2005 / 1 IXYS NEWS MSC IGBT Module Line to include Economical Small 6Pack Incorporating Latest NPT3 and Trench IGBT Technologies IXYS announced that in keeping up with ambitious growth plans in the IGBT market, its European Operation, a leader in Direct Copper Bond (DCB) module packaging technology, located in Lampertheim, Germany has extended its portfolio of IGBT modules down in power to cover the high volume cost sensitive segment of the market. This new family of DCB based IGBT Modules are housed in the industry standard low profile "Econo-style" module outline which cost effectively covers the current ranges from 10 to 60 Amps depending on configuration and voltage ratings. IXYS has now made available in volume production both 6 Pack and Converter-Brake-inverter (CBI) configurations in the Econo-style growing segment of these markets", according to Peter Ingram, President of IXYS Europe. 6 Pack versions of these IGBT modules include the MWI15 and MWI60 rated at1200V with current capabilities varying from 19-58 Amp at 25C. The CBI versions include the MUBW10 and MUBW35 offered at 600V with current ratings of 12- 42 Amp at 25C and the MUBW15 and MUBW30 with current ratings of 19-30 Amp at 25C rated at 1200V. module utilizingboth low loss NPT3 and Trench IGBT technologies. "The combination of improved higher efficiency IGBTs with this low cost DCB module package enables IXYS to serve high volume "micro-packaged" AC Drives and UPS markets up to 5KW, the fastest Typical applications for this product include AC drives, UPS, AC servo and robotic drives. All modules are UL approved and are readily available on stock. Datasheets and detailed information are available at www.ixys.com. IXYS Offers Discrete 1700V IGBT Copacks With New Soft Recovery SONIC-FRD Diodes tions with switching frequencies up to 50kHz. These high voltage NPT IGBT discretes can enable more costly, lower performance solutions such as thyristors or series connected MOSFETs or IGBTs typically used at voltages above 1200V. Offered as Copacks, they offer a more complete solution for power conversion applications to improve efficiency and reliability due to reduced voltage drop, lower switching losses and the need for fewer components. IXYS announced the availability of a new line of 1700V IGBT Copacks and Isolated Package 1700V IGBT Phase Leg products with its proprietary 1800V SONIC-FRDTM ultrasoft, fast recovery diodes. These new Copack and Phase Leg products provide unique, cost effective options for customers with applications requiring 1700V power switching. IXYS is offering its fast switching A" Version 1700V NPT IGBTs in Copack and Phase Leg configurations for PWM applica- Enhancing the efficiency and noise performance of these Copacks and Phase Legs is the use of IXYS 1800V SONIC-FRD ultrasoft, fast recovery diodes. IXYS SONIC-FRD fast and ultrafast recovery diodes are designed for temperature stability with low forward voltage and ultralow, ultra-soft reverse recovery characteristics. In addition, IXYS SONIC-FRD diodes are optimized to provide excellent dynamic avalanche ruggedness. These diodes minimize losses in hard switching applications, while maintaining superior soft recovery characteristics to minimize switching noise and eliminate the need for costly snubber circuits. Copacks will be offered in 16A and 24A versions with TO-247, TO-268, PLUS247TM and ISOPLUS247TM package options. A 24A rated Phase Leg configuration is offered in IXYS proprietary ISOPLUS i4-PAC TM. The i4-PAC is a UL recognized isolated package incorporating a DCB ceramic isolator which provides 2500Vrms isolation with superior isolated thermal performance. Two ISOPLUS i4PAC TM versions are offered, including a solderable, leaded version and a surface-mountable version. IXYS' new 1700V discrete IGBTs provide a lower cost