1
®ISL54105A
TMDS Regenerator
The ISL54105A is a high-performance TMDS timing
regenerator containing a programmable equalizer and a
clock data recovery (CDR) func tion fo r each of the 3 TMDS
pairs in an HDMI or DVI signal. The TMDS data outputs of
the ISL54105A are regenerated and perfectly aligned to the
regenerated TMDS clock signal, creating an extremely
clean, low-jitter DVI/HDMI signal that can be easily
decoded by any TMDS receiver.
The ISL54105A can be used as a cable extender, to clean
up a noisy/jittery TMDS source, or to provide a very stable
TMDS signal to a finicky DVI or HDMI receiver.
Features
Clock Data Recovery and Retiming
Programmable pre-emphasis on output driver
Programmable internal 50Ω, 100Ω, or high-Z termination
Stand-alone or I2C software-contro lled operation
72 lead, 10mm x 10mm QFN package
Pb-free (RoHS compliant)
Applications
DVI/HDMI extenders
Televisions/PC monitors/projectors
Block Diagram
2TX1
2TX0
2TXC
2TX2
CONFIGURATION AND CONTRO L
RES_BIAS
SCL
PD
RESET
ACTIVITY
DETECT
7
ADDR
SDA
RX0
2
2
RX1
RX2
CDR
CH0
CDR
CH1
CDR
2
PLL
RES_TERM
BIAS GENERATION
TERMINATION AND
EQUALIZATION
TERMINATION
RXC 2
CK
D
CK
D
CK
D
FIFO
CH2
Ordering Information
PART NUMBER TEMP. RANGE (°C) PACKAGE PKG. DWG. #
ISL54105ACRZ 0 to +70 72 Ld QFN (Pb-Free) L72.10x10B
NOTE : These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Key Features
Data Sheet June 4, 2008
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
FN6716.0
2FN6716.0
June 4, 2008
Absolute Maximum Ratings Thermal Information
Voltage on VD (referenced to GND). . . . . . . . . . . . . . . . . . . . . . 4.0V
Voltage on any Input Pin (referenced to GND) . . . -0.3V to VD+0.3V
Voltage on any “5V Tolerant” Input Pin
(referenced to GND). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Current into any Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA
ESD Classification
Human Body Model . . . >4 0 00V, hi g her v o l tage t es t ing i n p r ogres s
Machine Model. . . . . . . .>200V, higher voltage testing in progress
Thermal Resistance (Typical, Note 1) θJA (°C/W)
QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Maximum Biased Junction Temperature . . . . . . . . . . . . . . . . +125°C
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VD = 3.3V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
Electrical Specifications S pecifications apply for VD = 3.3V, pixel rate = 165MHz, T A = +25°C, RES_TERM = 1kΩ, RES_BIAS = 3.16kΩ,
TMDS output load = 50Ω, TMDS output termination voltage VTERM = 3.3V unless otherwise noted.
SYMBOL PARAMETER COMMENT MIN
(Note 2) TYP MAX
(Note 2) UNIT
FULL CHANNEL CHARACTERISTICS
fDATA_MAX Maximum Rx Clock Frequency/Pixel Rate (Note 3) 165 225 MHz
fDATA_MIN Minimum Rx Clock Frequency/Pixel Rate 25 MHz
TMDS RECEIVER CHARACTERISTICS
VSENS Minimum Differential Input Sensitivity 50 150 mVP-P
R50 50Ω Termination Resistance 45 50 55 Ω
R100 100Ω Termination Resistance 90 97 110 Ω
CLKDUTY Rx Clock Duty Cycle 20 80 %
TMDS TRANSMITTER CHARACTERISTICS
jTX_CLOCK Total Jitter on Clock Outputs Independent of incoming jitter 32 ps
jTX_DATA Total Jitter on Data Outputs Independent of incoming jitter 52 ps
SKEWINTRA Intra-Pair (+ to -) Differential Skew ±4 ps
SKEWINTER Inter-Pair (channel-to-channel) Skew Added with respect to incoming
inter-pair skew 2UI
tRISE Rise Time into 50Ω Load to 3.3V 20% to 80% 80 240 ps
tFALL F all Time into 50Ω Load to 3.3V 20% to 80% 80 240 ps
TX VOH Single-Ended High Level Output Voltage VTERM - 10 VTERM + 10 mV
TX VOL Single-Ended Low Level Output Voltage VTERM - 600 VTERM - 400 mV
DIGITAL SCHMITT INPUT CHARACTERISTICS
VIH High Threshold Voltage 2.0 V
VIL High to Low Threshold Voltage 0.8 V
I Input Leakage Current ±10 nA
RPU Internal Pull-Up Resistance SDA and SCL pins 65 kΩ
RPD Internal Pull-Down Resistance AUTO_CH_SEL, CH_SEL_x,
RESET, ADDRx, PD pins 60 kΩ
CIN Input Capacitance 5pF
ISL54105AISL54105A
3FN6716.0
June 4, 2008
DIGITAL OUTPUT CHARACTERISTICS
VOH Output HIGH Voltage, IO = 8mA 2.4 V
VOL Output LOW Voltage, IO = -8mA 0.4 V
POWER SUPPLY REQUIREMENTS
VDSupply Voltage 3 3.3 3.6 V
IDSupply Current Inputs driven by 165Mpixel/s
TMDS signals.
