LM2703MFXADJNOPB - NATIONAL SEMICONDUCTOR

LM5100A,LM5100B,LM5100C,LM5101A,LM5101B,

LM5101C

LM5100A/B/C LM5101A/B/C 3A, 2A and 1A High Voltage High-Side and Low-Side

Gate Drivers

Literature Number: SNOSAW2M

LM5100A/B/C

LM5101A/B/C

August 20, 2011

3A, 2A and 1A High Voltage High-Side and Low-Side Gate

Drivers

General Description

The LM5100A/B/C and LM5101A/B/C High Voltage Gate

Drivers are designed to drive both the high-side and the low-

side N-Channel MOSFETs in a synchronous buck or a half-

bridge configuration. The floating high-side driver is capable

of operating with supply voltages up to 100V. The “A” versions

provide a full 3A of gate drive while the “B” and “C” versions

provide 2A and 1A respectively. The outputs are indepen-

dently controlled with CMOS input thresholds (LM5100A/B/C)

or TTL input thresholds (LM5101A/B/C). An integrated high

voltage diode is provided to charge the high-side gate drive

bootstrap capacitor. A robust level shifter operates at high

speed while consuming low power and providing clean level

transitions from the control logic to the high-side gate driver.

Under-voltage lockout is provided on both the low-side and

the high-side power rails. These devices are available in the

standard SOIC-8 pin, PSOP-8 pin and the LLP-10 pin pack-

ages. The LM5100C and LM5101C are also available in

eMSOP-8 package. The LM5101A is also available in LLP-8

pin package.

Features

■Drives both a high-side and low-side N-Channel

MOSFETs

■Independent high and low driver logic inputs

■Bootstrap supply voltage up to 118V DC

■Fast propagation times (25 ns typical)

■Drives 1000 pF load with 8 ns rise and fall times

■Excellent propagation delay matching (3 ns typical)

■Supply rail under-voltage lockout

■Low power consumption

■Pin compatible with HIP2100/HIP2101

Typical Applications

■Current Fed push-pull converters

■Half and Full Bridge power converters

■Synchronous buck converters

■Two switch forward power converters

■Forward with Active Clamp converters

Package

■SOIC-8

■PSOP-8

■LLP-8 (4 mm x 4 mm)

■LLP-10 (4 mm x 4 mm)

■eMSOP-8

Simplified Block Diagram

20203103

FIGURE 1.

LM5100A/B/C, LM5101A/B/C 3A, 2A and 1A High Voltage High-Side and Low-Side Gate Drivers