solution using standard PCB assembly for a broad range of high voltage applications. These high speed A" Copacks and Phase Legs are intended for high voltage, fast switching applications such as induction heating, induction cooking, 480 to 575VAC offline inverters, flyback power supplies, UPS and microwave ovens. Next Generation B2-Class Short Circuit Rated IGBTs for Appliance and White Goods Applications IXYS has introduced a new family of Next Generation Short Circuit Rated IGBTs for appliance and white goods motor drive applications. These 600V, Short Circuit Rated B2-Class Medium Speed IGBTs are ideal for high volume, small drive applications. This family applies IXYS Next Generation IGBT Technology to its Short Circuit rated family of 600V IGBTs to provide significant improvements in efficiency for offline small drive applications requiring this class of 600V device with switching frequency ranging up to 30kHz. The B2-Class IGBTs have up to 25% improvement in saturation voltage and lower turnoff energy versus IXYS prior generation of B-Class IGBTs. These performance improvements are further enhanced by a 25% reduction in thermal resistance, providing significant increases in power handling and reliability. IXYS' new Short-Circuit Rated B2Class of IGBTs offer significant reductions in conduction and switching losses, which when coupled with the improvements in thermal performance, greatly extend their performance and thus cost efficiency. This family of IGBTs possesses a lower saturation voltage at elevated temperature, as compared to the saturation voltage of other NPT type IGBTs used for small drive applications. Initial products will be offered for applications ranging from 10A to 40A in TO-220, TO247 and TO-3P discrete packages, as well as surface mountable TO263 and TO-268 packages. IXYS has also recently taken steps to decrease its manufacturing costs on all its products, including IGBTs. These manufacturing improvements are of particular benefit for very high volume applications, particularly the cost sensitive small drive applications of the appliance and white goods markets. Its pursuit of cost improvements has significant impact on enabling IXYS to aggressively pursue new business in these markets, for which IXYS SB2 Class IGBTs are the first. Additional products will be developed in the future to address the unique requirements of these high volume markets. S-B2 Class Short-Circuit Rated Medium Speed IGBT Copacks Part Number IXSP10N60B2D1 IXSA10N60B2D1 IXSH10N60B2D1* IXSQ10N60B2D1* IXSP20N60B2D1 IXSA20N60B2D1 IXSH20N60B2D1 IXSQ20N60B2D1* IXSH30N60B2D1* IXST30N60B2D1* IXSH40N60B2D1* IXST40N60B2D1* VCES 600 V 600 V 600 V 600 V 600 V 600 V 600 V 600 V 600 V 600 V 600 V 600 V IC (110C) 10 A 10 A 10 A 10 A 20 A 20 A 20 A 20 A 30 A 30 A 40 A 40 A VCE (ON, 25C) @ It, MAX / It Eoff @ TJ = 125C IC = It, VCE = 480V Typ. R(J-C) 2.50 V / 10 A 2.50 V / 10 A 2.50 V / 10 A 2.50 V / 10 A 2.50 V / 16 A 2.50 V / 16 A 2.50 V / 16 A 2.50 V / 16 A 2.50 V / 30 A 2.50 V / 30 A 2.50 V / 40 A 2.50 V / 40 A 0.79 mJ 0.79 mJ 0.79 mJ 0.79 mJ 0.97 mJ 0.97 mJ 0.97 mJ 0.97 mJ 1.50 mJ 0.50 mJ 1.90 mJ 1.90 mJ 0.83 C/W 0.83 C/W 0.83 C/W 0.83 C/W 0.65 C/W 0.65 C/W 0.65 C/W 0.65 C/W 0.42 C/W 0.42 C/W 0.31 C/W 0.31 C/W Package TO-220 TO-263 TO-247 TO-3P TO-220 TO-263 TO-247 TO-3P TO-247 TO-268 TO-247 TO-268 * Samples and datasheets available 1/05. New single Thyristor Family in miniBLOC TM Housing IXYS Corporation, a leader in power semiconductors for power conversion and motion control applications, announces the extension of its thyristor (SCR) portfolio in the standard package miniBLOC (SOT-227B). The `Single Thyristor' family with miniBLOC package now has a current range of 25 to 150A with VRRM ratings of 1200 and 1600 V. The planar passivated SCR-dies are the basis of high reliability and performance in many different applications and systems as in softstarters, motor controlling, solid state switches, light and temperature control and several rectifying circuits. 