Default register settings
357 405 mA
IDSupply Current in Power-down Mode All available inputs driven by
165Mpixel/s TMDS signals. 20 26 mA
AC TIMING CHARACTERISTICS (2-WIRE INTERFACE)
fSCL SCL Clock Frequency 0 400 kHz
tAA SCL LOW to SDA Data Out Valid 200 470 ns
tBUF Time the Bus Must be Free Before a New
Transmission Can Start 1.3 µs
tLOW Clock LOW Time 1.3 0.1 µs
tHIGH Clock HIGH Time 0.6 0.2 µs
tSU:STA Start Condition Setup Time 0.6 0.03 µs
tHD:STA Start Condition Hold Time 0.6 0.07 µs
tSU:DAT Data In Setup Time 100 0.03 ns
tHD:DAT Data In Hold Time 0 ns
tSU:STO Stop Condition Setup Time 0.6 µs
tDH Data Output Hold Time 160 ns
NOTE:
2. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. T emperature limits established by characterization
and are not production tested.
3. Operation up to 165MHz is guaranteed. While many parts will typically operate up to 225MHz, operation above 165MHz is not guaranteed.
Electrical Specifications S pecifications apply for VD = 3.3V, pixel rate = 165MHz, T A = +25°C, RES_TERM = 1kΩ, RES_BIAS = 3.16kΩ,
TMDS output load = 50Ω, TMDS output termination voltage VTERM = 3.3V unless otherwise noted.
SYMBOL PARAMETER COMMENT MIN
(Note 2) TYP MAX
(Note 2) UNIT
tSU:STO
tDH
tHIGH
tSU:STA tHD:STA tHD:DAT
tSU:DAT
SCL
SDA IN
SDA OUT
tFtLOW
tBUF
tAA
tR
FIGURE 1. 2-WIRE INTERFACE TIMING
ISL54105AISL54105A
4FN6716.0
June 4, 2008
ISL54105A Pin Configuration
NC
NC
NC
ADDR2
72 71 70 69 68 67 66 65 64 63 62 61
NC
NC
ADDR1
VD
NC
VD
NC
VD
60 59
VD
VD
VD
VD_ESD
VD
VD
TXC+
TXC-
TX2+
TX2-
TX1+
TX1-
TX0+
TX0-
VD
VD_ESD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
54
53
52
51
50
49
48
47
46
45
44
43
42
41
NC
PD
VD
VD
VD
VD
RES_TERM
VD
RES_BIAS
VD
RXC-
RXC+
VD
VD
19 20 21 22 23 24 25 26 27 28 29 30 31 32
ADDR3
ADDR4
VD
RX1-
RX1+
VD
RX2-
RX2+
VD
VD
VD
VD
VD
ADDR5
15
16
17
18
RX0-
RX0+
VD
RESET
33 34 35 36
ADDR6
NC
VD
NC
VD
TEST
SCL
SDA
40
39
38
37
58 57
NC
ADDR0
56 55
AD
NC
ISL54105A
5FN6716.0
June 4, 2008
Pin Desc riptions
SYMBOL DESCRIPTION
RX0-, RX0+, RX1-, RX1+, RX2-, RX2+ TMDS Inputs. Incoming TMDS data signals.
RXC-, RXC+ TMDS Inputs. Incoming TMDS clock signals.
TX0-, TX0+, TX1-, TX1+, TX1-, TX1+ TMDS Outputs. TMDS output data for selected channel.
TXC-, TXC+ TMDS Outputs. TMDS output clock for selected channel.
SCL Digital input, 5V tolerant, 500mV hysteresis. Serial data clock for 2-wire interface.
Note: Internal 65kΩ pull-up to VD.
SDA Bidirectional Digital I/O, open drain, 5V tolerant. Serial data I/O for 2-wire interface.
Note: Internal 65kΩ pull-up to VD.
ADDR[6:0] Digital inputs, 5V tolerant. 7-Bit address for serial interface.
Note: Internal 60kΩ pull-down to GND.
AD Digital Output, 3.3V. AD = Activity Detect. Output goes high when an active TMDS clock is detected on
RXC.
RES_BIAS Tie to GND through a 3.16k external resistor. Sets up internal bias currents.
RES_TERM T ie to VD through a 1.0k 1% external resistor. During calibration, the termination resistor closest in value
to RES_TERM/20 (= 50Ω) is selected.
PD Digital Input, 3.3V. PD = Power-down. Pull high to put the ISL54105A in a minimum power consumption
mode.
Note: To ensure proper operation, this pin must be held low during power-up. It may be taken high 100ms
after the power supplies have settled to 3.3V ±10%.