Input/Output Options

Part Number Input Thresholds Peak Output Current

LM5100A CMOS 3A

LM5101A TTL 3A

LM5100B CMOS 2A

LM5101B TTL 2A

LM5100C CMOS 1A

LM5101C TTL 1A

Connection Diagrams

20203101

20203137

20203135

20203102

20203136

www.national.com 2

LM5100A/B/C, LM5101A/B/C

Ordering Information

Ordering Number Package Type NSC Package Drawing Supplied As

LM5100A/LM5101AM SOIC 8 M08A 95 units shipped in anti static rails

LM5100A/LM5101AMX SOIC 8 M08A 2500 shipped in Tape & Reel

LM5100A/LM5101AMR PSOP 8 MRA08A 95 units shipped in anti static rails

LM5100A/LM5101AMRX PSOP 8 MRA08A 2500 shipped in Tape & Reel

LM5100A /LM5101ASD LLP 10 SDC10A 1000 shipped in Tape & Reel

LM5100A/LM5101ASDX LLP 10 SDC10A 4500 shipped in Tape & Reel

LM5100B/LM5101BMA SOIC 8 M08A 95 units shipped in anti static rails

LM5100B/LM5101BMAX SOIC 8 M08A 2500 shipped in Tape & Reel

LM5100B/LM5101BSD LLP 10 SDC10A 1000 shipped in Tape & Reel

LM5100B/LM5101BSDX LLP 10 SDC10A 4500 shipped in Tape & Reel

LM5100C/LM5101CMA SOIC 8 M08A 95 units shipped in anti static rails

LM5100C/LM5101CMAX SOIC 8 M08A 2500 shipped in Tape & Reel

LM5100C /LM5101CSD LLP 10 SDC10A 1000 shipped in Tape & Reel

LM5100C/LM5101CSDX LLP 10 SDC10A 4500 shipped in Tape & Reel

LM5100C/LM5101CMYE eMSOP-8 MUY08A 250 shipped in Tape & Reel

LM5100C/LM5101CMY eMSOP-8 MUY08A 1000 shipped in Tape & Reel

LM5100C/LM5101CMYX eMSOP-8 MUY08A 3500 shipped in Tape & Reel

LM5101ASD-1 LLP 8 SDC08A 1000 shipped in Tape & Reel

LM5101ASDX-1 LLP 8 SDC08A 4500 shipped in Tape & Reel

3 www.national.com

LM5100A/B/C, LM5101A/B/C

Pin Descriptions

Pin # Name Description Application Information

SOIC-8 PSOP-8 LLP-8 LLP-10 eMSOP-8

1 1 1 1 1 VDD Positive gate drive

supply

Locally decouple to VSS using low

ESR/ESL capacitor located as close

to the IC as possible.

2 2 2 2 2 HB High-side gate driver

bootstrap rail

Connect the positive terminal of the

bootstrap capacitor to HB and the

negative terminal to HS. The

bootstrap capacitor should be placed

as close to the IC as possible.

3 3 3 3 3 HO High-side gate driver

output

Connect to the gate of high-side

MOSFET with a short, low

inductance path.

4 4 4 4 4 HS High-side MOSFET

source connection

Connect to the bootstrap capacitor

negative terminal and the source of

the high-side MOSFET.

5 5 5 7 5 HI High-side driver

control input

The LM5100A/B/C inputs have

CMOS type thresholds. The

LM5101A/B/C inputs have TTL type

thresholds. Unused inputs should be

tied to ground and not left open.

6 6 6 8 6 LI Low-side driver

control input

The LM5100A/B/C inputs have

CMOS type thresholds. The

LM5101A/B/C inputs have TTL type

thresholds. Unused inputs should be

tied to ground and not left open.

7 7 7 9 7 VSS Ground return All signals are referenced to this

ground.

8 8 8 10 8 LO Low-side gate driver

output

Connect to the gate of the low-side

MOSFET with a short, low

inductance path.

EP EP EP EP EP (LLP and PSOP and eMSOP

packages)

Solder to the ground plane under the

IC to aid in heat dissipation.

Note: For LLP-8, LLP-10 and eMSOP-8 package, it is recommended that the exposed pad on the bottom of the package is soldered to ground plane

on the PC board, and that ground plane should extend out from beneath the IC to help dissipate heat. For LLP-10 package, pins 5 and 6 have no

connection.

www.national.com 4

LM5100A/B/C, LM5101A/B/C

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VDD to VSS −0.3V to +18V

HB to HS −0.3V to +18V

LI or HI Input −0.3V to VDD +0.3V

LO Output −0.3V to VDD +0.3V

HO Output VHS −0.3V to VHB +0.3V

HS to VSS (Note 6) −5V to +100V

HB to VSS 118V

Junction Temperature +150°C

Storage Temperature Range −55°C to +150°C

ESD Rating HBM (Note 2) 2 kV

Recommended Operating

Conditions

VDD +9V to +14V

HS −1V to 100V

HB VHS +8V to VHS +14V

HS Slew Rate < 50 V/ns

Junction Temperature −40°C to +125°C

Electrical Characteristics

Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to

+125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the

most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified, VDD = VHB =

12V, VSS = VHS = 0V, No Load on LO or HO (Note 4).