2 miniBLOC offers also an isolation voltage of 2500V and high current capability. Next to its easy mounting with just two screws the robust package Product MCO MCO MCO MCO MCO 25-12/16io6 50-12/16io6 75-12/16io6 100-12/16io6 150-12/16io6 With the introduction of this new range of single SCRs IXYS makes a further step to supply customers with a very comprehensive range of solutions for power semiconductors from MW to MW at one service. ITAV / A@ TC = 80 C VRRMV ITSMA 31 54 77 99 149 1200 - 1600 1200 - 1600 1200 - 1600 1200 - 1600 1200 - 1600 370 740 1070 1400 2000 GaAs MESFET in low cost SOT89 package The MwT-1789 is a high linearity GaAs MESFET device in low cost SOT89 package that is ideally suited for high linearity driver, PA (Power Amplifier), and high dynamic range LNA applications. The applications include 2G, 2.5G, and 3G wireless infrastructure standards, such as GSM, TDMA, cdma, Edge, cdma2000, WCDMA, TDSCDMA, and UMTS base stations. This product is also ideal for high data rate wireless LAN infrastructure applications, such as high QAM rate 802.11 WiFi and 802.16 WiMax base stations and APs (Access Points). In additional, the product can be used for point-to-point microwave communications links. The third order intercept performance of the MwT-1789 is excellent, typically 18 dB above the 1 dB power gain compression point. The noise figure is as low as 0.8 dB at 900 MHz. The chip is produced using MwT's proprietary high linearity device design. It also uses MwT reliable metallization process. All chips are passivated using MwT's patented Diamond-Like Carbon" process for increased durability. 650V 3-Phase and Half-Bridge Driver IC Family Offering Superior Performance for Full Range of Consumer, Automotive and Industrial Applications IXYS expanded its new family of 3Phase and Half-Bridge Drivers optimized for gate drive applications up to 650V. This family provides a complete spectrum of solutions with 0.6A peak to 6.0A peak output drive current capability for applications ranging from 1kHz to 1MHz. These Drivers draw upon a newly optimized architecture first introduced with the IX6R11, building on and enhancing its superior performance and high-end current handling capability of the IX6R11. As with the original IX6R11, IXYS 650V Driver IC Family gives better matching of propagation delays, enhanced fault tolerance and reliability, with improved efficiency and cooler operation. This 3-Phase and HalfBridge Driver Family was planned to provide compatibility with similar Drivers from other suppliers, while offering the superior performance of our architecture. The Family includes unique customer options in packaging and configurations. Several Drivers are offered in packages that offer size (16-Pin MLP, 48-Pin SSLGA) or thermal advantages (18-Pin SOIC-CT). A unique product configuration is the IX6S11 offered for split-rail circuit configurations (+300V/-200V), with control logic ground referenced. Performance advantages common to IXYS 3-Phase and Half-Bridge Driver ICs include 50kV/s dV/dt noise immunity and 200V negative voltage transient immunity, 8 times that of competing Half-Bridge Drivers. Noise immunity is further enhanced by the use of non-latching level translation. IXYS level translation technique exhibits lower power dissipation versus techniques using high-voltage transistors typical of competing Half-Bridge Drivers. Lower dissipation enables the use of IXYS Drivers for larger loads, higher bus voltages or for faster switching frequency. Lower dissipation means also that IXYS Drivers can be pushed to higher temperatures with greater reliability. This Family of Drivers offers a wide mix of user options for input logic options, output current ratings and packages. The high peak current capability of the IX6R11 enables the drive of larger MOSFET and IGBT die sizes at higher frequency without additional discrete transistors and components. 