When exiting Power-down, a termination resistor Recalibration cycle must be run to re-trim the
termination resistors (see register 0x03[7]).
Note: Internal 60kΩ pull-down to GND.
RESET Digital Input, 3.3V. Pull high then low to reset the mux. Tie to GND in final application.
Note: Internal 60kΩ pull-down to GND.
TEST Digital Input. Used for production testing only. Tie to GND in final application. This pin has an internal
pulldown to GND, so it is also acceptable to leave this pin floating.
VDPower supply. Connect to a 3.3V supply and bypass each pin to GND with 0.1µF.
VD_ESD Power supply for ESD protection diodes. Connect one of these pins (pin 41 or 53) to the 3.3V VD supply
rail with a low VF (0.4V or lower) Schottky diode, with the cathode connected to VD_ESD and the anode
connected to VD. Bypass each pin to GND with 0.1µF.
THERMAL PAD (GND) Ground return for the entire chip. The thermal pad must have a low impedance connection to GND for
the ISL54105A to function at all. The lower electrical impedance, the better the ground, and the better the
performance. A low thermal impedance between the thermal pad and the GND plane of the PCB will
dissipate the heat from the package more efficiently as well and is recommended.
ISL54105A
6FN6716.0
June 4, 2008
Register Listing
ADDRESS REGISTER (DEFAULT VALUE) BIT(S) FUNCTION NAME DESCRIPTION
0x00 Device ID (read only) 3:0 Device Revision 1 = initial silicon, 2 = second revision, etc.
7:4 Device ID 3 = ISL54105A
0x01 Channel Activity Detect (read only) 1:0 Reserved Reserved
2 Activity Detect 0: TMDS clock not present on RXC
1: TMDS clock detected on RXC
0x02 Channel Selection (0x0C) 3:0 Reserved This nibble should always be set to 0xC.
4 Reset Full chip reset. Write a 1 to reset. Will set itself to 0 when
reset is complete.
5 Power-down 0: Normal Operation
1: Puts the chip in a minimal power consumption mode,
turning off all TMDS outputs and open-circuiting all TMDS
inputs.
This bit is OR'ed with the Power-down input pin. If either is
set, the chip will enter power-down. Serial
I/O stays operational in PD mode.
Note: When exiting Power-down, a termination resistor
Recalibration cycle must be run to re-trim the termination
resistors (see register 0x03[7]).
0x03 Input Control (0x12)
Recommended default: 0x63 0 Reserved Set to 1. Default value of 0 is OK, set to 1 to slightly reduce
power consumption.
1 Reserved Set to 1.
2 Tri-state Clock
Inputs 0: Clock inputs are terminated into 50Ω/100Ω.
1: Clock inputs are tri-stated (to allow chip to operate in
parallel with another TMDS receiver with fixed 50Ω
termination)
3 Tri-state Data Inputs 0: Data inputs are terminated into 50Ω/100Ω.
1: Data inputs are tri-stated (to allow chip to operate in
parallel with another TMDS receiver with fixed 50Ω
termination)
4 Activity Detect Mode 0: AC Activity . Activity detection is based on the presence of
AC activity on TMDS clock inputs. This setting (along with a
hysteresis of 20mV enabled) provides reliable activity
detection. (recommended setting)
1: Common Mode Voltage. If the common mode voltage is
above ~3.05V , the input is considered in active. This method
has been found to be unreliable with small signal swings and
should not be used. This setting is the silicon default but
should be changed in software for more reliable activity
detection.
5 Clock Rx Hysteresis Enables hysteresis for the clock inputs to prevent false clock
detection when both inputs are high. Data inputs do not get
hysteresis.
0: TMDS input hysteresis disabled
1: TMDS input hysteresis enabled. Eliminates false activity
detects on unconnected channels. (recommended setting)
6 Clock Rx Hysteresis
Magnitude Controls the amount of hysteresis in the clock inputs.
0: 10mV
1: 20mV (recommended setting)
7 Recalibrate 0: Normal Operation
1: Recalibrates termination resistance. To recalibrate, take
this bit high, wait at least 1ms, then take this bit low.
Calibration is automatically done after power-on, but
performing a recalibration after the supply voltage and
temperature have stabilized may result in termination
resistances closer to the desired 50Ω.
ISL54105A
7FN6716.0
June 4, 2008
0x04 Termination Control (0x00) 1:0 Reserved Set to 00.
2 Data Termination 0: TMDS Data inputs terminated into 50Ω (normal
operation)
1: TMDS Data inputs terminated into 100Ω (for paralleled
inputs)
5:3 Reserved Set to 000.
6 Clk Termination 0: TMDS Clock inputs terminated into 50Ω (normal
operation)
1: TMDS Clock inputs terminated into 100Ω (f or paralleled
inputs)
7 Reserved Set to 0.
0x05 Output Options (0x00) 0 Tri-state Clock
Outputs 0: Normal Operation
1: Clock outputs tri-stated (allows another chip to drive the
output clock pins)
1 Tri-state Data
Outputs 0: Normal Operation
1: Data outputs tri-stated (allows another chip to drive the
output data pins)
2 Invert Output
Polarity 0: Normal Operation
1: The polarity of the TMDS data outputs is inverted
(+ becomes -, - becomes +). TMDS clock unchanged.
