BAS16HLP
Document number: DS31740 Rev. 3 - 2 1 of 5
www.diodes.com April 2011
© Diodes Incorporated
BAS16HLP
SURFACE MOUNT FAST SWITCHING DIODE
Features
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Breakdown Voltage
Lead Free by Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Marking Information
Terminals: Finish - NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Ordering Information (Note 3)
Part Number Case Packaging
BAS16HLP-7 X1-DFN1006-2 3,000/Tape & Reel
BAS16HLP-7B X1-DFN1006-2 10,000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Bottom View
X1-DFN1006-2
T9 = Product Type Marking Code
BAS16HLP-7 BAS16HLP-7B
Top View
Bar Denotes
Cathode Side
Top View
Dot Denotes
Cathode Side
T9 T9
BAS16HLP
Document number: DS31740 Rev. 3 - 2 2 of 5
www.diodes.com April 2011
© Diodes Incorporated
BAS16HLP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage VRM 125 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 100 V
RMS Reverse Voltage VR
(
RMS
)
71 V
Forward Continuous Current IFM 215 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0
μ
s
@ t = 1.0ms
@ t = 1.0s IFSM 4
1
0.5 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) PD 250 mW
Thermal Resistance Junction to Ambient (Note 4) R
θ
JA 500 °C/W
Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Conditions
Reverse Breakdown Voltage (Note 5) V
(
BR
)
R 100 V IR = 100μA
Forward Voltage VF
0.715
0.855
1.0
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Peak Reverse Current (Note 5) IR
500
50
30
30
nA
μA
μA
nA
VR = 80V
VR = 80V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 25V
Total Capacitance CT 1.5 pF
VR = 0V, f = 1.0MHz
Reverse Recovery Time trr 4.0 ns
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
BAS16HLP
Document number: DS31740 Rev. 3 - 2 3 of 5
www.diodes.com April 2011
© Diodes Incorporated
BAS16HLP
0
50
100
0 25 50 75 100 125 150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
T , AMBIENT TEMPERA TURE (°C)
Fig. 1 Power Derating Curve
A
150
200
250
300
0
I , INSTANTANEOUS FORWARD CURRENT (mA)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
F
0.0001
0.1
0.01
0.001
1
10
100
10 20 30 40 50 60 70 80
V , INSTANT ANEOUS REVERSE VOLTAGE (V)
Fig. 3 T ypical Reverse Characteristics
R
T = -55ºC
A
T = 0ºC
A
T = 25ºC
A
T = 85ºC
A
T = 125ºC
A
T = 150ºC
A
I , INSTANT A NEOUS REVERSE CURRENT ( A)
R
μ
0468210
I , FORWARD CURRENT (mA)
Fig. 4 Reverse Recovery Ti me vs. Forward Current
F
t,
R
EVE
R
SE
R
E
C
O
VE
R
Y
T
IME (nS)
rr
0
0.5
1.0
1.5
2.0
2.5
0.40
0.45
0.50
0.55
0.60
01020304050
V , REVERSE VOLT AGE (V)
R
C , TOTAL CAPACITANCE (pF)
T
Fig. 5 Typical Total Capacitance
f = 1MHz
BAS16HLP
Document number: DS31740 Rev. 3 - 2 4 of 5
www.diodes.com April 2011
© Diodes Incorporated
BAS16HLP
Package Outline Dimensions
Suggested Pad Layout
X1-DFN1006-2
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
Dimensions Value (in mm)
Z 1.1
G 0.3
X 0.7
Y 0.4
C 0.7
L
Eb
R
e
D
A1
A
Z
X
C
G
Y
BAS16HLP
Document number: DS31740 Rev. 3 - 2 5 of 5
www.diodes.com April 2011
© Diodes Incorporated
BAS16HLP
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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