600mA Drivers, such as the IXD611, are used in lower power/lower frequency applications such as small power tools. Other user options covered by this Family include fixed and programmable delays, shutdown options, protection features, as well as high and low side under voltage protection. Performance advantages include extended voltage range operation, and extended temperature operation from -55C to +125C. 3-Phase and Half-Bridge Driver Summary Table Package(1) UVLO Level IGBT MOSFET, LOGIC Special Features 600mA Half-Bridge Drivers IXYS PN Shutdown Inputs/Keying Protection Features Deadtime IXA611(1) IXB611(1) IXC611(1) IXD611(1) IXE611(1) IXF611(1) IXG611(1) IXH611(1) IXJ611(1) IXK611(1) MOSFET MOSFET MOSFET MOSFET Logic Logic MOSFET MOSFET MOSFET MOSFET Yes (High) No No No No Yes (Low) No No No No Dual/In Phase Dual/High-In Phase/Low-Inv Single/High Side Dual/In Phase Dual/In Phase Single/High Side Dual/In Phase Dual/In Phase Dual/In Phase Dual/Out of Phase No Cross-Conduct Cross-Conduct No No Cross-Conduct Cross-Conduct Cross-Conduct No No No Fixed - 520ns Typ Fixed - 650ns Typ No No Fixed - 540ns Typ Fixed - 100ns Typ Fixed - 540ns Typ No No 600mA 3-Phase Drivers IXA531(1) IGBT Yes (Low) Six/Out of Phase Cross-Conduct,OCP (Prog. Reset) No 2A Half-Bridge Drivers IX2A11(1) MOSFET Yes (Low) IX2B11(1) MOSFET Yes (Low) IX2C11(1) MOSFET No IX2D11(1) MOSFET No IX2R11(1) MOSFET Yes (High) Single/High Side Single/High Side Dual/In Phase Dual/In Phase Dual/In Phase Cross-Conduct Cross-Conduct No No No Fixed - 500ns Typ Programmable No No No P1(3),S1(3),S1T/R(6) P7(3),S7(3),S7T/R(6) P1(3),S1(3),S1T/R(6) P7(3),S7(3),S7T/R(6) P7(2),S3(2),S3T/R(5),M6(2),M6T/R(5) 4A Half-Bridge Drivers IX4R11(1) MOSFET Yes (High) Dual/In Phase No No P7(2),S3(2),S3T/R(5),M6(2),M6T/R(5) 6A Half-Bridge Drivers IX6R11(1) MOSFET Yes (High) IX6S11(1,8) MOSFET No Dual/In Phase Dual/In Phase No No No No P7(2),S3(2),S3T/R(5),S6(2),S6T/R(5),M6(2),M6T/R(5) S6,S6T/R(3) P7(2),S3(2),S3T/R(5),M6(3),M6T/R(6) P1(3),S1(3),S1T/R(6) P1(3),S1(3),S1T/R(6) P1(3),P7(3),S1(3),S1T/R(5),S7(3),S7T/R (5) P1(4),S1(4),S1T/R(7) P1(4),S1(4),S1T/R(7) P1(3),S1(3),S1T/R(6) P1(3),S1(3),S1T/R(6) P1(4),S1(4),S1T/R(7) P1(4),S1(4),S1T/R(7) L4(3),L4T/R(5),S10(2),S10T/R(5) (1) Package designation. L4 - 44-Pin PLCC S1T/R - 8-Pin SOIC on Tape and Reel L4T/R - 44-Pin PLCC on Tape and Reel S3 - 16-Pin SOIC M6 - 16-Pin MLP S3T/R - 16-Pin SOIC on Tape and Reel M6T/R - 16-Pin MLP on Tape and Reel S6 - 16-Pin SOIC-CT (Heatsinkable Package) P1 - 8-Pin PDIP S6T/R - 16-Pin SOIC-CT (Heatsinkable Package) on Tape and Reel P7 14-Pin PDIP S10 - 48-Pin SSLGA S1 - 8-Pin SOIC S10T/R - 48-Pin SSLGA on Tape and Reel Consult datasheet for Tube or Tape and Reel package quantities. (2) Samples available Nov 2004. (3) Samples available Dec 2004. (4) Samples available Jan 2005. (5) Samples available Feb 2005. (6) Samples available Mar 2005. (7) Samples available Apr 2005. (8) Half-Bridge Driver configured for Split-Rail circuits, (+300/-200V). PolarHVTM 500V and 600V Standard and HiPerFETTM Power MOSFETs IXYS has developed a new technology platform of Power MOSFET products, called PolarHT and PolarHV, for the voltage range from 55V to 600V. These new families of Power MOSFETs include cost-efficient, Standard Power MOSFETs and high-performance, HiPerFET Power MOSFETs. IXYS has now extended this MOSFET Family to include PolarHVTM 500V and 600V rated parts. supply applications. They are used in demanding and high reliability IT and telecom infrastructure applications that require efficient