3 Reverse Output
Order 0: Normal Operation
1: CH0 data is output on CH2 and CH2 data is output on
CH0. No change to CH1.
0x06 Data Output Drive (0x00) 3:0 Transmit Current Transmit Drive Current for data signals, adjustable in
0.125mA steps. Clock current is fixed at 10mA.
0x0: 10mA
0x8: 11mA
0xF: 11.875mA
7:4 Transmit
Pre-emphasis Drive boost (in 0.125mA steps) added during first half of
each bit period for data signals. Clock signals do not have
pre-emphasis.
0x0: 0mA
0x8: 1mA
0xF: 1.875mA
0x07 Reserved (0xCC) 7:0 Reserved Default value of 0xCC is OK, can also be set to 0x00.
0x08 Equalization (0xCC) 3:0 Equalizer Gain Boost (dB) = 1dB + <gain value> * 0.8dB
0x0: 1dB boost at 800MHz
0xC: 10.6dB boost at 800MHz (default)
0xF: 13dB boost at 800MHz
7:4 Reserved Default value of 0xC is OK, can also be set to 0x0.
0x09 Test Pattern Generator (0x00) 1:0 Generator Mode When a 25MHz to 165MHz clock is applied to the clock
input, this function will output a PRBS7 pattern on the TX
pins.
0: Normal operation (test patterns disabled)
1: PRBS7 pattern
2: Low frequency toggle (0000011111…)
3: High frequency toggle (1010101010…)
Note: When switching from the high frequency toggle
pattern to the low frequency toggle pattern, you must first
select normal operation.
2 Enable PRBS7 Error
Counter Enables PRBS7 error counter in registers 0x0A to 0x0C.
0: Disable PRBS7 Error Counter
1: Enable PRBS7 Error Counter
Register Listing (Continued)
ADDRESS REGISTER (DEFAULT VALUE) BIT(S) FUNCTION NAME DESCRIPTION
ISL54105A
8FN6716.0
June 4, 2008
0x0A PRBS7 Error Counter Link 0 (read only) 7:0 PRBS7 Error
Counter Link 0 PRBS7 Error Counter of Link 0. Saturates at 0xFF. Reading
this register clears this register at end of read
0x0B PRBS7 Error Counter Link 1 (read only) 7:0 PRBS7 Error
Counter Link 1 PRBS7 Error Counter of Link 1. Saturates at 0xFF. Reading
this register clears this register at end of read
0x0C PRBS7 Error Counter Link 2 (read only) 7:0 PRBS7 Error
Counter Link 2 PRBS7 Error Counter of Link 2. Saturates at 0xFF. Reading
this register clears this register at end of read
0x10 PLL Bandwidth (0x10)
Recommended default: 0x12 1:0 PLL Bandwidth Selects between 4 PLL bandwidth settings
0: 4MHz (silicon default)
1: 2MHz
2: 1MHz (recommended default)
3: 500kHz
1MHz provides slightly better performance with high jitter/
high noise signals.
7:2 Reserved Keep set to 000100 binary.
Register Listing (Continued)
ADDRESS REGISTER (DEFAULT VALUE) BIT(S) FUNCTION NAME DESCRIPTION
ISL54105A
9FN6716.0
June 4, 2008
Application Information
The ISL54105A is a TMDS regenerator , locking to the incoming
DVI or HDMI signal with triple Clock Data Recovery units
(CDRs) and a Phase Locked Loop (PLL). The PLL generates a
low jitter pixel clock from the incoming TMDS clock. The TMDS
data signals are equalized, sliced by the CDR, re-aligned to the
PLL clock, and sent out the TMDS outputs.
Activity Detection
The TMDS input is considered active using one of two
methods. The original default activity detect method (registe r
0x03b4 = 1) is to measure the co mmon mode of the TMDS
clock input for each channel. If the common mode is 3.3V, it
indicates that there is nothing connected to tha t input, or that
whatever is connected is turned off (in active). This has been
found to be relatively unreliabl e, particularly with weak sign als.
The preferred method of activity detection is lookin g for an
active AC signal on the TMDS clock input for that channel
(register 0x03b4 = 1). This is more robust, however
disconnected inputs will cause both inputs to the differential
receiver to be the same level - 3.3V. If the offset error of the
differential TMDS receiver is very small, the receiver can not
resolve a 1 or a 0 and will randomly switch between states,
which may be detected as an active clock. Register 0x03 bit s
5 and 6 allow a 10mV or 20mV offset to be added to the input
stage of the clock inputs, eliminating this problem. This offset
will slightly reduce the sensitivity of TMDS receiver for the
clock lines, but since the clock signals are much lower
frequency than the data, they will not be nearly as
attenuated, so this is not a problem in practice.