Symbol Parameter Conditions Min Typ Max Units

SUPPLY CURRENTS

IDD VDD Quiescent Current, LM5100A/B/C LI = HI = 0V 0.1 0.2 mA

VDD Quiescent Current, LM5101A/B/C LI = HI = 0V 0.25 0.4

IDDO VDD Operating Current f = 500 kHz 2.0 3mA

IHB Total HB Quiescent Current LI = HI = 0V 0.06 0.2 mA

IHBO Total HB Operating Current f = 500 kHz 1.6 3mA

IHBS HB to VSS Current, Quiescent HS = HB = 100V 0.1 10 µA

IHBSO HB to VSS Current, Operating f = 500 kHz 0.4 mA

INPUT PINS

VIL Input Voltage Threshold LM5100A/B/C Rising Edge 4.5 5.4 6.3 V

VIL Input Voltage Threshold LM5101A/B/C Rising Edge 1.3 1.8 2.3 V

VIHYS Input Voltage Hysteresis LM5100A/B/C 500 mV

VIHYS Input Voltage Hysteresis LM5101A/B/C 50 mV

RIInput Pulldown Resistance 100 200 400 kΩ

UNDER VOLTAGE PROTECTION

VDDR VDD Rising Threshold 6.0 6.9 7.4 V

VDDH VDD Threshold Hysteresis 0.5 V

VHBR HB Rising Threshold 5.7 6.6 7.1 V

VHBH HB Threshold Hysteresis 0.4 V

BOOT STRAP DIODE

VDL Low-Current Forward Voltage IVDD-HB = 100 µA 0.52 0.85 V

VDH High-Current Forward Voltage IVDD-HB = 100 mA 0.8 1V

RDDynamic Resistance LM5100A/B/C, LM5101A/B/

IVDD-HB = 100 mA 1.0 1.65 Ω

LO & HO GATE DRIVER

VOL Low-Level Output Voltage LM5100A/LM5101A IHO = ILO = 100 mA 0.12 0.25

VLow-Level Output Voltage LM5100B/LM5101B 0.16 0.4

Low-Level Output Voltage LM5100C/LM5101C 0.28 0.65

VOH High-Level Output Voltage LM5100A/LM5101A IHO = ILO = 100 mA

VOH = VDD– LO or

VOH = HB - HO

0.24 0.45

VHigh-Level Output Voltage LM5100B/LM5101B 0.28 0.60

High-Level Output Voltage LM5100C/LM5101C 0.60 1.10

IOHL Peak Pullup Current LM5100A/LM5101A HO, LO = 0V 3

APeak Pullup Current LM5100B/LM5101B 2

Peak Pullup Current LM5100C/LM5101C 1

5 www.national.com

LM5100A/B/C, LM5101A/B/C

Symbol Parameter Conditions Min Typ Max Units

IOLL Peak Pulldown Current LM5100A/LM5101A HO, LO = 12V 3

APeak Pulldown Current LM5100B/LM5101B 2

Peak Pulldown Current LM5100C/LM5101C 1

THERMAL RESISTANCE

θJA Junction to Ambient SOIC-8 170

°C/W

LLP-8(Note 3) 40

LLP-10 (Note 3) 40

PSOP-8 40

eMSOP-8 (Note 3) 80

Switching Characteristics

Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to

+125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the

most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified, VDD = VHB =

12V, VSS = VHS = 0V, No Load on LO or HO (Note 4).