switching and energy conversion in tight enclosures as well as products where reduced size and weight are important features. PolarHT and PolarHV Power MOSFETs are designed with a proprietary cell design (patent pending) and process improvements that dramatically enhance the power handling capability and system efficiency. These design and process changes provide best-in-class" on resistance, gate charge, thermal resistance and power handling capability. IXYS' proven HiPerFET process yields Power MOSFETs with a fast intrinsic body diode with low Qrr and enhanced dV/dt ruggedness. IXYS' HiPerFETs are targeted for hard switching inverter and power PolarHTTM - 500V and 600V Standard Power MOSFET Table Part Number VDSS I 25 Min. Tc=25C V A R DS(on) Tc=25C Qg RthJC IXT(1)1R6N50P 500 nC C/W 1.6 6 2 3 IXT(1)2R4N50P 500 2.4 3.5 4 IXT(1)3N50P 500 3.6 2.0 IXT(1)5N50P 500 5 IXT(1)6N50P 500 6 IXTP12N50PM 500 IXT(1)8N50P The PolarHV line is offered in 500V and 600V versions plus 800V and higher versions are in development. This higher voltage product line brings the same benefits of enhanced performance and cost-effectiveness to key market applications in the mid-voltage range. Example applications are off-line switchmode power supplies of all sizes, from small wall socket style ranging to rack mount power systems for IT, UPS and Telecom applications. Package type designations: Letter Symbol A C H I K N P P..M Q R T V X Y Package Type TO-263 ISOPLUS220 TO-247 Leaded TO-263 TO-264 SOT-227B TO-220 Overmolded TO-220 TO-3P ISOLPUS247 TO-268 PLUS220 PLUS247 TO-252 PolarHVTM - 500V and 600V HiPerFET Power MOSFET Table Package Type Part Number VDSS I 25 Min. Tc=25C V A RDS(on) Tc=25C Qg RthJC Y IXFC16N50P 500 2.5 Y, P IXF(1)12N50P 8 1.8 Y, P, A 1.3 12 1.5 1.0 15 1.3 6 0.50 30 500 8 0.8 IXT(1)12N50P 500 12 IXTC26N50P 500 15 IXT(1)16N50P 500 IXT(1)22N50P(2) Package Type nC C/W 10 0.44 40 1.25 500 12 0.50 30 0.75 P, A IXFC26N50P 500 15 0.26 60 0.95 C P, A IXF(1)16N50P 500 16 0.40 40 0.42 P, A, H P, A IXF(1)22N50P(2) 500 22 0.27 50 0.35 V, H 2.5 P..M IXF(1)36N50P 500 23 0.19 82 0.6 C, R 21 1.0 P, A IXF(1)26N50P(2) 500 26 0.23 60 0.31 V, H 0.50 30 0.75 P, A, I IXFR44N50P 500 28 0.15 104 0.5 R 0.26 60 0.95 C IXF(1)30N50P(2) 500 30 0.20 72 0.27 V,H, T 16 0.40 40 0.42 P, A, Q IXF(1)36N50P(2) 500 36 0.17 82 0.23 V,H, T 500 22 0.27 50 0.35 V, Q IXFR64N50P 500 37 0.1 150 0.45 R IXT(1)26N50P(2) 500 26 0.23 60 0.31 V, Q IXF(1)44N50P 500 44 0.14 104 0.19 H, T, K IXT(1)30N50P(2) 500 30 0.20 72 0.27 V, H, Q, T IXF(1)64N50P 500 64 0.10 150 0.15 X, K, N IXT(1)36N50P(2) 500 36 0.17 82 0.23 V, H, Q, T IXFC14N60P 600 9 0.60 40 1.25 C IXT(1)1R4N60P 600 1.4 8 2 3 Y IXF(1)10N60P 600 10 0.74 30 0.62 P, A IXT(1)2N60P 600 2 4.7 4 2.25 Y, P IXFC22N60P 600 13 0.36 60 0.95 C IXT(1)3N60P 600 3 2.8 8 1.8 Y, P, A IXF(1)14N60P 600 14 0.55 40 0.42 P, A, H IXT(1)4N60P 600 4 1.9 12 1.5 P, A IXF(1)18N60P(2) 600 18 0.42 50 0.35 V, H IXT(1)5N60P 600 5 1.6 14 1.2 P, A IXF(1)30N60P 600 18 0.27 82 0.85 C, R IXTP10N60PM 600 5 0.74 30 2.5 P..M IXFR36N60P 600 20 0.21 103 0.60 R IXT(1)7N60P 600 7 1.10 20 1 P, A IXF(1)22N60P(2) 600 22 0.33 60 0.31 V, H IXT(1)10N60P 600 9 0.74 30 0.75 P, A, I IXF(1)26N60P(2) 600 26 0.27 72 0.27 V,H, T IXT(1)14N60P 600 14 0.55 40 0.42 P, A, Q IXFR48N60P 600 27 0.15 150 0.50 R IXT(1)18N60P(2) 600 18 0.42 50 0.35 V, Q IXF(1)30N60P(2) 600 30 0.24 82 0.23 V,H, T IXT(1)22N60P(2) 600 22 0.33 60 0.31 V, Q IXF(1)36N60P 600 36 0.19 103 0.19 H, T, K IXT(1)26N60P(2) 600 26 0.27 72 0.27 V, H, Q, T IXF(1)48N60P 600 48 0.14 150 0.15 X, K, N IXT(1)30N60P(2) 600 30 0.24 82 0.23 V, H, Q, T C Notes: * - best estimated values; - ISOPLUS package type. (1) Place holder in part number for package designator; (2) Add suffix letter `S' to part number for Surface Mountable PLUS220 package, e.g. IXTV22N50PS. www.msc-ge.com