Again, using the AC activity detection method (register
0x03b4 = 0) is recommended.
Rx Equalization
Register 0x08 bits 3:0 control the amount of equalization
applied to the TMDS inputs, providing 4 bits of control. The
equalization range available is from a minimum of 1dB boost
to a maximum of 13dB at 800MHz, in 0.8dB increments.
Ideally, the equalization is adjusted in the final application to
provide optimal performance with the specific DVI/HDMI
transmitter and cable used. In general, the amount of
equalization required is propo rtional to the cable length. If
the equalization must be fixed (can not be adjusted in the
final application), an equalization setting of 0xA works well
with short cables as well as medium to longer cables.
Tx Pre-emphasis
The transmit pre-emphasis function sinks additional current
during the first bit after every transition, increasing the slew
rate for a given capacitance, and helping to maintain the
slew rate when using longer/higher capacitance cables.
Pre-emphasis is controlled by register 0x06 bits 7:4, and
ranges from a minimum of 0mA (no pre-emphasis) to
1.875mA (max pre-emphasis).
PLL Bandwidth
The 2-bit PLL Bandwidth register controls the loop
bandwidth of the PLL used to recover the incoming clock
signal. The default 4MHz setting works well in most
applications, however a lower bandwidth of 1MHz has
proven to work just as well with good TMDS sources and
slightly better with marginal sources.
Power-down
The chip can be placed in a Power-down mode when not in
use to conserve power. Setting the Power-down bit (register
0x02 bit 5) to a 1 or pulling the PD input pin high pl aces the
chip in a minimal power consumption mode, turning off all
TMDS outputs and disconnecting all TMDS inputs. Serial I/O
stays operational in PD mode. Note that the PD pin must be
low during power-on in order to initialize the I2C in terface.
Note: When exiting Power-down, a termination resistor
Recalibration cycle mu st be run to re-trim the termination
resistors (see register 0x03[7]).
Typical Performance
Setup A (Figure 2) was used to capture the TMDS eye
diagrams shown in Figure 3 and Figure 4:
The 162.5Mpixel/s (UXGA 60Hz) DVI outp ut of the Chroma
2326 was terminated into a T PA2 Plug adapter and
measured with a LeCroy differential probe and 6MHz SDA
using the LeCroy’s software clock recovery. As Figure 3
shows, the amplitude of the TMDS signal is slightly low, but
the eye is otherwise acceptable.
CHROMA 2326
VIDEO PATTERN
GENERATOR @
UXGA 60Hz
DELL 2000FP
UXGA MONITOR
15m DUAL-LINK
DVI CABLE
FIGURE 2. TEST SETUP A
FIGURE 3 FIGURE 4
FIGURE 3. EYE DIAGRAM AT OUTPUT OF CHROMA
GENERATOR
ISL54105A
10 FN6716.0
June 4, 2008
Next, a 15m DualLink DVI cable was attached and
terminated into a female TPA2 adapter and the eye captured
in Figure 4.
The eye is not meeting the minimum requirements of either
the HDMI or DVI standards and the Dell Monitor is unable to
recover the data and display an image.
Setup B inserts an ISL54105A and an additional 15m cable
between the pattern generator and the monitor:
Given the input signal shown in Figure 4, the ISL54105A’s
TMDS output signal (Figure 6) is extremely clean. The
output is an improvement over the original signal coming
from the pattern generator in both amplitude and jitter.
The cleaner signal generated at the output of the ISL54105A
results in an improved eye at the end of another 15m cable
(Figure 7). The eye is open enough that the Dell 2000FP can
now display a UXGA image with no visible sparkle or other
artifacts.
Tx Loading Considerations
When the ISL54105A is powered-up and its Tx outputs are
disabled, via either the PD (power down) pin, the
power-down reg i ster bit (register 0x 02[5]), or the tri-state
outputs bits (register 0x05[1:0]), the Tx pins are high
impedance. In this state they will draw no current from the
Rx pins of any TMDS receiver they may be connected to.
However, if power to the ISL54105A is removed, the Tx pins
are no longer high-impedance. Figure 8 shows the relevant
equivalent circuit, including the internal ESD protection
diodes. For simplicity’s sake, only one of the eight Tx
outputs, ESD protection diodes, and Rx termination resistors
are shown.
When VD to the ISL54105A drops below ~2.7V and power is
applied to the external TMDS receiver, ESD protection
diodes inside the ISL54105A can become forward-biased,
FIGURE 4. CHROMA EYE DIAGRAM AFTER 15m CABLE
CHROMA 2326
VIDEO PATTERN
GENERATOR
15m DUAL-LINK
DVI CABLE
DELL 2000FP
UXGA MONITOR
ISL54105A 15m DUAL-LINK
DVI CABLE
FIGURE 5. TEST SETUP B
FIGURE 6
FIGURE 3
FIGURE 4 FIGURE 7
FIGURE 6. EYE DIAGRAM AT OUTPUT OF ISL54105A
FIGURE 7. ISL54105A EYE DIAGRAM AFTER 15m CABLE
ISL54105A
11 FN6716.0
June 4, 2008
drawing current from the external TMDS receiver it is
attached to.
