Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 1 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Product Features
x DC – 5.5 GHz
x +15.5 dBm P1dB at 1 GHz
x +32 dBm OIP3 at 1 GHz
x 15 dB Gain at 1 GHz
x 4.0 dB Noise Figure at 2 GHz
x Available in lead-free / green
SOT-363, SOT-86 and SOT-
89 Package Styles
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
The ECG006 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG006 typically provides 15
dB of gain, +32 dBm Output IP3, and +15.5 dBm P1dB.
The ECG006 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic lead-free/green/RoHS-compliant
SOT-363, SOT-86 and SOT-89 packages. All devices are
100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG006 will work for other various applications within
the DC to 5.5 GHz frequency range such as CATV and
fixed wireless.
Functional Diagram
RF IN GND
RF OUT
GND
1
2
3
4
ECG006B / ECG006B-G
RF Out
RF In
GND
GND
1
2
3
4
RF Out
RF In
GND
GND
1
2
3
4
ECG006C / ECG006C-G
RF IN
GND
RF OUT
GND
GND
GND
1
2
3
4
6
5
ECG006F / ECG006F-G
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz DC 5500
Test Frequency MHz 1000
Gain dB 15
Output P1dB dBm +15.4
Output IP3 (2) dBm +32
Test Frequency MHz 2000
Gain dB 12 14 18
Input Return Loss dB 18
Output Return Loss dB 14
Output P1dB dBm 12 15
Output IP3 (2) dBm 32
Noise Figure dB 4.0
Device Voltage V 3.5 3.9 4.3
Device Current mA 45
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3
, 50
System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 qC
Storage Temperature -55 to +150 qC
Device Current 150 mA
RF Input Power (continuous) +12 dBm
Junction Temperature +250 qC
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (3)
Parameter Units Typical
Frequency MHz 500 900 1900 2140
S21 dB 15.5 15 14.2 14
S11 dB -20 -14 -17.4 -18
S22 dB -16 -13 -14.5 -15
Output P1dB dBm +15.8 +15.4 +15 +15
Output IP3 (2) dBm +32 +32 +30 +30
Noise Figure dB 3.7 3.7 3.7 3.7
3. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9V, Rbias = 24.3
, 50
System.
Ordering Information
Part No. Description
ECG006B* InGaP HBT Gain Block
(lead-tin SOT-89 Pkg)
ECG006B-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG006C* InGaP HBT Gain Block
(lead-tin SOT-86 Pkg)
ECG006C-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 Pkg)
ECG006F* InGaP HBT Gain Block
(lead-tin SOT-363 Pkg)
ECG006F-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 Pkg)
ECG006B-PCB 700 – 2400 MHz Fully Assembled Eval. Board
ECG006C-PCB 700 – 2400 MHz Fully Assembled Eval. Board
ECG006F-PCB 700 – 2400 MHz Fully Assembled Eval. Board
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 2 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24.3 :, Icc = 45 mA
Frequency MHz 100 500 900 1900 2140 2400 3500 5800
S21 dB 15.3 15.2 15.1 14.5 14.3 14.1 13.9 10.2
S11 dB -20 -18 -14 -17 -18 -20 -17 -12.5
S22 dB -29 -16 -13 -14 -14 -15 -15 -9.5
Output P1dB dBm +15.8 +15.4 +15.2 +15.0 +14.9 +14.6 +14
Output IP3 dBm +31 +31.5 +32 +30 +30 +29.6
Noise Figure dB 3.8 3.7 3.6 3.6 3.6 3.6
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24.3
, Icc = 45 mA typical, 50
System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
8
10
12
14
16
18
500 1000 1500 2000 2500 3000
Frequency (MHz)
Gain
+25C -40C +85C
S11, S22 vs. Frequency
-25
-20
-15
-10
-5
0
0123456
Frequency (GHz)
S11, S22 (dB)
S22
S11
Vde vs. Icc
0
10
20
30
40
50
60
70
80
90
3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40
Vde (V)
Icc (mA)
+25C
OIP3 vs. Frequency
15
20
25
30
35
500 1000 1500 2000 2500 3000
Frequency (MHz)
OIP3 (dBm)
+25°C -40°C
+85°C
Noise Figure vs. Frequency
2
2.5
3
3.5
4
500 1000 1500 2000
Frequency (MHz)
NF (dB)
P1dB vs. Frequency
8
10
12
14
16
18
500 1000 1500 2000 2500 3000
Frequency (MHz)
P1dB (dBm)
+25°C -40°C
+85°C
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 3 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Recommended Application Circuit
ECG006B-PCB
ECG006C-PCB
ECG006F-PCB
Recommended Component Values
Reference Frequency (MHz)
Designator 50 500 900 1900 2200 2500 3500
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH
C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. Value / Type Size
L1 39 nH wirewound inductor 0603
C1, C2 56 pF chip capacitor 0603
C3 0.018 PF chip capacitor 0603
C4 Do Not Place
R4 24.3: 1% tolerance 0805
Recommended Bias Resistor Values
Supply
Voltage R1 value Size
5 V 24.4 ohms 0805
6 V 46.7 ohms 0805
