Microsemi
Copyright © 2005
7-17-05, Rev D
WWW.Microsemi .COM
UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE
DIVISION
DESCRIPTION
The UPGA301Ae3 is Designed for
high current na rrow-pulse swi tchi ng
applications where size and current
handling capability are critical.
These devices may be triggere d on
using low power logic drivers from
(+0.8 V at 200 μA).
Epoxy packaged, oxi de passivated planar
SCR chips with metallurgic bonds on both
sides to achieve high reliability. Internal
wire bond connection allows high curr ent
surge capability for narrow pulse
applications.
IMPORTANT: For the most current data, consult MICROSEMI’swebsite:http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating Symbol Value Unit
Repetative peak Off-State Voltage VDRM 100 V
Peak On-State Current for 50 ns (max) ITSM 100 A
Peak Gate Current IGM 250 mA
Reverse Gate Voltage VGR 5 V
Storage Temperature Range T s -50 to 150 ºC
Operating Temperature Range T J0 to 125 ºC
THERMAL CHARACTERISTIC S
(UNLESS OTHERWISE SPECIFIED)
(1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint
Thermal Resistance
Junction-to-Case (Anode Bottom) RθJC 4.0 ºC/Watt
Junction-to-Ambient (1) RθJA 65 ºC/Watt
Small foot print
.190 X .270 inches
1:1 Actual size
See mounting pad details on pg 3
KEY FEATURES
Very low thermal resistance package
Efficient heat path with integral
locking bottom metal tab
Full metallic bottom eliminates flux
entrapment
RoHS Compliant with e3 suffix
High speed switching capability
Compatible with high-speed insertion
Low profile height of 1 mm
APPLICATIONS/BENEFITS
Reference Microsemi MicroNote 601
and 602
Nanosecond SCR switch for reliable
high current pulse generators,
modulators and photo-flash
quenching
Logic drive capability (0.8V, 200μA)
Ideal for Laser Range finder and
Camera Applications
Ideal for Automotive Collision
Avoidance Ap pl i cat i ons
MECHANICAL & PACKAGING
• CASE: Void-free transfer molded
thermosetting epoxy compound
meeting UL94V-0
• FINISH: Annealed matte-Tin plating
over copper and readily solderable per
MIL-STD-750 method 2026 (consult
factory for Tin-Lead plating)
• POLARITY: See figure (left)
• MARKING: 301A•
• WEIGHT: 0.072 gram (approx.)
• Package dimensions on last page
• Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
U
UP
PG
GA
A3
30
01
1A
A
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 1
Microsemi
Copyright © 2005
7-17-05, Rev D
WWW.Microsemi .COM
UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE
DIVISION
ELECTRICAL PARAMETERS@25°C (unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Units
` On characteristics (up to 100 A w/ 100 ns pulse @ Duty Cycle = 0.0001% or less)
Forward Blocking Current IDRM VDRM = 100 V, RGK = 1 kΩ 1.0
μA
On - State Voltage VTIT = 1 A, Ig =10 mA 1.1 1.5 V
Gate Trigger Voltage VGT VD = 5 V, RGS = 100 Ω 0.5
0.75 V
Gate Trigger Current IGT VD = 5 V, RGS = 10 kΩ 10
200 μA
Reverse Gate Current IGR VGR = 5 V 0.01 0.1
mA
Holding Current IHVD = 5 V, RGK = 1 kΩ 1.0 3.0 5.0 mA
Reverse Current (Note 1) IRRM VRRM = 30 V, RGK = 1 kΩ 1 10
mA
` Switching characteristics (Tc = 25 °C)
20
td Ig = 20 mA, IT = 1 A 30 ns
Delay Time
VD = 60 V, IT=1 A, Ig =10 mA
dc < 1%
Rise Time
Note 1: Pulse Test intended to guarantee reverse anode voltage capability for pulse commutation. The device should not be
operated in the reverse blocking mode on a continuous basic
tr 15 25 ns
IT = 1.0 A , IR = 1.0 A max,
RGK = 1 kΩ
Circuit Commutated Turn—off
Time tq 0.3 0.5 μs
tpg(on) Ig = 10 mA, IT = 1 A
Gate Trigger—on Pulse Width 20 50 ns
Critical Rate of Rise dv/dt 15 30
V
Off –State Voltage D = 30 V, RGK = 1 kΩ V/μs
E
EL
LE
EC
CT
TR
RI
IC
CA
AL
LS
S
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 2
Microsemi
Copyright © 2005
7-17-05, Rev D
WWW.Microsemi .COM
UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE
DIVISION
Case: Molded Epoxy
Meets UL94V-O at 1/8 inch
Weight: 72 milligrams
Lead and Mounting Temperature: 260°C max for 10 seconds
NOTE: All dimensions are in inches.
P
PA
AC
CK
KA
AG
GE
E D
DA
AT
TA
A
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 3
Microsemi
Copyright © 2005
7-17-05, Rev D
WWW.Microsemi .COM
UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE
DIVISION
NOTES:
N
NO
OT
TE
ES
S
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 4