This is non-ideal and can cause the ISL54105A to fail HDMI
Compliance Test 7-3 (“VOFF”). VOFF is the voltage across
each 50Ω RxN resistor when the power is removed from the
device containing the ISL54105A.
To prevent this leakage current, insert a Schottky diode
between the VD power net and the VD_ESD pins as shown
in Figure 9. With the addition of this diode the system will
pass compliance test 7-3.
Inter-Pair (Channel-to-Channel) Skew
The read pointers for Channel 0, 1, and 2 of the FIFO that
follows the CDR all have the same clock, so all 3 channels
transition within a few picoseconds of each other - there is
essentially no skew between the transitions of the three
channels.
However the FIFO read pointers may be positioned up to 2
bits apart relative to each other, introducing a random, fixed
channel-to-channel skew of skew of 1 or (much less
frequently) 2 bits. The random skew is introduced whenever
there is a discontinuity in the input signal (typically a video
mode change or a new mux channel selection). After the
CDRs and PLL lock, the skew is fixed until the next
discontinuity . This adds up to 2 bits of skew in addition to any
incoming skew, as shown in the following examples.
Figure 10 shows an input (the top three sign als) with
essentially no skew. After the ISL54105A locks on to the
signal, there may be 1 bit of skew on the output, as shown in
Figure 10.
When there is pre-existing skew on the input, the ISL54105A
can add up to 2 bits to the channel-to-channel skew. In the
example in Figure 11, the incoming red channel has 2.3 bits
of skew relative to the incoming green and blue. The FIFO’s
quantization (worst case) increases the total skew to 4.0 bits.
While increasing skew is not desirable, DVI and HDMI
receivers are re qu i red to have a minimum of 6 bi ts of inter-
pair skew tolerance, so the addition of 2 bits of skew is only a
problem with the most pathological cables and transmitters.
It does, however, limit the number of ISL54105As that can
be put in series (although statistically it is unlikely that all the
skews would line up in a worst-case configuration).
FIGURE 8. ISL54105A ESD PROTECTION DIODES
ISL54105A
VD
VD_ESD (41 , 5 3)
3.3VTX
TxN
Tx
3.3VRX
50RxN
FIGURE 9. SCHOTTKY DIODE MODIFICATION
ISL54105A
VD
VD_ESD (41 , 5 3)
3.3VTX
TxN
Tx
3.3VRX
50RxN
D1
C1
0.1μF
FIGURE 10. MAXIMUM ADDITIONAL INTERCHANNEL SKEW
FOR INPUTS WITH NO OR LITTLE SKEW
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3
B
Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3
B
Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3
B
Bit 8Bit 9
Bit 4Bit 5Bit 6 Bit 0Bit 1Bit 2Bit 3
B
Bit 7Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3
B
Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3
B
Bit 8Bit 9
INPUT SKEW
(none, in this
example)
OUTPUT SKEW
(1 bit – 615ps at
162.5Mpixels/s)
FIGURE 1 1. MAXIMUM ADDITIONAL INTERCHANNEL SKEW
FOR INPUTS WITH MODERATE TO LARGE
SKEW
Bit 4Bit 5 Bit 0Bit 1Bit 2Bit 3 Bit 7Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3 Bit 7Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3 Bit 7Bit 8Bit 9
Bit 4 Bit 0Bit 1Bit 2Bit 3 Bit 6Bit 7
Bit 8
Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3 Bit 7Bit 8Bit 9
Bit 4Bit 5Bit 6Bit 7 Bit 0Bit 1Bit 2Bit 3 Bit 8Bit 9
INPUT SKEW
(2.3 b its /1.4ns
in this example)
OUTPUT SKEW
(4 bits /2.5ns at
162.5Mpixels/s)
Bit 5Bit 6
Bit 4Bit 5
Bit 8
ISL54105A
12 FN6716.0
June 4, 2008
PCB Layout Recommendations
Because of the high speed of the TMDS signals, careful
PCB layout is critical to maximize performance. The
following guideline s should be adhered to as closely as
possible:
All TMDS pair traces should have a characteristic
impedance of 50Ω with respect to the power/ground
planes and 100Ω with respect to each other. Failure to
meet this requirement will increase reflections, shrinking
the available eye.
Avoid vias for all 3 high speed TMDS pairs. Vias add
inductance which cause s a di sco n ti nu i ty i n th e
characteristic impedance of the trace. Keep all the traces
on the top (or the bottom) of the PCB. The TMDS clock
can have vias if necessary, since it is lower speed and less
critical. If you must use a via, ensure the vias are
symmetrical (put identical vias in both lines of the
differential pair).
For each TMDS channel, the trace lengths of the 3 TMDS
pairs (0, 1 and 2) should ideally be the same to reduce
inter channel skew introduced by the board.
