Reflowable Thermal Protection Device PRODUCT: RTP200R060SA DOCUMENT: REV LETTER: REV DATE: PAGE NO.: SCD28104 C NOVEMBER 1, 2011 1 OF 5 Specification Status: Released PIN CONFIGURATION AND DESCRIPTION: Pin Configuration (Bottom View of Device) (Top View of Device) A A2 C (Side View of Device) Note: A2 is product code is Batch Code P1 indicated by inmolded mark B P1 PTH ARM TABLE 1. DIMENSIONS: A mm in: MIN 11.60 (0.46) B MAX 12.00 (0.47) MIN 6.00 (0.24) C MAX 6.35 (0.25) MIN 5.25 (0.21) TABLE 2. ABSOLUTE MAX RATINGS: Absolute Max Ratings Max DC Open Voltage 1 Max DC Interrupt Current 1 MAX 5.50 (0.22) Max Units 32 VDC @ 16 VDC 200 @ 24 VDC @ 32 VDC 130 ESD rating (Human Body Model) Max Reflow Temperature (pre-arming) Operating temperature limits, post-arming, non-opening A 100 25 KV 260 -55 +175 C C 1. Performance capability at these conditions can be influenced by board design. Performance should be verified in the user's system. Reflowable Thermal Protection Device PRODUCT: RTP200R060SA DOCUMENT: REV LETTER: REV DATE: PAGE NO.: TABLE 3. PERFORMANCE CHARACTERISTICS (Typical unless otherwise specified): Resistance and Open Characteristics Min Typ Max P1 to PTH @ 23+/-3C 0.6 0.8 RPP (Resistance from P1 to PTH) 1.2 @ 175+/-3C 0.8 Operating Voltage 32 Open Temperature, post-arming IPP = 0 Thermal Resistance: Junction to Case Case = PTH pad Installation dependent Operating Current, postarming 2, 3 @ 23+/-3C @ 100+/-3C @ 175+/-3C 196 205 Moisture Sensitivity Level Rating 4 Units m VDC 213 0.5 32 27 SCD28104 C NOVEMBER 1, 2011 2 OF 5 C C/W 34 28 10 1 A 2. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz Cu traces, a 645 sq. mm, 2oz Cu heat spreader connected to the PTH pad, and a 387 sq. mm Cu heat spreader connected to the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet). Results are highly installation-dependent. Users should confirm for their own applications. 3. Operating current is measured on the RTP test board (see the RTP Datasheet) at the specified temperature. It is a highly installation dependent value. Users should confirm for their own applications. 4. As per JEDEC J-STD-020C TABLE 4. ARMING CHARACTERISTICS: Arming Characteristics ARM Arming Type RARM (Resistance from ARM to P1 or PTH) Arming Current (IARM) 5 Arming Time (@23 +/-3C) 5 Min Typ Max Units Electronically Armed Pre-Arming 300 Post-Arming 10 @ 23 +/-3C 2 m K 5 @ 2A 0.10 @ 5A 0.01 A Sec 5. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz, Cu traces, a 645 sq. mm 2oz Cu heat spreader connected to the PTH pad, and a 387 sq. mm Cu heat spreader connected to the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet.) Results are highly installation dependent. Users should confirm for their own applications. Reflowable Thermal Protection Device Solder Reflow Recommendation: Recommended Pad Layout: mm PRODUCT: RTP200R060SA DOCUMENT: REV LETTER: REV DATE: PAGE NO.: SCD28104 C NOVEMBER 1, 2011 3 OF 5 Reflowable Thermal Protection Device PRODUCT: RTP200R060SA DOCUMENT: REV LETTER: REV DATE: PAGE NO.: SCD28104 C NOVEMBER 1, 2011 4 OF 5 Package Information: E F W P1 P0 P2 mm (in) 1.750.10 (0.0690.004) 11.500.10 (0.4530.004) 24.000.30 (0.9450.012) 12.000.10 (0.4720.004) 4.000.10 (0.1570.004) 2.000.10 (0.0790.004) D0 D1 T A0 B0 K0 mm (in) 1.50+0.10/-0.00 (0.059+0.004/-0.000) 1.500.10 (0.0590.004) 0.460.046 (0.0180.002) 5.700.18 (0.2240.007) 12.400.18 (0.4880.007) 6.500.18 (0.2560.007) mm (inch) B 102.0 2.0 (4.0 0.079) W1 24 (0.945) W2 Max 29 (1.14) Reflowable Thermal Protection Device Precedence: Effectivity: PRODUCT: RTP200R060SA DOCUMENT: REV LETTER: REV DATE: PAGE NO.: SCD28104 C NOVEMBER 1, 2011 5 OF 5 This specification takes precedence over documents referenced herein. Reference documents shall be the issue in effect on the date of invitation for bid. MATERIALS INFORMATION RoHS Compliant ELV Compliant Pb-Free Halogen Free* HF * Halogen Free refers to: Br900ppm, Cl900ppm, Br+Cl1500ppm. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of companies ("TE") reserves the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes and replaces all information previously supplied. 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