Symbol Parameter Conditions Min Typ Max Units

tLPHL LO Turn-Off Propagation Delay

LM5100A/B/C

LI Falling to LO Falling 20 45

LO Turn-Off Propagation Delay

LM5101A/B/C 22 56

tLPLH LO Turn-On Propagation Delay

LM5100A/B/C

LI Rising to LO Rising 20 45

LO Turn-On Propagation Delay

LM5101A/B/C 26 56

tHPHL HO Turn-Off Propagation Delay

LM5100A/B/C

HI Falling to HO Falling 20 45

HO Turn-Off Propagation Delay

LM5101A/B/C 22 56

tHPLH LO Turn-On Propagation Delay

LM5100A/B/C

HI Rising to HO Rising 20 45

LO Turn-On Propagation Delay

LM5101A/B/C 26 56

tMON Delay Matching: LO on & HO off

LM5100A/B/C

1 10 ns

Delay Matching: LO on & HO off

LM5101A/B/C 4 10

tMOFF Delay Matching: LO off & HO on

LM5100A/B/C

1 10

Delay Matching: LO on & HO off

LM5101A/B/C 4 10

tRC, tFC Either Output Rise/Fall Time CL = 1000 pF 8 ns

tROutput Rise Time (3V to 9V) LM5100A/

LM5101A

CL = 0.1 µF 430

Output Rise Time (3V to 9V) LM5100B/

LM5101B 570

Output Rise Time (3V to 9V) LM5100C/

LM5101C 990

tFOutput Fall Time (3V to 9V) LM5100A/

LM5101A

CL = 0.1 µF 260

Output Fall Time (3V to 9V) LM5100B/

LM5101B 430

Output Fall Time (3V to 9V) LM5100C/

LM5101C 715

www.national.com 6

LM5100A/B/C, LM5101A/B/C

Symbol Parameter Conditions Min Typ Max Units

tPW Minimum Input Pulse Width that Changes

the Output

50 ns

tBS Bootstrap Diode Reverse Recovery Time IF = 100 mA,

IR = 100 mA

37 ns

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation

of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,

see the Electrical Characteristics tables.

Note 2: The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. 2 kV for all pins except Pin 2, Pin 3 and Pin 4

which are rated at 1000V for HBM. Machine Model (MM) ratings are : 100V(MM) for Options B and C; 50V(MM) for Option A.

Note 3: 4 layer board with Cu finished thickness 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm ground and power

planes embedded in PCB. See Application Note AN-1187.

Note 4: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical

Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).

Note 5: The θJA is not a given constant for the package and depends on the printed circuit board design and the operating environment.

Note 6: In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS node will generally not exceed -1V.

However, in some applications, board resistance and inductance may result in the HS node exceeding this stated voltage transiently. If negative transients occur,

the HS voltage must never be more negative than VDD-15V. For example if VDD = 10V, the negative transients at HS must not exceed -5V.

Typical Performance Characteristics

Peak Sourcing Current vs VDD

20203127

Peak Sinking Current vs VDD

20203128

Sink Current vs Output Voltage

20203129

Source Current vs Output Voltage

20203130

7 www.national.com

LM5100A/B/C, LM5101A/B/C

LM5100A/B/C IDD vs Frequency

20203109

LM5101A/B/C IDD vs Frequency

20203110

Operating Current vs Temperature

20203111

IHB vs Frequency

20203114

Quiescent Current vs Supply Voltage

20203118

Quiescent Current vs Temperature

20203119

www.national.com 8

LM5100A/B/C, LM5101A/B/C

Undervoltage Rising Thresholds vs Temperature

20203122

Undervoltage Threshold Hysteresis vs Temperature

20203117

Bootstrap Diode Forward Voltage

20203115

LM5100A/B/C Input Threshold vs Temperature

20203123

LM5101A/B/C Input Threshold vs Temperature

20203124

LM5100A/B/C Input Threshold vs VDD

20203125

9 www.national.com

LM5100A/B/C, LM5101A/B/C

LM5101A/B/C Input Threshold vs VDD

20203126

LM5100A/B/C Propagation Delay vs Temperature

20203112

LM5101A/B/C Propagation Delay vs Temperature

20203113

LO & HO Gate Drive - High Level Output Voltage vs

Temperature

20203120

LO & HO Gate Drive - Low Level Output Voltage vs

Temperature

20203121

LO & HO Gate Drive - Output High Voltage vs VDD

20203131

www.national.com 10

LM5100A/B/C, LM5101A/B/C

LO & HO Gate Drive - Output Low Voltage vs VDD

20203132

Timing Diagram

20203104

FIGURE 2.

11 www.national.com

LM5100A/B/C, LM5101A/B/C

Layout Considerations

The optimum performance of high and low-side gate drivers

cannot be achieved without taking due considerations during

circuit board layout. Following points are emphasized.

1. Low ESR / ESL capacitors must be connected close to

the IC, between VDD and VSS pins and between the HB

and HS pins to support the high peak currents being

drawn from VDD during turn-on of the external MOSFET.

2. To prevent large voltage transients at the drain of the top

MOSFET, a low ESR electrolytic capacitor must be

connected between MOSFET drain and ground (VSS).

3. In order to avoid large negative transients on the switch

node (HS pin), the parasitic inductances in the source of

top MOSFET and in the drain of the bottom MOSFET

(synchronous rectifier) must be minimized.

