The documentation and process conversion INCH-POUND measures necessary to comply with this shall be completed by 16 Aug 94. MIL-S-19500/406C 16 May 1994 SUPERSED ING MIL-S-19500/4068 19 June 1992 MILITARY SPECIFICATION SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR TYPES 1N4460, 1N4460C, 1N4460D THROUGH 1N4496, 1N4496C, 1N4496D AND 1N64B5, 1N6485C, 1N6485D THROUGH 1N6491, 1N6491C, 1N6491D 1NG460US, 1N4460CUS, 1NG46ODUS THROUGH 1N4496US, 1N4496CUS, 1N4496DUS AND IN6485US, IN6485CUS, IN64B5DUS THROUGH 1N6491US, IN6491CUS, 1N6491DUS PLUS C AND D TOLERANCE SUFFIX; JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for microminiature 1.5 watt silicon, low leakage, voltage regulator diodes with tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product assurance are provided for each device type as specified in MIL-S-19500, and two level of product assurance for die. 1.2 Physical dimensions. See figures 1 (similar to DO-41), 2, and 3. 1.3 Maximum ratings. Maximum ratings are as shown in colums 8 and 10 of table III herein and as follows: P, = 1.5 W (derate at 10 mW/C above T, = +25C) -55C < T,, < +175C; -65C < Torq < +175C 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 2, 9, 12, and 14 of table III herein and as foltows: 3.3 V de s V, 200 V de 1N4460D through 1N4496D and 1N64850 through 1N6491D are 1 percent voltage tolerance. 1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance. 1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance. Roy = 42C/W (max) at L = .375 inch (9.52 mm) (nonsurface mount) Rosec = 20C/W (max) (surface mount) Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Electronics Supply Center, DESC-ELD, 1507 Wilmington Pike, Dayton, OH 45444-5765 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Me o0001eS 0035082 751 MENILSMIL-S-19500/406C EE _ = ie tL flew #0 Ltr Dimensions Notes Inches Millimeters Min Max Min Max G -106 - 160 2.69 | 4.06 3 pd .060 085 1.52 | 2.16 3 L 800 | 1.300 | 20.32 133.02 $8 .028 | .032 | 0.71 | 0.81 L, .050 1.27 | 4 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Package contour optional with @D and length G. Heat slugs, if any, shall be included within this cylinder but shall not be subject to minimum Limit of #0. 4. The specified lead diameters apply in the zone between .050 inch (1.27 mm) from the diode body and the end of the lead. FIGURE 1. Physical dimensions of nonsurface mount device. M! 00001e5 0035083 98 MEMILSMIL-S-19500/406C \ { -+b \ / NS U7 4x &|.006 (0.15) Ltr Dimensions Notes Inches Millimeters Min Max Min Max G - 168 200 4.28 5.08 F 019 028 0.48 0.71 $ .003 9.08 D 091 103 2.31 2.62 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 2. Physical dimensions of surface mount device, "US". M ococd1es 0035084 S24 MEMILSMIL-S-19500/406C j {\ __a= _ | ie I oy a <--> __ a Dimension Symbo | Inches Millimeters Min Max Min | Max A 0.030] 0.036] 0.813] 0.914 B 0.022] 0.027] 0.584) 0.686 c 0.006) 0.012! 0.152} 0.305 NOTES: 1. Dimensions are in inches. oO DESIGN DATA Metallization: Top: (Cathode) ....+-. Back (Anode). . . + 2 2. Metric equivalents are given for general information only. @@ o00dgieS 0035085 460 MENILS FIGURE 3. Physical dimensions for JANHCA and JANKCA (die). Aluminum GoldMIL-S-19500/406C | ie Ff ee 09 > oO Dimension Symbol Inches Millimeters DESIGN DATA Min Max Min | Max Metal lization: A 0.030} 0.036) 0.813} 0.914 Top: (Cathode) ..... Aluminum Back (Anode). .....