8 V 91 ohms 1210
9 V 113 ohms 1210
10 V 136 ohms 2010
12 V 180 ohms 2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
R4
Bias
Resistor
RF IN
C4
Bypass
Capacitor
C2
Blocking
Capacitor
Vcc
Icc = 45 mA
ECG006
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 4 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E006” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 5 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“ E006G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 6 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006C (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “ xx”)
followed with a “ N” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +235
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use
a .35mm (#80 / .0135”) diameter drill and have a
final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 7 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006C-G (Green / Lead-free Sot-86 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “ XX”)
followed with a “ I” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 8 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006F (SOT-363 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “ 3” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 9 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
ECG006F-G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “ XX”)
followed with a “ 7” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 10 of 10 July 2005
ECG006
InGaP HBT Gain Block Product Information
The Communications Edge
TM
Typical Device S-Parameters – ECG006B / ECG006B-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25
C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -16.18 -2.18 15.76 178.02 -18.89 -0.38 -14.36 -2.29
500 -16.13 -22.13 15.57 160.12 -18.77 -2.87 -14.40 -26.41
1000 -15.97 -44.58 15.21 141.76 -18.46 -5.33 -14.15 -51.57
1500 -15.79 -68.38 14.80 124.56 -17.94 -9.45 -13.78 -77.30
2000 -15.34 -96.24 14.57 108.50 -17.29 -14.37 -13.23 -104.15
2500 -14.99 -124.42 14.34 91.11 -16.69 -21.48 -12.79 -131.75
3000 -14.73 -153.90 14.02 74.20 -16.16 -29.16 -12.22 -160.58
3500 -14.29 174.59 13.65 56.77 -15.76 -38.37 -11.63 170.65
4000 -13.38 141.41 13.22 39.56 -15.49 -47.75 -10.44 143.61
4500 -11.80 110.87 12.66 22.19 -15.29 -57.59 -9.04 117.68
5000 -9.66 85.53 12.00 5.48 -15.28 -68.56 -7.50 96.34
5500 -7.85 63.77 11.20 -10.89 -15.43 -79.10 -6.12 76.71
6000 -6.37 47.01 10.36 -26.75 -15.69 -89.87 -4.95 59.58
Typical Device S-Parameters – ECG006C / ECG006C-F
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25
C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -13.66 -1.22 15.30 178.47 -18.67 -0.33 -12.25 -1.92
500 -13.64 -13.39 15.23 164.32 -18.59 0.29 -12.33 -20.62
1000 -14.11 -23.99 15.01 149.00 -18.38 0.78 -12.52 -41.41
1500 -15.20 -35.45 14.72 134.06 -17.99 0.29 -13.08 -62.51
2000 -17.86 -52.47 14.44 119.89 -17.52 -0.93 -14.31 -82.78
2500 -20.46 -93.43 14.06 105.18 -17.12 -3.33 -15.20 -99.71
3000 -18.86 -135.97 13.53 91.27 -16.59 -6.24 -15.01 -124.98
3500 -17.20 -158.47 12.99 77.75 -16.21 -10.91 -14.89 -157.99
4000 -16.45 -171.80 12.38 65.03 -15.93 -15.16 -14.50 170.24
4500 -17.31 166.84 11.76 52.68 -15.73 -19.74 -13.75 147.52
5000 -16.22 136.42 11.25 40.65 -15.52 -24.35 -12.08 133.59
5500 -13.68 110.91 10.56 28.09 -15.42 -29.98 -10.21 119.31
6000 -11.01 97.79 9.95 17.28 -15.43 -34.96 -8.73 106.39
Typical Device S-Parameters – ECG006F / ECG006F-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25
C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -16.22 -0.52 15.76 178.32 -18.82 -0.82 -14.16 -2.06
500 -14.87 -18.97 15.63 165.77 -18.87 1.49 -12.83 -24.91
1000 -16.45 -51.46 15.51 151.31 -18.40 1.44 -14.19 -55.98
1500 -16.41 -95.69 15.22 137.15 -18.07 0.35 -14.59 -93.37
2000 -14.08 -118.65 14.79 123.39 -17.74 -1.31 -13.52 -120.99
2500 -12.50 -114.48 14.48 112.93 -17.16 -2.57 -13.05 -122.53
3000 -12.18 -126.96 14.14 100.74 -16.80 -4.49 -12.19 -138.80
3500 -11.70 -139.53 13.94 88.52 -16.16 -8.66 -11.93 -159.41
4000 -10.97 -158.51 13.57 75.28 -15.72 -12.48 -11.00 174.63
4500 -10.24 178.62 13.03 62.14 -15.50 -19.07 -9.10 151.63
5000 -9.06 161.58 12.33 51.12 -15.19 -24.71 -7.50 139.14
5500 -8.32 150.77 11.60 42.08 -15.22 -28.00 -6.87 136.14
6000 -7.84 140.56 10.95 33.72 -15.14 -30.97 -6.78 137.51
Device S-parameters are available for download off of the website at: http://www.wj.com
