September 2005 1/15
15
Rev 4
VN808
OCTAL CHANNEL HIGH SIDE DRIVER
General Features
VCC/2 COMPATIBLE INPUT
JUNCTION OVER-TEM PERATURE
PROTECTION
CASE OVER-TEMPERATURE PROTECTION
FOR THERMAL INDEPENDENCE OF THE
CHANNELS
CURRENT LIMITAT ION
SHORTED LOAD PROTECTION
UNDERVOLTAGE SHUDOWN
PROTECTION AGA INST LOSS OF GROUND
VERY LOW STAND-BY CURRENT
COMPLIANCE TO 61000-4-4 IEC TEST UP
TO 4KV
Description
The VN808 is a monolithic device designed in
STMicroelectronics VIPower M0-3 technology,
Blo ck Diag r am
intended for driving any kind of load wi th one side
connected to ground. Active current limitation
combined with thermal shutdown and automatic
restart, protect the device against overload. In
overload condition, channel turns OFF and back
ON automatically so as to maintain junction
temperature between TTSD and TR. If this
condition makes case temperature reach TCSD,
overloaded channel is turned OFF and and will
restart only when case temperature has
decreased down to TCR( see waveform 3 Figure 7
on page 9 ). Non overloaded channels continue to
operate normally. Device automat ically turns OF F
in case of ground pin disconnection. This device is
especially suitable for industrial applications
conform to IEC 61131
Type RDS(on) Iout VCC
VN808 150mΩ0.7A 45V PowerSO-36
www.st.com
VN808
2/15
Table 1. Absolute Maximum Rating
Table 2 . Pin De fini t io ns a n d Funct i ons
Symbol Parameter Value Unit
VCC DC Supply voltage 45 V
-IGND DC ground pin reverse current
TRAN Ground pin rev erse c urrent ( pulse duration < 1ms) -250
-6 mA
A
IOUT DC Output current Internally limited A
-IOUT Reverse DC ou tput current -2 A
IIN DC Input current ± 10 mA
VIN Input vol tage range -3/+VCC V
VESD Electrostati c discharge (R = 1.5KW ; C = 100pF) 2000 V
PTOT Power dissipation at Tc = 25°C 96 W
LMAX Max inductive load ( VCC = 24V, RLOAD = 48Ω, TA = 100°C) 2H
TJJuncti on operating tem perature Inter nally limited °C
TCCase operating temper ature Inter nally limit ed °C
TSTG St orage Temperature -55 to 150 °C
Pin No. Symbol Fu nction
TAB VCC Posi ti ve power s upply volt age
1VCC Positive power supply volt age
2,3,4, 5 NC No t connected
6 Input 1 Input of channel 1
7 Input 2 Input of channel 2
8 Input 3 Input of channel 3
9 Input 4 Input of channel 4
10 Input 5 Input of channel 5
11 Input 6 Input of channel 6
12 Input 7 Input of channel 7
13 Input 8 Input of channel 8
14,15,16,17,18 NC Not connected
19 GND Logic ground
20 STATUS Common open source diagnostic for over-temper ature
21,22 Output 8 High-Side out put of channel 8
23,24 Output 7 High-Side out put of channel 7
25,26 Output 6 High-Side out put of channel 6
27.28 Output 5 High-Side out put of channel 5
29,30 Output 4 High-Side out put of channel 4
31,32 Output 3 High-Side out put of channel 3
33,34 Output 2 High-Side out put of channel 2
35,36 Output 1 High-Side out put of channel 1
VN808
3/15
Figure 1. Connection Diagram (Top View)
Figure 2. Current and Volt ag e Conventions
VN808
4/15
Table 3. Thermal data
Note: 1. When mounted on FR4 printed circuit board with 0.5cm2 of copper area ( at least 35
μ
thin k )
connected to all TAB pins.