- Silver B 0.022] 0.027} 0.584} 0.686 Cc 0.006] 0.012] 0.152) 0.305 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 4. Physical dimensions for JANHCB and JANKCB (die). MM 00001eC5 0035046 3T? MEMILSMIL-S-19500/406C - ie * Co a vn Sn $$ Dimension symbol Inches Millimeters DESIGN DATA Min Max Min | Max Metallization: A 0.030) 0.036] 0.813) 0.914 Top: (Cathode) ....: Silver Back (Amode). . . - + Silver B 0.022] 0.027] 0.584) 0.686 Cc 0.006] 0.012} 0.152} 0.305 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 5. Physical dimensions for JANHCC and JANKCC (die). M@ o0001e5 0035087 233 MNILSMIL-S-19500/406C 2. APPLICABLE DOCUMENTS 2.1 Government documents. Eee 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-$-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500, and as follows: EC. we ee ee Endcap. US . 2 ee we ee ee ee hw ee Surface mount case outline, square endcap. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-$-19500, and on figures 1, 2, and 3 herein. 3.3.1 Construction except for JANHC an JANKC. Devices shall be metallurgically bonded-thermally matched- noncavity-double plug construction in accordance with MIL-S-19500, 3.3.1.1, and 3.3.1.2 herein. The "US" version shall be structurally identical to the axial lead type except for lead configuration. 3.3.1.1 Metallurgical bond for diodes with Vy > 6.8 V de. Category I metallurgical bonds as def ined in MIL-S-19500 shall be utilized. 3.3.1.2 Metallurgical bond for diodes with Vy < 6.8 V de. Category I and category III bonds as defined in MIL-S-19500 may be utilized. 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 3.4.1 Marking of US version devices. For "US" version devices only, all marking (except polarity) may be omitted from the body, but shall be retained on the initial container. 3.4.2 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end. Alternatively, for US suffix devices, a minimum of three contrasting color dots spaced around the periphery on the cathode end may be used. Me 0000125 0035066 177 MMILSMIL-$-19500/406C 3.5 selection of tighter tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, JANTXV, or JANS devices, which have successfully completed all applicable screening, and groups A, 8, and C testing as 5 percent tolerance devices. Alt sublots of C and D suffix devices shall pass group A, subgroup 2, at tighter tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish correlation. For C and D tolerance levels, T, = 25C + 2C at 0.375" from body or equivalent. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. Lot accumulation period shall be 6 months in lieu of 6 weeks. This applies to JAN, JANTX and JANTXV quality levels only. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-S-19500 and table II herein. 4.2.2 JANHC and JANKC devices. Qualification for JANC devices shall be as specified in appendix H of ee SS MIL-S-19500. 4.3 Screening (all levels). Screening shail be in accordance with table II of MIL-$-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the Limits of table I herein shall not be acceptable. 4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-S-19500, appendix H. Screen (see table M jrements tI of MIL-S-19500) JANS level JANTX and JANTXV levels V Thermal impedance, see 4.5.4 Thermal impedance, see 4.5.4 7 Hermetic seal, gross leak Hermetic seal, gross leak 9 Iq, and VZ C1N4465 thru 1N4496 only) [Not applicable 11 Iq, and V, (1N4465 thru 1N4496 only); |I_, and Vz (1N4465 thru 1N4496 only)| Al 2100 percent of initial reading or 50 nA de, whichever is greater. AV, $ 2 percent of initial reading. 12 See 4.3.2 See 4.3.2 13 2/ 3/ Subgroups 2 and 3 of table I herein; |Subgroup 2 of table I herein; AIq,(max) < 100 percent At q,(max) <$ 100 percent of initial reading or 50 nA, initial reading or 50 nA, which- whichever is greater; ever is greater; AV, 22 percent AV, $ #2 percent of initial of initial reading. reading. 