PERRIN TECHNICAL DATA Page 1 / 3 RIGHT ANGLE JACK RECEPTACLE FoR PCB | R113.664.030 SMT TYPE - PACK. 10 SERIES MCX Tae square orn 6 | 0.335 0.138 O (8.5) (3.5) _ 0.045 . . (1.15) DIA 0.038 (2096) L {| __it L_| |__ | ia hs o 0.374 0.02 Sa [| (9.5) (0.5) SF 0.256 (6.5) Y | DIA 0.12 / (23.06) NOMINAL IMPEDANCE 50 oa : CABLES : FREQUENCY RANGE 0-6 GHz TEMPERATURE RATING -55/+155 c : V.S.W.R 4.25 + x F(GHz)Maxi : RF INSERTION LOSS 0.03 JF(GHz) 4B Maxi: VOLTAGE RATING 335 Veff Maxi: DIELECTRIC WITHSTANDING VOLTAGE 14000 Veff Mini: INSULATION RESISTANCE 4000 Mamini : OTHERS CHARACTERISTICS 3,0: HERMETIC SEAL NA Atm.om Is CABLE RETENTION NAN Mini LEAKAGE (pressurized only) NA : CENTER CONTACT RETENTION MECHANICAL DURABILITY 500 cycles ; x18! force - mating end 40 N Mini Axial force - opposite end 410 N Mini WEIGHT 4.72 gr : Torque NA cm.N Mini SPECIFICATION : RECOMMENDED TORQUES Mating NA cm.N Panel nut NA cm.N Clamp nut NA cm.N all values are given CONNECTOR PARTS; MATERIALS ; FINISH (arenes ane given | BODY : BRASS GOLD 0.2 OVER NICKEL 2 OUTER CONTACT CENTER CONTACT ?BERYLLIUM COPPER ?GOLD 0.5 OVER NICKEL 2 INSULATOR :PTFE i- GASKET - OTHERS PIECES ISSUE CREATION DATE |FILE ART NUMBER I'S ~|l 9841400 13/12/1996 | ss-o12-11 [ney RADIALL The information given here is subject to change without notice. Design changes may be in order to improve the product . Connect to the futurePERRIN TECHNICAL DATA Page 2/ 3 Sl RADIALL R113.664.030 ISSUE 9844A00/SERIES MCX SULDER PROCEDURE 1 - Deposit solder paste "Sn63Pb35Ag2" on mounting zone by screen printing appli- cation. We recommend a low Residue Solid flux. We advise a thickness of 200 micromm (7.800 microinch). Verify that the edges of the zone are clean. 2 - Placement of the receptacle on the mounting zone with an automatic machine of "pick and place " type. Aspiration port (see page 3/3) centered into body and push against it. Video camera is prefered to check the positionning of the component. (See page 3) Adhesive agents are forbidden on the receptacle. 3 - Soldering by infra-red reflow. We give under, the typical profile to use. 4 - Cleaning of printed circuit boards . 5 - Checking of solder joints and position of the component by visual inspection. one TEMPERATURE PROF IL F\pical i == $rocess limits py eye fe pe pee Tf poo The information given here is subject to change without notice.Design changes may be in order to improve the product.PERRIN TECHNICAL DATA Page 3/3 R113.664.030 RADIALL ISSUE _9841A00 SERIES 2,039 mini (#4 mini) (0.079+.002 (220.05) ASPIRATION PORT 0.148# .002 N (340.05) N Ni _ Ni Ni N a Ni N 0.079 .002 N (240.05) N 0 Ooo 00796 00 | 220.05) 2+0.05) e DIA 0.056450? 0.118+.002 +0.05 118 -002 (04 .42578-95, le DIA 0.066%2012 (01 .67579-3, COPLANAR LINE Pattern and signal are on the same side Thickness of PCB : The material of PCB is the epoxy resin of glass fabrics bacs.(Er = 4.8) The solder resist should be printed exept for the land pattern on the PCB. .063 (4.6 mm) Pattern 7 LLL | Land for solder paste SHADOW OF MCX RECEPTACLE FOR VIDEO CAMERA IA 0.316 (28.03) (6) The information given here is subject to change without notice.Design changes may be in order to improve the product.