El ectrical C h ar acter i stics (10.5V < VCC < 32V; -40°C < TJ < 100°C; unless ot herw is e
specified)
Table 4. Power Section
Table 5. Switching ( VCC = 24V )
Symbol Parameter Value Unit
RthJC Thermal resistance junction-case Max 1.3 ° C/W
RthJA Thermal resistance junction-am bient Note:1Max50°C/W
Symbol Parameter Test Condit ions Min. Typ. Max. Unit
VCC Operating supply voltage 10.5 45 V
VUSD Undervoltage shutdown 7 10.5 V
RON On state resistance IOUT = 0.5A; TJ = 25°C
IOUT = 0.5A; 150 185
280 mΩ
mΩ
ISSupply current
OFF state; VCC = 24V; TCASE = 25° C
ON sta te( a ll channels ON) ; VCC = 24V
TCASE = 100°C
150
12
μA
mA
ILGND Output current at turn- off VCC = VSTAT = VIN = VGND = 24V
VOUT = 0V 1mA
IL(off) OFF state output curr ent VIN = VOUT = 0V; 05μA
VOUT(off) OFF state output voltage VIN = 0V, IOUT = 0A 3V
td(Vccon) Power-on delay time
fro m VCC rising edge Figure 6. 1ms
Symbol Parameter Test Conditions Min. Typ. Max. Unit
tON Turn-on time RL = 48Ω from 80% VOUT Figure 5. 50 100 μs
tOFF Tu rn -o ff time RL = 48 Ω to 10% VOUT Figure 5. 75 150 μs
dVOUT/
dt(on) T urn-on voltage sl ope RL = 48Ω from VOUT = 2.4V to
VOUT = 19.2V Figure 5. 0.7 Vs
dVOUT/
dt(off) Turn-off voltage slope RL = 48Ω from VOUT = 21.6V to
VOUT = 2.4V Figure 5. 1.5 Vs
VN808
5/15
Table 6. In put Pin
Table 7. Pr otection s
Table 8. Sta tus Pin
Symbo l Parameter Test Conditions Min. Typ. Max . Unit
VINL Input low l evel VCC /2-1 V
IINL Low level input current VIN = VCC / 2 - 1V 80 μΑ
VINH Input high level VCC /2+1 V
IINH High level input current VIN = VCC / 2 + 1V 150 260 μΑ
VI(HYST) Input hysteresi s voltage 0.6 V
IIN Input current VIN = VCC = 32V 300 μΑ
Symbol Parameter Test Conditions Min. Typ. Max. Uni t
TCSD Case shut-down
temperature 125 130 135 °C
TCR Case reset temperature 110 °C
TCHYST Case thermal hysteresis 7 15 °C
TTSD Junction shutdown
temperature 150 175 200 °C
TRJuncti on reset temperature 135 °C
THYST Junction thermal hysteresis 7 15 °C
Ilim DC Short ci rcuit current VCC = 24V; RLOAD = 10mΩ0.7 1.7 A
Vdemag Turn-of f output clamp
voltage IOUT = 0.5A; L = 6mH VCC-57 VCC-52 VCC-47 V
Symbol Parameter Test Conditions Min. Typ. Max. Uni t
IHSTAT High level output current VCC = 18...32V; RSTAT = 1 KΩ
( Fault condition ) 234mA
ILSTAT Leakage current Normal operation; VCC = 32V 0.1 μA
VCLSTAT Clamp voltage ISTAT = 1mA
ISTAT = -1mA 6.0 6.8
-0.7 8.0 V
V
VN808
6/15
Figure 3. Equivalent Internal Block Diagram ( same structure for all channel )
Figure 4. Application Example
OUTn
GND
INn
VCC
STATUS
50V
50V
52V
6.8V
13
Ω
110k
Ω
Vcc24V - 28,2V IEC61131
22µF 100nF
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
22µF 100nF
Vcc24V - 28,2V IEC61131
22µF 100nF
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
22µF 100nF
Vcc24V - 28,2V IEC61131
22µF 100nF
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
10nF
.
..
.....
.
.
RGNDRGND
Vcc24V - 28,2V IEC61131
10nF
Vcc/2 compatible inputs
.
..
.....
.
.
RGNDRGND
Vcc24V - 28,2V IEC61131
22µF 100nF
Vcc24V - 28,2V IEC61131
22µF 100nF
Vcc24V - 28,2V IEC61131
22µF 100nF
22µF 100nF
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Load 1
Load 2
Load 3
Load 8
VN808
Status
Vin1
Vin2
Vin8
Vin3
Imax 80µA
Filter for bus inductance effect.,
M ake supply voltage stable and
Avoid undervoltageshut-dow n EM C filter Protection for IE C 61 000-4-5
S urge test suggested 1,5KE 39xx
O ptional protection for
V
CC
disconnection.
Protection against
IEC 61000-4-6
C urrent injection tes
t
10Ωprotection against disconnection
On inductive loads
PROTECTIONS INCLUDED IN THE DEVICE:
IEC 61000-4-2 E SD test better than 2kV H um an B ody M odel IEC 61000-4-4 Burst test
S tatus output current
From 2 to 4 m A
VN808
7/15
Switching Time Waveforms
Fi gure 5. Turn-on & Turn-off
Fi gure 6. VCC Turn-on
VN808
8/15
Table 9. Truth Table
Conditions INPUTn OUTPUTn STATUS
Normal operation L
HL
HL
L
Current limitation L
HL
XL
L
Ove rt em perature (s ee waveforms 3, 4 Figure 7. Figure 8.) ->
TJ > TTSD
L
HL
LL
H
Undervoltage L
HL
LX
X
VN808
9/15
Figure 7. Waveforms
VN808
10/15
Figure 8. Waveforms ( continued )
VN808
11/15
Mechanical Data
In order to meet environmen tal requirements, ST offe rs these devices in ECOPACK®
packages. These packages have a Lead-free second level interconn ect . The category of
secon d level interconnec t is marked on the package and on the in ner box label, in complianc e
w ith JEDEC Standa rd JESD97. The maxim um ratings related to sold ering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
VN808
12/15
Table 10. PowerSO -36 Mec han ical Data
1. “D“ and “E1” do not include mold flash o r protusions
Mold flash or protusions shall non exceed 0.15mm (0.006 inch)
Critical dimensions are “a3“, “E” and “G“.
Figure 9. PowerSO-36 Scheme
VN808
13/15
Table 11 . Ord er Cod es
Package Tube Tape and Reel
PowerSO-36 VN808 VN80813TR
VN808
14/15
Table 12. Revision History
Date Revision Changes
13-Sep-2005 4 Final release
VN808
15/15
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nformation furnished is believed to be accurate and reliable. However, S TMicroelectronics assumes no res ponsibility for the consequence
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o
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
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ct
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o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
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uthorized for use as cri tical c om ponents i n l i fe suppor t devic es or system s with out expr ess writt en approval of STMicro el ectronics.
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