AO7400
30V N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 1.7A
R
DS(ON)
(at V
GS
=10V) < 55mΩ
R
DS(ON)
(at V
GS
=4.5V) < 65mΩ
R
DS(ON)
(at V
GS
=2.5V) < 85mΩ
Symbol
V
DS
V
GS
I
DM
T
J
, T
STG
Symbol
t ≤ 10s
Steady-State
Steady-State
R
θJL
Maximum Junction-to-Ambient
A
Maximum Junction-to-Lead °C/W
°C/W
Maximum Junction-to-Ambient
A D
280 425
320
Pulsed Drain Current
C
Continuous Drain
Current
T
A
=25°C W
0.35
V±12Gate-Source Voltage T
A
=25°C A
I
D
1.7
1.3
15
T
A
=70°C
The AO7400 uses advanced trench technology to
provide excellent R
DS(ON)
, low gate charge and
operation with gate voltages as low as 2.5V, in the
small SOT323 footprint. It can be used for a wide
variety of applications, including load switching, low
current inverters and low current DC-DC converters.
V
Maximum UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
30V
Drain-Source Voltage 30
°C
Thermal Characteristics UnitsParameter Typ Max °C/W
R
θJA
300
340 360
0.22
T
A
=70°C
Junction and Storage Temperature Range -55 to 150
Power Dissipation
B
P
D
G
D
S
SC-70
(SOT-323)
Top View Bottom View
G
D
SG
S
D
Rev 5: May 2011 www.aosmd.com Page 1 of 5
AO7400
Symbol Min Typ Max Units
BV
DSS
30 V
V
DS
=30V, V
GS
=0V 1
T
J
=55°C 5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage 0.5 1 1.5 V
I
D(ON)
15 A
45 55
T
J
=125°C 70 84
50 65 mΩ
61 85 mΩ
g
FS
14 S
V
SD
0.75 1 V
I
S
1.5 A
C
iss
185 235 285 pF
C
oss
25 35 45 pF
C
rss
10 18 25 pF
R
g
2.1 4.3 6.5 Ω
Q
g
(10V) 10 12 nC
Q
g
(4.5V) 4.7 nC
Q
gs
0.95 nC
Q
gd
1.6 nC
t
D(on)
3.5 ns
t
r
1.5 ns
t
D(off)
17.5 ns
t
f
2.5 ns
t
rr
8.5 11 ns
Q
rr
2.6 3.5 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
Drain-Source Breakdown Voltage
On state drain current
I
D
=250µA, V
GS
=0V
V
GS
=10V, V
DS
=5V
V
GS
=10V, I
D
=1.7A
Reverse Transfer Capacitance
I
F
=1.7A, dI/dt=100A/µs
V
GS
=0V, V
DS
=15V, f=1MHz
SWITCHING PARAMETERS
I
DSS
µA
V
DS
=V
GS
I
D
=250µA
V
DS
=0V, V
GS
=±12V
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS Parameter Conditions
Zero Gate Voltage Drain Current
Gate-Body leakage current
I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=1.7A
V
GS
=2.5V, I
D
=1A
V
GS
=4.5V, I
D
=1.5A
Forward Transconductance
Diode Forward Voltage
R
DS(ON)
Static Drain-Source On-Resistance mΩ
Gate resistance V
GS
=0V, V
DS
=0V, f=1MHz
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=15V, I
D
=1.7A
Gate Source Charge
Gate Drain Charge
Total Gate Charge
Body Diode Reverse Recovery Charge I
F
=1.7A, dI/dt=100A/µs
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime V
GS
=10V, V
DS
=15V, R
L
=8Ω,
R
GEN
=3Ω
A. The value of R
θJA
is measured with the device mounted on 1in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C. Ratings are based on low frequency and duty cycles to keep
initialT
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to lead R
θJL
and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2
FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
Rev 5: May 2011 www.aosmd.com Page 2 of 5
AO7400
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
17
5
2
10
0
18
40
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3
V
GS
(Volts)
Figure 2: Transfer Characteristics (Note E)
I
D
(A)
30
40
50
60
70
80
0 2 4 6 8 10
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage (Note E)
R
DS(ON)
(mΩ
Ω
Ω
Ω)
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
I
S
(A)
25°C
125°C
0.8
1
1.2
1.4
1.6
1.8
0 25 50 75 100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
Normalized On-Resistance
V
GS
=2.5V
I
D
=1A
V
GS
=4.5V
I
D
=1.5A
V
GS
=10V
I
D
=1.7A
20
40
60
80
100
120
0 2 4 6 8 10
V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
R
DS(ON)
(mΩ
Ω
Ω
Ω)
25°C
125°C
V
DS
=5V
V
GS
=4.5V
V
GS
=10V
I
D
=1.7A
25°C
125°C
0
3
6
9
12
15
0 1 2 3 4 5
V
DS
(Volts)
Fig 1: On-Region Characteristics (Note E)
I
D
(A)
V
GS
=2.0V
4.5V
10V 3V 2.5V
V
GS
=2.5V
Rev 5: May 2011 www.aosmd.com Page 3 of 5
AO7400
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
2
4
6
8
10
0 2 4 6 8 10 12
Q
g
(nC)
Figure 7: Gate-Charge Characteristics
V
GS
(Volts)
0
50
100
150
200
250
300
350
400
0 5 10 15 20 25 30
V
DS
(Volts)
Figure 8: Capacitance Characteristics
Capacitance (pF)
C
iss
C
oss
rss
V
DS
=15V
I
D
=1.7A
1
10
100
1000
10000
0.00001 0.001 0.1 10 1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Ambient (Note F)
Power (W)
T
A
=25°C
0.0
0.1
1.0
10.0
100.0
0.01 0.1 1 10 100
V
DS
(Volts)
I
D
(Amps)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
10
µ
s
10s
1ms
DC
R
DS(ON)
limited
T
J(Max)
=150°C
T
A
=25°C
100
µ
s
10ms
0.001
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Z
θ
θ
θ
θJA
Normalized Transient
Thermal Resistance
Single Pulse
D=T
on
/T
T
J,PK
=T
A
+P
DM
.Z
θJA
.R
θJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
R
θJA
=425°C/W
Rev 5: May 2011 www.aosmd.com Page 4 of 5
AO7400
-
+
VDC
Ig
Vds
DUT
-
+
VDC
Vgs
Vgs
10V
Qg
Qgs Qgd
Charge
Gate Charge Test Circuit & Waveform
Ig
Vgs
-
+
VDC
DUT
L
Vgs
Vds
Isd
Isd
Diode Recovery Test Circuit & Waveforms
Vds -
Vds +
I
F
dI/dt
I
RM
rr
Vdd
Vdd
Q = - Idt
t
rr
-
+
VDC
DUT Vdd
Vgs
Vds
Vgs
RL
Rg
Vgs
Vds
10%
90%
Resistive Switching Test Circuit & Waveforms
t t
r
d(on)
t
on
t
d(off)
t
f
t
off
Rev 5: May 2011 www.aosmd.com Page 5 of 5