DS14C89A
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SNLS081C –MAY 1998–REVISED APRIL 2013
DS14C89A Quad CMOS Receiver
Check for Samples: DS14C89A
1FEATURES DESCRIPTION
The DS14C89A, pin-for-pin compatible to the
2• Meets EIA/TIA-232-E and CCITT V.28 DS1489A/MC1489A, ia a quad receiver designed to
Standards interface data terminal equipment (DTE) with data
• Failsafe - Output High for Open Input circuit-terminating equipment (DCE). These devices
• LOW Power Consumption translate levels conforming to EIA-232E and CCITT
V.28 standards to TTL/CMOS logic levels.
• On Chip Noise Filter The device is fabricated in low threshold CMOS metal
• Available in SOIC Package gate technology. The device provides very low power
consumption compared to their bipolar equivalents:
900 μA (DS14C89A) versus 26 mA (DS1489A).
The DS14C89A provides on chip noise filtering which
eliminates the need for external response control filter
capacitors. When replacing the DS1489A with the
DS14C89A, the response control filter pins can be
tied high, low, or not connected.
Connection Diagram
Figure 1. See Package Number D, NFF0014A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
VCC +6V
Input Voltage −30V to +30V
Receiver Output Voltage (VCC) +0.3V to GND−0.3V
Junction Temperature +150°C
NFF0014A Package 1513 mW
Continuous Power Dissipation @ +25°C(3) D Package 1063 mW
Lead Temp. (Soldering 4 seconds) +260°C
Storage Temp. Range −65°C to +150°C
ESD Rating ≥1.8 kV, Typically ≥2 kV (HMB, 1.5 kΩ, 100 pF)
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The tables of AC Electrical Characteristics specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Derate NFF0014A Package 12.1 mW/°C, and D Package 8.5 mW/°C above +25°C.
Recommended Operating Conditions Min Max Units
VCC (GND = 0V) +4.5 +5.5 V
Operating Free Air Temp. (TA) DS14C89A 0 +75 °C
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DS14C89A
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SNLS081C –MAY 1998–REVISED APRIL 2013
Electrical Characteristics
Over recommended operating conditions, unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
VTH Input High Threshold 1.3 2.7 V
VTL Input Low Threshold 0.5 1.9 V
VHY Typical Input Hysteresis 1.0 V
IIN Input Current VIN = +25V VCC = +4.5V to +5.5V 3.6 8.3 mA
VIN =−25V −3.6 −8.3 mA
VIN = +3V 0.43 1.0 mA
VIN =−3V −0.43 −1.0 mA
VIN = +15V VCC = 0V (Power-Off)(1) 2.14 5.0 mA
VIN =−15V −2.14 −5.0 mA
VIN = +3V 0.43 1.0 mA
VIN =−3V −0.43 −1.0 mA
VOH Output High Voltage VIN = VTL (min) IOUT =−3.2 mA 2.8 4.0 V
IOUT =−20μA 3.5 4.7 V
VOL Output Low Voltage VIN = VTH (max) 0.15 0.4 V
IOUT = +3.2 mA
ICC Supply Current No Load, VIN = 2.7V or 0.5V 0.5 900 μA
(1) Under the power-off supply conditions it is assumed that the power supply potential drops to zero (0V) and is replaced by a low
impedance or short circuit to ground.
AC Electrical Characteristics(1)
Over recommended operating conditions, unless otherwise specified, CI= 50 pF
Symbol Parameter ConditIons Min Typ Max Units
tPLH Propagation Delay Low to High Input Pulse Width ≥10 μs 3.5 6.5 μs
tPHL Propagation Delay High to Low Input Pulse Width ≥10 μs 3.2 6.5 μs
tSK Typical Propagation Delay Skew 400 ns
trOutput Rise TIme 40 300 ns
tfOutput Fall Time 40 300 ns
tnw Pulse Width assumed to be Noise 1.0 μs
(1) AC input waveforms for test purposes: tr= tf= 200 ns, VIH = +3V, VL=−3V, f = 20 KHz.
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DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
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Parameter Measurement Information
Figure 2. Receiver Load Circuit
Figure 3. Receiver Switching Waveform(2)
(2) AC input waveforms for test purposes: tr= tf= 200 ns, VIH = +3V, VL=−3V, f = 20 KHz.
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Product Folder Links: DS14C89A
DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 5
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Product Folder Links: DS14C89A
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS14C89AM/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 DS14C89AM
DS14C89AMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM DS14C89AM
DS14C89AN/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br) SN Level-1-NA-UNLIM 0 to 70 DS14C89AN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS14C89AMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jan-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS14C89AMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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