The trace length of the clock pair is not critical at all.
Since the clock is only used as a frequency reference, its
phase/delay is inconsequential. In addition, since the
TMDS clock frequency is 1/10th the pixel rate, the clock
signal itself is much more noise-immune. So liberties
(such as vias and circuitous paths) can be taken when
routing the cl ock lines.
Minimize capacitance on all TMDS lines. The lower the
capacitance, the sharper the rise and fall times.
Maintain a constant, solid ground (or power) plane under
the 3 high speed TMDS signals. Do not route the signals
over gaps in the ground plane or over other traces.
Ideally each supply should be bypassed to ground with a
0.1µF capacitor. Minimize trace length and vias to
minimize inductance and maximize noise rejection.
Figure 12 demonstrates a common but non-ideal PCB
layout and its equivalent circuit. The additional trace
resistance between the bypass capacitor and the power
supply/IC reduces its effectiveness. Figure 13
demonstrates a better layout. In this case there is still
series trace resistance (it is impossible to completely
eliminate it), but now it is being put to good use, as part of
a “T” filter , attenuating supply noise before it gets to the IC,
and reducing the amount of IC-generated noise that gets
injected into the supply. Follow the good supply bypassing
rules shown in Figure 13 to the extent possible.
FIGURE 12. SUB-OPTIMAL BYPASS CAPACITOR LAYOUT
CBYPASS
RTRACE
V+
RTRACE
IC
V+
GND
GROUND PLANE
POWER PLANE
CBYPASS IC
V+
GND
VIAS
TO
GND
VIA TO
POWE R
PLANE
EQUIVALENT CIRCUIT
RVIA
FIGURE 13. OPTIMAL (“T”) BYPASS CAPACITOR LAYOUT
CBYPASS
RTRACE
V+
RTRACE
IC
V+
GND
GROUND PLANE
C BYPASS IC
V+
GND
VIAS
TO
GND
VIA TO
POWER
PLANE
EQUIVALENT CIRCUIT
POW ER PLANE
RVIA
ISL54105A
13 FN6716.0
June 4, 2008
ISL54105A Serial Communication
Overview
The ISL54105A uses a 2-wire serial bus for communication
with its host. SCL is the Serial Clock line, driven by the host
and SDA is the Serial Data line, which can be dr iven by all
devices on th e bu s. SDA is open drain to all ow mu ltiple
devices to share the same bus simultaneously.
Communication is accomplished in three steps:
1. The Host selects the ISL54105A it wishes to
communicate with.
2. The Host writes the initial ISL54105A Configuration
Register address it wishes to write to or read from.
3. The Host writes to or reads from the ISL54105A’s
Configuration Register. The ISL54105A’s internal
address pointer auto increments, so to read registers
0x00 through 0x1B, for example, one would write 0x00 in
step 2, then repeat step three 28 times, with each read
returning the ne xt re gister value.
The ISL54105A has a 7-bit address on the serial bus,
determined by the ADDR0-ADDR6 bits. This allows up to
128 ISL54105As to be independently controlled by the same
serial bus.
The bus is nominally inactive, with SDA and SCL high.
Communication begins when the host issues a START
command by taking SDA low while SCL is high (Figure 14).
The ISL54105A continuously monitors the SDA and SCL
lines for the start condition and will not respond to any
command until this condition has been met. The host then
transmits the 7-bit serial address plus a R/W bit, indicating if
the next transaction will be a Read (R/W = 1) or a Write (R/W
= 0). If the address transmitted matches that of any device
on the bus, that device must respond with an
ACKNOWLEDGE (Figure 15).
Once the serial address has been transmitted and
acknowledged, one or more bytes of information can be
written to or read from the slave. Communication with the
selected device in the selected direction (read or write) is
ended by a STOP command, where SDA rises while SCL is
high (Figure 14), or a second START command, which is
commonly used to reverse data direction without
relinquishing the bus.
Data on the serial bus must be valid for the entire time SCL
is high (Figure 16). To achieve this, data being written to the
ISL54105A is latched on a delayed version of the rising edge
of SCL. SCL is delayed and deglitched inside the ISL54105A
for three crystal clock periods (120ns for a 25MHz crystal) to
eliminate spurious clock pulses that could disrupt serial
communication.
When the contents of the ISL54105A are being read, the
SDA line is updated after the falling edge of SCL, delayed
and deglitched in the same manner.
Configuration Register Write
Figure 17 shows two views of the steps necessary to write
one or more words to the Configuration Register.
Configuration Register Read
Figure 18 shows two views of the steps necessary to read
one or more words from the Configuration Register.
SCL
SDA
START STOP
FIGURE 14. VALID START AND STOP CONDITIONS
SCL FROM
HOST
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
81 9
START ACKNOWLEDGE
FIGURE 15. ACKNOWLEDGE RESPONSE FROM RECEIVER
ISL54105A
14 FN6716.0
June 4, 2008
SCL
SDA
DATA STABLE DATA CHANGE DATA STABLE
FIGURE 16. VALID DATA CHANGES ON THE SDA BUS
D7 D6 D5 D2D4 D3 D1 D0
A0A7 A2A4 A3 A1
ISL54105A Register Data Write(s)
This is the data to be written to the ISL54105A’s configuration
register.