4/ This test shalt be performed anytime after screen 3. 2/ Thermal impedance not applicable, if already performed 100%. 3/ Delta limits applicable to 1N4465 thru 1N4496 only. WB 0000125 0035085 OOb MENILSMIL-S- 19500/406C 4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: The diode shali be suspended by its leads (nonsurface mount only) with the mounting clips at a minimum of 375 inch (9.52 mm) from the device body in a room ambient as defined in (see 4.5) general requirements of MIL-STD-750. The test current I, shall be adjusted to produce a junction temperature of +175C maximum and I, minimum shall be equal to 50 percent of column 8 of table III. For surface mount devices, the mounting clips shall contact the endcaps and the ambient temperature may be elevated in order to achieve the specified Junction temperature. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500 and as specified herein. Group A inspection shall be performed on each sublot. 4.4.1 Group A inspection. Group A inspection shall be in accordance with MIL-S-19500 and table I herein. Thermal impedance conditions are as follows: a. Iy Measurement current . . - - 2 e e et ee ets 1m to 10 m. b. 1, forward heating current . 6 6 6 6 ee ee ee es 3A to 10 A. c. t, heating time . 6 ee we ee ee ee ee es 10 ms. d. typ measurement delay time... 2-6 2 ee ee ee ees 100 ws maximum. The maximum limit for Zg,, under these test conditions are Zojxgnay = 4.5C/W for category I bonds and Zouximan = 7-5C/W for category 111 bonds (see 3.3.1.1 and 3.3.1.2). 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in tables IVa and IVb of MIL-$-19500. Electrical measurements (end-points) shall be in accordance with the applicable inspections of table 1, group A, subgroup 2 herein except Zo,x need not to be performed. See subgroup conditions for deita Limits when applicable. 4.4.2.1 Group B inspection, table IVa (JANS) of MIL-S-19500. Subgroup Method Condition 3 1056 25 cycles, condition A 3 1071 Test condition & NOTE: For non-transparent devices, hermetic seal may be performed after electrical measurements. 4 1037 I, = column 8 of table III at T, = room ambient as defined in the general requirements of paragraph 4.5 of MIL-STD-750; te. = ton = 3 minutes minimum for 2,000 cycles. Mounting conditions in accordance with 4.5.2. No forced air cooling on the device shall be permitted. Leaded samples from this lot may be used in Lieu of surface mount devices. 4 Endpoints: I, endpoints in accordance with table III, column 13. 5 1027 1, = colum 8 of table III for 96 hours; P, = 1.5 W; T, = +125C or adjusted as required by the chosen T, to give an average lot T, = +275C. Leaded samples from this lot may be used in lieu of surface mount devices. 5 Endpoints: Iq endpoints in accordance with table III, column 13. 6 3101 Ron = 42C/W maximum; Rojec = 20C/W maximum; #25C < T, 435C; or reference temperature measuring point is the inside of mounting clip 4081 on lead or endeap (see 4.5.7). MB 0000125 00350590 428 MBNILSMIL-S-19500/406C 4.4.2.2 Group B inspection, table IVb (JAN, JANTX and JANTXV of MIL-S-19500). Subgroup Method Condition 1 2026 Immersion depth to within 0.10 inch (2.54 mm) of device body (leaded devices only). 2 4066 Iysq = column 10 of table III at T, +25C (see 4.5.1). 2 1071 Test condition E only NOTE: for non-transparent devices, hermetic seal may be performed after electrical measurements. 3 1027 1,(min) = 50 percent of column 8 of table III (conditions in accordance with 4.3.2); T, = room ambient as defined in the general requirements of paragraph 4.5 of MIL-STD-750. 