Approval sheet Capacitor Arrays Series MULTILAYER CERAMIC CAPACITORS Capacitor Arrays Series (10V to 50V) 4 x 0402, 4 x 0603 Size NP0, X7R & Y5V Dielectrics RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series 1. INTRODUCTION WTC middle and high voltage series MLCC is designed by a special internal electrode pattern, which can reduce voltage concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords increased capacitance values in a given case size and voltage rating. WTC capacitor arrays are developed to offer designers the opportunity to lower placement costs increase assembly line output through lower component count per board. 2. FEATURES 3. APPLICATIONS a. a. b. c. High density mounting due to mounting space saving. Mounting cost saving. Increased throughput. b. c. For use as a bypass for digital and analog signal line noise Computer motherboards and peripherals. The other common electronic circuits. 4. HOW TO ORDER Y 4C Series Cap. Nr. 3 B 103 Termination pitch Dielectric Capacitance Y=Capacitor 4C=4xCap 3=0.03" pitch array 2=0.02" pitch N=NP0 (C0G) B=X7R F=Y5V Two significant digits followed by no. of zeros. And R is in place of decimal point. K 500 C T Tolerance Rated voltage Termination Packaging J=5% K=10% M=20% Z=-20/+80% eg.: 103=10x103 =10,000pF =10nF Page 2 of 8 ASC_ Cap_Arrays_005M_AS Two significant C=Cu/Ni/Sn digits followed by no. of zeros. And R is in place of decimal point. T=7" reeled eg.: 100=10 VDC 160=16 VDC 250=25 VDC 500=50 VDC Oct. 2012 Approval sheet Capacitor Arrays Series 5. EXTERNAL DIMENSIONS L S W T BW P Fig. 1 The outline of MLCC Size Inch (mm) L (mm) W (mm) 0508 (1220) 2.000.15 1.250.15 0.850.10 0612 (1632) 3.200.15 1.600.15 0.800.10 T (mm)/Symbol S (mm) BW (mm) P (mm) T 0.200.10 0.250.10 0.500.10 B 0.300.20 0.400.15 0.800.15 Reflow soldering process only. 6. GENERAL ELECTRICAL DATA Dielectric Size Capacitance* Capacitance tolerance** NP0 X7R 4x0603 4x0402 4x0603 4x0603 10pF to 270pF 10pF to 470pF 1000pF to 100nF 180pF to 100nF 10nF to 100nF J (5%), K (10%) Rated voltage (WVDC) 50V Q/Tan * Cap<30pF: Q400+20C Cap30pF: Q1000 Insulation resistance at Ur Termination K (10%), M (20%) 25, 50V 10V, 16V, 25V, 50V 16V, 25V, 50V Ur=50V, 2.5% Ur=25V&16V, 3.5% Ur=10V, 5.0% 10G Operating temperature Capacitance characteristic Y5V 4x0402 Z (-20/+80%) 16V, 50V Ur=50V, 5% Ur=16V, 7% 10G or RxC500xF whichever is less -55 to +125C 30ppm -25 to +85C 15% +30/-80% Ni/Sn (lead-free termination) * Measured at 30~70% related humidity. NP0: Apply 1.00.2Vrms, 1.0MHz10% at the conditions of 25C ambient temperature. X7R: Apply 1.00.2Vrms, 1.0kHz10%, at the conditions of 25C ambient temperature. Y5V: Apply 1.00.2Vrms, 1.0kHz10%, at the conditions of 20C ambient temperature. ** Preconditioning for Class II MLCC: Perform a heat treatment at 15010C for 1 hour, then leave in a mbient condition for 242 hours before measurement. Page 3 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series 7. CAPACITANCE RANGE SIZE Capacitance DIELECTRIC RATED VOLTAGE (VDC) 10pF (100) 4 x 0402 NP0 50 4 x 0603 X7R 10 16 NP0 25 50 X7R 25 50 16 Y5V 25 50 T B B 15pF (150) 22pF (220) T T B B B B 33pF (330) T B B 47pF (470) T B B 68pF (680) T B B 100pF (101) T B B 150pF (151) 180pF (181) T T B B B B B B 