1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as USB 2.0, Ethernet and
Digital Visual Interface (DVI) against ElectroStatic Discharge (ESD).
The device includes four hig h-l evel ESD protection diod e structur es for hi gh-spee d sign al
lines and is encapsulated in a leadless ultra small DFN1410-6 (SOT886) plastic package.
Special diode configuration protect s all signal lines and offers ultra low line capacitance of
only 1 pF. The rail-to-rail diodes are connected to the Zener diode which allows ESD
protection to be independent of supply voltage.
1.2 Features and benefits
System ESD protection for high-speed data lines such as USB 2.0, Ethernet and DVI
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 8 kV according to IEC 61000-4-2, level 4
Line capacitance of only 1 pF for each channel
Leadless ultra small DFN1410-6 package: 1 1.45 0.5 mm; pitch 0.5 mm
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
Mobile phones, smartphones and handsets
TVs and monitors
DVD recorders and players
Notebooks, mother boards, graphic cards and ports
Set-top boxes and game consoles
IP4221CZ6-S
ESD protection for high-speed interfaces
Rev. 2 — 13 December 2012 Product data sheet
XSON6
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 2 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
[1] All pins to ground.
Table 1. Pinning
Pin Symbol Description Simplified outline Graphic symbol
1 I/O 1 ESD protection
2 GND ground
3 I/O 2 ESD protection
4 I/O 3 ESD protection
5V
CC supply voltage
6 I/O 4 ESD protection
Transparent
top view
456
321
001aag273
12 3
654
Table 2. Orde ring information
Type number Package
Name Description Version
IP4221CZ6-S DFN1410-6 plastic extremely thin small outline package;
no leads; 6 terminals; body 1 1.45 0.5 mm SOT886
Table 3. Marking co des
Type number Marking code
IP4221CZ6-S 1S
Ta ble 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIinput voltage 0.5 +5.5 V
VESD electrostatic discharge
voltage IEC 61000-4-2, level 4;
contact discharge [1] 8+8kV
Tstg storage temperature 55 +125 C
Tamb ambient temperature 40 +85 C
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 3 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
6. Characteristics
[1] This parameter is guaranteed by design.
[2] Pins 1, 3, 4 and 6 are measured to ground.
[3] All pins measured to ground (pin 2).
[4] Measured from pin 5 to pin 2.
7. Application information
7.1 USB 1.1 and 2.0 protection
Table 5. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
C(I/O-GND) input/output to ground
capacitance VI= 0 V; f = 1 MHz;
VCC =3V [1][2] -11.2pF
IRM reverse leakage current VI=3V [3][2] - - 100 nA
VBRzd Zener diode breakdown
voltage II=1mA [4] 6- 9V
VFforward voltage Itest =10mA - 0.7 - V
Each device is capable to protect USB data lines and VBUS supply.
Fig 1. Typical application for USB ESD protection
001aah371
1
2
3
6
VBUS
USB
PORT
USB 2.0/
IEEE 1394
CONTROLLER
5
4
DAT+
DAT
GND
VBUS
USB
PORT
DAT+
DAT
DAT+
DAT
DAT+
DAT
GND
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 4 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
7.2 USB On-The-GO (OTG) protection
7.3 Universal SIM card protection
The device is capable to protect USB data lines, VBUS supply and ID pin.
Fig 2. Typical application for USB OTG ESD protection
001aag051
1
2
3
6
VBUS
DAT+
USB OTG
RECEPTACLE
CARKIT
DAT
ID
GND
Shld GND
mini B receptacle mini A receptacle
to phone
5
4
The device also protects VCC.
Fig 3. Typical application for universal SIM card ESD prot ection
001aag052
1
I/O
CLOCK
RESET
V
CC
GND
2
3
6
SIM
5
4
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 5 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
7.4 IEEE 1394a/b protection
Fig 4. Typical application for IEEE 1394a/b ESD protection
001aag050
1 MΩ
56 Ω
56 Ω56 Ω
56 Ω
5 kΩ1 nF 10 nF
220 pF
1
μ
F
1
2
3
TPB+
TPB
TPA+
IEEE 1394
PHYSICAL
LAYER
TPA
6
5
4
BUS PWR
TPB+
GND
Shld2
TPB
TPA+
TPA
PWR
Shld1
4
2
8
3
6
5
1394
CONNECTOR
1
7
TPBIAS
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 6 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
7.5 Gigabit Ethernet transceiver protection
Fig 5. Typical application for gigabit Ethernet transceiver ESD protection
001aag053
1
2
3
TPOPD
R4
TPOND
6
5
4
C4
TPOPC
R3
TPONC
C3
1
2
GIGABIT
ETHERNET
TRANSCEIVER
QUAD
TRANSFORMER RJ45
3
TPOPB
R2
TPONB
6
5
4
C2
TPOPA
R1
TPONA
C1
C8
C7
C6
C5
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 7 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
7.6 Universal microSD/TransFlash and SD memory card protection
8. Package outline
Fig 6. Typical application for universal microSD/TransFlash and SD memory card ESD
protection
Fig 7. Package outline DFN1410-6 (SOT886)
04-07-22Dimensions in mm
0.25
0.17
0.40
0.32 0.35
0.27
0.5
0.6
1.05
0.95
1.5
1.4 0.5
0.50
max 0.04
max
3
2
1
4
5
6
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 8 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T4: reverse taping
10. Soldering
Ta ble 6. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code. [1]
Type number Package Description Packing quantity
5000
IP4221CZ6-S DFN1410-6
(SOT886) 4 mm pitch, 8 mm tape and reel; T1 [2] -115
4 mm pitch, 8 mm tape and reel; T4 [3] -132
Fig 8. Reflow soldering footprint DFN1410-6 (SOT886)
sot886_fr
solder resist
occupied area
solder paste = solderland
Dimensions in mm
0.425
(6×)
1.250
0.675
1.700
0.325
(6×)
0.270
(6×)
0.370
(6×)
0.500
0.500
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 9 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
11. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
IP4221CZ6-S v. 2 20121213 Product data sheet - IP4221CZ6-S v. 1
Modifications: Section 1 “Product profile: updated
Section 4 “Marking: added
Section 5 “Limiting values: Tamb added
Recommended operating conditions: removed
Table 5 “Characteristics: updated
Section 7 “Application information: updated
Section 8 “Package outline: drawing replaced with minimized package outline drawing
Section 10 “Soldering: updated
Section 12 “Legal information: updated
IP4221CZ6-S v. 1 20080429 Product data sheet - -
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 10 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
12.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconduct ors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe propert y or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Develop ment This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 December 2012 11 of 12
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and st andards, customer
(a) shall use the product without NXP Semicond uctors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed produ ct cl aims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors IP4221CZ6-S
ESD protection for high-speed interfaces
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 December 2012
Document identifier: IP4221CZ6-S
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Application information. . . . . . . . . . . . . . . . . . . 3
7.1 USB 1.1 and 2.0 protection . . . . . . . . . . . . . . . 3
7.2 USB On-The-GO (OTG) protection . . . . . . . . . 4
7.3 Universal SIM card protection. . . . . . . . . . . . . . 4
7.4 IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 5
7.5 Gigabit Ethernet transceiver protection . . . . . . 6
7.6 Universal microSD/TransFlash and SD memory
card protection . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Packing information . . . . . . . . . . . . . . . . . . . . . 8
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Contact information. . . . . . . . . . . . . . . . . . . . . 11
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12