3 Endpoints: 1, endpoints in accordance with table III, column 13. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500 and herein. Electrical measurements (end-points) shall be in accordance with the applicable inspections of table I, group A, subgroup 2 herein except Zag, need not to be performed. See subgroup conditions for delta Limits when applicable. 4.4.3.1 Group C_ inspection, table V of MIL-S-19500. Subgroul Method Condition 2 2036 Tension - test condition A; 10 lbs; t = 15s 43s. Lead fatigue - Test condition E. NOTE: Not applicable to US versions. 2 1071 Test condition E only NOTE: For non-transparent devices, hermetic seal may be performed after electrical measurements. 6 1027 1,(min) = 50 percent of column & of table IT] (conditions in accordance with 4.3.2); T, = room ambient as defined in the general requirements of paragraph 4.5 of MIL-STD-750. 6 Endpoints: I, endpoints in accordance with table III, column 13. 7 4071 Temperature coefficient for JAN, JANTX and JANTXV only; I, = column 5 of table III; Ta; = +25C 5C; Tag = +100C 25C; Limit = colum 44 of table III (see paragraph 4.5.3). 8 1056 Liquid N, (-195C) to +150C fluoro bath. The DUT shall be stabilized at the temperature extremes for 20 s minimum, transfer time $5 s, continuously monitor for discontinuities during the last five cycles, V, = 200 mA dc; 20 cycles for group C. 8 tote Visual inspection - cracks in package shall be cause for rejection. 8 Endpoints: AV, at 200 mA = 20 mV or 2 percent of initial readings, whichever 1s greater. 4.5 Methods of examination and test. Methods of examination and test shall be as specified in the appropriate tables and as follows. M@@ 0000125 0035091 764 MMMILSMIL-S-19500/406C 4.5.1 Surge current {T 564 ). The peak currents specified in column 10 of table III shall be applied in the reverse direction and shall be superimposed on the current (I, = column 5 of table III) a total of five surges at 1 minute intervals. Each individual surge shall be at one-half square wave pulse of 8.3 millisecond duration or an equivalent sine wave with the same effective (rms) current. 4.5.2 Voltage regulation WV (reg)). A current of 10 percent of I, (column 8) shall be maintained until thermal equilibrium is attained and the V, shall be noted. The current shall then be increased to a level of 50 percent of 1, (column 8) and maintained at this level until thermal equilibrium is attained at which time the voltage change shalt not exceed column 9 of table III. For this test, the diode shal! be suspended by its leads (nonsurface mount) with mounting clips whose inside edge is located at 0.375 20.010 inch (9.52 +0.25 mm) from the body and the lead temperature at inside edge of the mounting clips shall be maintained at a temperature between +23C and +33C. For surface mount packages, the diode shall be suspended by the endcaps with the temperature of the endcaps being maintained between +23C and +33C. for JANC, the die shall be stabilized at +25C and the test shall be performed utilizing pulse condition. This measurement may be performed after a shorter time interval following application of the test current than that which provides thermal equilibrium if correlation can be established to the satisfaction of the qualifying activity. 4.5.3 Temperature coefficient of regulator voltage (a): The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature. For JANC, this test shall be made with the chip resting on a metal heat sink maintained at +25C #3C, utilizing pulse condition. 