220pF (221) T B B B B 270pF (271) T B B B B 330pF (331) B B B B 470pF (471) B B B B B B 16 50 6,80pF (681) 1,000pF (102) T T T T B B 1,500pF (152) T T T T B B 2,200pF (222) T T T T B B 3,300pF (332) T T T T B B 4,700pF (472) T T T T B B 6,800pF (682) 0.010F (103) T T T T T T T T B B B B B 0.015F (153) T T T B B B B 0.022F (223) T T T B B B B 0.033F (333) T T T B B 0.047F (473) T T T B B 0.068F (683) 0.10F (104) T T T T T T B B B B B 1. The letter in cell is expressed the symbol of product thickness. 8. PACKAGING DIMENSION AND QUANTITY Size 4 x 0402 4 x 0603 Paper tape Thickness/Symbol (mm) 0.850.10 0.800.10 7" reel T B 4k 4k 13" reel Unit: pieces Page 4 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series 9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. 1. Item Visual and Test Condition --- * No remarkable defect. Mechanical 2. 3. 4. Requirements * Dimensions to conform to individual specification sheet. Capacitance Class I: (NP0) Q/ D.F. 1.00.2Vrms, 1MHz10% NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C (Dissipation Class II: (X7R, Y5V) X7R: Ur=50V, 2.5%; Ur=25V&16V, 3.5%; Ur=10V, 5.0% Factor) 1.00.2Vrms, 1kHz10% Y5V: Ur=50V, 5%; Ur=16V, 7% Dielectric * To apply 250% rated voltage. Strength * Duration: 1 to 5 sec. * Shall not exceed the limits given in the detailed spec. * No evidence of damage or flash over during test. * Charge and discharge current less than 50mA. 5. Insulation To apply rated voltage for max. 120 sec. 10G or RxC500-F whichever is smaller. Resistance 6. 7. Temperature With no electrical load. Coefficient T.C. Operating Temp T.C. NP0 -55~125C at 25C NP0 Within 30ppm/C X7R -55~125C at 25C X7R Within 15% Y5V -25~85C at 20C Y5V Within +30%/-80% Adhesive Strength of 8. * Pressurizing force Capacitance Change * No remarkable damage or removal of the terminations. 5N (0603) and 10N (>0603) Termination * Test time: 101 sec. Vibration * Vibration frequency: 10~55 Hz/min. * No remarkable damage. Resistance * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Measurement to be made after keeping at room temp. for 242 hrs. 9. Solderability * Solder temperature: 2355C 95% min. coverage of all metalized area. * Dipping time: 20.5 sec. 10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage. of the pressurizing rod at a rate of about 1 mm per second until * Cap change the deflection becomes 1 mm and then the pressure shall be NP0: within 5.0% or 0.5pF whichever is larger. maintained for 51 sec. X7R: within 12.5% * Measurement to be made after keeping at room temp. for Y5V: within 30% 242 hrs. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to * Solder temperature: 2605C Soldering Heat * Dipping time: 101 sec * No remarkable damage. * Cap change: * Preheating: 120 to 150C for 1 minute before imme rse the NP0: within 2.5% or 0.25pF whichever is larger. capacitor in a eutectic solder. X7R: within 7.5% * Before initial measurement (Class II only): Perform Y5V: within 20% 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Measurement to be made after keeping at room temp. for * 25% max. leaching on each edge. 242 hrs. Page 5 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series No. 12. Item Test Condition Requirements Temperature * Conduct the five cycles according to the temperatures and * No remarkable damage. Cycle time. * Cap change Step Temp. (C) Time (min.) 1 Min. operating temp. +0/-3 303 2 Room temp. 2~3 3 Max. operating temp. +3/-0 303 4 Room temp. 2~3 NP0: within 2.5 or 0.25pF whichever is larger. X7R: within 7.5% Y5V: within 20% * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. 