4. Grounding Considerations:

a) The first priority in designing grounding connections

is to confine the high peak currents that charge and

discharge the MOSFET gate into a minimal physical

area. This will decrease the loop inductance and

minimize noise issues on the gate terminal of the

MOSFET. The MOSFETs should be placed as close as

possible to the gate driver.

b) The second high current path includes the bootstrap

capacitor, the bootstrap diode, the local ground

referenced bypass capacitor and low-side MOSFET

body diode. The bootstrap capacitor is recharged on a

cycle-by-cycle basis through the bootstrap diode from

the ground referenced VDD bypass capacitor. The

recharging occurs in a short time interval and involves

high peak current. Minimizing this loop length and area

on the circuit board is important to ensure reliable

operation.

A recommended layout pattern for the driver is shown in the

following figure. If possible a single layer placement is pre-

ferred.

20203138

www.national.com 12

LM5100A/B/C, LM5101A/B/C

Power Dissipation Considerations

The total IC power dissipation is the sum of the gate driver

losses and the bootstrap diode losses. The gate driver losses

are related to the switching frequency (f), output load capac-

itance on LO and HO (CL), and supply voltage (VDD) and can

be roughly calculated as:

PDGATES = 2 • f • CL • VDD2

There are some additional losses in the gate drivers due to

the internal CMOS stages used to buffer the LO and HO out-

puts. The following plot shows the measured gate driver

power dissipation versus frequency and load capacitance. At

higher frequencies and load capacitance values, the power

dissipation is dominated by the power losses driving the out-

put loads and agrees well with the above equation. This plot

can be used to approximate the power losses due to the gate

drivers.

Gate Driver Power Dissipation (LO + HO)

VDD = 12V, Neglecting Diode Losses

20203105

The bootstrap diode power loss is the sum of the forward bias

power loss that occurs while charging the bootstrap capacitor

and the reverse bias power loss that occurs during reverse

recovery. Since each of these events happens once per cycle,

the diode power loss is proportional to frequency. Larger ca-

pacitive loads require more energy to recharge the bootstrap

capacitor resulting in more losses. Higher input voltages

(VIN) to the half bridge result in higher reverse recovery loss-

es. The following plot was generated based on calculations

and lab measurements of the diode recovery time and current

under several operating conditions. This can be useful for ap-

proximating the diode power dissipation.

The total IC power dissipation can be estimated from the pre-

vious plots by summing the gate drive losses with the boot-

strap diode losses for the intended application.

Diode Power Dissipation VIN = 50V

20203106

13 www.national.com

LM5100A/B/C, LM5101A/B/C

Physical Dimensions inches (millimeters) unless otherwise noted

Controlling dimension is inch. Values in [ ] are millimeters.

Notes: Unless otherwise specified.

1. Standard lead finish to be 200 microinches/5.08 micrometers minimum lead/tin (solder) on copper.

2. Dimension does not include mold flash.

3. Reference JEDEC registration MS-012, Variation AA, dated May 1990.

SOIC-8 Outline Drawing

NS Package Number M08A

PSOP-8 Outline Drawing

NS Package Number MRA08A

www.national.com 14

LM5100A/B/C, LM5101A/B/C

LLP-8 Outline Drawing

NS Package Number SDC08A

Notes: Unless otherwise specified.

1. For solder thickness and composition, see “Solder Information” in the packaging section of the National Semiconductor web page (www.national.com).

2. Maximum allowable metal burr on lead tips at the package edges is 76 microns.

3. No JEDEC registration as of May 2003.

LLP-10 Outline Drawing

NS Package Number SDC10A

15 www.national.com

LM5100A/B/C, LM5101A/B/C

eMSOP-8 Outline Drawing

NS Package Number MUY08A

www.national.com 16

LM5100A/B/C, LM5101A/B/C

Notes

17 www.national.com

LM5100A/B/C, LM5101A/B/C

Notes

LM5100A/B/C, LM5101A/B/C 3A, 2A and 1A High Voltage High-Side and Low-Side Gate Drivers

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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

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