4.5.4 Thermal impedance (Ze jx measurements). The Zo,x measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum Limit shall not to exceed the Group A, Subgroup 2 Limit for 2, in screening (table II of MIL-S-19500). 4.5.4.1 Thermal impedance Goeiy measurements) for initial qualification or requalification. The Zax measurements shall be performed in accordance with MIL-STD-750, method 3101 (read and record date 2g)y)- Zesx shall be supplied on one lot (500 devices minimum and a thermat response curve shall be submitted). Twenty two of these samples shall be serialized and provided to the qualifying activity for correlation prior to shipment of parts. Measurements conditions shall be in accordance with 4.4.1. 4.5.5 Regulator voltage. The test current (column 5 of table III) shall be applied until thermal equilibrium is attained prior to reading the regulator voltage. For this test, the diode shall be suspended by its leads (nonsurface mount) with mounting clips whose inside edge is located at 0.375 0.010 inch (9.52 20.25 mm) from the body and the lead temperature at inside edge of the mounting clips shall be maintained at a temperature of +23C to +33C. for surface mount diodes, the diode shall be suspended by the endcaps with the temperature of the endcaps being maintained at #23C to +33C. For JANC, this measurement shall be made with the chip resting on a metal heat sink maintained at +25C 43C. This measurement may be performed after a shorter time following application of the test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the qualifying activity. 4.5.6 Pulse measurements. Conditions for pulse measurements shall be as specified in paragraph 4.3.2.1 of MIL-STD-750. M@ 0000125 0035092 &T0 MENILSMIL-S-19500/406C TABLE I. Group A_ inspection. 2/ Inspection 1/ MIL-STD-750 Symbol Limits Unit Method Conditions Min Max Subgroup _1 Visual and mechanical | 2071 examination Subgroup 2 Thermal impedance 4/ | 3101 Category | bond Zoux 4.5 C/W Category III bond 7.5 C/W (See 4.4.1) Forward voltage 4011 I, = 200 mA de Ve 1.0 Vv de Forward voltage 4011 I, = 1A de Veo 1.5 V de Reverse current 4016 OC method; V, = column 11 of Tp Column 12 pA de leakage table ITI Regulator voltage 3/ | 4022 1, = colum 5 of table III Vz Column 3 Column 4 V de (see 4.5.5) -5, -2, -1 |+5, +2, +1 percent percent Subgroup 3 High temperature Ty = +150C operation Reverse current 4016 DC method; V, = column 11 of Ine Column 16 A de leakage table I11 Subgroup _4 Small-signal reverse 4051 1, = column 5 of table II! 2, Column 6 g breakdown impedance I,, = 10 percent 1, Knee impedance 4051 I,, = column 15 of table IIT Zz Column 7 a I, = 10 percent 12. Subgroup _5 Not applicable Subgroup 6 Surge current 4066 JANS only lose loca 2 column 10 of table III (see 4.5.1) End-point electrical See table I, group A, measurements subgroup 2 except Z5,x See footnotes at end of table. 12 M@ 00001325 0035093 $37 MBMILSMIL-S-19500/406C TABLE 1. Group A inspection - Continued. coefficient of regulator voltage 1, = column 5 of table III Tar = F25C 25C, = 120C < T, = 130C Tao Inspection 1/ MIL-STD-750 Symbol Limits o Unit Method Conditions Min Max Subgroup _7 Voltage regulation 3/ See 4.5.2 V0) Cotumn 9 Vv de Temperature 4071 JANS level only Qyz Column 14 a/C 4s For sampling plan, see MIL-S-19500. 2/ Column references are to table III. 3/ For JANC, test using pulse conditions. 