TCD2950D
2002-01-31
1
TOSHIBA CCD Image SensorCCD (charge coupled device)
TCD2950D
The TCD2950D is a high sensitive and low dark current 10680
elements × 6 line CCD color image sensor which includes CCD
drive circuit and cl amp circuit. The sensor is designed for
scanner.
The device contains a row of 10680 elements × 6 line staggered
photodiodes which provide a 96 lines/mm (2400DPI) across a A4
size paper. The device is operated by 5 V pulse, and 12 V power
supply.
Features
• Number of image sensing elements: 10680 elements × 6 line
• Image sensing ele ment size : 2.8 µm by 4 µm on 4 µm centers
• Photo sensing region: High sensitive and low dark current PN photodiode
• Distance between photodiode array: 64 µm (16 lines)
• Clock: 2 phase (5 V)
• Power su pply: 12 V power supply voltage
• Internal circuit: Clamp circuit
• Package: 22 pin CERDIP package
• Color filter: Red, green, blue
Maximum Ratings (Note1)
Characteristics Symbol Rating Unit
Clock pulse voltage Vφ
Shift pulse voltage VSH
Reset pulse voltage VRS
Clamp pulse voltage VCP
−0.3~8.0 V
Power supply voltage VOD −0.3~15 V
Operating temperature Topr 0~60 °C
Storage temperature Tstg −25~85 °C
Note1: All voltage are with respect to SS terminals (ground).
Weight: 5.2 g (typ.)
Preliminar
y
OS2
22
OS1
OD
SS
φ1A4
21
20
19
18
17
16
OS3 1
2
3
4
5
6
7
SS
RS
CP
φ1A1
φ2A3
φ1A3
SH1
15
14
13
12
8
9
10
11
φ2A2
φ1A2
SH3
SS SH2
1 R 21360
1
1
21360
21360
G
B
Pin Connections (top view)
SS
NC
φ2A1 φ2A4
TCD2950D
2002-01-31
2
Circuit Diagram
CCD ANALOG SHIFT REGISTER 1
SHIFT GATE 1
CLAMP
19 18
21
13
OS2
OS1
OD SS
SS
RS
CP φ1A4
SH1
φ2A1 φ1A1
4
14
OS3
D16
D18
D60
D62
S1
S3
D64
D66
Ｄ74
D76
S21359
S21357
PHOTO
DIODE
(B)
SH3
D14
SHIFT GATE 2
CCD ANALOG SHIFT REGISTER 2
D15
D17
D59
D61
D63
S2
S4
S21360
D65
Ｄ73
D75
S21358
S21356
PHOTO
DIODE
(B)
D13
20 15 16 17
CCD ANALOG SHIFT REGISTER 3
SHIFT GATE 3
CLAMP
22
12 SH2
D16
D18
D60
D62
S1
S3
S5
D64
D66
Ｄ74
D76
S21359
S21357
PHOTO
DIODE
(G)
D14
SHIFT GATE 4
D15
D17
D59
D61
D63
S2
S4
S21360
D65
Ｄ73
D75
S21358
S21356
PHOTO
DIODE
(G)
D13
SHIFT GATE 5
CLAMP
1
D16
D18
D60
D62
S1
S3
S5
D64
D66
Ｄ74
D76
S21359
S21357
PHOTO
DIODE
(R)
D14
SHIFT GATE 6
CCD ANALOG SHIFT REGISTER 6
D15
D17
D59
D61
D63
S2
S4
S21360
D65
Ｄ73
D75
S21358
S21356
PHOTO
DIODE
(R)
D13
10
11
3 9
8 7 6
φ2A3 φ1A3 φ2A4
SS SS φ1A2
CCD ANALOG SHIFT REGISTER 4
CCD ANALOG SHIFT REGISTER 5
φ2A2
TCD2950D
2002-01-31
3
Optical/Electrical Characteristics
(Ta =
==
= 25°C, VOD =
==
= 12 V, Vφ
φφ
φ =
==
= VSH =
==
=VRS =
==
= VCP =
==
= 5 V (pulse), fφ
φφ
φ =
==
= 1 MHz, fRS =
==
= 2 MHz,
tINT =
==
= 11 ms, LIGHT SOURCE =
==
= A LIGHT SOURCE +
++
+ CM500S FILTER (t =
==
= 1 mm),
LOAD RESISTANCE =
==
= 100 kΩ
ΩΩ
Ω)
Characteristics Symbol Min Typ. Max Unit Note
Red R(R) 0.9 1.4 1.9
Green R(G) 1.3 1.9 2.5
Sensitivity
Blue R(B) 0.9 1.3 1.7
V/lx･s (Note 2)
PRNU (1) 15 20 % (Note 3)
Photo response non uniformity
PRNU (3) 3 12 mV (Note 4)
Register imbalance RI 1 % (Note 5)
Saturation Output Voltage VSAT 2.9 3.5 V (Note 6)
Saturation Exposure SE 1.16 1.84 lx･s (Note 7)
Dark signal Voltage VDRK 0.5 2.0 mV (Note 8)
Dark Signal Non Uniformity DSNU 2.0 7.0 mV (Note 8)
DC Power Dissipation PD 420 585 mW
Total Transfer Efficiency TTE 92 98 %
Output Impedance ZO 0.3 1.0 kΩ
DC Compensation Output Voltage VOS 5.0 6.0 7.0 V (Note 9)
Random Noise NDσ 0.8 mV (Note 10)
Reset Noise VRSN 0.3 1.0 V (Note 9)
Masking Noise VMS 0.2 1.0 V (Note 9)
Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied
with the light of uniform illumination and uniform color temperature.
Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive
surface is applied with the light of uniform illumination and uniform color temperature.
PRNU (1) = x
x∆ × 100 (%)
Where xis average of total signal output and ∆X is the maximum deviation from x .
The amount of incident light is shown below.
Red = 1/2·SE
Green = 1/2·SE
Blue = 1/4·SE
Note 4: PRNU (3) is defined as maximum voltage with next pixels, where measured at 5% of SE (typ.).
Note 5: Register imbalance is defined as follows.
(%) 100
x21359
1) (n x xn
RI
21359
1 n
×
×
∑+−
==
Note 6: VSAT is defined as minimum saturation output of all effective pixels.
Note 7: Definition of SE
SE =
G
R
SAT
V (lx･s)
TCD2950D
2002-01-31
4
Note 8: VDRK is defined as average dark signal voltage of all effective pixels.
DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal
voltage.
Note 9: DC signal output voltage is defined as follows. Reset noise voltage is defined as follows.
Masking noise voltage is defined as follows.
Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two
adjacent effective pixels under no illumination (i.e. darkconditions) calculated by the following procedure.
(1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points.
(2) Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n + 1).
(3) V (n + 1) is subtracted from V (n) to get ∆V.
∆V = V (n) − V (n + 1)
(4) The standard deviation of ∆V is calculated after procedure (2) and (3) are repeated 30 times (30
readings).
∑
∆30
1=i
|∆Vi|
30
1
=V ∑∆∆
30
1i
2
)VV(
30
1
i
=||
=−
σ
(5) Procedure (2), (3) and (4) are repeated 10 times to get sigma value.
(6) 10 sigma values are averaged.
∑
10
1j j
10
1
=
=
σσ
(7) σ value calculated using the above procedure is observed 2 times larger than that me asured
rela tive to the ground level. So we spe cify rando m noise as follows.
σσ
2
1
ND =
VMDK
VDRK
DSNU
SS
VOS
VRSN
VMS
OS
video output video output
200 ns
200 ns
pixel (n)
pixel (n + 1)
∆V
Output waveform
(effective pixels under
dark condition)
TCD2950D
2002-01-31
5
Operating Condition
Characteristics Symbol Min Typ. Max Unit Note
“H” level 4.5 5.0 5.5
Clock pulse voltage
“L” level
VφA
0 0.3
V
“H” level 4.5 5.0 5.5
Shift pulse voltage
“L” level
VSH
0 0.5
V
“H” level 4.5 5.0 5.5
Reset pulse voltage
“L” level VRS
0 0.5
V
“H” level 4.5 5.0 5.5
Clamp pulse voltage
“L” level VCP
0 0.5
V
Power supply voltage VOD 11.4 12.0 13.0 V
Clock Characteristics (Ta =
==
= 25°C)
Characteristics Symbol Min Typ. Max Unit
Clock pulse frequency fφA 0.15 1.0 10 MHz
Reset pulse frequency fRS 0.3 2.0 10 MHz
Clamp pulse frequency fCP 0.3 2.0 10 MHz
Clock capacitance (Note 11) CφA 400 pF
Shift gate capacitance CSH 50 pF
Reset gate capacitance CRS 10 pF
Clamp gate capacitance CCP 10 pF
Note 11: VOD = 12 V
TCD2950D
2002-01-31 6
Timing Chart (bit clamp mode)
OS
TEST OUTPUT
(2 element)
D73
D76
D77
D75
D66
S2
D62
D61
D60
D59
D58
D12
D4
D10
D1
D0
S1
D63
D11
S21360
S21359
D64
D65
D67
SH
φ1A
φ2A
RS
CP
D3
D2
D15
D13
D14
D16
S3
D2
D3
D1
D0
1 LINE READOUT PERIOD (21438 elements)
LIGHT SHIELD
OUTPUTS
(47 elements)
DUMMY OUTPUTS (64 elements)
DUMMY OUTPUTS
(14 elements)
SIGNAL OUTPUTS
(21360 elements)
(3 elements)
DUMMY OUTPUT
(1 element)
DUMMY OUTPUTS
(13 elements)
DUMMY
OUTPUTS
(8 elements)
tINT (integration time)
TCD2950D
2002-01-31
7
Timing Requirements
OS
t12
t1
t2 t3 t4
t5
t18
RS
CP
φ1
t14 t15
t9
t6 t7
φ2
φ1
SH
φ2
GND
φ1A
3.5 V (max)
1.5 V (min)
RS
CP
3.5 V (max)
1.5 V (min)
t10 t8
t13 t11
t17
t16
TCD2950D
2002-01-31
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Timing Requirements
Characteristics Symbol Min
Typ.