Note: The ISL54105A’s Configuration Register’s address pointer
auto increments after each data write: repeat this step to write
multiple sequential bytes of data to the Configuration Register.
A6 A5
0
R/W
ISL54105A Register Address Write
This is the address of the ISL54105A’s configuration register
that the following byte will be written to.
ISL54105A Serial Bus
FIGURE 17. CONFIGURATION REGISTER WRITE
START Command
STOP Command
(Repeat if desired)
Signals the beginning of serial I/O
Signals the ending of serial I/O
S
T
A
R
T
S
T
O
P
Data
Write*
Register
Address
Serial Bus
Address
A
C
K
AAAAAAAA A
C
K
dddddddd
A
C
K
aaaaaaa0
* The data write step may be repeated to write to the
ISL54105A’s Configuration Register sequentially, beginning at
the Register Address written in the previous step.
SDA Bus
Signals from
the
Signals from
the Host
ISL54105A Device Select Address Write
The first 7 bits of the first byte select the ISL54105A on the 2-
wire bus at the address set by the ADDR[6:0} pins. The R/W bit
is a 0, indicating that the next transaction will be a write.
ADDR1 ADDR0ADDR3 ADDR2ADDR5 ADDR4ADDR6
ISL54105A
15
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of Intersil or its subsidiari es.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6716.0
June 4, 2008
FIGURE 18. CONFIGURATION REGISTER READ
A0A7 A2A4 A3 A1A6 A5
R/W
ISL54105A Register Address Write
This sets the initial address of the ISL54105A’s configuration
register for subsequent reading.
ISL54105A Serial Bus
START Command Signals the beginning of serial I/O
ISL54105A Serial Bus Address Write
This is the same 7-bit address that was sent previously, however
the R/W bit is now a 1, indicating that the next transaction(s) will
be a read.
D7 D6 D5 D2D4 D3 D1 D0 ISL54105A Register Data Read(s)
This is the data read from the ISL54105A’s configuration register.
Note: The ISL54105A’s Configuration Register’s address pointer
auto increments after each data read: repeat this step to read
multiple sequential bytes of data from the Configuration Register.
R/W
ISL54105A Serial Bus
START Command
STOP Command
(Repeat if desired)
Ends the previous transaction and starts a new one
Signals the ending of serial I/O
S
T
A
R
T
S
T
O
P
Data
Read*
SDA Bus
Signals from
the
Signals from
the Host Register
Address
Serial Bus
Address
A
C
K
AAAAAAAA
A
C
K
dddddddd
A
C
K
aaaaaaa0
* The data read step may be repeated to read
from the ISL54105A’s Configuration Register
sequentially, beginning at the Register
Address written in the two steps previous.
R
E
S
T
A
R
T
Serial Bus
Address
A
C
K
aaaaaaa1
ISL54105A Device Select Address Write
The first 7 bits of the first byte select the ISL54105A on the 2-
wire bus at the address set by the ADDR[6:0} pins. R/W = 0,
indicating that the next transaction will be a write.
0
ADDR1 ADDR0ADDR3 ADDR2ADDR5 ADDR4ADDR6
1
ADDR1 ADDR0ADDR3 ADDR2ADDR5 ADDR4ADDR6
ISL54105A
16 FN6716.0
June 4, 2008
ISL54105A
Package Outline Drawing
L72.10x10B
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN)
Rev 0, 5/07
BOTTOM VIEW
SIDE VIEW
TOP VIEW
C0.400 X 45°
11° ±1° ALL AROUND
eb
L 0.450
8.50 REF.
4.70 REF.
(0.125)
68X
TYPICAL RECOMMENDED LAND PATTERN
PACKAGE OUTLINE
(4X)
INDEX AREA
6
PIN 1
4
PIN #1 INDEX AREA
6
R0.200 MAX
ALL AROUND
(4X)
Y
1
72
0.100 C
DETAIL “Z” TYP.
R0.115
TYP.
R0.200
R0.200
1
72
EXPOSED PAD AREA
X
A
(4X)
(4X)
PLANE
SEATING
(ALL AROUND)
Z
72
1
0.19~ 0.245
10.00
10.00
9.75
(72X 0.60)
(68X 0.50)
(72X 0.20)
(72X 0.23)
4.70
9.75
10.00
0.85
0.65
0.23
0.50
72X 0.40 ±0.1 mm
B
9.75 10.00
B0.100 MAC
B0.100 MAC
0.050 MC
0.08 C
C
0.25 ±0.02
DETAIL “X”
DETAIL “Y”
0.15
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05;
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
between 0.15mm and 0.30mm from the terminal tip.
Dimension b applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and toleran cing conform to JESD-MO 220.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
body tolerance: ±0.1mm