4/ Not require for JANHC and JANKC @ o0o001eS 0035094 473 MMILSMIL-S-19500/406C TABLE 11. Group E inspection (all quality levels). Inspection MIL-STD-750 Sampling plan Method Conditions Subgroup_1 22 devices c=0 Temperature cycling 1051 {500 cycles Electrical measurements See table I, group A, subgroup 2 Subgroup _2 22 devices c=0 Steady-state intermittent 1037 |1, = Iz2 Ccotumn 8 of table III) at operating life T, = +25C; T,, = Tow = 3 minutes minimum for 10,000 cycles. No forced air cooling on the device shall be permitted. (Mounting conditions in accordance with 4.5.2.) Electrical measurements See table I, group A, subgroup 2 Subgroup 3 22 devices e=0 Not applicable Subgroup 4 Thermal resistance 3101 [Ray = 42C/W (max) at L = 3/8; (see 4.5.7) or Rojec = 20C/W max for US types, 4081MIL-S-19500/406C TABLE II. Electrical characteristics and test conditions (all case outlines). Col Col Col Col Col Col Col Col Col Col Col Col Col Col Col Col 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Device] Vz V2 Vz I, test| 2, zx I, Max |V,Creg)|Izsm Va TR I, Qyz Tox Tp type | Nom | Min Max |current|Imped-| Knee de |voltage Reverse|Reverse|Reverse|Temper-| Test |Reverse ance |imped-|current|regula-| T, voltage|current}current| ature |currentjcurrent dc V2 |i 2 Ty ance | Ty tion |= +25C de de, 1,,|coeffi-| Ta = +25C = +25C 3/ 4 Tas post cient = +450C test 5/ lao Vv Vv Vv mA Qa Qa mA Vv A Vv BA BA 41C mA BA 1N6485| 3.3] 3.14 | 3.46 76 10 400 433 0.9 | 4.2 41.0 50.00 | 75.00 | -.075 1.00 500 1N6486| 3.61 3.42 | 3.78 69 10 400 397 0.8 | 3.9 1.0 50.00 | 75.00 | -.070 1.00 200 1N6487| 3.9] 3.71 | 4.09 64 9 400 366 75 | 3.6 1.0 35.00 | 50.00 | -.060 1.00 100 1N6488| 4.3] 4.09 | 4.51 58 9 400 332 .70 | 3.3 1.0 5.00 7.50 | +.050 1.00 100 1N6489| 4.7) 4.47 | 4.93 53 8 500 304 -60 | 3.0 1.0 4.00 6.00 | 2.025 1.00 100 1N6490} 5.1) 4.85 | 5.35 49 7 500 280 5 2.7 1.0 1.00 2.00 | +.030 1,00 100 1N6491 5.6| 5.32 | 5.88 45 5 600 255 40 | 2.5 2.0 0.50 1.00 | +.040 4.00 100 1N4460} 6.21 5.89 | 6.51 40 4 200 230 35 | 2.3 3.72 | 10.00 | 20.00 | +.050 1.00 50 1N4461| 6.8) 6.46 | 7.14 37 2.5) 200 210 30 | 2.1 4.08 5.00 | 10.00 | +.057 1.00 20 1N4462| 7.5| 7.13 | 7.87 34 2.5{ 400 191 35 | 1.9 4.50 1.00 2.00 | +.061 0.50 10 1N4463| 8.2] 7.79 | 8.61 31 3.0! 400 174 40 | 1.7 4.92 0.50 1.00 | +.065 0.50 5 1N4464] 9.1] 8.65 | 9.55 28 4.0; 500 157 45 | 1.6 5.46 0.30 0.60 | +.068 0.50 3 1N4465| 10 9.50 | 10.50 25 5.0} 500 143 50 | 1.4 8.0 0.30 0.60 | +.071 0.25 3 1N4466| 11 0.45 (11.55 23 6.0} 550 130 -55 | 1.3 8.8 0.30 0.60 | +.073 0.25 2 1N464671 12 1.40 (12.60 21 7.0} 550 119 60 | 1.2 9.6 0.20 0.40 | +.076 0.25 2 1N4468| 13 [12.35 |13.65 19 8.0} 550 110 65 | 1.1 10.4 0.05 0.10 | +.079 0.25 2 1N44691 15 [14.25 115.75 17 9.0; 600 95 75 95 12.0 0.05 0.10 | +.082 0.25 2 1N4470/ 16 115.20 |16.80 15.5 10.0] 600 90 .80 -90 12.8 0.05 0.10 | +.083 0.25 2 1N44711 18 j|17.10 |18.90 14 11.0} 650 79 83 v7 14.4 0.05 0.10 | +.085 0.25 2 1N4472!1 20 119.00 |21.00 12.5 12.0] 650 71 95 71 16.0 0.05 0.10 | +.086 0.25 2 1N4473| 22 |20.90 {23.10 11.5 14 650 65 1.0 65 17.6 0.05 0.10 | +.087 0.25 2 1N4474] 24 [22.80 | 25.20 10.5 16 700 60 1.1 .60 19.2 0.05 0.10 | +.088 0.25 2 1N4475| 27 [25.70 128.30 9.5 18 700 53 1.3 53 21.6 0.05 0.10 | +.090 0.25 2 1N4476| 30 [28.50 |31.50 8.5 20 750 48 1.4 48 24.0 0.05 0.10 | +.091 0.25 2 1N4677| 33 (31.40 (34.60 7.5 25 800 43 1.5 43 26.4 9.05 0.10 | +.092 0.25 2 See footnotes at end of table. 