
AdjR2
1.25
RS
Cin
Cin
Cin Co
10 mF
Cin
Cin
GND Cin
**
**
**
**
**
**
*
*
*
*
*
MC33269, NCV33269
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7
ORDERING INFORMATION
Device Package Shipping Information†
MC33269D SO−8
98 Units / Rail
MC33269DG SO−8
(Pb−Free)
MC33269DR2 SO−8
2500 Units / Tape & Reel
MC33269DR2G SO−8
(Pb−Free)
MC33269DT DPAK
75 Units / Rail
MC33269DTG DPAK
(Pb−Free)
MC33269DTRK DPAK
2500 Units / Tape & Reel
MC33269DTRKG DPAK
(Pb−Free)
MC33269T TO−220
50 Units / Rail
MC33269TG TO−220
(Pb−Free)
MC33269D−3.3 SO−8
98 Units / Rail
MC33269D−3.3G SO−8
(Pb−Free)
MC33269DR2−3.3 SO−8
2500 Units / Tape & Reel
MC33269DR2−3.3G SO−8
(Pb−Free)
MC33269DT−3.3 DPAK
75 Units / Rail
MC33269DT−3.3G DPAK
(Pb−Free)
MC33269DTRK−3.3 DPAK
2500 Units / Tape & Reel
MC33269DTRK−3.3G DPAK
(Pb−Free)
MC33269ST−3.3T3 SOT−223
4000 Units / Tape & Reel
MC33269ST−3.3T3G SOT−223
(Pb−Free)
MC33269T−3.3 TO−220
50 Units / Rail
MC33269T−3.3G TO−220
(Pb−Free)
MC33269D−5.0 SO−8
98 Units / Rail
MC33269D−5.0G SO−8
(Pb−Free)
MC33269DR2−5.0 SO−8
2500 Units / Tape & Reel
MC33269DR2−5.0G SO−8
(Pb−Free)
MC33269DT−5.0 DPAK
75 Units / Rail
MC33269DT−5.0G DPAK
(Pb−Free)
NCV33269DT−5.0G* DPAK
(Pb−Free)
MC33269DTRK−5.0 DPAK
2500 Units / Tape & Reel
MC33269DTRK−5.0G DPAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV prefix is for automotive and other applications requiring site and control changes.
MC33269, NCV33269
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8
ORDERING INFORMATION (continued)
Device Package Shipping Information†
MC33269T−5.0 TO−220
50 Units / Rail
MC33269T−5.0G TO−220
(Pb−Free)
MC33269D−012 SO−8
98 Units / Rail
MC33269D−012G SO−8
(Pb−Free)
MC33269DR2−012 SO−8
2500 Units / Tape & Reel
MC33269DR2−012G SO−8
(Pb−Free)
MC33269DT−012 DPAK
75 Units / Rail
MC33269DT−012G DPAK
(Pb−Free)
MC33269DTRK−012 DPAK
2500 Units / Tape & Reel
MC33269DTRK−012G DPAK
(Pb−Free)
MC33269T−012 TO−220
50 Units / Rail
MC33269T−012G TO−220
(Pb−Free)
NCV33269DR2G* SO−8
(Pb−Free)
2500 Units / Tape & Reel
NCV33269DTRK* DPAK
NCV33269DTRKG* DPAK
(Pb−Free)
NCV33269DTRK−3.3* DPAK
NCV33269DTRK3.3G* DPAK
(Pb−Free)
NCV33269DTRK−5.0* DPAK
NCV33269DTRK5.0G* DPAK
(Pb−Free)
NCV33269DTRK−012* DPAK
NCV33269DTRK−12G* DPAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV prefix is for automotive and other applications requiring site and control changes.
MC33269, NCV33269
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9
SO−8
D SUFFIX
CASE 751
269AJ
ALYW
G
1
8
1
8
269−3
ALYW
G
1
8
69−12
ALYW
G
269−5
ALYW
G
1
8
MARKING DIAGRAMS
1
2
3
269AJG
ALYWW
1
2
3
69−12G
ALYWW
1
2
3
269−3G
ALYWW
1
2
3
269−5G
ALYWW
DPAK
DT SUFFIX
CASE 369C
TO−220AB
T SUFFIX
CASE 221A
MC
33269T
AWLYWWG
MC
33269T−12
AWLYWWG
MC
33269T−33
AWLYWWG
MC
33269T−5
AWLYWWG
SOT−223
ST SUFFIX
CASE 318E
1
AYW
2693 G
G
23
A = Assembly Location
L, WL = Wafer Lot
Y = Year
W, WW = Work Week
G = Pb−Free Package
G= Pb−Free Package
(Note: Microdot may be in either location)
132132132132
MC33269, NCV33269
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10
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33269, NCV33269
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11
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C−01
ISSUE D
b
D
E
b3
L3
L4
b2
eM
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
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12
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE M
1.5
0.059 ǒmm
inchesǓ
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
A1
b1
D
E
b
e
e1
4
123
0.08 (0003)
A
L1
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.50 1.63 1.75 0.060
INCHES
A1 0.02 0.06 0.10 0.001
b0.60 0.75 0.89 0.024
b1 2.90 3.06 3.20 0.115
c0.24 0.29 0.35 0.009
D6.30 6.50 6.70 0.249
E3.30 3.50 3.70 0.130
e2.20 2.30 2.40 0.087
0.85 0.94 1.05 0.033
0.064 0.068
0.002 0.004
0.030 0.035
0.121 0.126
0.012 0.014
0.256 0.263
0.138 0.145
0.091 0.094
0.037 0.041
NOM MAX
L1 1.50 1.75 2.00 0.060
6.70 7.00 7.30 0.264
0.069 0.078
0.276 0.287
HE
− −
e1
0°10°0°10°
qq
MC33269, NCV33269
http://onsemi.com
13
PACKAGE DIMENSIONS
TO−220AB, SINGLE GAUGE
T SUFFIX
CASE 221AB−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.570 0.620 14.48 15.75
B0.380 0.405 9.66 10.28
C0.160 0.190 4.07 4.82
D0.025 0.035 0.64 0.88
F0.142 0.147 3.61 3.73
G0.095 0.105 2.42 2.66
H0.110 0.155 2.80 3.93
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.15 1.52
N0.190 0.210 4.83 5.33
Q0.100 0.120 2.54 3.04
R0.080 0.110 2.04 2.79
S0.020 0.055 0.508 1.39
T0.235 0.255 5.97 6.47
U0.000 0.050 0.00 1.27
V0.045 --- 1.15 ---
Z--- 0.080 --- 2.04
B
Q
H
Z
L
V
G
N
A
K
F
123
4
D
SEATING
PLANE
−T−
C
S
T
U
R
J
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