13. Humidity * Test temp.: 402C (Damp Heat) * Humidity: 90~95% RH * No remarkable damage. Steady State * Test time: 500+24/-0hrs. * Cap change: NP0: within 5.0% or 0.5pF whichever is larger. X7R: within 12.5% *Before initial measurement (Class II only): Perform Y5V: within 30% 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for * Q/D.F. value: NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C 242 hrs Cap<10pF; Q200+10C X7R: Ur=50V, 3%; Ur=25V&16V, 5%; Ur=10V, 7.5% Y5V: Ur=50V, 7.5%; Ur=16V, 10% * I.R.: 1G or RxC50-F whichever is smaller. 14. Humidity * Test temp.: 402C * No remarkable damage. (Damp Heat) * Humidity: 90~95%RH * Cap change: NP0: within 7.5% or 0.75pF whichever is larger. Load * Test time: 500+24/-0 hrs. X7R: within 12.5% * To apply voltagerated voltage. * Before initial measurement (Class II only): To apply test Y5V: within 30% * Q/D.F. value: voltage for 1hr at 40C and then set for 242 hrs a t room temp. NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C * Measurement to be made after keeping at room temp. for X7R: Ur=50V, 3%; Ur=25V&16V, 5%; Ur=10V, 7.5% Y5V: Ur=50V, 7.5%; Ur=16V, 10% 242 hrs. * I.R.: 500M or RxC25-F whichever is smaller. 15. High * Test temp.: Temperature NP0, X7R: 1253C Load Y5V: 853C (Endurance) * No remarkable damage. * Cap change: NP0: within 3.0% or 0.3pF whichever is larger. X7R: within 12.5% * To apply voltage: 200% of rated voltage. * Test time: 1000+24/-0 hrs. *Before initial measurement (Class II only): To apply test Y5V: within 30% * Q/D.F. value: NP0: Cap30pF, Q350 voltage for 1hr at test temp. and then set for 242 hrs at room 10pFCap<30pF, Q275+2.5C temp. Cap<10pF, Q200+10C *Measurement to be made after keeping at room temp. for 242 hrs X7R: Ur=50V, 3%; Ur=25V&16V, 5%; Ur=10V, 7.5% Y5V: Ur=50V, 7.5%; Ur=16V, 10% * I.R.: 1G or RxC50-F whichever is smaller. Page 6 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series APPENDIXES Tape & reel dimensions Fig. 2 The dimension of paper tape Size Thickness A0 4x0402 T 1.500.10 4x0603 B 2.000.10 B0 2.300.10 3.500.10 T 0.950.05 0.950.05 K0 - 8.000.10 W 8.000.10 P0 4.000.10 4.000.10 10xP0 40.00.10 40.00.10 P1 4.000.10 4.000.10 P2 2.000.05 2.000.05 D0 1.550.05 1.500.05 D1 - - E 1.750.05 1.750.10 F 3.500.05 3.500.05 Size Reel size C W1 A N 4x0402, 4x0603 7" 13.0+0.5/-0.2 8.4+1.5/-0 178.00.10 60.0+1/-0 Fig. 3 The dimension of reel Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Page 7 of 8 ASC_ Cap_Arrays_005M_AS Oct. 2012 Approval sheet Capacitor Arrays Series Constructions No. Name NP0, X7R, Y5V 1 Ceramic material BaTiO3 based 2 Inner electrode Ni 3 4 Termination 5 Inner layer Cu Middle layer Ni Outer layer Sn (Matt) Fig. 4 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 5 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Page 8 of 8 Fig. 6 Recommended wave soldering profile for SMT process with SnAgCu series solder. ASC_ Cap_Arrays_005M_AS Oct. 2012