(Note11) Max Unit
t1 110 1000
Pulse timing of SH and φ1A
t5 200 1000
ns
SH pulse rise time, fall time t2, t4 0 50 ns
SH pulse width t3 1000 2000 ns
φ1, φ2 pulse rise time, fall time t6, t7 0 50 ns
RS pulse rise time, fall time t8, t10 0 20 ns
RS pulse width (Note 12) t9 15 100 ns
CP pulse rise time, fall time t11, t13 0 20 ns
CP pulse width t12 20 100 ns
Pulse timing of φ1A, φ2A and CP t14 10 40 ns
Pulse timing of RS and CP t15 0 100 ns
Video data delay time (Note 13) t16, t17 15 ns
Pulse timing of SH and CP t18 0 500 ns
Note 12: TYP is the case of fRS = 2.0 MHz.
Note 13: Load resistance is 100 kΩ.
TCD2950D
2002-01-31
9
Typical Spectral Response
Wave length λ (nm)
Relative response
Spectral response
1.0
0
400
Ta = 25°C
0.2
0.4
0.6
0.8
450 500 550 600 650 700
Blue Green
Red
TCD2950D
2002-01-31
10
Typical Drive Circuit
RS
CP OS2 OS1 OD
OS3 SS
SH1
φ2A2 φ1A2 SH3 SS
SH2
21 22 19 20 17 18 15 16 14 12 13
2 1 4 3 6 5 8 7 9 11 10
TCD2950D
IC1, 2: TC74AC04P
TR1, 2, 3: 2SC1815-Y
R1: 150 Ω
R2: 1500 Ω
12 V
10 µF/25 V
0.1 µF/25 V
φ1A3
φ1A4
φ2A3
φ2A4
OS3
OS2
OS1
+12 V
0.1 µF/25 V
R1 R1 R1
TR1
TR2
TR3
R2 R2 R2
R1 R1 R1
SS
NC
+5 V
0.1 µF/25 V
IC2
SH1
SH2
SH3
RS
CP
+5 V
0.1 µF/25 V
IC3
+5 V
0.1 µF/25 V
IC1
φ1A2
φ2A2
φ2A1
φ1A1
φ2A1 φ1A1 SS
φ2A3 φ1A3 φ2A4 φ1A4
10 µF/25 V
TCD2950D
2002-01-31
11
Caution
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and
allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or
thermal shock because the glass window is easily to damage.
2. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-cha rging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, radio cutting pliers of or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
3. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.
4. Lead Frame Forming
Since this package is not strong against mechanical stress, you should not reform the lead frame.
We recommend to use a IC-inserter when you assemble to PCB.
5. Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious
effects on prevention of window glass soiling and heat resistance.
Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or
within three seconds for lead temperatures of up to 350°C.
TCD2950D
2002-01-31
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Package Dimensions
(Note1): TOP OF CHIP TO BOTTOM OF PACKAGE
(Note2): GLASS THICKNESS (n = 1.5)
(Note3): No.1 SENSOR ELEMENT (S1) TO CENTER OF No.1 PIN.
Weight: 5.2 g (typ.)
TCD2950D
2002-01-31
13
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
000707EB
A
RESTRICTIONS O N PRODUCT USE
