
3-10
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(VCC -0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 1) θJA (oC/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 110
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 155
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . . 75
24 Ld PDIP (W) Package. . . . . . . . . . . . . . . . . . . . . 55
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5% HIN207E); C1-C4 = 0.1µF; TA = Operating Temperature
Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, ICC No Load,
TA = 25oCHIN202E - 8 15 mA
HIN205E - HIN208E, HIN211E,
HIN213E, HIN235E - HIN241E -1120mA
HIN232E - 5 10 mA
Shutdown Supply Current, ICC(SD) TA = 25oC HIN205E, HIN206E, HIN211E,
HIN235E, HIN236E, HIN241E -110µA
HIN213E - 15 50 µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL TIN, EN, SD, EN, SD - - 0.8 V
Input Logic High, VlH TIN 2.0 - - V
EN, SD, EN, SD 2.4 - - V
Transmitter Input Pullup Current, IPTIN = 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA (HIN202E, HIN232E, IOUT = 3.2mA) - 0.1 0.4 V
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V
TTL/CMOS Receiver Output Leakage EN = VCC, EN = 0, 0V < ROUT < VCC - 0.5 ±10 µA
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN -30 - +30 V
Receiver Input Impedance, RIN TA = 25oC, VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, VIN (H-L) VCC = 5V,
TA = 25oCActive Mode - 1.2 - V
Shutdown Mode HIN213E R4 and R5 - 1.5 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V,
TA = 25oCActive Mode - 1.7 2.4 V
Shutdown Mode HIN213E R4 and R5 - 1.5 2.4 V
Receiver Input Hysteresis, VHYST VCC = 5V, No Hysteresis in Shutdown Mode 0.2 0.5 1.0 V
HIN202E thru HIN241E