15 M@ 0000125 0035056 24b MENILSMIL-S-19500/406C TABLE Ifl. Electrical characteristics and test conditions (allt case outlines) - Continued. Col Col Col Col Col Col Col Col Col Col Col Col Col Col Col Col 1 2 3 4 5 6 7 8 9 10 "i 12 13 14 15 16 Device] V, Vz Vz I, test| 2, 2 [Iz Max [V,reg)|T2oq Va la Iq Qyz Lax Ip type | Nom | Min Max |current|Imped-| Knee de |voltage Reverse|Reverse|Reverse|Temper-| Test |Reverse ance |imped-|current|regula-| Ts voltage|current|current| ature {current|current de VV 2/ |i/ 2s Ta ance Ta tion |= +25C de de, Ip, {coef fi-| Tr = +25C = +25C 3/ 4/ Ta post cient = +150C test 5/ Tae Vv V Vv TA Q a mA Vv A Vv BA BA SLC mA LA 1N4478| 36 34.2 | 37.8 7.0 27 850 40 1.7 | .40 28.8 .05 .10 +.093 0.25 2 1N4479| 39 37.1 | 40.9 6.5 30 900 37 1.8 | .37 31.2 .05 -10 +.094 0.25 2 1N4480| 43 40.9 | 45.1 6.0 40 950 33 1.9 | .33 34.4 05 10 +095 0.25 2 1N4481| 47 44.7 | 49.3 5.5 50 1000 30 2.1 | .30 37.6 05 -10 +095 0.25 2 1N4482) 51 48.5 | 53.5 5.0 60 1100 28 2.3 | .28 40.8 -05 -10 +.096 0.25 2 1N4483| 56 53.2 | 58.8 4.5 70 1300 26 2.5 | .26 44.8 25 225 +096 0.25 10 1N4484{1 62 58.9 | 65.1 4.0 80 1500 23 2.7 | .23 49.6 025 225 +097 0.25 10 1N4485| 68 64.6 | 71.4 3.7 100 1700 21 3.0 | .21 54.4 25 220 +.097 0.25 10 1N4486| 75 71.3 | 78.7 3.3 130 2000 19 3.3 | .19 60.0 229 -25 +098 0.25 10 1N4487/ 82 77.9 | 86.1 3.0 160 2500 17 3.6) .17 65.6 .25 25 +.098 0.25 10 1N4488; 91 86.5 | 95.5 2.8 200 3000 16 4.0 | .16 72.8 25 25 +099 0.25 10 1N4489| 100 95.0 |105.0 2.5 250 3100 14 4.4 | .14 80.0 25 -25 +. 100 0.25 10 1N4490/110 1104.5 [115.5 2.3 300 4000 13 5.0 | .13 88.0 25 .25 +,100 0.25 10 1N4491/120 1114.0 [126.0 2.0 400 4500 12 5.5 | .12 96.0 -25 -25 +. 100 0.25 10 1N44921130 [123.5 [136.5 1.9 500 5000 11 6.0 | .11 104 .25 .25 +. 100 0.25 10 1N4493{150 [142.5 [157.5 1.7 700 6000 9.5 7.0 | .095 120 -25 .25 +.100 0.25 10 1N44941160 | 152 168 1.6 41000 6500 8.9 8.0 | .089 128 225 25 +. 100 0.25 10 1N4495/180 |171 189 1.4 |1300 7000 7.9) 10.0 | .079 444 +25 .25 +.100 0.25 10 1N4496/200 |190 210 1.2 |1500 8000 7.2] 12.0 | .072 160 -25 225 +. 100 0.25 10 V/ See 4.5.5. Voltages shown are for 5 percent tolerance devices. Voltages for 2 and 1 percent tolerances devices shall be calculated accordingly. 2/ 1N4460D through 1N4496D and 1N6485D through 1N6491D are 1 percent voltage tolerance. 1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance. 1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance. 3/ See 4.5.2. 4/ See 4.5.1. S/ See 4.5.3. 16 Me 0000125 0035057 142 MEMILSMIL-S-19500/406C 4.5.7 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with test method 3101 of MIL-STD-750. The following details shal! apply: Iy = 2.0 A de minimum Iy = 1 to 10 mA tun = 100 ws maximum ty = thermal equilibrium The device shall be allowed to reach thermal equilibrium at current 1, before the measurement shall be made. 3/8 inches for leaded devices. Lead spacing: tS LS = 0 (endcap mount) for US devices. COPPER LEAD CLAMP \ COPPER LEAD CLAMP 4 INFINITE HEAT-DISSIPATOR FIGURE 4. Mounting arrangement. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shalt be in accordance with MIL-S- 19500. & NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 7 M@@! 0000125 0035098 015 MENILSMIL-S-19500/406C 6.2 Acquisition requirements. Acquisition documents must specify the following: a. Issue of DODISS to be cited in the solicitation. b. Lead finish as specified. c. Product assurance level, type designator, and for die acquisition, the JANHC and JANKC identification (see figure 3 and 6.3), top and bottom metallization. 6.3 Suppliers of die. The qualified die suppliers with the applicable letter version (example JANHCA1N4461) will be identified on the QPL. JANG ordering information Manufacturer PIN 12969 1N4461 JANHCA1N4461 thru thru 1N4496 JANHCA1N4496 1N4461 JANHCB1N4461 thru thru 1N4496 JANHCB1N4496 1N4461 JANHCC1N4461 thru thru 1N4496 JSANHCC 1N46496 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER DLA - ES Navy - EC Air Force - 17 (Project 5961-1544) NASA - NA Review activities: Army - AR, MI, SM Navy - AS, CG, MC Air Force - 13, 19, 85 MB 00001e5 0035099 TSS MENILS